CN108261070A - Insulating pot - Google Patents

Abstract

The invention discloses a kind of insulating pots, including bottom of the pot wall (2) and hot plate component (1), hot plate component is mounted on the bottom surface of bottom of the pot wall to heat the bottom of the pot wall, bottom of the pot wall is the multiple layer metal harden structure being laminated, and multiple adiabatic holes (22) and/or insulated tank (21) are intervally distributed in the laminate surface of at least one layer metallic plate therein.Adiabatic holes and/or insulated tank surround the central distribution of laminate surface, and the distribution area of adiabatic holes and/or insulated tank in single laminate surface is more than the circular area of the heat pipe (11) in hot plate component.In the insulating pot of the present invention, insulated tank or adiabatic holes are set by the laminate surface in stacked conducting plate, the thermal conductivity factor of air in hole slot is minimum, the thermal conductivity factor of bottom of the pot wall entirety can be reduced, thickness direction heat transfer is reduced, accordingly expands lateral heat diffusion, that is, increases the heat affected zone of bottom of the pot wall, realization is evenly heated, and is effectively alleviated local heating unevenness and is led to the problem of local dense bubble.

Description

Insulating pot

Technical field

The invention belongs to household appliance technical fields, and in particular, to a kind of insulating pot.

Background technology

The bottom of the pot wall of conventional insulating pot uses the sheet metal of high thermal conductivity coefficient more, and electric hot tray is mounted on the bottom of bottom of the pot wall Bottom of the pot wall is directly heated in face, and then the liquid water in heating kettle.

Wherein, the heat source of electric hot tray comes from heat pipe, and heat pipe is in surround shape more, thus only to the heat pipe of the annular in bottom of the pot wall Contact area concentrates heating, and heating surface area is small, and the heating effect far from heat pipe contact area is poor, causes local heating apparent.

In this way, when insulating pot works, bottom of the pot bubble will be caused uneven, local bubble is intensive, grows up, and then brokenly bubble, Generate larger noise.

Invention content

For above-mentioned insufficient or defect of the prior art, the present invention provides a kind of insulating pot, bottom of the pot can be made to be heated more Uniformly, the phenomenon that avoiding local bubble intensive, achievees the effect that noise reduction.

To achieve the above object, the present invention provides a kind of insulating pots, including bottom of the pot wall and hot plate component, the hot plate group Part is mounted on the bottom surface of the bottom of the pot wall to heat the bottom of the pot wall, wherein, the bottom of the pot wall is the multiple layer metal harden structure being laminated, The first layer metal plate on the surface layer in the multiple layer metal harden structure is food of the thickness not less than 0.4mm and no more than 0.8mm Grade metallic plate, at least one layer in other layers of metallic plate in the multiple layer metal harden structure in addition to the first layer metal plate It is not more than the low thermal conductivity metallic plate of 100W/m.k for thermal conductivity factor.

Preferably, the overall thickness of the bottom of the pot wall not less than 1mm and is not more than 5mm, the low thermal conductivity metallic plate Overall thickness is not less than 0.2mm and no more than 4.6mm.

Preferably, the top surface area of the following table area of at least one layer of low thermal conductivity metallic plate and the bottom of the pot wall The ratio between not less than 1/4 and no more than 1.

Preferably, the number of plies in the multiple layer metal harden structure is 2 layers or 3 layers.

Preferably, in the multiple layer metal harden structure of stacking, the diameter of each layer metallic plate is identical, alternatively, from top to bottom each The diameter of layer metallic plate successively decreases successively.

Preferably, the low thermal conductivity metallic plate is 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or potassium steel Plate.

Preferably, the multiple layer metal harden structure of the insulating pot includes the institute of 304 stainless steel plates on surface layer, single-layer or multi-layer State low thermal conductivity metallic plate, bottom aluminium sheet or copper coin.

Preferably, it is intervally distributed in the laminate surface of at least one layer of metallic plate in the multiple layer metal harden structure multiple Adiabatic holes and/or insulated tank.

Preferably, the adiabatic holes and/or insulated tank surround the central distribution of the laminate surface, and the adiabatic holes And/or distribution area of the insulated tank in the single laminate surface is more than the circular area of the heat pipe in the hot plate component.

Preferably, the insulated tank is round or rectangular annular groove, and radially spaced multiple annular groove distributions are in Concentric circles or concentric boxes shape；Alternatively, the insulated tank is straight trough, the multiple straight trough distributions being spaced successively are in grid Shape.

Preferably, the depth of the adiabatic holes and/or insulated tank is not less than 0.2mm and no more than 1mm.

Preferably, it is filled with the low heat conduction system that thermal conductivity factor is not more than 100W/m.k in the adiabatic holes and/or insulated tank Number material.

