CN206710746U - A kind of backlight module - Google Patents
A kind of backlight module Download PDFInfo
- Publication number
- CN206710746U CN206710746U CN201720555039.9U CN201720555039U CN206710746U CN 206710746 U CN206710746 U CN 206710746U CN 201720555039 U CN201720555039 U CN 201720555039U CN 206710746 U CN206710746 U CN 206710746U
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- underframe
- heat
- backlight module
- led
- guide plate
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Abstract
The utility model discloses a kind of backlight module, including underframe, glue frame, light guide plate, LED and heat-conducting glue, the underframe is aluminum alloy frame, the LED towards the light guide plate incidence surface and be arranged on the inner side of the underframe, underframe and the glue frame is equipped with carries the light guide plate and LED to coat, the backlight module also includes heat conducting pipe, and the heat conducting pipe is adhered to the outside of the underframe by heat-conducting glue.By increasing copper heat conducting pipe on the basis of underframe is done with aluminum alloy materials, it can at utmost ensure backlight own temperature, avoid display module from generating heat.
Description
Technical field
Technical field of liquid crystal display is the utility model is related to, relates more specifically to a kind of strong backlight module of thermal diffusivity.
Background technology
Backlight source module is typically provided with liquid crystal display device, backlight source module includes light guide plate and be arranged on to lead
The LED of tabula rasa incidence surface, LED by light-emitting component with for make the luminous circuit board group of light-emitting component into.Got over current
Carry out more liquid crystal display devices to use out of doors, when being operated under the scene for having direct sunlight, in order to be shown as indoor,
Need the surface brightness of raising module.For LCD products, it is exactly to improve backlight to improve the most direct method of module surface brightness
Brightness, and as backlight illumination improves, the LED number of use is more and more, and backlight caloric value is increasing, and backlight must just be examined
Consider heat dissipation problem.Conventional backlight heat sink conception uses aluminum alloy frame in the prior art, and heat caused by LED is passed by heat-conducting glue
Aluminum alloy frame is delivered to, is distributed by aluminum alloy frame.But because outdoor environment is changeable, when environment temperature is high, depend merely on aluminium alloy
Frame can not radiate in time, it is therefore necessary to increase some other measure to improve heat dispersion, reduce the temperature of backlight source module.
Utility model content
In order to solve the deficiencies in the prior art, the utility model provides a kind of strong backlight module of thermal diffusivity.
The utility model technique effect to be reached is realized by following scheme：A kind of backlight module, including underframe, glue
Frame, light guide plate, LED and heat-conducting glue, the underframe are aluminum alloy frame, the LED towards the light guide plate incidence surface and
The inner side of the underframe is arranged on, underframe and the glue frame is equipped with carries the light guide plate and LED to coat, in addition to
Heat conducting pipe, the heat conducting pipe are adhered to the outside of the underframe by heat-conducting glue.
Preferably, the LED is towards on the incidence surface of the light guide plate and three faces being arranged on the inside of the underframe.
Preferably, the shape of the heat conducting pipe, position are corresponding to the arrangement of LED.
Preferably, the heat conduction tube material is C1020 oxygen-free coppers.
Preferably, in addition to FPC, the FPC are adhered on the inside of the underframe by heat-conducting glue.
Preferably, the material of the glue frame is expected for PC.
Preferably, the underframe outer surface carries out anode processing.
Preferably, underframe outer surface is mat surface.
Preferably, the backlight module size be 5 cun and more than.
The utility model has advantages below：
1st, by increasing copper heat conducting pipe on the basis of underframe is done with aluminum alloy materials, by the way of aluminum bronze combination,
First pass through aluminium alloy heat is conducted and distributed, recycle copper pipe waste heat to be rapidly transmitted to the radiating of client
Device, it so can at utmost ensure backlight own temperature, avoid display module from generating heat；
2nd, by setting locating dowel on underframe, positioning hole is accordingly opened up on glue frame, the grafting of locating dowel and positioning hole makes glue
Frame is not influenceed and phenomenon of expanding with heat and contract with cold by LED heat.
