CN206365152U - A kind of conducting orifice device of FPC - Google Patents

A kind of conducting orifice device of FPC Download PDF

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Publication number
CN206365152U
CN206365152U CN201720016076.2U CN201720016076U CN206365152U CN 206365152 U CN206365152 U CN 206365152U CN 201720016076 U CN201720016076 U CN 201720016076U CN 206365152 U CN206365152 U CN 206365152U
Authority
CN
China
Prior art keywords
wiring board
line plate
wire
fpc
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720016076.2U
Other languages
Chinese (zh)
Inventor
韩燕红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Peng Peng Electronic Technology Co Ltd
Original Assignee
Anhui Peng Peng Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Peng Peng Electronic Technology Co Ltd filed Critical Anhui Peng Peng Electronic Technology Co Ltd
Priority to CN201720016076.2U priority Critical patent/CN206365152U/en
Application granted granted Critical
Publication of CN206365152U publication Critical patent/CN206365152U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of conducting orifice device of FPC, formed by the first line plate, substrate layer and the second wiring board that are sequentially overlapped from top to down by press pressing, first line plate and the second wiring board are double-faced flexible wiring board, and first line plate and the second wiring board are provided with conducting wire.Via hole is provided with first line plate, substrate layer and the second wiring board, the inwall of via hole is provided with the metal level for connecting first line plate and the second wiring board, and metal level is layers of copper.The utility model, in layers of copper of the via hole inwall provided with connection first line plate and the second wiring board, makes product is two-sided can be while assembling electronic component by opening up via hole on first line plate, substrate layer and the second wiring board.The utility model is simple in construction, easy to make, and production cost is low, is conducive to wiring board manufacturer to carry out large-scale production and better meets the market demand.

Description

A kind of conducting orifice device of FPC
Technical field
The utility model is related to a kind of flexible circuitry panel assembly, more particularly to a kind of FPC conducting orifice device.
Background technology
As modern is to the lightweight of semiconductor/LCD product, the higher and higher requirement of portability, simultaneous The possibility being achieved that science and technology and industry technology development with rapid changepl. never-ending changes and improvements are brought, there is light and handy accurate and flexible folding The application of FPC is more and more extensive, such as mobile phone, personal digital assistant, digital camera, e-dictionary, printing The electronic products such as machine, laptop computer and automobile.
FPC (Flexible Printed Circuit, FPC) is commonly called as " soft board ", to use flexible insulation base material The printed circuit board (PCB) being made, because it has a variety of advantages that hard printed circuit board does not possess, for example, Distribution density is high, again Amount is light etc., particularly it can with free bend, winding, fold, any arrangement can be required according to space layout, and can be in three-dimensional space Between it is any mobile and flexible, so as to reach the integration of components and parts assembling and wire connection.It can be contracted significantly using FPC The volume of small electronic product, the need for applicable electronic product develops to high density, miniaturization, highly reliable direction, therefore, is obtained Extensive use.
In the prior art, double-sided wiring board realizes that circuit is connected by setting up conducting structure between the wire on two sides.But Wiring board with this structure makes inconvenient, and expends aluminium, improves production cost, is unfavorable for wiring board manufacturer and carries High efficiency and better meet the market demand.
Utility model content
The purpose of this utility model is and a kind of FPC proposed in order to solve shortcoming present in prior art Conducting orifice device.
To achieve these goals, the utility model employs following technical scheme:
A kind of conducting orifice device of FPC, including be sequentially overlapped from top to down first line plate, substrate layer and Second wiring board, the first line plate and the second wiring board are provided with conducting wire;The first line plate, substrate layer and Via hole, metal level of the inwall provided with connection first line plate and the second wiring board of via hole are provided with two wiring boards;
Offered in the middle of conducting wire on the first line plate and the second wiring board multiple spaced and along conduction The hollow-out parts that the length direction of circuit is arranged side by side;The hollow-out parts are rectangular, and conducting wire is divided into by hollow-out parts to be parallel to each other The first wire and the second wire, and perpendicular to and with the privates that is connected of the first wire and the second wire.
Preferably, the first line plate, substrate layer and the second wiring board press to form FPC by press.
Preferably, the metal level is layers of copper.
Preferably, the first line plate and the second wiring board are made up of copper or copper alloy, and substrate layer is by insulating materials system Into.
Preferably, the first line plate and the second wiring board are made up of copper foil.
Preferably, the first line plate and the second wiring board are double-faced flexible wiring board.
Preferably, the width of first wire and the second wire is equal.
Compared with prior art, the beneficial effects of the utility model are:
1st, the utility model on first line plate, substrate layer and the second wiring board by opening up via hole, and is turning on Layers of copper of the hole inwall provided with connection first line plate and the second wiring board, makes product is two-sided can be while assembling electronic component.This Utility model is simple in construction, easy to make, and production cost is low, is conducive to wiring board manufacturer to carry out large-scale production and more preferable Meet the market demand.
2nd, conducting wire can realize multi-way conduction, many places fracture can be born after bending, as long as ensureing to engrave same It is broken when the first wire of empty portion's upper and lower and different the second wire, you can ensure the normal work of FPC, make conduction The break resistance of circuit is greatly improved.
Brief description of the drawings
Fig. 1 be the utility model proposes a kind of FPC conducting orifice device structural representation.
In figure:1st, first line plate, 2, substrate layer, the 3, second wiring board, 4, hollow-out parts, the 5, first wire, 6, second leads Line, 7, privates, 8, via hole, 9, metal level.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.
Reference picture 1, the conducting orifice device of a kind of FPC, by first line plate 1, the base being sequentially overlapped from top to down Material layer 2 and the second wiring board 3 are formed by press pressing, and the wiring board 3 of first line plate 1 and second is by copper or copper alloy system Into substrate layer 2 is made up of insulating materials, and the wiring board 3 of first line plate 1 and second is double-faced flexible wiring board, the First Line The wiring board 3 of road plate 1 and second is provided with conducting wire.It is provided with and leads on the first line plate 1, the wiring board 3 of substrate layer 2 and second Through hole 8, metal level 9 of the inwall provided with connection first line plate 1 and the second wiring board 3 of via hole 8, the metal level 9 is copper Layer.The utility model on first line plate 1, the wiring board 3 of substrate layer 2 and second by opening up via hole 8, and in via hole 8 Layers of copper of the inwall provided with connection first line plate 1 and the second wiring board 3, makes product is two-sided can be while assembling electronic component.This Utility model is simple in construction, easy to make, and production cost is low, is conducive to wiring board manufacturer to carry out large-scale production and more preferable Meet the market demand.
Offered in the middle of conducting wire on the wiring board 3 of first line plate 1 and second multiple spaced and along leading The hollow-out parts 4 that the length direction of electric line is arranged side by side;The hollow-out parts 4 are rectangular, and conducting wire is divided into mutually by hollow-out parts 4 Parallel the first wire 5 and the second wire 6, and perpendicular to and with the privates 7 that is connected of the first wire 5 and the second wire 6; The width of the wire 6 of first wire 5 and second is equal.So, conducting wire can realize multi-way conduction (along the first wire 5, Second wire 6 and the conducting in the direction of privates 7), after bending, many places fracture can be born, as long as ensureing in same hollow out It is broken when the first wire 5 and different the second wire 6 of the upper and lower of portion 4, you can ensure the normal work of FPC, make conduction The break resistance of circuit is greatly improved.
In actual applications, the first wire 5 of the same upper and lower of hollow-out parts 4 and the situation hair of the second fracture simultaneously of wire 6 Raw probability very little, thereby may be ensured that FPC remains to normal work after multiple bending, improves its break resistance.
It is described above, only the utility model preferably embodiment, but protection domain of the present utility model is not This is confined to, any one skilled in the art is in the technical scope that the utility model is disclosed, according to this practicality New technical scheme and its utility model design are subject to equivalent substitution or change, should all cover in protection model of the present utility model Within enclosing.