Preferably, pass through soldering connection between metallic plate described in multilayer.

Preferably, the hot plate component includes heat pipe, and the heat pipe is welded in the bottom surface of the bottom of the pot wall or the heat Pipe is fixedly connected on the bottom surface of the bottom of the pot wall by substrate, and the substrate is more than the high heat conduction system of 100W/m.k for thermal conductivity factor Number metallic plate.

Preferably, the insulating pot includes bottle body, is welded between the periphery of the bottom of the pot wall and the bottom periphery of the bottle body Connection or crimping connection.

Through the above technical solutions, in the insulating pot of the present invention, it is exhausted by being set in the laminate surface of stacked conducting plate Heat channel or adiabatic holes, the thermal conductivity factor of the air in hole slot is minimum, can reduce the thermal conductivity factor of bottom of the pot wall entirety, reduces thickness side To heat transfer, accordingly expand lateral heat diffusion, that is, increase the heat affected zone of bottom of the pot wall, realization is evenly heated, and effectively alleviates part Heating is uneven and leads to the problem of local dense bubble, reaches effective noise reduction purpose.

Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.

Description of the drawings

The attached drawing for forming the part of the present invention is used to provide further understanding of the present invention, schematic reality of the invention Example and its explanation are applied for explaining the present invention, is not constituted improper limitations of the present invention.In the accompanying drawings：

Fig. 1 is the entirety sectional view of the insulating pot of the present invention；

Fig. 2 and Fig. 3 is the C portion enlarged drawing in Fig. 1, respectively illustrates two kinds of connection knots between bottle body and bottom of the pot wall Structure；

Fig. 4 is bottom view when hot plate component is installed on bottom of the pot wall；

Fig. 5, Fig. 6 respectively illustrate two kinds of mounting structures between hot plate component and bottom of the pot wall；

Fig. 7 is according to the bottom of the pot wall construction figure of the insulating pot of the first preferred embodiment of the present invention, and wherein bottom of the pot wall is Low thermal conductivity metallic plate；

Fig. 8 is according to the bottom of the pot wall construction figure of the insulating pot of the second preferred embodiment of the present invention, and wherein bottom of the pot wall is Multiple layer metal harden structure；

Fig. 9 illustrates prior art medium heat disk component after the heating region of bottom of the pot wall and the comparable present invention improve Heating region；

Figure 10 is according to the bottom of the pot wall construction figure of the insulating pot of the third preferred embodiment of the present invention, wherein low heat conduction system The bottom of number metallic plate is formed with thickening part；

Figure 11 is the sectional view of Figure 10；

Figure 12 is the bottom view of Figure 10；

Figure 13 is the sectional view that high thermal conductivity coefficient metallic plate has been inlayed in the round inner groovy of Figure 11；

Figure 14 is the bottom view when the thickening part of Figure 12 cuts out notch；

Figure 15 is according to the bottom of the pot wall construction figure of the insulating pot of the 4th preferred embodiment of the present invention, wherein thickening part shape As discoid；

Figure 16 is the structure diagram according to the kettle body of the insulating pot of the 5th preferred embodiment of the present invention；

Respectively illustrate between the bottle body in the kettle body of Figure 16 and bottom of the pot wall two kinds of Figure 17, Figure 18 are welded and fixed mode；

Bottom of the pot wall construction figures of the Figure 19 for the insulating pot of the 6th preferred embodiment according to the present invention, wherein bottom of the pot wall Bottom surface offers insulated tank or adiabatic holes；

Figure 20 to Figure 22 shows insulated tank of different shapes and its distribution；

Figure 23, Figure 24 respectively illustrate the round hole of bottom of the pot wall, rectangular pore size distribution；

Figure 25 is illustrated on the basis of Figure 19, and low thermal conductivity material is filled in insulated tank or adiabatic holes；And

Figure 26 is according to the bottom of the pot wall construction figure of the insulating pot of the 7th preferred embodiment of the present invention, wherein multiple layer metal Adiabatic holes or insulated tank are distributed in the laminate surface of harden structure.

Reference sign：

1 hot plate component, 2 bottom of the pot wall

3 bottle body, 4 pot lid

5 shell, 6 steam pipe

7 handle, 8 low thermal conductivity metallic plate

9 high thermal conductivity coefficient metallic plates

11 heat pipe, 12 substrate

21 insulated tank, 22 adiabatic holes

23 low thermal conductivity materials

81 thickening part, 82 thin section

83 811 notch of round inner groovy

D1 outer peripheral edges spacing d2 inner peripheral spacing

Specific embodiment

The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.

It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase Mutually combination.

In the present invention, in the case where not making to illustrate on the contrary, the noun of locality such as " upper and lower, top, bottom " used is typically needle For direction shown in the drawings either for it is vertical, on vertical or gravity direction for each component mutual alignment relation Word is described.

