CN108261067A - Insulating pot - Google Patents
Insulating pot Download PDFInfo
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- CN108261067A CN108261067A CN201611260345.6A CN201611260345A CN108261067A CN 108261067 A CN108261067 A CN 108261067A CN 201611260345 A CN201611260345 A CN 201611260345A CN 108261067 A CN108261067 A CN 108261067A
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- Prior art keywords
- thermal conductivity
- plate
- low thermal
- insulating pot
- coating
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- 239000000463 material Substances 0.000 claims abstract description 55
- 238000000576 coating method Methods 0.000 claims abstract description 46
- 239000011248 coating agent Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000010965 430 stainless steel Substances 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 3
- 229910000617 Mangalloy Inorganic materials 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 24
- 238000010276 construction Methods 0.000 abstract description 11
- 238000005524 ceramic coating Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 11
- 238000012546 transfer Methods 0.000 description 11
- 239000010963 304 stainless steel Substances 0.000 description 8
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000013081 microcrystal Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 238000009841 combustion method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/21—Water-boiling vessels, e.g. kettles
- A47J27/21008—Water-boiling vessels, e.g. kettles electrically heated
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
- A47J36/04—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay the materials being non-metallic
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/24—Warming devices
- A47J36/2483—Warming devices with electrical heating means
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Cookers (AREA)
Abstract
The invention discloses a kind of insulating pots, including bottom of the pot wall (2) and hot plate component (1), bottom of the pot wall includes low thermal conductivity plate of material (8 ') of the thermal conductivity factor no more than 100W/m.k and is formed in the coating (25) of the food-grade of the upper surface of low thermal conductivity plate of material, and hot plate component is mounted on the bottom of low thermal conductivity plate of material.Coating is food-grade polytetrafluorethylecoatings coatings or ceramic coating, and thickness is not less than 50 μm and no more than 1000 μm.The upper surface of low thermal conductivity plate of material is intervally distributed with multiple adiabatic holes (22) and/or insulated tank (21), and coating can be filled in hole slot.The bottom of the pot wall construction of the insulating pot of the present invention employs low thermal conductivity plate of material and its face coat, it may be such that the heat of bottom heat pipe will not be concentrated along plate thickness direction to conduct heat, and it can transversely spread, expand the lateral heating surface area of bottom of the pot wall, so as to solve the problems, such as local dense bubble and brokenly bubble noise.
Description
Technical field
The invention belongs to household appliance technical fields, and in particular, to a kind of insulating pot.
Background technology
The bottom of the pot wall of conventional insulating pot uses the sheet metal of high thermal conductivity coefficient more, and electric hot tray is mounted on the bottom of bottom of the pot wall
Bottom of the pot wall is directly heated in face, and then the liquid water in heating kettle.
Wherein, the heat source of electric hot tray comes from heat pipe, and heat pipe is in surround shape more, thus only to the heat pipe of the annular in bottom of the pot wall
Contact area concentrates heating, and heating surface area is small, and the heating effect far from heat pipe contact area is poor, causes local heating apparent.
In this way, when insulating pot works, bottom of the pot bubble will be caused uneven, local bubble is intensive, grows up, and then brokenly bubble,
Generate larger noise.
Invention content
For above-mentioned insufficient or defect of the prior art, the present invention provides a kind of insulating pot, bottom of the pot is made to be heated evenly,
The phenomenon that avoiding local bubble intensive, to reach noise reduction.
To achieve the above object, the present invention provides a kind of insulating pots, including bottom of the pot wall and hot plate component, the bottom of the pot wall
Including low thermal conductivity plate of material of the thermal conductivity factor no more than 100W/m.k and it is formed in the upper of the low thermal conductivity plate of material
The coating of the food-grade on surface, the hot plate component are mounted on the bottom of the low thermal conductivity plate of material.
Preferably, the thickness of the coating is not less than 50 μm and no more than 1000 μm.
Preferably, the coating is food-grade polytetrafluorethylecoatings coatings or ceramic coating.
Preferably, the thickness of the low thermal conductivity plate of material is not less than 1mm and no more than 5mm.