Claims (7)

1. the conducting orifice device of a kind of FPC, it is characterised in that including the first line plate being sequentially overlapped from top to down (1), substrate layer (2) and the second wiring board (3), the first line plate (1) and the second wiring board (3) are provided with conducting wire; Via hole (8) is provided with the first line plate (1), substrate layer (2) and the second wiring board (3), the inwall of via hole (8) is provided with Connect the metal level (9) of first line plate (1) and the second wiring board (3);
Offered in the middle of conducting wire on the first line plate (1) and the second wiring board (3) multiple spaced and along leading The hollow-out parts (4) that the length direction of electric line is arranged side by side;The hollow-out parts (4) are rectangular, and hollow-out parts (4) divide conducting wire For the first wire (5) and the second wire (6) being parallel to each other, and perpendicular to and with the first wire (5) and the second wire (6) phase Privates (7) even.
2. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that the first line plate (1), substrate layer (2) and the second wiring board (3) press to form FPC by press.
3. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that the metal level (9) For layers of copper.
4. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that the first line plate (1) it is made up with the second wiring board (3) of copper or copper alloy, substrate layer (2) is made up of insulating materials.
5. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that the first line plate (1) it is made up with the second wiring board (3) of copper foil.
6. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that the first line plate (1) and the second wiring board (3) be double-faced flexible wiring board.
7. a kind of conducting orifice device of FPC according to claim 1, it is characterised in that first wire (5) and the second wire (6) width it is equal.
CN201720016076.2U 2017-01-06 2017-01-06 A kind of conducting orifice device of FPC Expired - Fee Related CN206365152U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720016076.2U CN206365152U (en) 2017-01-06 2017-01-06 A kind of conducting orifice device of FPC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720016076.2U CN206365152U (en) 2017-01-06 2017-01-06 A kind of conducting orifice device of FPC

Publications (1)

Publication Number Publication Date
CN206365152U true CN206365152U (en) 2017-07-28

Family

ID=59379626

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720016076.2U Expired - Fee Related CN206365152U (en) 2017-01-06 2017-01-06 A kind of conducting orifice device of FPC

Country Status (1)

Country Link
CN (1) CN206365152U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170728

Termination date: 20200106

CF01 Termination of patent right due to non-payment of annual fee