The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

As shown in Figure 1, the present invention provides a kind of insulating pot, the bottom of the pot wall 2 including hot plate component 1 and composition kettle body, Bottle body 3 and pot lid 4, kettle body outside is around shell 5 and is connected with handle 7, and kettle body is equipped with steam pipe 6 in order to steam alarm etc.. The phenomenon that in order to which bottom of the pot is made to be heated evenly, avoids local bubble intensive, to achieve the effect that noise reduction, as shown in fig. 7, of the invention Bottom of the pot wall 2 include to promote the low thermal conductivity material layer laterally conducted heat, the heat conduction system of the low thermal conductivity material layer Number is usually more than 100W/m.k, preferably not greater than 60W/m.k, its certain thermal conductivity factor is also not necessarily limited to this, can be according to circumstances Specific setting.Hot plate component 1 is mounted on the bottom surface of bottom of the pot wall 2, and the heat of hot plate component 1 is upward via low thermal conductivity material layer Heat transfer.In the present invention, the heat transfer of hot plate component 1 need to pass through low thermal conductivity material layer, and experiment finds which increase horizontal strokes To heat transfer, increase heating surface (area) (HS, the heat transfer of heat pipe to bottom of the pot wall everywhere evenly, can effectively avoid that local bubble is intensive to be showed As achieving the effect that noise reduction.

Existing noise reduction thinking is typically in the surface layer sheet metal (being usually 304 stainless steel plates) of bottom of the pot wall 2 and heat pipe 11 Between add aluminium sheet of high heat conduction etc., and the thickness of 304 stainless steel plates is thinned, to reach uniform biography by way of flash heat transfer Heat.In contrast, present invention employs completely different converse thoughts, increase bottom wall thickness, low thermal conductive material layer is used to subtract The mode that slow heat is transmitted, obtains breakthrough effect.Especially there is rational heat conduction in the low thermal conductivity material layer of use When coefficient and thickness, the noise reduction of optimization can be obtained in a certain range, also will be explained in detail below.

Referring to Fig. 4, the heat pipe 11 of hot plate component 1 is illegally occupied with monocyclic shape in the bottom surface of bottom of the pot wall 2, if bottom of the pot wall is using conventional High thermal conductivity coefficient sheet metal, then heat pipe contact region for annular shape, i.e., the present situation heating region shown in the top of Fig. 9, The region it is heated significantly, radially inner and outer region is then heated few so that the heating of bottom of the pot wall everywhere is uneven, so as to generate part Intensive bubble, noise are apparent.And in the present invention, when employing low thermal conductivity material layer, the heat in heat pipe contact region is not Can be quickly transmitted along plate thickness direction, thus more horizontal proliferation so that heating region is compared after the improvement shown in Fig. 9 lower parts Significantly expand in the heating surface area of the present situation heating region on top, it is uneven so as to effectively alleviate local heating, generate local dense The problem of bubble, noise reduction are notable.

Wherein, low thermal conductivity material layer is preferably plate, and such as 45# steel plates, 304 stainless steel plates, 430 stainless may be selected Steel plate or high manganese steel sheet etc., are certainly not limited to this.

In a kind of preferred embodiment shown in Fig. 7, bottom of the pot wall 2 is the low thermal conductivity metallic plate 8 of individual layer food-grade, Such as 304 stainless steel plates of the food-grade after processing etc..When usual bottom of the pot wall uses stainless steel plate, thickness is only 0.5mm or even use are thinner.And in the present invention, when bottom of the pot wall 2 is single plate structure, veneer thickness is relatively thick, such as Fig. 7 In the thickness of bottom of the pot wall 2 be usually not less than 1mm and no more than 5mm.The thickness of low thermal conductivity metallic plate 8 is too small, then thickness The heat-transfer rate in direction is fast, and noise reduction is not evident, and security reliability is low, and service life is short, if thickness is excessive, the thermal efficiency Lowly, the thermal efficiency design requirement of insulating pot is not met, and material cost increases.

In another preferred embodiment shown in Fig. 8, bottom of the pot wall 2 is then the multiple layer metal harden structure being laminated, multilayer At least one layer in metal plate structure is low thermal conductivity metallic plate 8, and the first layer on the surface layer in multiple layer metal harden structure is golden Category plate is food-grade, because first layer metal plate is directly contacted with food materials.During more harden structures, individual layer low thermal conductivity metallic plate 8 Thickness very little, but the overall thickness of low thermal conductivity metallic plate 8 should equally be not less than 1mm and no more than 5mm.Meanwhile bottom of the pot wall 2 Stacked conducting plate overall thickness not less than 1mm and no more than 10mm.It should be noted that herein and following such as thickness Etc. parameters be limited only to illustrate or current working under reasonable value, but it is not limited to this, and should have as the case may be Body is set.

