CN206621206U - Insulating pot - Google Patents

Abstract

The utility model discloses a kind of insulating pot, including bottom of the pot wall (2) and hot plate component (1), saved electric-heating heat-tube (11) coiling of hot plate component is installed in the bottom surface of bottom of the pot wall, bottom of the pot wall is the multiple layer metal harden structure of stacking, and multiple adiabatic holes (22) and/or insulated tank (21) are intervally distributed with the laminate surface of at least one layer of metallic plate therein.Adiabatic holes and/or insulated tank surround the central distribution of laminate surface, and the distribution area of adiabatic holes and/or insulated tank in single laminate surface is more than the circular area of heat pipe (11).In insulating pot of the present utility model, insulated tank or adiabatic holes are set by the laminate surface in stacked conducting plate, the thermal conductivity factor of air in hole slot is minimum, the overall thermal conductivity factor of bottom of the pot wall can be reduced, thickness direction heat transfer is reduced, accordingly expands lateral heat diffusion, that is, increases the heat affected zone of bottom of the pot wall, realization is evenly heated, the problem of effectively alleviating local heating inequality and produce local dense bubble.

Description

Insulating pot

Technical field

The utility model belongs to household appliance technical field, in particular it relates to a kind of insulating pot.

Background technology

The bottom of the pot wall of conventional insulating pot uses the sheet metal of high thermal conductivity coefficient more, and electric hot tray is arranged on the bottom of bottom of the pot wall Face, directly bottom of the pot wall is heated, and then the aqueous water in heating kettle.

Wherein, the thermal source of electric hot tray comes from heat pipe, and heat pipe is in surround shape more, thus only to the annular heat pipe in bottom of the pot wall Contact area concentrates heating, and heating surface area is small, and the heating effect away from heat pipe contact area is poor, causes local heating obvious.

So, when insulating pot works, bottom of the pot bubble will be caused uneven, local bubble is intensive, grows up, and then brokenly bubble, Produce larger noise.

Utility model content

There is provided a kind of insulating pot for above-mentioned deficiency of the prior art or defect, the utility model, can make bottom of the pot by Heat evenly, avoids the intensive phenomenon of local bubble, reaches the effect of noise reduction.

To achieve the above object, the utility model provides a kind of insulating pot, including bottom of the pot wall and hot plate component, the heat Disk component includes coiling installed in the bottom surface of the bottom of the pot wall to heat the heat pipe of the bottom of the pot wall, wherein, the bottom of the pot wall is layer Folded multiple layer metal harden structure, the first layer metal plate on the top layer in the multiple layer metal harden structure are not less than 0.4mm for thickness And it is not more than 0.8mm grade metal plate, it is other in addition to the first layer metal plate in the multiple layer metal harden structure At least one layer in layer metallic plate is not more than 100W/m.k low thermal conductivity metallic plate for thermal conductivity factor.

Preferably, the gross thickness of the bottom of the pot wall not less than 1mm and is not more than 5mm, the low thermal conductivity metallic plate Gross thickness is not less than 0.2mm and is not more than 4.6mm.

Preferably, the top surface area of the following table area of at least one layer of low thermal conductivity metallic plate and the bottom of the pot wall The ratio between not less than 1/4 and no more than 1.

Preferably, the number of plies in the multiple layer metal harden structure is 2 layers or 3 layers.

Preferably, in the multiple layer metal harden structure of stacking, the diameter of each layer metallic plate is identical, or, from top to bottom each The diameter of layer metallic plate successively decreases successively.

Preferably, the low thermal conductivity metallic plate is 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or potassium steel Plate.

Preferably, the multiple layer metal harden structure of the insulating pot includes 304 stainless steel plates on top layer, the institute of single or multiple lift State low thermal conductivity metallic plate, the aluminium sheet or copper coin of bottom.

Preferably, it is intervally distributed with the laminate surface of at least one layer of metallic plate in the multiple layer metal harden structure multiple Adiabatic holes and/or insulated tank.

Preferably, the adiabatic holes and/or insulated tank surround the central distribution of the laminate surface, and the adiabatic holes And/or distribution area of the insulated tank in the single laminate surface is more than the circular area of the heat pipe.

Preferably, the insulated tank is circular or square annular groove, and radially spaced multiple annular groove distributions are in Concentric circles or concentric boxes shape；Or the insulated tank is straight trough, the multiple straight trough distributions being spaced successively are in grid Shape.

Preferably, the depth of the adiabatic holes and/or insulated tank not less than 0.2mm and is not more than 1mm.

Preferably, it is not more than 100W/m.k low heat conduction system in the adiabatic holes and/or insulated tank filled with thermal conductivity factor Number material.

Preferably, soldering connection is passed through between metallic plate described in multilayer.