Preferably, the upper table surface roughness of the low thermal conductivity plate of material is 3 μm~8 μm.
Preferably, the low thermal conductivity plate of material is 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or potassium steel
Plate.
Preferably, the upper surface of the low thermal conductivity plate of material is intervally distributed with multiple adiabatic holes and/or insulated tank.
Preferably, the depth of the adiabatic holes and/or insulated tank is not less than 0.1mm and no more than 0.5mm.
Preferably, thermal conductivity factor is filled with less than the low thermal conductivity plate of material in the adiabatic holes and/or insulated tank
Low thermal conductivity material.
Preferably, the adiabatic holes and/or insulated tank are around the center of the upper surface of the low thermal conductivity plate of material point
Cloth, and the distribution area of the adiabatic holes and/or insulated tank in the upper surface is more than the ring of the heat pipe in the hot plate component
Around area.
Preferably, the insulated tank is round or rectangular annular groove, and radially spaced multiple annular groove distributions are in
Concentric circles or concentric boxes shape；Alternatively, the insulated tank is straight trough, the multiple straight trough distributions being spaced successively are in grid
Shape.
Preferably, the hot plate component includes heat pipe, and the heat pipe is welded in the bottom surface of the low thermal conductivity plate of material,
Or the heat pipe is fixedly connected on the bottom surface of the low thermal conductivity plate of material by substrate, the substrate is big for thermal conductivity factor
In the high thermal conductivity coefficient metallic plate of 100W/m.k.
Preferably, the insulating pot includes bottle body, is welded between the periphery of the bottom of the pot wall and the bottom periphery of the bottle body
Connection or crimping connection.
Through the above technical solutions, in the insulating pot of the present invention, bottom of the pot wall construction employs low thermal conductivity plate of material
And its coating of surface coating, using low thermal conductivity plate of material in the low heat conductivity energy of thickness direction, it may be such that low heat conduction system
The heat in the heat pipe contact region of number plate of material bottom surface will not be concentrated along plate thickness direction to conduct heat, and can transversely spread, and makes bottom of the pot
The lateral heating surface area of wall expands, and solves the local dense bubble of generation and asking for brokenly bubble noise due to local heating unevenness
Topic, can obtain preferable noise reduction.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Description of the drawings
The attached drawing for forming the part of the present invention is used to provide further understanding of the present invention, schematic reality of the invention
Example and its explanation are applied for explaining the present invention, is not constituted improper limitations of the present invention.In the accompanying drawings：
Fig. 1 is the entirety sectional view of the insulating pot of the present invention；
Fig. 2 and Fig. 3 is the C portion enlarged drawing in Fig. 1, respectively illustrates two kinds of connection structures between bottle body and bottom of the pot wall；
Fig. 4 is bottom view when hot plate component is installed on bottom of the pot wall；
Fig. 5, Fig. 6 respectively illustrate two kinds of mounting structures between hot plate component and bottom of the pot wall；
Fig. 7 illustrates prior art medium heat disk component after the heating region of bottom of the pot wall and the comparable present invention improve
Heating region；
Fig. 8 is the bottom of the pot wall construction figure according to the insulating pot of the first preferred embodiment of the present invention；
Fig. 9 is the bottom of the pot wall construction figure according to the insulating pot of the second preferred embodiment of the present invention；
Figure 10 is the bottom view of the bottom of the pot wall in Fig. 8 or Fig. 9；
Figure 11, Figure 12 respectively illustrate two kinds of shapes of nonmetallic heat conductive plate；
Figure 13 is the bottom of the pot wall construction figure according to the insulating pot of the third preferred embodiment of the present invention；
Figure 14 is the bottom of the pot wall construction figure according to the insulating pot of the 4th preferred embodiment of the present invention；
Figure 15 is the bottom of the pot wall construction figure according to the insulating pot of the 5th preferred embodiment of the present invention；
Figure 16 is the bottom of the pot wall construction figure according to the insulating pot of the 6th preferred embodiment of the present invention；
Figure 17 to Figure 19 illustrates several different shapes and the arrangement of the insulated tank in Figure 16；And
Figure 20 and Figure 21 respectively illustrates several different shapes and the arrangement of the adiabatic holes in Figure 16.
