CN206729740U - Insulating pot - Google Patents
Insulating pot Download PDFInfo
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- CN206729740U CN206729740U CN201621493426.6U CN201621493426U CN206729740U CN 206729740 U CN206729740 U CN 206729740U CN 201621493426 U CN201621493426 U CN 201621493426U CN 206729740 U CN206729740 U CN 206729740U
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- plate
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- thermal conductivity
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- 239000000758 substrate Substances 0.000 claims description 14
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims description 9
- 239000010963 304 stainless steel Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000013081 microcrystal Substances 0.000 claims description 7
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- 238000010438 heat treatment Methods 0.000 description 21
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- 230000000694 effects Effects 0.000 description 11
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- 239000004411 aluminium Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
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- 239000012141 concentrate Substances 0.000 description 2
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Abstract
The utility model discloses a kind of insulating pot, including bottom of the pot wall (2) and hot plate component (1), the low thermal conductivity metallic plate (8) of nonmetallic heat conductive plate (10) and thermal conductivity factor no more than 100W/m.k that bottom of the pot wall includes the coating metal heat-conducting plate (9) of food-grade and is laminated in below coating metal heat-conducting plate, hot plate component includes electrically heated heat pipe, heat pipe coiling is conducted to coating metal heat-conducting plate installed in the bottom surface of bottom of the pot wall, the heat of heat pipe by low thermal conductivity metallic plate and nonmetallic heat conductive plate.Bottom of the pot wall is preferably the three ply board structure being laminated, include coating metal heat-conducting plate, low thermal conductivity metallic plate and nonmetallic heat conductive plate from top to bottom including coating metal heat-conducting plate from top to bottom, nonmetallic heat conductive plate and low thermal conductivity metallic plate, or three ply board structure.Due to being additionally arranged low thermal conductivity metallic plate and nonmetallic heat conductive plate in bottom of the pot wall construction, the low thermal conductivity of the two can be effectively increased bottom of the pot wall and laterally conduct heat.
Description
Technical field
The utility model belongs to household appliance technical field, in particular it relates to a kind of insulating pot.
Background technology
The bottom of the pot wall of conventional insulating pot uses the sheet metal of high thermal conductivity coefficient more, and electric hot tray is arranged on the bottom of bottom of the pot wall
Face, directly bottom of the pot wall is heated, and then the aqueous water in heating kettle.
Wherein, the thermal source of electric hot tray comes from heat pipe, and heat pipe is in surround shape more, thus only to the annular heat pipe in bottom of the pot wall
Contact area concentrates heating, and heating surface area is small, and the heating effect away from heat pipe contact area is poor, causes local heating obvious.
So, when insulating pot works, bottom of the pot bubble will be caused uneven, local bubble is intensive, grows up, and then brokenly bubble,
Produce larger noise.
Utility model content
A kind of insulating pot is provided for above-mentioned deficiency of the prior art or defect, the utility model, makes bottom of the pot heated more
Uniformly, the intensive phenomenon of local bubble is avoided, to reach noise reduction.
To achieve the above object, the utility model provides a kind of insulating pot, including bottom of the pot wall and hot plate component, the kettle
The nonmetallic heat conductive plate that bottom wall includes the coating metal heat-conducting plate of food-grade and is laminated in below the coating metal heat-conducting plate
It is not more than 100W/m.k low thermal conductivity metallic plate with thermal conductivity factor, the hot plate component includes electrically heated heat pipe, described
Installed in the bottom surface of the bottom of the pot wall, the heat of the heat pipe passes through the low thermal conductivity metallic plate and described non-for heat pipe coiling
Metal heat-conducting plate is conducted to the coating metal heat-conducting plate.
Preferably, the bottom of the pot wall is the three ply board structure of stacking, and the three ply board structure includes from top to bottom described
Coating metal heat-conducting plate, nonmetallic heat conductive plate and low thermal conductivity metallic plate, or the three ply board structure are included from top to bottom
The coating metal heat-conducting plate, low thermal conductivity metallic plate and nonmetallic heat conductive plate.
Preferably, the thickness of the low thermal conductivity metallic plate not less than 1mm and is not more than 4.4mm.