Wherein, the area of low thermal conductivity metallic plate 8 should not be too small, otherwise influences the thermal efficiency, and lateral heat diffusion effect Difference, therefore in the present embodiment, the following table area of at least one layer of low thermal conductivity metallic plate 8 and the upper surface of bottom of the pot wall 2 The ratio between product should be not less than 1/4 and no more than 1.Preferentially so that hot plate component 1 is arranged on the foreign steamer of low thermal conductivity metallic plate 8 In wide boundary, as shown in Figure 7, Figure 8.In other words, heat pipe 11 is preferably located in the outer profile of low thermal conductivity metallic plate 8, So that laterally heat transfer increases, expand heating region, realization is evenly heated.

As shown in Figure 5, Figure 6, hot plate component 1 includes heat pipe 11 to the mounting structure of hot plate component 1, and the heat pipe 11 in Fig. 5 can It is directly welded in the bottom surface of bottom of the pot wall 2.Alternatively, as shown in fig. 6, heat pipe 11 can be also fixedly connected by substrate 12 with rational method In the bottom surface of bottom of the pot wall 2.In general, it is preferably soldering connection between heat pipe 11, substrate 12, bottom of the pot wall 2.Wherein, substrate 12 is usual It is more than the high thermal conductivity coefficient metallic plate 9 of 100W/m.k, such as copper coin, aluminium sheet for thermal conductivity factor, thickness direction heat conduction is fast, facilitates The installation of heat pipe 11, but have substantially no effect on the heat transfer of heat pipe.It is well known by those skilled in the art that usually have on substrate 12 dry Piece is burnt, may also function as the purpose for preventing dry combustion method.

Certainly, hot plate component 1 may also comprise the Electric radiant Heating Film for being attached to bottom of the pot wall 2, i.e. infrared heating film or including setting Coil panel below bottom of the pot wall 2.But heat pipe 11 is usually annular in shape, is conducted heat in a manner of thermal contact conductance, relative to the red of Electric radiant Heating Film For the electromagnetic heating of external heat and coil panel, heat pipe 11 is being heated due to the characteristic of self structure and the reason of heat transfer type It is easier to occur in the process uneven to the heat transfer of bottom of the pot wall 2 so that insulating pot easily generates very big noise, corresponding heat After the insulating pot technical solution using the present invention of pipe heating, heat conduction uniformity and lower noise are all preferably improved.

Bottom of the pot wall 2 and the sealed connection of bottle body 3 ensure that water does not leak out.As shown in Figure 1 and Figure 2, the bottom of the pot wall 2 of insulating pot Can be tightly connected by flanging compression joint technique between periphery and the bottom periphery of bottle body 3, i.e. the periphery and bottle body of bottom of the pot wall 2 3 bottom periphery compresses and crimping folding is around in labyrinth-like, good seal performance, and connect it is firm.Alternatively, as shown in figure 3, the two may be used also To be welded directly together by base weld seam or even be connected together as shown in figure 17 by the surface layer weld seam weldering of bottom of the pot wall 2.

Referring to Figure 10, a kind of insulating pot in accordance with another preferred embodiment of the present invention, bottom of the pot therein are additionally provided Wall 2 also includes thermal conductivity factor no more than 100W/m.k, the low thermal conductivity metallic plate 8 of preferably not greater than 60W/m.k.But especially Ground, the bottom surface of low thermal conductivity metallic plate 8 are formed with the thickening part 81 of enlarged in thickness, and hot plate component 1 (especially heat pipe 11) is even The bottom surface of thickening part 81 is connected to heating kettle bottom wall 2.

In this way, thickening part 81 becomes heat pipe contact region, but due to the thickness increase of thickening part 81, i.e. heat pipe contact region Thickness bigger, thus cause 81 through-thickness of thickening part heat transmit poor, the easy horizontal proliferation of heat, be conducive to bottom of the pot wall 2 The transverse direction (the paper left and right directions of Figure 10) of (i.e. the low thermal conductivity metallic plate 8 of Figure 10) is by thermal balance.

Wherein, the shape of thickening part 81 should correspond to 11 shape of heat pipe, thickening part 8 to be made at least to cover heat pipe after mounting 11.In general, hot plate component 1 includes the heat pipe 11 in circular arrangement, as shown in figure 12, thus thickening part 81 is formed as protruding from The round ring boss of the bottom surface of low thermal conductivity metallic plate 8, referring to Figure 10 to Figure 12.Cricoid heat pipe 11 is then connected to circular ring shape On the bottom surface of boss.