Reference sign：
1 hot plate component, 2 bottom of the pot wall
3 bottle body, 4 pot lid
5 shell, 6 steam pipe
7 handle, 8 low thermal conductivity metallic plate
8 ' low thermal conductivity plate of material, 9 coating metal heat-conducting plate
10 nonmetallic heat conductive plate, 11 heat pipe
12 substrate, 21 insulated tank
22 adiabatic holes, 23 low thermal conductivity material
24 fastener, 25 coating
Specific embodiment
The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In the present invention, in the case where not making to illustrate on the contrary, the noun of locality such as " upper and lower, top, bottom " used is typically needle
For direction shown in the drawings either for it is vertical, on vertical or gravity direction for each component mutual alignment relation
Word is described.
The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
As shown in Figure 1, the present invention provides a kind of insulating pot, the bottom of the pot wall 2 including hot plate component 1 and composition kettle body,
Bottle body 3 and pot lid 4, kettle body outside is around shell 5 and is connected with handle 7, and steam pipe 6 is equipped in kettle body.In order to which bottom of the pot is made to be heated
Evenly, the phenomenon that avoiding local bubble intensive, to achieve the effect that noise reduction, as shown in Figure 8, Figure 9, bottom of the pot wall 2 of the invention
Include the nonmetallic heat conductive plate 10 of low thermal conductivity, thermal conductivity factor is usually more than 100W/m.k, its certain thermal conductivity factor
This is also not necessarily limited to, according to circumstances can specifically be set.Hot plate component 1 is mounted on the bottom surface of bottom of the pot wall 2, the heat warp of hot plate component 1
It is conducted heat upwards by nonmetallic heat conductive plate 10.In this way, when the heat of hot plate component 1 passes through nonmetallic heat conductive plate 10, transverse direction is increased
Heat transfer, increases heating surface (area) (HS, the heat transfer of bottom of the pot wall 2 everywhere is uniform, can effectively avoid the phenomenon that local bubble is intensive, reaches drop
The effect made an uproar.
Referring to Fig. 4, the saved electric-heating heat-tube 11 of hot plate component 1 is usually illegally occupied with monocyclic shape in the bottom surface of bottom of the pot wall 2, if bottom of the pot
Wall 2 is using the sheet metal of conventional high thermal conductivity coefficient, then heat pipe contact region is annular shape, i.e. showing shown in the top of Fig. 7
Shape heating region, the region it is heated significantly, radially inner and outer region is then heated few so that the heating of bottom of the pot wall 2 everywhere is uneven,
So as to generate local dense bubble, noise is apparent.And in the present invention, employ the nonmetallic heat conductive plate 10 of low thermal conductivity
When, what the heat in heat pipe contact region will not be quickly transmits along plate thickness direction, more horizontal proliferation so that shown in Fig. 7 lower parts
Improvement after heating region significantly expand compared to the heating surface area of the present situation heating region on top, so as to effectively alleviate part plus
It is hot uneven, local dense bubble is led to the problem of, noise reduction is notable.
Certainly, hot plate component 1 may also comprise the Electric radiant Heating Film for being attached to bottom of the pot wall 2, i.e. infrared heating film or including setting
Coil panel below bottom of the pot wall 2.But heat pipe 11 is usually annular in shape, is conducted heat in a manner of thermal contact conductance, relative to the red of Electric radiant Heating Film
For the electromagnetic heating of external heat and coil panel, heat pipe 11 is being heated due to the characteristic of self structure and the reason of heat transfer type
It is easier to occur in the process uneven to the heat transfer of bottom of the pot wall 2 so that insulating pot easily generates very big noise, corresponding heat
After the insulating pot technical solution using the present invention of pipe heating, heat conduction uniformity and lower noise are all preferably improved.
Specifically, the bottom of the pot wall 2 of insulating pot of the invention is the Multilayer Structure being laminated, and Multilayer Structure includes food-grade
Coating metal heat-conducting plate 9 and be laminated in the nonmetallic heat conductive plate 10 of the lower section of coating metal heat-conducting plate 9, hot plate component 1 is mounted on
The bottom surface of bottom of the pot wall 2, the heat of hot plate component 1 are conducted by nonmetallic heat conductive plate 10 to coating metal heat-conducting plate 9.