Preferably, the thickness of the nonmetallic heat conductive plate not less than 0.2mm and is not more than 2mm.
Preferably, the coating metal heat-conducting plate is that thickness is not less than 0.4mm and stainless no more than 1mm food-grade 304
Steel plate.
Preferably, the nonmetallic heat conductive plate is micro-crystal plate or ceramic wafer, and the low thermal conductivity metallic plate is 45# steel
Plate, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet.
Preferably, each laminate in the bottom of the pot wall is arranged concentric, the following table area of the nonmetallic heat conductive plate and institute
The ratio for stating the following table area of low thermal conductivity metallic plate and the top surface area of the coating metal heat-conducting plate is not less than 0.25
And no more than 1.
Preferably, the heat pipe is fixedly connected on the bottom surface of the bottom of the pot wall by substrate, and the substrate is thermal conductivity factor
High thermal conductivity coefficient metallic plate more than 100W/m.k.
Preferably, the coating metal heat-conducting plate, the nonmetallic heat conductive plate, the low thermal conductivity metallic plate and described
It is fastenedly connected between substrate by multiple fasteners.
Preferably, the insulating pot includes bottle body, is welded between the periphery of the bottom of the pot wall and the bottom periphery of the bottle body
Connection or crimping connection.
Pass through above-mentioned technical proposal, in insulating pot of the present utility model, low heat conduction is also additionally arranged in bottom of the pot wall construction
Coefficient metallic plate and nonmetallic heat conductive plate, the two is respectively provided with low thermal conductivity, can more effectively reduce the longitudinal direction heat transfer of bottom of the pot wall,
And increase laterally heat transfer, make bottom of the pot wall thermally equivalent effect more prominent, such bubble is less, and brokenly bubble noise is also smaller, i.e., electric water
The noise reduction of kettle is obvious.
Other features and advantages of the utility model will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Form a part of accompanying drawing of the present utility model to be used for providing further understanding to of the present utility model, this practicality is new
The schematic description and description of type is used to explain the utility model, does not form to improper restriction of the present utility model.
In accompanying drawing：
Fig. 1 is the entirety sectional view of insulating pot of the present utility model；
Fig. 2 and Fig. 3 is the C portion enlarged drawing in Fig. 1, respectively illustrates two kinds of connection knots between bottle body and bottom of the pot wall
Structure；
Fig. 4 is upward view when hot plate component is installed on bottom of the pot wall；
Fig. 5, Fig. 6 respectively illustrate two kinds of mounting structures between hot plate component and bottom of the pot wall；
Fig. 7 illustrates prior art medium heat disk component and changed in the heating region of bottom of the pot wall and comparable the utility model
Heating region after entering；
Fig. 8 is the bottom of the pot wall construction figure according to the insulating pot of the first preferred embodiment of the present utility model；
Fig. 9 is the bottom of the pot wall construction figure according to the insulating pot of the second preferred embodiment of the present utility model；
Figure 10 is the upward view of the bottom of the pot wall in Fig. 8 or Fig. 9；
Figure 11, Figure 12 respectively illustrate two kinds of shapes of nonmetallic heat conductive plate；
Figure 13 is the bottom of the pot wall construction figure according to the insulating pot of the 3rd preferred embodiment of the present utility model；
Figure 14 is the bottom of the pot wall construction figure according to the insulating pot of the 4th preferred embodiment of the present utility model；
Figure 15 is the bottom of the pot wall construction figure according to the insulating pot of the 5th preferred embodiment of the present utility model；
Figure 16 is the bottom of the pot wall construction figure according to the insulating pot of the 6th preferred embodiment of the present utility model；
Figure 17 to Figure 19 illustrates several different shapes and the arrangement of the insulated tank in Figure 16；And
Figure 20 and Figure 21 respectively illustrates several different shapes and the arrangement of the adiabatic holes in Figure 16.