In the embodiment shown in Figure 10, Figure 11, the outer diameter of the thickening part 81 of round ring boss shape is less than low heat conduction system The outer diameter of number metallic plate 8 so that it is smaller thin that the radially inner side region and radial outside region of thickening part 81 are each formed with thickness Portion 82.Obviously, referring to Figure 11, the radially inner side region of thickening part 81 is formed as round inner groovy 83.This difference of bottom of the pot wall 2 The thin and thick in region is distinguished, and is conducive to the equilibrium of lateral heat.

Preferably, the thickness of thickening part 81 more preferably not less than 2mm and is not more than not less than 1mm and no more than 5mm 5mm, is evenly heated that effect is more prominent, and in addition the thickness of thin section 82 is preferably less than 1mm.

In another embodiment shown in Figure 14, since 11 both ends of heat pipe not dock to form closed ring, annulus The thickening part 81 of shape can also be correspondingly formed with notch 811, with the thin section in the radially inner side region of radial communication round ring boss 82 bottom surfaces and 82 bottom surface of thin section in radial outside region.

In addition, the round inner groovy 83 in Figure 11 can also be inlaid with high thermal conductivity coefficient gold of the thermal conductivity factor more than 100W/m.k Belong to plate 9, as shown in figure 13, promote the lateral heat transfer between the thickening part 81 of circular ring shape, more promote the laterally heat of bottom of the pot wall Weighing apparatus.

With reference to figure 14, in this embodiment, along bottom of the pot wall 2 radially, outer peripheral edge and the heat pipe 11 of thickening part 81 The inner peripheral spacing d2 between outer peripheral edge spacing d1 and the inner peripheral of thickening part 81 and the inner peripheral of heat pipe 11 between outer peripheral edge Preferably meet respectively：2mm≤d1≤10mm, 2mm≤d2≤10mm so that heat pipe 11 is completely covered in thickening part 81 so that pot Bottom wall obtains preferable lateral thermal balance effect.Similarly, with theory of area, the following table area of thickening part 81 and the upper table of bottom of the pot wall 2 Area ratio should be not less than 1/8 and no more than 1/2, should preferably be not less than 1/6 and no more than 1/3.

Certainly, in other embodiments, as shown in figure 15, thickening part 81 may also be formed as protruding from low thermal conductivity gold Belong to the bottom surface of plate 8 and the disk boss-shaped of arranged concentric.Wherein, heat pipe 11, thickening part 81 and low thermal conductivity metallic plate 8 is outer Diameter is sequentially increased.At this point, the peripheral portion of only low thermal conductivity metallic plate 8 is formed as thin section 82.Similarly, thickening part 81 is outer Outer peripheral edge spacing d1 between the outer peripheral edge of periphery and heat pipe 11 should also meet：2mm≤d1≤10mm.

It is contemplated that ground, thickening part 81 can also cover the entire bottom surface of low thermal conductivity metallic plate 8, in other words so that bottom of the pot Wall 2 is formed as Integral upset wall.And in another embodiment shown in Figure 16 to Figure 18, the bottle body 3 of insulating pot is (for for example Food-grade stainless steel) and bottom of the pot wall 2 can also be all thickened wall, the two is connected by different welding manners.At this point, bottle body 3 Thickness is usually not less than 0.5mm and no more than 2mm, and the thickness of bottom of the pot wall 2 is usually not less than 1mm and no more than 5mm.Certainly, pot Body 3 is not limited to Integral upset wall, can also be local thickening, such as its lower half is the thickened wall of half portion thereon relatively Bottle body structure.

To further increase lateral heat transfer, thickness direction heat transfer is reduced, promotes the lateral thermal balance of bottom of the pot wall, bottom of the pot wall 2 Bottom surface can surround bottom of the pot wall central distribution have spaced multiple insulated tanks 21 or adiabatic holes 22, as shown in figure 19.It is adiabatic The thermal conductivity factor of slot 21 or the air in adiabatic holes 22 is minimum, reduces the whole thermal conductivity factor of bottom of the pot wall 2, so as to reduce thickness side To heat transfer, accordingly expand lateral heat diffusion.

Preferably, insulated tank 21 can be around the concentric of 2 center of circle of bottom of the pot wall and radially spaced arrangement shown in Figure 20 Annular groove or the concentric square slot shown in Figure 21 can also be the frame trough that the straight trough shown in Figure 22 is formed.Similarly, Adiabatic holes 22 can be the uniformly distributed small square hole shown in uniformly distributed small sircle hole or Figure 24 shown in Figure 23, and be that blind hole is blind Slot.

In fig. 25, low thermal conductivity material 23 also can be filled, such as than low heat conduction system in insulated tank 21 or adiabatic holes 22 The lower low thermal conductivity material 23 of the thermal conductivity factor of metallic plate 8 is counted, such as thermal conductivity factor is not more than 60W/m.k.