Fig. 8 shows the situation of individual layer nonmetallic heat conductive plate 10, and Fig. 9 then illustrates the stacking of n-layer nonmetallic heat conductive plate 10
Situation.But no matter nonmetallic heat conductive plate 10 should be not less than for monolithic or the polylith of stacking, the overall thickness of nonmetallic heat conductive plate 10
0.2mm and no more than 2mm preferable laterally thermal effect but nor affects on the thermal efficiency to obtain.
Preferably, the thermal conductivity factor of 10 through-thickness of nonmetallic heat conductive plate should be not more than 100W/m.k.Further, it is non-
The lateral thermal conductivity factor of metal heat-conducting plate 10 is not less than 100W/m.k.This nonmetallic heat conductive plate 10 can be for example micro-crystal plate or
Ceramic wafer etc..As in shape, as shown in Figure 11, Figure 12, nonmetallic heat conductive plate 10 can be circular sheet or polygon thin plate
Etc. various Reasonable Shapes.
Wherein, coating metal heat-conducting plate 9 is preferably food-grade 304 stainless steel of the thickness not less than 0.4mm and no more than 1mm
Plate, but not limited to this.Simultaneously, it should be ensured that the overall thickness of bottom of the pot wall 2 is maintained at rational thickness not less than 1mm and no more than 5mm
In the range of.
When plate is laminated, coating metal heat-conducting plate 9 and nonmetallic heat conductive plate 10 are preferably arranged concentric.At this point, non-gold
Belong to the ratio of the following table area of heat-conducting plate 10 and the top surface area of coating metal heat-conducting plate 9 not less than 0.25 and no more than 1, so that
It obtains nonmetallic heat conductive plate 10 to be able to cover hot plate component 1, obtains preferable lateral thermal balance effect.
Wherein, hot plate component 1 includes heat pipe 11, and as shown in Figure 5, Figure 6, heat pipe 11 can be directly welded in the bottom of bottom of the pot wall 2
Portion, also can by substrate 12 by weld or fastener etc. in a manner of be fixedly connected on the bottom surface of bottom of the pot wall 2, in general, heat pipe 11, substrate
12nd, it is preferably soldering connection between bottom of the pot wall 2.Wherein, substrate 12 is usually the high heat conduction system that thermal conductivity factor is more than 100W/m.k
Number metallic plate 9, such as copper coin, aluminium sheet, thickness direction heat conduction is fast, facilitates the installation of heat pipe 11, but has substantially no effect on heat pipe
Heat transfer.It is well known by those skilled in the art that usually having dry combustion method piece on substrate 12, the purpose for preventing dry combustion method may also function as.
After plate is laminated, referring to Figure 10, it can pass through between coating metal heat-conducting plate 9, nonmetallic heat conductive plate 10 and substrate 12
Multiple fasteners 24 (such as housing screw) are fastenedly connected so that plate compacting is laminated and compresses, forms reliable and stable plane each other
Contact, in favor of heat transfer.
In addition, bottom of the pot wall 2 and the sealed connection of bottle body 3, ensure that water does not leak out.As shown in Figure 1 and Figure 2, the bottom of the pot of insulating pot
Can be tightly connected by flanging compression joint technique between the periphery of wall 2 and the bottom periphery of bottle body 3, i.e. the periphery of bottom of the pot wall 2
Compressed with the bottom periphery of bottle body 3 and crimping folding be around in labyrinth-like, good seal performance, and connect it is firm.Alternatively, as shown in figure 3, two
Person can also be welded directly together by base weld seam or even can be connected together by the surface layer weld seam weldering of bottom of the pot wall 2.
During experiment, using coating metal heat-conducting plate 9 shown in Fig. 8 and the individual layer being laminated in below coating metal heat-conducting plate 9
The bottom of the pot wall construction of nonmetallic heat conductive plate 10, coating metal heat-conducting plate 9 therein is 304 stainless steel plate of food-grade of 0.6mm, non-
The micro-crystal plate and ceramic wafer of different-thickness is respectively adopted in metal heat-conducting plate 10.