Preferably, the heat pipe is welded in the bottom surface of the bottom of the pot wall, or the heat pipe is fixedly connected on by substrate The bottom surface of the bottom of the pot wall, the substrate are the high thermal conductivity coefficient metallic plate that thermal conductivity factor is more than 100W/m.k.

Preferably, the insulating pot includes bottle body, is welded between the periphery of the bottom of the pot wall and the bottom periphery of the bottle body Connection or crimping connection.

Pass through above-mentioned technical proposal, in insulating pot of the present utility model, set by the laminate surface in stacked conducting plate Put insulated tank or adiabatic holes, the thermal conductivity factor of the air in hole slot is minimum, can reduce the overall thermal conductivity factor of bottom of the pot wall, reduces thick Direction heat transfer is spent, accordingly expands lateral heat diffusion, that is, increases the heat affected zone of bottom of the pot wall, realization is evenly heated, and is effectively alleviated Local heating is uneven and the problem of produce local dense bubble, reach effective noise reduction purpose.

Other features and advantages of the utility model will be described in detail in subsequent specific embodiment part.

Brief description of the drawings

Form a part of accompanying drawing of the present utility model to be used for providing further understanding to of the present utility model, this practicality is new The schematic description and description of type is used to explain the utility model, does not form to improper restriction of the present utility model. In accompanying drawing：

Fig. 1 is the entirety sectional view of insulating pot of the present utility model；

Fig. 2 and Fig. 3 is the C portion enlarged drawing in Fig. 1, respectively illustrates two kinds of connection knots between bottle body and bottom of the pot wall Structure；

Fig. 4 is upward view when hot plate component is installed on bottom of the pot wall；

Fig. 5, Fig. 6 respectively illustrate two kinds of mounting structures between hot plate component and bottom of the pot wall；

Fig. 7 is according to the bottom of the pot wall construction figure of the insulating pot of the first preferred embodiment of the present utility model, wherein bottom of the pot Wall is low thermal conductivity metallic plate；

Fig. 8 is according to the bottom of the pot wall construction figure of the insulating pot of the second preferred embodiment of the present utility model, wherein bottom of the pot Wall is multiple layer metal harden structure；

Fig. 9 illustrates prior art medium heat disk component and changed in the heating region of bottom of the pot wall and comparable the utility model Heating region after entering；

Figure 10 is according to the bottom of the pot wall construction figure of the insulating pot of the 3rd preferred embodiment of the present utility model, wherein low lead The bottom of hot coefficient metallic plate is formed with thickening part；

Figure 11 is Figure 10 sectional view；

Figure 12 is Figure 10 upward view；

Figure 13 is the sectional view that high thermal conductivity coefficient metallic plate has been inlayed in Figure 11 circular inner groovy；

Figure 14 is the upward view when Figure 12 thickening part cuts out otch；

Figure 15 is according to the bottom of the pot wall construction figure of the insulating pot of the 4th preferred embodiment of the present utility model, wherein thickening Portion is formed as discoid；

Figure 16 is the structural representation according to the kettle body of the insulating pot of the 5th preferred embodiment of the present utility model；

Respectively illustrate between the bottle body in Figure 16 kettle body and bottom of the pot wall two kinds of Figure 17, Figure 18 are welded and fixed mode；

Figure 19 is according to the bottom of the pot wall construction figure of the insulating pot of the 6th preferred embodiment of the present utility model, wherein bottom of the pot The bottom surface of wall offers insulated tank or adiabatic holes；

Figure 20 to Figure 22 shows insulated tank of different shapes and its distribution；

Figure 23, Figure 24 respectively illustrate the circular port of bottom of the pot wall, square pore size distribution；

Figure 25 is illustrated on the basis of Figure 19, and low thermal conductivity material is filled with insulated tank or adiabatic holes；And

Figure 26 is according to the bottom of the pot wall construction figure of the insulating pot of the 7th preferred embodiment of the present utility model, wherein multilayer Adiabatic holes or insulated tank are distributed with the laminate surface of metal plate structure.

Description of reference numerals：

The bottom of the pot wall of 1 hot plate component 2

The pot lid of 3 bottle body 4

The steam pipe of 5 shell 6

The low thermal conductivity metallic plate of 7 handle 8

9 high thermal conductivity coefficient metallic plates

The substrate of 11 heat pipe 12

The adiabatic holes of 21 insulated tank 22

23 low thermal conductivity materials

The thin section of 81 thickening part 82

The 83 circular otch of inner groovy 811

D1 outer peripheral edges spacing d2 inner peripheral spacing

Embodiment

Specific embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.It should be appreciated that herein Described embodiment is merely to illustrate and explained the utility model, is not limited to the utility model.

It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can To be mutually combined.

In the utility model, in the case where not making opposite explanation, the noun of locality such as " upper and lower, top, bottom " used is generally It is each part mutual alignment either on vertical, vertical or gravity direction for direction shown in the drawings Relationship description word.