Wherein it is preferred to the entire floor space or top surface of the distribution area of insulated tank 21 or adiabatic holes 22 and bottom of the pot wall 2 Product is than that should be not less than 1/8 and no more than 1/2, preferable final can play more preferably not less than 1/6 and no more than 1/3 Noise reduction.The depth of insulated tank 21 or adiabatic holes 22 is preferably not less than 0.2mm and no more than 1.5mm, more preferably not small In 0.5mm and no more than 1mm.

Comparative example：

It is tested by taking aluminium sheet of the thermal conductivity factor more than 200W/m.k as an example into Row noise and thermal power.Thermal conductivity factor is more than Easily there is early jump, water is burnt not open, thus cannot be used separately as bottom of the pot wall since conductivity is too high in the copper coin of 300W/m.k.

Wherein, heating power：1800W, water in pot：1.7L, the minimum thermal efficiency value of insulating pot should be not less than 80%.

Testing procedure：

1) maximum scale water, is put into pot；

2), temperature sensor is placed in the middle of the height of water level at kettle center；

3), start timing measuring by "start" button；

4) stop timing measuring when, water temperature rises to 80 DEG C in pot；

5) noise figure of sound power value≤45dB, is rejected, A weighteds are carried out to test noise value, take average acoustical power conduct Decision content.

Table 1：Correspondence noise data of the aluminium sheet under different-thickness

Bottom wall thickness	Maximum acoustical power/dB	Average acoustical power/dB
			1mm	67.5	64.6
2mm	67.9	64.0
			3mm	66.8	64.7
4mm	67.3	64.9
			5mm	66.5	63.5

In addition, the thermal efficiency value of the aluminium sheet of above-mentioned thickness is maintained at more than 87% high position, thickness effect is not notable, greatly In the minimum thermal efficiency value of insulating pot design.

Embodiment 1：

By thermal conductivity factor less than 20W/m.k 304 stainless steel plates for, respectively 0.5mm, 0.8mm, 1mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 6mm, 7mm have carried out noise-measuring totally under 12 kinds of different-thickness, obtain data Such as the following table 2.

Table 2：Correspondence noise data and thermal efficiency value data of 304 stainless steel plates under different-thickness

Tables 1 and 2 is integrated it is found that the aluminium sheet of high thermal conductivity coefficient is in the thickness more than 1mm, thickness increases to noise almost Without influence, thermal efficiency value is very high, it is clear that noise is excessive, but meets thermal efficiency requirement.And low thermal conductivity metallic plate is with thickness Increase, noise reduction is apparent, also on the basis of the design requirement for meeting the two, is deposited along with the decline of thermal efficiency value certainly In preferred thickness range.

Referring specifically to table 2, during the thickness increase of 304 stainless steel plates of low thermal conductivity, maximum acoustical power and average sound work( Rate is all downward trend.In the certain thickness zone of reasonableness for meeting design requirement (more than 80%) in thermal efficiency value, such as 1mm~ In the range of 5mm (preferably 2mm~4mm or 2mm~5mm), the value range of maximum acoustical power and average acoustical power is all that can connect It receives, compared to the aluminium sheet of high thermal conductivity coefficient, noise reduction is apparent.

Therefore, the bottom of the pot wall of low thermal conductivity material layer (i.e. 304 stainless steel plates etc.) is added, increases low thermal conductivity material The integral thickness of layer or local thickness can achieve the effect that slow down the transmission of thickness direction heat, increase lateral thermal uniformity, from And it is finally reached optimization noise reduction.

Referring to Fig. 8 and Figure 26, a kind of insulating pot in accordance with another preferred embodiment of the present invention is additionally provided, it is therein Bottom of the pot wall 2 is also the multiple layer metal harden structure being laminated, wherein, it is preferably 2 layers or 3 laminates in multiple layer metal harden structure.Multilayer gold Belong to and there is an at least low thermal conductivity metallic plate 8 in harden structure.

Wherein, preferably pass through soldering connection between stacked conducting plate.

Particularly, the first layer metal plate on the surface layer in multiple layer metal harden structure be grade metal plate, stacked conducting plate At least one layer in other layers of metallic plate in structure in addition to first layer metal plate is thermal conductivity factor no more than 100W/m.k's Low thermal conductivity metallic plate 8 can effectively reduce the heat transfer of thickness direction in this way, increase lateral heat diffusion.

Wherein, when being attached to the actual process parameter design of insulating pot, the overall thickness of bottom of the pot wall 2 should be not less than 1mm and not More than 5mm, wherein the thickness of the grade metal plate of first layer is not less than 0.4mm and no more than 0.8mm, and low thermal conductivity is golden Belong to the overall thickness of plate 8 not less than 0.2mm and no more than 4.6mm.Certainly, the setting of this parameter area is only preferable example, not to this Invention is formed and is particularly limited to.