Wherein, heating power：1800W, water in pot：1.7L, the minimum thermal efficiency value of insulating pot should be not less than 80%.
Testing procedure：
1) maximum scale water, is put into pot；
2), temperature sensor is placed in the middle of the height of water level at kettle center；
3), start timing measuring by "start" button；
4) stop timing measuring when, water temperature rises to 80 DEG C in pot；
5) noise figure of sound power value≤45dB, is rejected, A weighteds are carried out to test noise value, take average acoustical power conduct
Decision content.
Noise data when insulating pot works is obtained respectively such as lower section Tables 1 and 2.
Table 1：Correspondence noise data and thermal efficiency value data under micro-crystal plate different-thickness
| Bottom wall thickness | Maximum acoustical power/dB | Average acoustical power/dB | Thermal efficiency value |
| 0.2mm | 71 | 65 | 89.8% |
| 0.5mm | 68 | 62 | 87.9% |
| 0.7mm | 64 | 61 | 86.1% |
| 1.0mm | 62 | 60 | 85.3% |
| 1.5mm | 50 | 58 | 83% |
| 2mm | 58 | 56 | 80.1% |
| 2.5mm | 57 | 54 | 78.4% |
| 3mm | 57.5 | 53.5 | 76.2% |
Table 2：Correspondence noise data and thermal efficiency value data under ceramic wafer different-thickness
Comparably, the noise data such as table 3 during the insulating pot work of aluminium sheet bottom of the pot wall can be obtained with similarity condition.
Table 3：Correspondence noise data of the aluminium sheet under different-thickness
| Bottom wall thickness | Maximum acoustical power/dB | Average acoustical power/dB |
| 1mm | 67.5 | 64.6 |
| 2mm | 67.9 | 64.0 |
| 3mm | 66.8 | 64.7 |
| 4mm | 67.3 | 64.9 |
| 5mm | 66.5 | 63.5 |
Wherein, the thermal efficiency value of the aluminium sheet of above-mentioned thickness is maintained at more than 87% high position, and thickness effect is not notable, greatly
In the minimum thermal efficiency value of insulating pot design.
Obviously, either micro-crystal plate and ceramic wafer, during wall thickness increase, noise reduction is all apparent, certain thermal efficiency value
Decline.For high thermal conductivity coefficient metallic plate, such as conventional aluminium sheet etc., noise reduction is notable.Under condition of equivalent thickness, aluminium sheet
Noise much larger than the present invention.
With reference to the thermal efficiency value (be not less than minimum design requirement 80%) of insulating pot design, nonmetallic heat conductive is chosen
The overall thickness of plate 10 is preferably between 0.2mm~2mm ranges.
In the other two embodiment shown in Figure 13, Figure 14, the bottom of the pot wall 2 of insulating pot includes the surface layer gold of food-grade
The nonmetallic heat conductive plate 10 and thermal conductivity factor for belonging to heat-conducting plate 9 and being laminated in below coating metal heat-conducting plate 9 are not more than 100W/
The low thermal conductivity metallic plate 8 of m.k, hot plate component 1 are mounted on the bottom surface of bottom of the pot wall 2, and the heat of hot plate component 1 passes through low heat conduction
Coefficient metallic plate 8 and nonmetallic heat conductive plate 10 are conducted to coating metal heat-conducting plate 9.
Embodiment compared to Fig. 8, Fig. 9 is additionally arranged low thermal conductivity metallic plate 8 in bottom of the pot wall construction herein, with
Longitudinal heat transfer is further reduced, increases laterally heat transfer, makes bottom of the pot wall thermally equivalent effect more prominent.
Wherein, it is contemplated that the wall thickness of bottom of the pot wall and the Rational Thickness easy to process of individual layer plate, bottom of the pot wall 2 are preferably
The three ply board structure of stacking, is also not necessarily limited to this certainly.Such as Figure 13, this three ply board structure includes coating metal from top to bottom
Heat-conducting plate 9, nonmetallic heat conductive plate 10 and low thermal conductivity metallic plate 8.Alternatively, such as Figure 14, the three ply board structure may also comprise by
Coating metal heat-conducting plate 9, low thermal conductivity metallic plate 8 and nonmetallic heat conductive plate 10 under.In other words, in addition to coating metal
The position stacked on top of one another of heat-conducting plate 9, remaining nonmetallic heat conductive plate 10 and low thermal conductivity metallic plate 8 is not particularly limited.