Describe the utility model in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

As shown in figure 1, the utility model provides a kind of insulating pot, including hot plate component 1 and the bottom of the pot for forming kettle body Wall 2, bottle body 3 and pot lid 4, kettle body outside is around shell 5 and is connected with handle 7, and kettle body is provided with steam pipe 6 in order to which steam is alarmed Deng.In order that bottom of the pot is heated evenly to avoid the intensive phenomenon of local bubble, to reach the effect of noise reduction, as shown in fig. 7, this The bottom of the pot wall 2 of utility model includes for promoting the low thermal conductivity material layer laterally conducted heat, the low thermal conductivity material layer Thermal conductivity factor be usually more than 100W/m.k, preferably not greater than 60W/m.k, its certain thermal conductivity factor is also not necessarily limited to this, can According to circumstances specific setting.Hot plate component 1 is arranged on the bottom surface of bottom of the pot wall 2, and the heat of hot plate component 1 is via low thermal conductivity material The bed of material conducts heat upwards.In the utility model, the heat transfer of hot plate component 1 need to pass through low thermal conductivity material layer, experiment hair Now which increase horizontal heat transfer, increase heating surface (area) (HS, the heat transfer of heat pipe to bottom of the pot wall everywhere evenly, can effectively avoid part The intensive phenomenon of bubble, reach the effect of noise reduction.

Existing noise reduction thinking is typically the top layer sheet metal (being usually 304 stainless steel plates) and heat pipe 11 in bottom of the pot wall 2 Between set up aluminium sheet of high heat conduction etc., and the thickness of 304 stainless steel plates is thinned, to reach uniform biography by way of flash heat transfer Heat.In contrast, the utility model employs completely different converse thought, increases bottom wall thickness, using low thermal conductive material layer In a manner of slowing down heat transfer, breakthrough effect is obtained.Especially have reasonably in the low thermal conductivity material layer of use When thermal conductivity factor and thickness, the noise reduction of optimization can be obtained within the specific limits, also will be explained in detail below.

Referring to Fig. 4, the heat pipe 11 of hot plate component 1 is illegally occupied in the bottom surface of bottom of the pot wall 2 with monocyclic shape, if bottom of the pot wall is using conventional High thermal conductivity coefficient sheet metal, then heat pipe contact region for annular shape, i.e., the present situation heating region shown in Fig. 9 top, The region it is heated significantly, its radially inner and outer region is then heated few so that the heating of bottom of the pot wall everywhere is uneven, so as to produce part Intensive bubble, noise are obvious.And in the utility model, when employing low thermal conductivity material layer, the heat in heat pipe contact region Amount can not be quickly transmitted along thickness of slab direction, thus more horizontal proliferation so that heating region after the improvement shown in Fig. 9 bottoms Heating surface area compared to the present situation heating region on top substantially expands, uneven so as to effectively alleviate local heating, produces local The problem of intensive bubble, noise reduction are notable.

Wherein, low thermal conductivity material layer is preferably tabular, and such as 45# steel plates, 304 stainless steel plates, 430 stainless may be selected Steel plate or high manganese steel sheet etc., are certainly not limited to this.

In a kind of preferred embodiment shown in Fig. 7, bottom of the pot wall 2 is the low thermal conductivity metallic plate 8 of individual layer food-grade, Such as 304 stainless steel plates of the food-grade after processing etc..When usual bottom of the pot wall uses stainless steel plate, thickness is only 0.5mm, or even use are thinner.And in the utility model, when bottom of the pot wall 2 is single plate structure, veneer thickness is relatively thick, such as The thickness of bottom of the pot wall 2 in Fig. 7 is usually not less than 1mm and is not more than 5mm.The thickness of low thermal conductivity metallic plate 8 is too small, then thick The heat-transfer rate in degree direction is fast, and noise reduction is not evident, and security reliability is low, and service life is short, if thickness is excessive, thermal effect Rate is low, does not meet the thermal efficiency design requirement of insulating pot, and material cost increase.

In another preferred embodiment shown in Fig. 8, bottom of the pot wall 2 is then the multiple layer metal harden structure of stacking, multilayer At least one layer in metal plate structure is low thermal conductivity metallic plate 8, and the first layer on the top layer in multiple layer metal harden structure is golden Category plate is food-grade, because first layer metal plate directly contacts with food materials.During more harden structures, individual layer low thermal conductivity metallic plate 8 Thickness very little, but the gross thickness of low thermal conductivity metallic plate 8 should equally be not less than 1mm and be not more than 5mm.Meanwhile bottom of the pot wall 2 The gross thickness of stacked conducting plate not less than 1mm and be not more than 10mm.It should be noted that herein and following such as thickness It is limited only to illustrate etc. parameter, or the reasonable value under current working, but this is not limited to, and should have as the case may be Body is set.