Brief description of the drawings
Fig. 1 is the schematic diagram of backlight module in the prior art；
Fig. 2 is the schematic diagram of backlight module in the utility model；
Fig. 3 is the A-A profiles in Fig. 2.
Embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
As shown in figure 1, backlight source module of the prior art includes underframe 1, glue frame 2, light guide plate 3, LED 4, FPC 5
With heat-conducting glue 6, the underframe 1 and glue frame 2 cooperate to be set with coating the undertaking light guide plate 3 and LED 4, the LED 4
Put in the incidence surface side of light guide plate 3, the FPC 5 is arranged on LED 4 bottom, and the underframe 1 passes through heat-conducting glue 6 and the glue
Frame 2, FPC 5 are fixed together.The underframe 1 is aluminum alloy frame, and heat caused by LED 4 is delivered to aluminium by heat-conducting glue 6 and closed
Golden frame, is transferred heat away from by aluminum alloy frame.
Heat-sinking capability is good in the less liquid crystal display device of size or in indoor liquid crystal display device for this structure,
Condition requirement can be met, but cause heat conduction can not because of the quantity increase of LED 4 in larger-size liquid crystal display device
In time, or out of doors under the higher environment of temperature, depend aluminum alloy frame radiating alone and be unable to reach requirement, be easily damaged backlight mould
Group.Therefore, the utility model makes improvements on the basis of existing structure, described in detail below.
As Figure 2-3, a kind of backlight module is disclosed in the utility model, the backlight module is used primarily in open air
On middle large scale display screen, the backlight source module size be generally 5 cun and more than.The backlight module includes underframe 100, glue
Frame 200, light guide plate 300, LED 400, FPC 500, heat-conducting glue 600.The underframe 100 is aluminum alloy frame.The LED 400
Towards the light guide plate 300 incidence surface and be arranged on the side of the underframe 100, the underframe 100 and glue frame 200, which coordinate, to be set
Put and carry light guide plate 300, LED 400 and the FPC 500 to coat, the FPC 500 is adhered to institute by heat-conducting glue 600
State the inner side of underframe 100., will using material of the aluminium alloy that thermal conductivity is good and heat transfer is fast as underframe 100 in the utility model
The heat of LED 400 is delivered to aluminum alloy frame by heat-conducting glue 600, then is dispersed into by aluminum alloy frame outside backlight module.
As a further improvement, the backlight module in the utility model also includes heat conducting pipe 700, the heat conducting pipe 700 is logical
Cross the outside that heat-conducting glue 600 is adhered to the underframe 100.The position that the shape of the heat conducting pipe 700 can place according to LED 400
Put and make corresponding shape, directly heat caused by LED 400 can be conducted.As a further improvement, the heat conducting pipe
700 material is C1020 oxygen-free coppers, and C1020 oxygen-free coppers are free from the fine copper that oxygen is also free of any deoxidier residue, thermal conductivity
Fabulous, processing characteristics and welding performance, corrosion resisting property and cryogenic property are good.
According to known technology, silver, copper, gold, the thermal conductivity factor of aluminium be respectively 411W/m.K, 398W/m.K, 315W/m.K,
237W/m.K, it can be seen that the maximum metal of thermal conductivity factor is silver, next to that copper, gold, aluminium, thermal conductivity factor is bigger, illustrates heat conduction
Performance is better.Because gold and silver is expensive, be not suitable for as Heat Conduction Material, although and copper heat conductivility is excellent, compare aluminium
Say, cost is high, heavy and poor processability, so metal frame is also not suitable for using copper after backlight large area.The thermal conductivity of other copper
Although can be more much faster than aluminium, the no aluminium of radiating of copper be fast, and copper quickly can take away heat, but can not be in a short time
The heat of itself is dispersed, therefore the utility model does underframe 100 using aluminium alloy, then copper lead is adhered to by heat-conducting glue 600
Heat pipe 700, by the way of Cu and Al combination, first pass through aluminium alloy and heat is conducted and distributed, recycle copper pipe unnecessary
Heat is rapidly transmitted to the heat abstractor of client, so can at utmost ensure backlight own temperature, avoid display module
Heating.