As previously mentioned, the ratio between the following table area of at least one layer of low thermal conductivity metallic plate 8 and the top surface area of bottom of the pot wall 2 Not less than 1/4 and no more than 1.In the multiple layer metal harden structure of stacking, the diameter of each layer metallic plate can be identical, also can be different. For example, it may be the diameter of each layer metallic plate from top to bottom successively decreases successively.

In selection, as previously mentioned, 45# steel plates, 304 stainless steel plates, 430 stainless can be selected in low thermal conductivity metallic plate 8 Steel plate or high manganese steel sheet etc..In this way, illustratively, the multiple layer metal harden structure of insulating pot includes 304 stainless steel plates, the list on surface layer Layer or 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or the high manganese steel sheet of multilayer and the aluminium sheet or copper coin of bottom, each plate Layer thickness is defined to：The thickness of 304 stainless steel plates on surface layer is not less than 0.4mm and no more than 0.8mm, the 45# of single-layer or multi-layer Steel plate, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet overall thickness not less than 0.2mm and no more than 4.6mm, in bottom of the pot When the overall thickness of wall 2 should be not less than 1mm and be not more than 5mm, aluminium plate thickness is generally also smaller, usually less than 1mm.

Heat pipe 11 can be directly welded in the bottom surface of bottom of the pot wall 2 or the bottom of bottom of the pot wall 2 is fixedly connected on by substrate 12 Face, the preferably thermal conductivity factor of substrate 12 are more than the high thermal conductivity coefficient metallic plate 9 of 100W/m.k, such as aluminium sheet, copper coin.Insulating pot Solderable connection between the periphery of bottom of the pot wall 2 and the bottom periphery of bottle body 3, also can crimping connection etc..

In addition, multiple adiabatic holes are intervally distributed in the laminate surface of at least one layer of metallic plate in the multiple layer metal harden structure 22 and/or insulated tank 21, for reducing longitudinal direction heat transfer, increase laterally heat transfer, increase heating surface (area) (HS, heating evenly, such as It is preceding described.

Such as Figure 20 to Figure 24, likewise, adiabatic holes 22 and/or insulated tank 21 surround the central distribution of laminate surface, and absolutely The distribution area of hot hole 22 and/or insulated tank 21 in single laminate surface is more than the circular face of the heat pipe 11 in hot plate component 1 Product.Insulated tank 21 can be round or rectangular annular groove, and radially spaced multiple annular groove distributions are in concentric circles or concentric side Frame shape；Alternatively, insulated tank 21 can be straight trough, the multiple straight troughs distribution being spaced successively is in grid-like, is not repeated herein thin It states.

Similarly, the depth of adiabatic holes 22 and/or insulated tank 21 should be not less than 0.2mm and no more than 1mm.Adiabatic holes 22 And/or the more fillable low thermal conductivity material 23 for thering is such as thermal conductivity factor to be not more than 100W/m.k in insulated tank 21.

Embodiment 2

Experimental condition, parameter are identical with comparative example 1, embodiment 1.

It employs in the bottom of the pot wall shown in Fig. 8 and Figure 26 and is especially set in multiple layer metal harden structure and the laminate surface of metallic plate Adiabatic holes 22 and/or insulated tank 21 are counted, and the first layer metal plate on the surface layer in multiple layer metal harden structure selects food-grade gold When belonging to plate, grade metal plate is specifically chosen as 304 stainless steel plates (thermal conductivity factor is less than 20W/m.k), thickness 0.5mm, remaining (thermal conductivity factor is greatly for 430 stainless steel plates (thermal conductivity factor is less than 20W/m.k) and the aluminium sheet of one layer of 0.5mm changed for a layer thickness In 200W/m.k), table 3 is obtained by the thickness (in the range of 0.2mm~4.6mm) for changing 430 stainless steel plates, wherein 430 not The laminate surface become rusty between steel plate and aluminium sheet is equipped with the insulated tank 21 of concentric circles, and depth 0.2mm can be obtained at this time In test noise data such as the following table 3 of different-thickness.

Table 3：In the bottom of the pot wall of multiple layer metal harden structure, the test noise data under 430 stainless steel plates of different-thickness With thermal efficiency value data

By table 3 as it can be seen that in the bottom of the pot wall of multiple layer metal harden structure, the grade metal plate thickness of skim-coat is constant, and During the wall thickness increase for the metallic plate, especially low thermal conductivity metallic plate that lower section is laminated, it is clear that noise reduction is also apparent, example Such as in the range of 2mm~4mm Rational Thickness, the noise range for meeting design requirement can be obtained, and meets the thermal effect of insulating pot The heating requirements of rate value.Especially after being designed using adiabatic holes 22 and/or insulated tank 21, hence it is evident that help to reduce noise, i.e., Make the aluminium sheet with the presence of high thermal conductivity coefficient, can also obtain individual layer low thermal conductivity metallic plate as shown in Figure 1 almost comparable drop It makes an uproar effect.