Description of reference numerals：
The bottom of the pot wall of 1 hot plate component 2
The pot lid of 3 bottle body 4
The steam pipe of 5 shell 6
The low thermal conductivity metallic plate of 7 handle 8
The coating metal heat-conducting plate of 8 ' low thermal conductivity plate of material 9
The heat pipe of 10 nonmetallic heat conductive plate 11
The insulated tank of 12 substrate 21
The low thermal conductivity material of 22 adiabatic holes 23
The coating of 24 fastener 25
Embodiment
Specific embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.It should be appreciated that herein
Described embodiment is merely to illustrate and explained the utility model, is not limited to the utility model.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can
To be mutually combined.
In the utility model, in the case where not making opposite explanation, the noun of locality such as " upper and lower, top, bottom " used is generally
It is each part mutual alignment either on vertical, vertical or gravity direction for direction shown in the drawings
Relationship description word.
Describe the utility model in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
As shown in figure 1, the utility model provides a kind of insulating pot, including hot plate component 1 and the bottom of the pot for forming kettle body
Wall 2, bottle body 3 and pot lid 4, kettle body outside is around shell 5 and is connected with handle 7, and steam pipe 6 is provided with kettle body.In order that bottom of the pot
It is heated evenly to avoid the intensive phenomenon of local bubble, it is as shown in Figure 8, Figure 9, of the present utility model to reach the effect of noise reduction
Bottom of the pot wall 2 includes the nonmetallic heat conductive plate 10 of low thermal conductivity, and its thermal conductivity factor is usually more than 100W/m.k, and it is led certainly
Hot coefficient is also not necessarily limited to this, according to circumstances can specifically set.Hot plate component 1 is arranged on the bottom surface of bottom of the pot wall 2, hot plate component 1
Heat conducts heat upwards via nonmetallic heat conductive plate 10.So, when the heat of hot plate component 1 passes through nonmetallic heat conductive plate 10, increase
Horizontal heat transfer, increases heating surface (area) (HS, the heat transfer of bottom of the pot wall 2 everywhere is uniform, can effectively avoid local bubble is intensive from showing
As reaching the effect of noise reduction.
Referring to Fig. 4, the saved electric-heating heat-tube 11 of hot plate component 1 is generally illegally occupied in the bottom surface of bottom of the pot wall 2 with monocyclic shape, if kettle
Bottom wall 2 is using the sheet metal of conventional high thermal conductivity coefficient, then heat pipe contact region is annular shape, i.e., shown in Fig. 7 top
Present situation heating region, the region it is heated significantly, its radially inner and outer region is then heated few so that the heating of bottom of the pot wall 2 everywhere is not
, so as to produce local dense bubble, noise is obvious.And in the present invention, employ the nonmetallic heat conductive plate of low thermal conductivity
When 10, what the heat in heat pipe contact region will not be quickly transmits along thickness of slab direction, more horizontal proliferation so that Fig. 7 bottoms institute
Heating region substantially expands compared to the heating surface area of the present situation heating region on top after the improvement shown, local so as to effectively alleviate
Heating is uneven, the problem of producing local dense bubble, and noise reduction is notable.
Certainly, hot plate component 1 may also comprise the Electric radiant Heating Film for being attached to bottom of the pot wall 2, i.e. infrared heating film, or including setting
Coil panel below bottom of the pot wall 2.But heat pipe 11 is generally annular in shape, is conducted heat in a manner of thermal contact conductance, relative to the red of Electric radiant Heating Film
For the Electromagnetic Heating of external heat and coil panel, heat pipe 11 is being heated due to the characteristic of self structure and the reason of heat transfer type
During be easier heat transfer to bottom of the pot wall 2 occur it is uneven so that insulating pot easily produces very big noise, corresponding to use
After the insulating pot of heat pipes heat uses technical scheme, heat conduction uniformity and lower noise are all preferably improved.
Specifically, the bottom of the pot wall 2 of insulating pot of the present utility model is the Multilayer Structure of stacking, and Multilayer Structure is including eating
The coating metal heat-conducting plate 9 of grade and the nonmetallic heat conductive plate 10 for being laminated in the lower section of coating metal heat-conducting plate 9, hot plate component 1 are pacified
Mounted in the bottom surface of bottom of the pot wall 2, the heat of hot plate component 1 is conducted to coating metal heat-conducting plate 9 by nonmetallic heat conductive plate 10.