Wherein, each laminate thickness should not be excessive, and the thickness of low thermal conductivity metallic plate 8 is to be not less than 1mm and be not more than
4.4mm is advisable, and the thickness of nonmetallic heat conductive plate 10 should also be not less than 0.2mm and no more than 2mm.Preferably, coating metal heat conduction
Plate 9 is common food grade 304 stainless steel plate of the thickness not less than 0.4mm and no more than 1mm.
In selection, micro-crystal plate or ceramic wafer etc. can be selected in nonmetallic heat conductive plate 10, and low thermal conductivity metallic plate 8 can be selected
45# steel plates, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet etc..
When being laminated, each laminate in bottom of the pot wall 2 is preferably arranged concentric.At this point, for covering heat pipe 11, obtain preferable
Lateral thermal balance effect, nonmetallic heat conductive plate 10, low thermal conductivity metallic plate 8 area be sufficiently large.Preferably, it is nonmetallic to lead
The following table area of hot plate 10 and the ratio between the following table area of low thermal conductivity metallic plate 8 and the top surface area of coating metal heat-conducting plate 9
Value is not less than 0.25 and no more than 1.
During experiment, bottom of the pot wall 2 is individually using low thermal conductivity metallic plate 8, such as common 304 stainless steel plate of nonfood grade,
Under different-thickness, its noise data such as the following table 4 is measured.Wherein, it is identical with above-mentioned experiment that process, parameter are tested, is repeated no more.
Table 4：Correspondence noise data and thermal efficiency value of common 304 stainless steel plate under different-thickness
| Bottom wall thickness | Maximum acoustical power/dB | Average acoustical power/dB | Thermal efficiency value |
| 0.5mm | 71 | 64 | 86.8% |
| 0.8mm | 70 | 63 | 86.3% |
| 1mm | 68 | 61 | 86% |
| 2mm | 64 | 59 | 85.5% |
| 2.5mm | 61 | 58 | 85% |
| 3mm | 58 | 54 | 84.4% |
| 3.5mm | 56 | 51 | 83.7% |
| 4mm | 52 | 50 | 83% |
| 4.5mm | 51 | 49 | 82.2% |
| 5mm | 50.5 | 48.5 | 81.4% |
| 6mm | 49 | 47 | 79.9% |
| 7mm | 49 | 47.5 | 77% |
As it can be seen that compared to the high thermal conductivity coefficients metallic plate such as conventional aluminium sheet, under condition of equivalent thickness, low thermal conductivity metallic plate 8
Noise reduction is it is also obvious that slightly not as good as nonmetallic heat conductive plate.But low thermal conductivity metallic plate 8 is with nonmetallic heat conductive board stacking with structure
It during into bottom of the pot wall, is equally beneficial for obtaining preferably lateral thermal balance effect, and then eliminates local heat conduction on bottom of the pot wall and concentrate institute
The intensive bubble formed, obtains good noise reduction.
In the other two embodiment shown in Figure 15, Figure 16, the bottom of the pot wall 2 of insulating pot is not more than including thermal conductivity factor
The low thermal conductivity plate of material 8 ' of 100W/m.k and the coating of the food-grade of upper surface for being formed in low thermal conductivity plate of material 8 '
25, the bottom that hot plate component 1 is mounted on low thermal conductivity plate of material 8 ' is heated.
Embodiment compared to Fig. 8 substitutes surface layer metal heat-conducting plate 9 in bottom of the pot wall construction herein with coating 25, low
Thermal conductivity factor plate of material 8 ' is relatively thick plate, is not limited to low thermal conductivity metallic plate or other non-metal boards.