Wherein, the area of low thermal conductivity metallic plate 8 should not be too small, otherwise influences the thermal efficiency, and lateral heat diffusion effect Difference, therefore in the present embodiment, the following table area of at least one layer of low thermal conductivity metallic plate 8 and the upper surface of bottom of the pot wall 2 The ratio between product should be not less than 1/4 and no more than 1.Preferentially so that hot plate component 1 is arranged on the foreign steamer of low thermal conductivity metallic plate 8 In wide border, as shown in Figure 7, Figure 8.In other words, i.e., heat pipe 11 is preferably located in the outline of low thermal conductivity metallic plate 8, To cause laterally heat transfer increase, expand heating region, realization is evenly heated.

As shown in Figure 5, Figure 6, hot plate component 1 includes heat pipe 11 to the mounting structure of hot plate component 1, and the heat pipe 11 in Fig. 5 can It is directly welded in the bottom surface of bottom of the pot wall 2.Or as shown in fig. 6, heat pipe 11 can be also fixedly connected by substrate 12 with rational method In the bottom surface of bottom of the pot wall 2.Generally, it is preferably soldering connection between heat pipe 11, substrate 12, bottom of the pot wall 2.Wherein, substrate 12 is usual It is more than 100W/m.k high thermal conductivity coefficient metallic plate 9 for thermal conductivity factor, such as copper coin, aluminium sheet, thickness direction heat conduction is fast, facilitates The installation of heat pipe 11, but have substantially no effect on the heat transfer of heat pipe.It is well known by those skilled in the art that generally have on substrate 12 dry Piece is burnt, may also function as the purpose for preventing dry combustion method.

Certainly, hot plate component 1 may also comprise the Electric radiant Heating Film for being attached to bottom of the pot wall 2, i.e. infrared heating film, or including setting Coil panel below bottom of the pot wall 2.But heat pipe 11 is generally annular in shape, is conducted heat in a manner of thermal contact conductance, relative to the red of Electric radiant Heating Film For the Electromagnetic Heating of external heat and coil panel, heat pipe 11 is being heated due to the characteristic of self structure and the reason of heat transfer type During be easier heat transfer to bottom of the pot wall 2 occur it is uneven so that insulating pot easily produces very big noise, corresponding heat After the insulating pot of pipe heating uses technical scheme, heat conduction uniformity and lower noise are all preferably improved.

Bottom of the pot wall 2 and the sealed connection of bottle body 3, ensure that water is not spilt.As shown in Figure 1 and Figure 2, the bottom of the pot wall 2 of insulating pot Can be tightly connected by flanging compression joint technique between periphery and the bottom periphery of bottle body 3, i.e. the periphery and bottle body of bottom of the pot wall 2 3 bottom periphery compresses and crimping folding is around in labyrinth-like, good seal performance, and connect it is firm.Or as shown in figure 3, the two may be used also To be welded directly together by base weld seam, or even connected together as shown in figure 17 by the top layer weld seam weldering of bottom of the pot wall 2.

Referring to Figure 10, a kind of insulating pot according to another preferred embodiment of the present utility model is additionally provided, it is therein Bottom of the pot wall 2 is also not more than 100W/m.k, preferably not greater than 60W/m.k low thermal conductivity metallic plate 8 including thermal conductivity factor.But Especially, thickening part 81 of the bottom surface of low thermal conductivity metallic plate 8 formed with enlarged in thickness, (the especially heat pipe of hot plate component 1 11) bottom surface of thickening part 81 is connected to heating kettle bottom wall 2.

So, thickening part 81 turns into heat pipe contact region, but due to the thickness increase of thickening part 81, i.e. heat pipe contact region Thickness it is bigger, thus cause the heat transfer of the through-thickness of thickening part 81 poor, the easy horizontal proliferation of heat, be advantageous to bottom of the pot wall 2 The transverse direction (Figure 10 paper left and right directions) of (i.e. the low thermal conductivity metallic plate 8 of Figure 10) is by thermal balance.

Wherein, the shape of thickening part 81 should correspond to the shape of heat pipe 11, to make thickening part 8 at least cover heat pipe after mounting 11.Generally, hot plate component 1 includes the heat pipe 11 in circular arrangement, and as shown in figure 12, thus thickening part 81 is formed as protruding from The round ring boss of the bottom surface of low thermal conductivity metallic plate 8, referring to Figure 10 to Figure 12.The heat pipe 11 of ring-type is then connected to annular On the bottom surface of boss.

In the embodiment shown in Figure 10, Figure 11, the external diameter of the thickening part 81 of round ring boss shape is less than low heat conduction system The external diameter of number metallic plates 8 so that the radially inner side region and radial outside region of thickening part 81 are each formed with smaller thin of thickness Portion 82.Obviously, circular inner groovy 83 is formed as referring to Figure 11, the radially inner side region of thickening part 81.This difference of bottom of the pot wall 2 The thin and thick in region is distinguished, and is advantageous to the equilibrium of horizontal heat.