The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Within refreshing and principle, any modification, equivalent replacement, improvement and so on, for example, adiabatic holes 22 and/or insulated tank 21 can be Regularly arranged hole slot and conventional shape hole slot as shown in Figure 20 to Figure 24, it is apparent that can also be irregular irregularly-shaped hole, different Shape slot etc., arrangement mode are also not necessarily limited to regular fashion, and such change should all be included in the protection scope of the present invention.

It is further to note that specific technical features described in the above specific embodiments, in not lance In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can The combination of energy no longer separately illustrates.

In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally The thought of invention, it should also be regarded as the disclosure of the present invention.

Claims (15)

1. a kind of insulating pot, including bottom of the pot wall (2) and hot plate component (1), the hot plate component (1) is mounted on the bottom of the pot wall (2) bottom surface to heat the bottom of the pot wall (2), wherein, the bottom of the pot wall (2) be laminated multiple layer metal harden structure, the multilayer The first layer metal plate on the surface layer in metal plate structure is grade metal plate of the thickness not less than 0.4mm and no more than 0.8mm, At least one layer in other layers of metallic plate in the multiple layer metal harden structure in addition to the first layer metal plate is heat conduction system Low thermal conductivity metallic plate (8) of the number no more than 100W/m.k.

2. insulating pot according to claim 1, wherein, the overall thickness of the bottom of the pot wall (2) not less than 1mm and is not more than 5mm, the overall thickness of the low thermal conductivity metallic plate (8) is not less than 0.2mm and no more than 4.6mm.

3. insulating pot according to claim 1, wherein, the following table of at least one layer of low thermal conductivity metallic plate (8) The ratio between area and the top surface area of the bottom of the pot wall (2) are not less than 1/4 and no more than 1.

4. insulating pot according to claim 1, wherein, the number of plies in the multiple layer metal harden structure is 2 layers or 3 layers.

5. insulating pot according to claim 1, wherein, in the multiple layer metal harden structure of stacking, the diameter of each layer metallic plate It is identical, alternatively, the diameter of each layer metallic plate from top to bottom successively decreases successively.

6. insulating pot according to claim 1, wherein, the low thermal conductivity metallic plate (8) is 45# steel plates, 304 stainless Steel plate, 430 stainless steel plates or high manganese steel sheet.

7. insulating pot according to claim 6, wherein, the multiple layer metal harden structure of the insulating pot includes the 304 of surface layer Stainless steel plate, the low thermal conductivity metallic plate (8) of single-layer or multi-layer, bottom aluminium sheet or copper coin.

8. the insulating pot according to any one in claim 1~7, wherein, in the multiple layer metal harden structure at least Multiple adiabatic holes (22) and/or insulated tank (21) are intervally distributed in the laminate surface of one layer of metallic plate.

9. insulating pot according to claim 8, wherein, the adiabatic holes (22) and/or insulated tank (21) are around the layer The central distribution on folded surface, and the distribution face of the adiabatic holes (22) and/or insulated tank (21) in the single laminate surface Product is more than the circular area of the heat pipe (11) in the hot plate component (1).

10. insulating pot according to claim 8, wherein, the insulated tank (21) is round or rectangular annular groove, radially Multiple annular groove distributions at interval are in concentric circles or concentric boxes shape；Alternatively, the insulated tank (21) is straight trough, successively Multiple straight trough distributions at interval are in grid-like.

11. insulating pot according to claim 8, wherein, the depth of the adiabatic holes (22) and/or insulated tank (21) is not small In 0.2mm and no more than 1mm.

12. insulating pot according to claim 8, wherein, it is filled with and leads in the adiabatic holes (22) and/or insulated tank (21) Hot coefficient is not more than the low thermal conductivity material (23) of 100W/m.k.

13. insulating pot according to claim 1, wherein, pass through soldering connection between metallic plate described in multilayer.

14. insulating pot according to claim 1, wherein, the hot plate component (1) includes heat pipe (11), the heat pipe (11) bottom surface or the heat pipe (11) for being welded in the bottom of the pot wall (2) are fixedly connected on the bottom of the pot by substrate (12) The bottom surface of wall (2), the substrate (12) are more than the high thermal conductivity coefficient metallic plate (9) of 100W/m.k for thermal conductivity factor.

15. insulating pot according to claim 1, wherein, the insulating pot includes bottle body (3), the week of the bottom of the pot wall (2) It is welded to connect between edge and the bottom periphery of the bottle body (3) or crimping is connect.