Fig. 8 shows the situation of individual layer nonmetallic heat conductive plate 10, and Fig. 9 then illustrates the stacking of n-layer nonmetallic heat conductive plate 10
Situation.But no matter nonmetallic heat conductive plate 10, which is monolithic or the polylith of stacking, the gross thickness of nonmetallic heat conductive plate 10, to be not less than
0.2mm and it is not more than 2mm, preferably laterally thermal effect but the thermal efficiency is nor affected on to obtain.
Preferably, the thermal conductivity factor of the through-thickness of nonmetallic heat conductive plate 10 should be not more than 100W/m.k.Further, it is non-
The horizontal thermal conductivity factor of metal heat-conducting plate 10 is not less than 100W/m.k.This nonmetallic heat conductive plate 10 can be for example micro-crystal plate or
Ceramic wafer etc..As in shape, as shown in Figure 11, Figure 12, nonmetallic heat conductive plate 10 can be circular sheet or polygon thin plate
Etc. various Reasonable Shapes.
Wherein, coating metal heat-conducting plate 9 is preferably food-grade 304 stainless steel of the thickness not less than 0.4mm and no more than 1mm
Plate, but not limited to this.Simultaneously, it should be ensured that the gross thickness of bottom of the pot wall 2 is not less than 1mm and is not more than 5mm, is maintained at rational thickness
In the range of degree.
When plate is laminated, coating metal heat-conducting plate 9 and nonmetallic heat conductive plate 10 are preferably arranged concentric.Now, non-gold
Belong to the ratio of the following table area of heat-conducting plate 10 and the top surface area of coating metal heat-conducting plate 9 not less than 0.25 and no more than 1, so that
Obtain nonmetallic heat conductive plate 10 to be able to cover hot plate component 1, obtain preferably horizontal thermal balance effect.
Wherein, hot plate component 1 includes heat pipe 11, and as shown in Figure 5, Figure 6, heat pipe 11 can be directly welded in the bottom of bottom of the pot wall 2
Portion, also can by substrate 12 by weld or fastener etc. in a manner of be fixedly connected on the bottom surface of bottom of the pot wall 2, generally, heat pipe 11, substrate
12nd, it is preferably soldering connection between bottom of the pot wall 2.Wherein, substrate 12 is usually the high heat conduction system that thermal conductivity factor is more than 100W/m.k
Number metallic plate 9, such as copper coin, aluminium sheet, thickness direction heat conduction is fast, facilitates the installation of heat pipe 11, but has substantially no effect on heat pipe
Heat transfer.It is well known by those skilled in the art that generally there is dry combustion method piece on substrate 12, the purpose for preventing dry combustion method may also function as.
After plate stacking, referring to Figure 10, it can pass through between coating metal heat-conducting plate 9, nonmetallic heat conductive plate 10 and substrate 12
Multiple fasteners 24 (such as housing screw) are fastenedly connected so that stacking plate compacting compresses, and forms reliable and stable plane each other
Contact, in favor of heat transfer.
In addition, bottom of the pot wall 2 and the sealed connection of bottle body 3, ensure that water is not spilt.As shown in Figure 1 and Figure 2, the bottom of the pot of insulating pot
Can be tightly connected by flanging compression joint technique between the periphery of wall 2 and the bottom periphery of bottle body 3, i.e. the periphery of bottom of the pot wall 2
Compressed with the bottom periphery of bottle body 3 and crimping folding be around in labyrinth-like, good seal performance, and connect it is firm.Or as shown in figure 3, two
Person can also be welded directly together by base weld seam, or even can be connected together by the top layer weld seam weldering of bottom of the pot wall 2.
During experiment, using the coating metal heat-conducting plate 9 shown in Fig. 8 and the individual layer being laminated in below coating metal heat-conducting plate 9
The bottom of the pot wall construction of nonmetallic heat conductive plate 10, coating metal heat-conducting plate 9 therein are the 0.6mm stainless steel plate of food-grade 304,
The micro-crystal plate and ceramic wafer of different-thickness is respectively adopted in nonmetallic heat conductive plate 10.
Wherein, heating power：1800W, water in kettle：1.7L, the minimum thermal efficiency value of insulating pot should be not less than 80%.