Utilize the low heat conductivity energy of the thickness direction of low thermal conductivity plate of material 8 ' so that 8 ' bottom of low thermal conductivity plate of material
The heat in the heat pipe contact region in face will not be concentrated along plate thickness direction to conduct heat, and can transversely spread, and expands heating surface area, with
It is uneven to alleviate local heating, leads to the problem of local dense bubble.
Usually without the special processing and not up to coating of food-grade, thus its upper surface of low thermal conductivity plate of material 8 '
25 can be effectively isolated contact of the low thermal conductivity plate of material 8 ' with water, prevent to chemically react, it is ensured that the peace of insulating pot product
Entirely.
In addition, 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or potassium steel can be selected in low thermal conductivity plate of material 8 '
Plate etc., the upper table surface roughness of these planks usually have 3 μm~8 μm, after coating 25 covers, increase low thermal conductivity plate of material
8 ' upper surface smoothness, more gloss.
Conventional food-grade polytetrafluorethylecoatings coatings or ceramic coating etc. can be selected in coating 25, and other nanometers also can be selected
Coating etc..Wherein, the thickness of coating 25 is typically small, preferably not less than 50 μm and the range no more than 1000 μm.Coating 25
Thickness is small so that the thickness of low thermal conductivity plate of material 8 ' can be relatively larger, thickness can value range bigger.For example,
The thickness of low thermal conductivity plate of material 8 ' can be not less than 1mm and no more than optimum option in the range of 5mm, to take into account the thermal efficiency
It is harmonious with laterally heat transfer.
In addition, the upper surface of low thermal conductivity plate of material 8 ' can also be intervally distributed with multiple adiabatic holes 22 and/or insulated tank
21, as shown in figure 16.When offering adiabatic holes 22 and/or insulated tank 21, coating 25 can be filled in wherein, and adhesive force is more preferable.And
And coating 25 is filled in adiabatic holes 22 and/or thermal insulation when selecting the material than the more low thermal conductivity of low thermal conductivity plate of material 8 '
The coating 25 of slot 21 can increase the whole heat conduction difficulty of bottom of the pot wall through-thickness, that is, reduce longitudinal direction heat transfer, increase laterally heat transfer,
Contribute to lateral heat conduction balanced.Certainly, it is possible to use than the low thermal conductivity of the more low thermal conductivity of low thermal conductivity plate of material 8 '
Material 23 is directly filled in adiabatic holes 22 and/or insulated tank 21, then seal coat 25, can also obtain above-mentioned corresponding effect.
Wherein, consider with reference to the thickness of low thermal conductivity plate of material 8 ', the depth of adiabatic holes 22 and/or insulated tank 21 is general
Not less than 0.1mm and no more than 0.5mm.
When design, processing, adiabatic holes 22 and/or insulated tank 21 are preferably about the upper surface of low thermal conductivity plate of material 8 '
Central distribution, and the distribution area of adiabatic holes 22 and/or insulated tank 21 in upper surface is more than the heat pipe 11 in hot plate component 1
It is as shown in figure 16, balanced to promote lateral heat conduction around area.
Referring to Figure 17, Figure 18, insulated tank 21 is preferably round or rectangular annular groove, radially spaced multiple annular grooves
Distribution is in concentric circles or concentric boxes shape；Alternatively, as shown in figure 19, insulated tank 21 be straight trough, the multiple straight troughs being spaced successively
Distribution is in grid-like.Likewise, adiabatic holes 22 can be being evenly distributed with shown in uniformly distributed small sircle hole or Figure 21 shown in Figure 20
Small square hole, and be blind hole blind slot.