Preferably, the thickness of thickening part 81 not less than 1mm and is not more than 5mm, more preferably not less than 2mm and is not more than 5mm, uniform heating effect is more prominent, and the thickness of thin section 82 is preferably less than 1mm in addition.

In another embodiment shown in Figure 14, because the both ends of heat pipe 11 are not docked to form closed ring, annulus The thickening part 81 of shape can also be correspondingly formed with otch 811, with the thin section in the radially inner side region of radial communication round ring boss 82 bottom surfaces and the bottom surface of thin section 82 in radial outside region.

In addition, the circular inner groovy 83 in Figure 11 can also be inlaid with high thermal conductivity coefficient gold of the thermal conductivity factor more than 100W/m.k Belong to plate 9, as shown in figure 13, promote the horizontal heat transfer between the thickening part 81 of annular, more promote the laterally heat of bottom of the pot wall Weighing apparatus.

With reference to figure 14, in this embodiment, along bottom of the pot wall 2 radially, outer peripheral edge and the heat pipe 11 of thickening part 81 The inner peripheral spacing d2 between outer peripheral edge spacing d1 and the inner peripheral of thickening part 81 and the inner peripheral of heat pipe 11 between outer peripheral edge Preferably meet respectively：2mm≤d1≤10mm, 2mm≤d2≤10mm so that heat pipe 11 is completely covered in thickening part 81 so that kettle Bottom wall obtains preferably horizontal thermal balance effect.Similarly, with theory of area, the following table area of thickening part 81 and the upper table of bottom of the pot wall 2 Area ratio should be not less than 1/8 and no more than 1/2, should preferably be not less than 1/6 and no more than 1/3.

Certainly, in other embodiments, as shown in figure 15, thickening part 81 may also be formed as protruding from low thermal conductivity gold Belong to the bottom surface of plate 8 and the disk boss-shaped of arranged concentric.Wherein, heat pipe 11, thickening part 81 and low thermal conductivity metallic plate 8 is outer Footpath increases successively.Now, the peripheral portion of only low thermal conductivity metallic plate 8 is formed as thin section 82.Similarly, thickening part 81 is outer Outer peripheral edge spacing d1 between the outer peripheral edge of periphery and heat pipe 11 should also meet：2mm≤d1≤10mm.

It is contemplated that ground, thickening part 81 can also cover the whole bottom surface of low thermal conductivity metallic plate 8, in other words so that bottom of the pot Wall 2 is formed as Integral upset wall.And in another embodiment shown in Figure 16 to Figure 18, the bottle body 3 of insulating pot is (for for example Food-grade stainless steel) and bottom of the pot wall 2 can also be all thickened wall, the two is connected by different welding manners.Now, bottle body 3 Thickness is usually not less than 0.5mm and is not more than 2mm, and the thickness of bottom of the pot wall 2 is usually not less than 1mm and is not more than 5mm.Certainly, kettle Body 3 is not limited to Integral upset wall, can also be local thickening, such as its lower half is the thickened wall of half portion thereon relatively Bottle body structure.

For further increase laterally heat transfer, thickness direction heat transfer is reduced, promotes the horizontal thermal balance of bottom of the pot wall, bottom of the pot wall 2 Bottom surface can surround bottom of the pot wall central distribution have spaced multiple insulated tanks 21 or adiabatic holes 22, as shown in figure 19.It is adiabatic The thermal conductivity factor of groove 21 or the air in adiabatic holes 22 is minimum, reduces the overall thermal conductivity factor of bottom of the pot wall 2, so as to reduce thickness side To heat transfer, accordingly expand lateral heat diffusion.

Preferably, insulated tank 21 can be around the concentric of the center of circle of bottom of the pot wall 2 and radially spaced arrangement shown in Figure 20 Annular groove or the concentric square groove shown in Figure 21, it can also be the frame trough that the straight trough shown in Figure 22 is formed.Similarly, Adiabatic holes 22 can be the uniform small square hole shown in uniform small sircle hole or Figure 24 shown in Figure 23, and be that blind hole is blind Groove.

In fig. 25, low thermal conductivity material 23 can be also filled in insulated tank 21 or adiabatic holes 22, such as than low heat conduction system The lower low thermal conductivity material 23 of the thermal conductivity factor of metallic plate 8 is counted, such as thermal conductivity factor is not more than 60W/m.k.

Wherein it is preferred to the whole floor space or top surface of the distribution area of insulated tank 21 or adiabatic holes 22 and bottom of the pot wall 2 Product ratio should be not less than 1/8 and no more than 1/2, preferably final that can play more preferably not less than 1/6 and no more than 1/3 Noise reduction.The depth of insulated tank 21 or adiabatic holes 22 is preferably not less than 0.2mm and is not more than 1.5mm, more preferably not small In 0.5mm and it is not more than 1mm.