Testing procedure：
1) maximum scale water, is put into kettle；
2), temperature sensor is placed in the middle of the height of water level at kettle center；
3), timing measuring is started by "start" button；
4) timing measuring is stopped when, water temperature rises to 80 DEG C in kettle；
5) sound power value≤45dB noise figure, is rejected, A weighteds are carried out to test noise value, take average acoustical power conduct
Decision content.
Noise data when insulating pot works is obtained respectively such as lower section Tables 1 and 2.
Table 1：Corresponding noise data and thermal efficiency value data under micro-crystal plate different-thickness
| Bottom wall thickness | Maximum acoustical power/dB | Average acoustical power/dB | Thermal efficiency value |
| 0.2mm | 71 | 65 | 89.8% |
| 0.5mm | 68 | 62 | 87.9% |
| 0.7mm | 64 | 61 | 86.1% |
| 1.0mm | 62 | 60 | 85.3% |
| 1.5mm | 50 | 58 | 83% |
| 2mm | 58 | 56 | 80.1% |
| 2.5mm | 57 | 54 | 78.4% |
| 3mm | 57.5 | 53.5 | 76.2% |
Table 2：Corresponding noise data and thermal efficiency value data under ceramic wafer different-thickness
Comparably, the noise data such as table 3 during the insulating pot work of aluminium sheet bottom of the pot wall can be obtained with similarity condition.
Table 3：Corresponding noise data of the aluminium sheet under different-thickness
| Bottom wall thickness | Maximum acoustical power/dB | Average acoustical power/dB |
| 1mm | 67.5 | 64.6 |
| 2mm | 67.9 | 64.0 |
| 3mm | 66.8 | 64.7 |
| 4mm | 67.3 | 64.9 |
| 5mm | 66.5 | 63.5 |
Wherein, the thermal efficiency value of the aluminium sheet of above-mentioned thickness is maintained at more than 87% high position, and thickness effect is not notable, greatly
In the minimum thermal efficiency value of insulating pot design.
Obviously, either micro-crystal plate and ceramic wafer, during its wall thickness increase, noise reduction is all obvious, certain thermal efficiency value
Decline.For high thermal conductivity coefficient metallic plate, such as conventional aluminium sheet etc., noise reduction is notable.Under condition of equivalent thickness, aluminium sheet
Noise much larger than the present invention.
With reference to the thermal efficiency value (be not less than minimum design requirement 80%) of insulating pot design, nonmetallic heat conductive is chosen
The gross thickness of plate 10 is preferably between 0.2mm~2mm scopes.
In the other two embodiment shown in Figure 13, Figure 14, the bottom of the pot wall 2 of its insulating pot includes the top layer gold of food-grade
Category heat-conducting plate 9 and the nonmetallic heat conductive plate 10 being laminated in below coating metal heat-conducting plate 9 and thermal conductivity factor are not more than 100W/
M.k low thermal conductivity metallic plate 8, hot plate component 1 are arranged on the bottom surface of bottom of the pot wall 2, and the heat of hot plate component 1 passes through low heat conduction
Coefficient metallic plate 8 and nonmetallic heat conductive plate 10 are conducted to coating metal heat-conducting plate 9.
Embodiment compared to Fig. 8, Fig. 9, low thermal conductivity metallic plate 8 is additionally arranged in bottom of the pot wall construction herein, with
Longitudinal direction heat transfer is further reduced, increases laterally heat transfer, makes bottom of the pot wall thermally equivalent effect more prominent.
Wherein, it is contemplated that the wall thickness of bottom of the pot wall and the Rational Thickness for being easy to processing of individual layer plate, bottom of the pot wall 2 are preferably
The three ply board structure of stacking, is also not necessarily limited to this certainly.Such as Figure 13, this three ply board structure includes coating metal from top to bottom
Heat-conducting plate 9, nonmetallic heat conductive plate 10 and low thermal conductivity metallic plate 8.Or such as Figure 14, the three ply board structure may also comprise by
Coating metal heat-conducting plate 9, low thermal conductivity metallic plate 8 and nonmetallic heat conductive plate 10 under up to.In other words, except coating metal
The position stacked on top of one another of heat-conducting plate 9, remaining nonmetallic heat conductive plate 10 and low thermal conductivity metallic plate 8 is not particularly limited.
