CN206728376U - A kind of multilayer circuit board - Google Patents
A kind of multilayer circuit board Download PDFInfo
- Publication number
- CN206728376U CN206728376U CN201720504085.6U CN201720504085U CN206728376U CN 206728376 U CN206728376 U CN 206728376U CN 201720504085 U CN201720504085 U CN 201720504085U CN 206728376 U CN206728376 U CN 206728376U
- Authority
- CN
- China
- Prior art keywords
- substrate
- hole
- conducting strip
- circuit board
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
It the utility model is related to a kind of multilayer circuit board, including several substrates and a contiguous block, substrate is stacked, and it is provided with insulation plate between two adjacent substrates, square through hole is equipped with the correspondence position of substrate and insulation board, substrate circuit layer is provided with the conducting strip of four four sides for extending to through hole；Contiguous block includes the connecting pole and installation sheet being plugged in through hole, and four sides of connecting pole are provided with the conducting film being conductively connected with conducting strip, and conducting film is extended on the lower surface of installation sheet.The utility model is by being provided with square through hole on substrate, and the conducting strip on four four sides for extending respectively into square through hole is provided with substrate, each conducting strip electrically connects with a connecting node on circuit layer or a component respectively, because there is provided contiguous block, conducting strip on each circuit layer is conductively connected, realizes being conductively connected between multiple connecting nodes between multiple circuit layers or multiple components.
Description
Technical field
It the utility model is related to wiring board techniques field, more particularly to a kind of multilayer circuit board.
Background technology
Wiring board is the important composition part of electronic product, provides fixed and support for electronic component, and be to realize
Electrical connection between electronic component.
With the development of electronic technology, the function of electronic product is original more powerful, therefore wiring board is also by original one side
Individual layer wiring board is progressively improved to the wiring board of double-sided multi-layer.
Existing multilayer circuit board is conductively connected, it is necessary in the circuit board between multilayer circuit board when making, to realize
Conductive through hole is set, and the inside of conductive through hole is provided with conductive metal layer, but this connected mode is excessively extensive, and conductive through hole
Junction between circuit is more weak, and conductive contact area is small, and each conductive through hole can only connect a circuit or
One element, the connection of multiple components and multiple connecting nodes between multiple circuit boards, it is necessary to set more in the circuit board
Individual conductive through hole.
Utility model content
Technical problem to be solved in the utility model is：Offer one kind conducts electricity very well and can be by a through hole reality
The multilayer circuit board being conductively connected that existing multiple components are living or connecting node is between multiple circuit layers.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of multilayer circuit board, including several bases
Plate, the substrate are provided with circuit layer, and the substrate is stacked, and are provided with insulation plate between adjacent two substrates,
Through hole is equipped with the correspondence position of the substrate and insulation board, the through hole is square, and the substrate circuit layer is provided with four
The conducting strip of individual four sides for extending respectively into the through hole；The multilayer circuit board is also used for including one will be multiple described
The contiguous block that conducting strip on substrate is conductively connected, the contiguous block include a connecting pole being plugged in the through hole, with
And it is used for the installation sheet being fixedly mounted on the substrate circuit layer, four sides of the connecting pole above the connecting pole
Face is provided with the conducting film for being correspondingly arranged with the conducting strip and being conductively connected with the conducting strip, and the conducting film extends to institute
State on the lower surface of installation sheet.
As preferable technical scheme, the substrate is the double-sided wiring board that circuit layer is designed with upper and lower surface.
As preferable technical scheme, the insulation plate is provided with the groove for housing the conducting strip.
As preferable technical scheme, the insulation plate is surrounded by positioning retainer ring, and the substrate is arranged on institute
State on the inside of positioning retainer ring.
As preferable technical scheme, the first faying face is provided with the inside of the positioning retainer ring, is set on the side of the substrate
There is the second faying face being adapted with first faying face.
By adopting the above-described technical solution, the beneficial effects of the utility model are：The utility model on substrate by setting
Square through hole has been put, and the conducting strip on four four sides for extending respectively into square through hole is provided with substrate, each
Conducting strip electrically connects with a connecting node on circuit layer or a component respectively, due to there is provided contiguous block, by each electricity
Conducting strip on the floor of road is conductively connected, and realizes leading between multiple connecting nodes between multiple circuit layers or multiple components
Electrical connection.