Comparative example：

Enter Row noise and thermal power test by taking aluminium sheet of the thermal conductivity factor more than 200W/m.k as an example.Thermal conductivity factor is more than Easily there is early jump, water burns not open, thus can not be used separately as bottom of the pot wall because conductivity is too high in 300W/m.k copper coin.

Wherein, heating power：1800W, water in kettle：1.7L, the minimum thermal efficiency value of insulating pot should be not less than 80%.

Testing procedure：

1) maximum scale water, is put into kettle；

2), temperature sensor is placed in the middle of the height of water level at kettle center；

3), timing measuring is started by "start" button；

4) timing measuring is stopped when, water temperature rises to 80 DEG C in kettle；

5) sound power value≤45dB noise figure, is rejected, A weighteds are carried out to test noise value, take average acoustical power conduct Decision content.

Table 1：Corresponding noise data of the aluminium sheet under different-thickness

Bottom wall thickness	Maximum acoustical power/dB	Average acoustical power/dB
			1mm	67.5	64.6
2mm	67.9	64.0
			3mm	66.8	64.7
4mm	67.3	64.9
			5mm	66.5	63.5

In addition, the thermal efficiency value of the aluminium sheet of above-mentioned thickness is maintained at more than 87% high position, thickness effect is not notable, greatly In the minimum thermal efficiency value of insulating pot design.

Embodiment 1：

By thermal conductivity factor less than 20W/m.k 304 stainless steel plates exemplified by, respectively 0.5mm, 0.8mm, 1mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 6mm, 7mm have carried out noise-measuring totally under 12 kinds of different-thickness, obtain data Such as table 2 below.

Table 2：Corresponding noise data and thermal efficiency value data of 304 stainless steel plates under different-thickness

Comprehensive Tables 1 and 2 understands that in the thickness more than 1mm, thickness increases to noise almost the aluminium sheet of high thermal conductivity coefficient It is very high without influence, thermal efficiency value, it is clear that noise is excessive, but meets thermal efficiency requirement.And low thermal conductivity metallic plate is with thickness Increase, noise reduction is obvious, also on the basis of the design requirement of the two is met, is deposited along with the decline of thermal efficiency value certainly In preferred thickness range.

Referring specifically to table 2, during the thickness increase of 304 stainless steel plates of low thermal conductivity, maximum acoustical power and average sound work( Rate is all downward trend.In the certain thickness zone of reasonableness that thermal efficiency value meets design requirement (more than 80%), such as 1mm~ In the range of 5mm (being preferably 2mm~4mm or 2mm~5mm), the value range of maximum acoustical power and average acoustical power is all to connect Receive, compared to the aluminium sheet of high thermal conductivity coefficient, noise reduction is apparent.

Therefore, the bottom of the pot wall of low thermal conductivity material layer (i.e. 304 stainless steel plates etc.) is set up, increases low thermal conductivity material The integral thickness of layer or local thickness, can reach the effect for slowing down thickness direction heat transfer, increase horizontal thermal uniformity, from And it is finally reached optimization noise reduction.

Referring to Fig. 8 and Figure 26, a kind of insulating pot according to another preferred embodiment of the present utility model is additionally provided, its In bottom of the pot wall 2 also for stacking multiple layer metal harden structure, wherein, in multiple layer metal harden structure be preferably 2 layers or 3 laminates.It is more An at least low thermal conductivity metallic plate 8 be present in layer metal plate structure.

Wherein, soldering connection is preferably passed through between stacked conducting plate.

Especially, the first layer metal plate on the top layer in multiple layer metal harden structure is grade metal plate, stacked conducting plate At least one layer in other layers of metallic plate in structure in addition to first layer metal plate is thermal conductivity factor no more than 100W/m.k's Low thermal conductivity metallic plate 8, the heat transfer of thickness direction so can be effectively reduced, increase lateral heat diffusion.

Wherein, when being attached to the actual process parameter design of insulating pot, the gross thickness of bottom of the pot wall 2 should be not less than 1mm and not More than 5mm, wherein the thickness of the grade metal plate of first layer not less than 0.4mm and is not more than 0.8mm, and low thermal conductivity is golden The gross thickness of category plate 8 is not less than 0.2mm and is not more than 4.6mm.Certainly, it is only preferred exemplary that this parameter area, which is set, not to this Utility model is formed and is particularly limited to.

As it was previously stated, the ratio between top surface area of the following table area of at least one layer of low thermal conductivity metallic plate 8 and bottom of the pot wall 2 Not less than 1/4 and no more than 1.In the multiple layer metal harden structure of stacking, the diameter of each layer metallic plate can be identical, also can be different. For example, it may be the diameter of each layer metallic plate from top to bottom successively decreases successively.