Wherein, each laminate thickness should not be excessive, and the thickness of low thermal conductivity metallic plate 8 is not less than 1mm and to be not more than
4.4mm is advisable, and the thickness of nonmetallic heat conductive plate 10 should also be not less than 0.2mm and be not more than 2mm.Preferably, coating metal heat conduction
Plate 9 is common food level 304 stainless steel plate of the thickness not less than 0.4mm and no more than 1mm.
In selection, micro-crystal plate or ceramic wafer etc. can be selected in nonmetallic heat conductive plate 10, and low thermal conductivity metallic plate 8 can be selected
45# steel plates, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet etc..
In stacking, each laminate in bottom of the pot wall 2 is preferably arranged concentric.Now, to cover heat pipe 11, obtain preferable
Horizontal thermal balance effect, nonmetallic heat conductive plate 10, the area of low thermal conductivity metallic plate 8 are sufficiently large.Preferably, it is nonmetallic to lead
The ratio between top surface area of the following table area of hot plate 10 and the following table area of low thermal conductivity metallic plate 8 and coating metal heat-conducting plate 9
Value is not less than 0.25 and no more than 1.
During experiment, bottom of the pot wall 2 individually uses low thermal conductivity metallic plate 8, such as common 304 stainless steel plate of nonfood grade,
Under different-thickness, its noise data such as table 4 below is measured.Wherein, it is identical with above-mentioned experiment that process, parameter are tested, is repeated no more.
Table 4：Corresponding noise data and thermal efficiency value of common 304 stainless steel plate under different-thickness
It can be seen that compared to the high thermal conductivity coefficient metallic plate such as conventional aluminium sheet, under condition of equivalent thickness, low thermal conductivity metallic plate 8
Noise reduction is it is also obvious that slightly not as good as nonmetallic heat conductive plate.But low thermal conductivity metallic plate 8 and nonmetallic heat conductive flaggy it is folded with
When forming bottom of the pot wall, it is equally beneficial for obtaining more preferable horizontal thermal balance effect, and then eliminates local heat conduction on bottom of the pot wall and concentrate
The intensive bubble formed, obtains good noise reduction.
In the other two embodiment shown in Figure 15, Figure 16, the bottom of the pot wall 2 of insulating pot is not more than including thermal conductivity factor
The coating of 100W/m.k low thermal conductivity plate of material 8 ' and formation in the food-grade of the upper surface of low thermal conductivity plate of material 8 '
25, the bottom that hot plate component 1 is arranged on low thermal conductivity plate of material 8 ' is heated.
Embodiment compared to Fig. 8, top layer metal heat-conducting plate 9 is substituted with coating 25 in bottom of the pot wall construction herein, it is low
Thermal conductivity factor plate of material 8 ' is relatively thick plate, is not limited to low thermal conductivity metallic plate or other non-metal boards.
Utilize the low heat conductivity energy of the thickness direction of low thermal conductivity plate of material 8 ' so that the bottom of low thermal conductivity plate of material 8 '
The heat in the heat pipe contact region in face will not conduct heat along thickness of slab direction set, and can transversely spread, and expand heating surface area, with
Alleviate that local heating is uneven, the problem of producing local dense bubble.
Generally without the special processing and not up to food-grade of low thermal conductivity plate of material 8 ', coating of its upper surface for this
25 can be effectively isolated contact of the low thermal conductivity plate of material 8 ' with water, prevent to chemically react, it is ensured that the peace of insulating pot product
Entirely.
In addition, 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or potassium steel can be selected in low thermal conductivity plate of material 8 '
Plate etc., the upper table surface roughness of these sheet materials generally have 3 μm~8 μm, after coating 25 covers, add low thermal conductivity plate of material
8 ' upper surface smoothness, more gloss.