Because the insulation plate between two substrates is provided with the groove of accommodating conducting strip, multiple substrates are at pressing
During reason, the gap between substrate can be reduced, make the structure of multilayer circuit board more firm.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the mounting structure schematic diagram of substrate in the utility model embodiment；
Fig. 2 is the structural representation of contiguous block in the utility model embodiment；
Fig. 3 is Fig. 2 upward view；
In figure：1- substrates；11- circuit layers；The faying faces of 12- second；2- insulation plates；21- grooves；22- positioning retainer rings；
The faying faces of 23- first；3- conducting strips；41- connecting poles；42- installation sheets；43- conducting films.
Embodiment
As shown in figure 1, a kind of multilayer circuit board, including several substrates 1, substrate 1 are provided with circuit layer 11,1 layer of substrate
It is folded to set, and insulation plate 2 is provided between adjacent two substrates 1, on the correspondence position of substrate 1 and insulation plate 2
Provided with through hole, through hole is square, and the circuit layer 11 of substrate 1 is provided with the conducting strip of four four sides for extending respectively into through hole
3。
Insulation plate 2 is provided with the groove 21 of accommodating conducting strip 3, and insulation plate 2 is surrounded by positioning retainer ring 22,
Substrate 1 is arranged on the inner side of positioning retainer ring 22.
The inner side of positioning retainer ring 22 is provided with the first faying face 23, and the side of substrate 1 is provided with to be adapted with the first faying face 23
The second faying face 12.
Multilayer circuit board also includes a contiguous block for being used to the conducting strip 3 on multiple substrates being conductively connected, contiguous block
Including a connecting pole being plugged in through hole 41, and it is used to above connecting pole 41 to be fixedly mounted on the circuit of substrate 1
Installation sheet 42 on layer 11, four sides of connecting pole 41, which are provided with, to be correspondingly arranged with conducting strip 3 and is conductively connected with conducting strip 3
Conducting film 43, conducting film 43 extended on the lower surface of installation sheet 42.
Preferably, in the present embodiment, substrate is the double-sided wiring board that circuit layer is designed with upper and lower surface.
In the utility model, substrate is not limited to double-sided wiring board, the utility model be also applied for one side circuit with it is two-sided
The multilayer circuit board that circuit board pressing forms.
The advantages of general principle of the present utility model, principal character and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
- A kind of 1. multilayer circuit board, it is characterised in that：Including several substrates, the substrate is provided with circuit layer, the substrate It is stacked, and insulation plate is provided between adjacent two substrates, is all provided with the correspondence position of the substrate and insulation board There is a through hole, the through hole is square, and the substrate circuit layer is provided with four four sides for extending respectively into the through hole Conducting strip；The multilayer circuit board also includes a contiguous block for being used to the conducting strip on multiple substrates being conductively connected, The contiguous block includes a connecting pole being plugged in the through hole, and is used to be fixedly mounted above the connecting pole Installation sheet on the substrate circuit layer, four sides of the connecting pole be provided be correspondingly arranged with the conducting strip and with The conducting film that the conducting strip is conductively connected, the conducting film are extended on the lower surface of the installation sheet.
- A kind of 2. multilayer circuit board as claimed in claim 1, it is characterised in that：The substrate is to be designed with electricity in upper and lower surface The double-sided wiring board of road floor.
- A kind of 3. multilayer circuit board as claimed in claim 2, it is characterised in that：The insulation plate is provided with accommodating described The groove of conducting strip.
- A kind of 4. multilayer circuit board as claimed in claim 3, it is characterised in that：The insulation plate is surrounded by positioning Back-up ring, the substrate are arranged on the inside of the positioning retainer ring.
- A kind of 5. multilayer circuit board as claimed in claim 4, it is characterised in that：First is provided with the inside of the positioning retainer ring to combine Face, the side of the substrate are provided with the second faying face being adapted with first faying face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720504085.6U CN206728376U (en) | 2017-05-08 | 2017-05-08 | A kind of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720504085.6U CN206728376U (en) | 2017-05-08 | 2017-05-08 | A kind of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206728376U true CN206728376U (en) | 2017-12-08 |
Family
ID=60509598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720504085.6U Expired - Fee Related CN206728376U (en) | 2017-05-08 | 2017-05-08 | A kind of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206728376U (en) |
-
2017
- 2017-05-08 CN CN201720504085.6U patent/CN206728376U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171208 Termination date: 20180508 |