In addition, in the same manner, as shown in Figure 5, Figure 6, the heat pipe 11 of hot plate component 1 is solderable to be connected to low thermal conductivity plate of material 8 '
Bottom surface or also can by substrate 12 by weld or fastener etc. in a manner of be fixedly connected on the bottom of low thermal conductivity plate of material 8 '
Face, the preferably thermal conductivity factor of substrate 12 are more than the high thermal conductivity coefficient metallic plate of 100W/m.k, such as aluminium sheet, copper coin.In addition, electric water
Can be used between the periphery of the bottom of the pot wall 2 of pot and the bottom periphery of bottle body 3 Fig. 3 be welded to connect or the crimping of Fig. 2 connection, with obtain
Preferable sealing effect and structural durability, are not repeated carefully to state herein.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Within refreshing and principle, any modification, equivalent replacement, improvement and so on, for example, adiabatic holes 22 and/or insulated tank 21 can be
Regularly arranged hole slot and conventional shape hole slot as shown in figure 17 to figure 21, it is apparent that can also be irregular irregularly-shaped hole, different
Shape slot etc., arrangement mode are also not necessarily limited to regular fashion, and such change should all be included in the protection scope of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (13)
1. a kind of insulating pot, including bottom of the pot wall (2) and hot plate component (1), the bottom of the pot wall (2) is not more than including thermal conductivity factor
The low thermal conductivity plate of material (8 ') of 100W/m.k and be formed in the low thermal conductivity plate of material (8 ') upper surface food
The coating (25) of grade, the hot plate component (1) is mounted on the bottom of the low thermal conductivity plate of material (8 ').
2. insulating pot according to claim 1, wherein, the thickness of the coating (25) is not less than 50 μm and no more than 1000
μm。
3. insulating pot according to claim 1, wherein, the coating (25) is food-grade polytetrafluorethylecoatings coatings or ceramics
Coating.
4. insulating pot according to claim 1, wherein, the thickness of the low thermal conductivity plate of material (8 ') is not less than 1mm
And no more than 5mm.
5. insulating pot according to claim 4, wherein, the upper table surface roughness of the low thermal conductivity plate of material (8 ') is
3 μm~8 μm.
6. insulating pot according to claim 4, wherein, the low thermal conductivity plate of material (8 ') is not 45# steel plates, 304 not
Rust steel plate, 430 stainless steel plates or high manganese steel sheet.
7. the insulating pot according to any one in claim 1~6, wherein, the low thermal conductivity plate of material (8 ')
Upper surface is intervally distributed with multiple adiabatic holes (22) and/or insulated tank (21).
8. insulating pot according to claim 7, wherein, the depth of the adiabatic holes (22) and/or insulated tank (21) is not small
In 0.1mm and no more than 0.5mm.
9. insulating pot according to claim 7, wherein, it is filled with and leads in the adiabatic holes (22) and/or insulated tank (21)
Hot coefficient is less than the low thermal conductivity material (23) of the low thermal conductivity plate of material (8 ').
10. insulating pot according to claim 7, wherein, the adiabatic holes (22) and/or insulated tank (21) are around described low
The central distribution of the upper surface of thermal conductivity factor plate of material (8 '), and the adiabatic holes (22) and/or insulated tank (21) are on described
The distribution area on surface is more than the circular area of the heat pipe (11) in the hot plate component (1).
11. insulating pot according to claim 7, wherein, the insulated tank (21) is round or rectangular annular groove, radially
Multiple annular groove distributions at interval are in concentric circles or concentric boxes shape；Alternatively, the insulated tank (21) is straight trough, successively
Multiple straight trough distributions at interval are in grid-like.
12. insulating pot according to claim 1, wherein, the hot plate component (1) includes heat pipe (11), the heat pipe
(11) bottom surface or the heat pipe (11) for being welded in the low thermal conductivity plate of material (8 ') are fixedly connected by substrate (12)
In the bottom surface of the low thermal conductivity plate of material (8 '), the substrate (12) is more than the high heat conduction system of 100W/m.k for thermal conductivity factor
Number metallic plate.
13. insulating pot according to claim 1, wherein, the insulating pot includes bottle body (3), the week of the bottom of the pot wall (2)
It is welded to connect between edge and the bottom periphery of the bottle body (3) or crimping is connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260345.6A CN108261067A (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260345.6A CN108261067A (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108261067A true CN108261067A (en) | 2018-07-10 |
Family
ID=62754950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611260345.6A Pending CN108261067A (en) | 2016-12-30 | 2016-12-30 | Insulating pot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108261067A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113795056A (en) * | 2021-09-17 | 2021-12-14 | 福建辉伦婴童用品有限公司 | Electric heating plate and preparation method thereof |
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Application publication date: 20180710 |