Conventional food-grade polytetrafluorethylecoatings coatings or ceramic coating etc. can be selected in coating 25, and other nanometers also can be selected
Coating etc..Wherein, the thickness of coating 25 is typically small, preferably not less than 50 μm and the scope no more than 1000 μm.Coating 25
Thickness is small so that the thickness of low thermal conductivity plate of material 8 ' can be relatively larger, its thickness can span it is bigger.For example,
The thickness of low thermal conductivity plate of material 8 ' can be not less than 1mm and no more than optimum option in the range of 5mm, to take into account the thermal efficiency
It is harmonious with laterally heat transfer.
In addition, the upper surface of low thermal conductivity plate of material 8 ' can also be intervally distributed with multiple adiabatic holes 22 and/or insulated tank
21, as shown in figure 16.When offering adiabatic holes 22 and/or insulated tank 21, coating 25 can be filled in wherein, and adhesive force is more preferable.And
And coating 25 from than the more low thermal conductivity of low thermal conductivity plate of material 8 ' material when, be filled in adiabatic holes 22 and/or thermal insulation
The coating 25 of groove 21 can increase the overall heat conduction difficulty of bottom of the pot wall through-thickness, that is, reduce longitudinal direction heat transfer, increase laterally heat transfer,
Contribute to horizontal heat conduction balanced.Certainly, it is possible to use than the low thermal conductivity of the more low thermal conductivity of low thermal conductivity plate of material 8 '
Material 23 is directly filled in adiabatic holes 22 and/or insulated tank 21, then seal coat 25, can also obtain above-mentioned corresponding effect.
Wherein, consider with reference to the thickness of low thermal conductivity plate of material 8 ', the depth one of adiabatic holes 22 and/or insulated tank 21
As not less than 0.1mm and be not more than 0.5mm.
When design, processing, the upper surface of adiabatic holes 22 and/or insulated tank 21 preferably about low thermal conductivity plate of material 8 '
Central distribution, and the distribution area of adiabatic holes 22 and/or insulated tank 21 in upper surface is more than the heat pipe 11 in hot plate component 1
It is as shown in figure 16, balanced to promote horizontal heat conduction around area.
Referring to Figure 17, Figure 18, insulated tank 21 is preferably circular or square annular groove, radially spaced multiple annular grooves
Distribution is in concentric circles or concentric boxes shape；Or as shown in figure 19, insulated tank 21 is straight trough, the multiple straight troughs being spaced successively
Distribution is in grid-like.Likewise, adiabatic holes 22 can be uniform shown in uniform small sircle hole or Figure 21 shown in Figure 20
Small square hole, and be blind hole blind slot.
In addition, in the same manner, as shown in Figure 5, Figure 6, the heat pipe 11 of hot plate component 1 is solderable to be connected to low thermal conductivity plate of material 8 '
Bottom surface, or also can by substrate 12 by weld or fastener etc. in a manner of be fixedly connected on the bottom of low thermal conductivity plate of material 8 '
Face, the preferably thermal conductivity factor of substrate 12 are more than 100W/m.k high thermal conductivity coefficient metallic plate, such as aluminium sheet, copper coin.It is in addition, electric
Between the periphery of the bottom of the pot wall 2 of kettle and the bottom periphery of bottle body 3 can using Fig. 3 be welded to connect or Fig. 2 crimping connection, to obtain
Preferable sealing effectiveness and structural durability are obtained, is not repeated carefully to state herein.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Utility model spirit and principle within, any modification, equivalent substitution and improvements made etc., for example, adiabatic holes 22 and/or absolutely
Heat channel 21 can be regularly arranged hole slot and the conventional shape hole slot as shown in Figure 20 to Figure 21, it is apparent that can also be irregular
Irregularly-shaped hole, special-shaped slot etc., its arrangement mode is also not necessarily limited to regular fashion, and such change should be included in the utility model
Protection domain within.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, it can be combined by any suitable means, in order to avoid unnecessary repetition, the utility model is to each
The possible combination of kind no longer separately illustrates.
In addition, it can also be combined between a variety of embodiments of the present utility model, as long as it is not disobeyed
Thought of the present utility model is carried on the back, it should equally be considered as content disclosed in the utility model.