In selection, as it was previously stated, 45# steel plates, 304 stainless steel plates, 430 stainless can be selected in low thermal conductivity metallic plate 8 Steel plate or high manganese steel sheet etc..So, illustratively, the multiple layer metal harden structure of insulating pot includes 304 stainless steel plates, the list on top layer Layer or 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or the high manganese steel sheet of multilayer and the aluminium sheet or copper coin of bottom, each plate Thickness degree is defined to：The thickness of 304 stainless steel plates on top layer is not less than 0.4mm and is not more than 0.8mm, the 45# of single or multiple lift Steel plate, 304 stainless steel plates, the gross thickness of 430 stainless steel plates or high manganese steel sheet not less than 0.2mm and are not more than 4.6mm, in bottom of the pot When the gross thickness of wall 2 should be not less than 1mm and be not more than 5mm, aluminium plate thickness is generally also smaller, typically smaller than 1mm.

Heat pipe 11 can be directly welded in the bottom surface of bottom of the pot wall 2, or the bottom of bottom of the pot wall 2 is fixedly connected on by substrate 12 Face, the preferably thermal conductivity factor of substrate 12 are more than 100W/m.k high thermal conductivity coefficient metallic plate 9, such as aluminium sheet, copper coin.Insulating pot Solderable connection between the periphery of bottom of the pot wall 2 and the bottom periphery of bottle body 3, also can crimping connection etc..

In addition, it is intervally distributed with multiple adiabatic holes in the laminate surface of at least one layer of metallic plate in the multiple layer metal harden structure 22 and/or insulated tank 21, for reducing longitudinal direction heat transfer, increase laterally heat transfer, increase heating surface (area) (HS, heating evenly, such as It is preceding described.

Such as Figure 20 to Figure 24, likewise, adiabatic holes 22 and/or insulated tank 21 surround the central distribution of laminate surface, and absolutely The distribution area of hot hole 22 and/or insulated tank 21 in single laminate surface is more than the circular face of the heat pipe 11 in hot plate component 1 Product.Insulated tank 21 can be circular or square annular groove, and radially spaced multiple annular groove distributions are in concentric circles or square with one heart Frame shape；Or insulated tank 21 can be straight trough, the multiple straight troughs distribution being spaced successively is in grid-like, is not repeated herein thin State.

Similarly, the depth of adiabatic holes 22 and/or insulated tank 21 should be not less than 0.2mm and be not more than 1mm.Adiabatic holes 22 And/or the low thermal conductivity material 23 that such as thermal conductivity factor is not more than 100W/m.k can be more filled with insulated tank 21.

Embodiment 2

Experimental condition, parameter are identical with comparative example 1, embodiment 1.

Employ in the bottom of the pot wall shown in Fig. 8 and Figure 26 and especially set in multiple layer metal harden structure and the laminate surface of metallic plate Adiabatic holes 22 and/or insulated tank 21 are counted, and the first layer metal plate on the top layer in multiple layer metal harden structure is from food-grade gold When belonging to plate, specifically chosen grade metal plate is 304 stainless steel plates (thermal conductivity factor is less than 20W/m.k), thickness 0.5mm, remaining (thermal conductivity factor is greatly for 430 stainless steel plates (thermal conductivity factor is less than 20W/m.k) and one layer of 0.5mm aluminium sheet for a layer thickness change In 200W/m.k), table 3 is obtained by the thickness (in the range of 0.2mm~4.6mm) for changing 430 stainless steel plates, wherein 430 not The laminate surface become rusty between steel plate and aluminium sheet is provided with the insulated tank 21 of concentric circles, and its depth is 0.2mm, can now be obtained In the test noise data such as table 3 below of different-thickness.

Table 3：In the bottom of the pot wall of multiple layer metal harden structure, the test noise data under 430 stainless steel plates of different-thickness With thermal efficiency value data

Bottom wall thickness	Maximum acoustical power/dB	Average acoustical power/dB	Thermal efficiency value
				0.5mm	72	64.7	86.2%
0.8mm	70.6	64	86%
				1mm	69	62	85.7%
2mm	66	60.4	84.5%
				2.5mm	63	59.3	83.8%
3mm	59.4	56.2	83%
				3.5mm	57.3	53	82.5%
4mm	53.8	51.4	81.2%
				4.5mm	51.2	49.5	79.8%

From table 3, in the bottom of the pot wall of multiple layer metal harden structure, the grade metal plate thickness of skim-coat is constant, and During the wall thickness increase of the metallic plate, especially low thermal conductivity metallic plate of lower section stacking, it is clear that noise reduction is also apparent, example Such as in the range of 2mm~4mm Rational Thickness, the noise range for meeting design requirement can be obtained, and meets the thermal effect of insulating pot The heating requirements of rate value.Especially after being designed using adiabatic holes 22 and/or insulated tank 21, hence it is evident that help to reduce noise, i.e., Make the aluminium sheet with the presence of high thermal conductivity coefficient, can also obtain individual layer low thermal conductivity metallic plate as shown in Figure 1 almost suitable drop Make an uproar effect.

Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model Utility model spirit and principle within, any modification, equivalent substitution and improvements made etc., for example, adiabatic holes 22 and/or absolutely Heat channel 21 can be regularly arranged hole slot and the conventional shape hole slot as shown in Figure 20 to Figure 24, it is apparent that can also be irregular Irregularly-shaped hole, special-shaped slot etc., its arrangement mode is also not necessarily limited to regular fashion, and such change should be included in the utility model Protection domain within.

It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance In the case of shield, it can be combined by any suitable means, in order to avoid unnecessary repetition, the utility model is to each The possible combination of kind no longer separately illustrates.

In addition, it can also be combined between a variety of embodiments of the present utility model, as long as it is not disobeyed Thought of the present utility model is carried on the back, it should equally be considered as content disclosed in the utility model.

Claims (15)

1. a kind of insulating pot, it is characterised in that including bottom of the pot wall (2) and hot plate component (1), the hot plate component (1) includes disk Around installed in the bottom surface of the bottom of the pot wall (2) to heat the electrically heated heat pipe (11) of the bottom of the pot wall (2), the bottom of the pot wall (2) For the multiple layer metal harden structure of stacking, the first layer metal plate on the top layer in the multiple layer metal harden structure is not less than for thickness 0.4mm and the grade metal plate no more than 0.8mm, in the multiple layer metal harden structure in addition to the first layer metal plate At least one layer in other layers of metallic plate is not more than 100W/m.k low thermal conductivity metallic plate (8) for thermal conductivity factor.

2. insulating pot according to claim 1, it is characterised in that the gross thickness of the bottom of the pot wall (2) is not less than 1mm and not More than 5mm, the gross thickness of the low thermal conductivity metallic plate (8) not less than 0.2mm and is not more than 4.6mm.

3. insulating pot according to claim 1, it is characterised in that at least one layer of low thermal conductivity metallic plate (8) The ratio between the top surface area of following table area and the bottom of the pot wall (2) not less than 1/4 and no more than 1.

4. insulating pot according to claim 1, it is characterised in that the number of plies in the multiple layer metal harden structure for 2 layers or 3 layers of person.

5. insulating pot according to claim 1, it is characterised in that in the multiple layer metal harden structure of stacking, each layer metallic plate Diameter it is identical, or, the diameter of each layer metallic plate from top to bottom successively decreases successively.

6. insulating pot according to claim 1, it is characterised in that the low thermal conductivity metallic plate (8) be 45# steel plates, 304 stainless steel plates, 430 stainless steel plates or high manganese steel sheet.

7. insulating pot according to claim 6, it is characterised in that the multiple layer metal harden structure of the insulating pot includes top layer 304 stainless steel plates, the low thermal conductivity metallic plate (8) of single or multiple lift, the aluminium sheet or copper coin of bottom.

8. the insulating pot according to any one in claim 1~7, it is characterised in that in the multiple layer metal harden structure At least one layer of metallic plate laminate surface on be intervally distributed with multiple adiabatic holes (22) and/or insulated tank (21).

9. insulating pot according to claim 8, it is characterised in that the adiabatic holes (22) and/or insulated tank (21) surround The central distribution of the laminate surface, and the adiabatic holes (22) and/or insulated tank (21) are in the single laminate surface Distribution area is more than the circular area of the heat pipe (11).

10. insulating pot according to claim 8, it is characterised in that the insulated tank (21) is circular or square annular Groove, radially spaced multiple annular groove distributions are in concentric circles or concentric boxes shape；Or the insulated tank (21) is straight Groove, the multiple straight trough distributions being spaced successively are in grid-like.

11. insulating pot according to claim 8, it is characterised in that the depth of the adiabatic holes (22) and/or insulated tank (21) Degree is not less than 0.2mm and is not more than 1mm.

12. insulating pot according to claim 8, it is characterised in that filled out in the adiabatic holes (22) and/or insulated tank (21) It is not more than 100W/m.k low thermal conductivity material (23) filled with thermal conductivity factor.

13. insulating pot according to claim 1, it is characterised in that pass through soldering connection between metallic plate described in multilayer.

14. insulating pot according to claim 1, it is characterised in that the heat pipe (11) is welded in the bottom of the pot wall (2) Bottom surface, or the heat pipe (11) are fixedly connected on the bottom surface of the bottom of the pot wall (2) by substrate (12), and the substrate (12) is Thermal conductivity factor is more than 100W/m.k high thermal conductivity coefficient metallic plate (9).

15. insulating pot according to claim 1, it is characterised in that the insulating pot includes bottle body (3), the bottom of the pot wall (2) it is welded to connect between periphery and the bottom periphery of the bottle body (3) or crimping is connected.