Claims (10)
1. a kind of insulating pot, it is characterised in that the insulating pot includes bottom of the pot wall (2) and hot plate component (1), the bottom of the pot wall
(2) the coating metal heat-conducting plate (9) including food-grade and be laminated in below the coating metal heat-conducting plate (9) nonmetallic lead
Hot plate (10) and thermal conductivity factor are not more than 100W/m.k low thermal conductivity metallic plate (8), and the hot plate component (1) includes electricity and added
The heat pipe (11) of heat, heat pipe (11) coiling pass through installed in the bottom surface of the bottom of the pot wall (2), the heat of the heat pipe (11)
The low thermal conductivity metallic plate (8) and the nonmetallic heat conductive plate (10) are conducted to the coating metal heat-conducting plate (9).
2. insulating pot according to claim 1, it is characterised in that the bottom of the pot wall (2) for stacking three ply board structure, institute
Stating three ply board structure includes the coating metal heat-conducting plate (9), nonmetallic heat conductive plate (10) and low thermal conductivity from top to bottom
Metallic plate (8), or the three ply board structure include the coating metal heat-conducting plate (9) from top to bottom, low thermal conductivity gold
Belong to plate (8) and nonmetallic heat conductive plate (10).
3. insulating pot according to claim 2, it is characterised in that the thickness of the low thermal conductivity metallic plate (8) is not small
In 1mm and it is not more than 4.4mm.
4. insulating pot according to claim 2, it is characterised in that the thickness of the nonmetallic heat conductive plate (10) is not less than
0.2mm and it is not more than 2mm.
5. insulating pot according to claim 1, it is characterised in that the coating metal heat-conducting plate (9) is not less than for thickness
0.4mm and the stainless steel plate of food-grade 304 no more than 1mm.
6. insulating pot according to claim 1, it is characterised in that the nonmetallic heat conductive plate (10) be heat conduction micro-crystal plate or
Ceramic wafer, the low thermal conductivity metallic plate (8) are 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet.
7. the insulating pot according to any one in claim 1~6, it is characterised in that each layer in the bottom of the pot wall (2)
Plate is arranged concentric, the following table area of the nonmetallic heat conductive plate (10) and the lower surface of the low thermal conductivity metallic plate (8)
The ratio of product and the top surface area of the coating metal heat-conducting plate (9) is not less than 0.25 and no more than 1.
8. the insulating pot according to any one in claim 1~6, it is characterised in that the heat pipe (11) passes through substrate
(12) bottom surface of the bottom of the pot wall (2) is fixedly connected on, the substrate (12) is the high heat conduction that thermal conductivity factor is more than 100W/m.k
Coefficient metallic plate.
9. insulating pot according to claim 8, it is characterised in that the coating metal heat-conducting plate (9), described nonmetallic lead
It is fastenedly connected between hot plate (10), the low thermal conductivity metallic plate (8) and the substrate (12) by multiple fasteners (24).
10. insulating pot according to claim 1, it is characterised in that the insulating pot includes bottle body (3), the bottom of the pot wall
(2) it is welded to connect between periphery and the bottom periphery of the bottle body (3) or crimping is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621493426.6U CN206729740U (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621493426.6U CN206729740U (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206729740U true CN206729740U (en) | 2017-12-12 |
Family
ID=60556009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621493426.6U Expired - Fee Related CN206729740U (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206729740U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108261069A (en) * | 2016-12-30 | 2018-07-10 | 佛山市顺德区美的电热电器制造有限公司 | Insulating pot |
| CN115120092A (en) * | 2022-06-14 | 2022-09-30 | 广州大学 | Electric kettle capable of preventing bottom from being rapidly corroded and corrosion preventing method |
-
2016
- 2016-12-30 CN CN201621493426.6U patent/CN206729740U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108261069A (en) * | 2016-12-30 | 2018-07-10 | 佛山市顺德区美的电热电器制造有限公司 | Insulating pot |
| CN115120092A (en) * | 2022-06-14 | 2022-09-30 | 广州大学 | Electric kettle capable of preventing bottom from being rapidly corroded and corrosion preventing method |
| CN115120092B (en) * | 2022-06-14 | 2024-02-27 | 广州大学 | Electric kettle capable of preventing bottom from being corroded rapidly and corrosion preventing method |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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| CF01 | Termination of patent right due to non-payment of annual fee |