As a further improvement, the LED 400 towards the light guide plate 300 incidence surface and be arranged on the underframe
Three faces of 100 inner sides（A, b, c）On, the heat conducting pipe 700 is correspondingly arranged at immediately below LED 400, can fast and effeciently
Heat transfer is on heat conducting pipe 700.
As a further improvement, the material of the utility model glue frame 200 expects that the underframe 100 is close to the position of glue frame 200 for PC
Extend a locating dowel 110, the corresponding locating dowel of the glue frame 200, which coordinates, offers a positioning hole 210, and the locating dowel 110 is inserted
Into positioning hole 210, with the fixation glue frame 200.As a further improvement, the locating dowel and the quantity of positioning hole are at least
2 pairs, being formed in the relative both sides of the underframe 100 and glue frame 200, effectively prevents glue frame 200 from occurring because of the heat of LED 400
Expand with heat and contract with cold and influence LCD display effects.
Locating dowel 110 described in the utility model and positioning hole 210 are preferably shaped to cylinder but are not limited to cylinder.
As a further improvement, the outer surface of underframe 100 carries out anode processing, coarse table can be also further designed to
Face, makes the emissivity of underframe 100 increase, and improves radiant heat biography amount, and then helps to radiate.
It is last it should be noted that above example is only illustrating the technical scheme of the embodiment of the present invention rather than it is entered
Row limitation, although the embodiment of the present invention is described in detail with reference to preferred embodiment, one of ordinary skill in the art
It should be understood that can still be modified to the technical scheme of the embodiment of the present invention or equivalent substitution, and these modifications or wait
The scope of amended technical scheme disengaging technical scheme of the embodiment of the present invention can not also be made with replacement.
Claims (9)
1. a kind of backlight module, including underframe, glue frame, light guide plate, LED and heat-conducting glue, the underframe is aluminum alloy frame, described
LED towards the light guide plate incidence surface and be arranged on the inner side of the underframe, underframe and the glue frame be equipped with wrap
Cover the carrying light guide plate and LED, it is characterised in that institute is also adhered to by heat-conducting glue including heat conducting pipe, the heat conducting pipe
State the outside of underframe.
2. a kind of backlight module as claimed in claim 1, it is characterised in that the LED enters light towards the light guide plate
On face and three faces being arranged on the inside of the underframe.
3. a kind of backlight module as claimed in claim 1, it is characterised in that the shape of the heat conducting pipe, position and LED
Arrangement is corresponding.
4. a kind of backlight module as claimed in claim 1, it is characterised in that the heat conduction tube material is C1020 oxygen-free coppers.
5. a kind of backlight module as claimed in claim 1, it is characterised in that also gluing by heat conduction including FPC, the FPC
It is attached on the inside of the underframe.
6. a kind of backlight module as claimed in claim 1, it is characterised in that the material of the glue frame is expected for PC.
7. a kind of backlight module as claimed in claim 1, it is characterised in that the underframe outer surface carries out anode processing.
8. a kind of backlight module as claimed in claim 1, it is characterised in that underframe outer surface is mat surface.
A kind of 9. backlight module as claimed in claim 1, it is characterised in that the backlight module size be 5 cun and more than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720555039.9U CN206710746U (en) | 2017-05-18 | 2017-05-18 | A kind of backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720555039.9U CN206710746U (en) | 2017-05-18 | 2017-05-18 | A kind of backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206710746U true CN206710746U (en) | 2017-12-05 |
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ID=60464682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720555039.9U Active CN206710746U (en) | 2017-05-18 | 2017-05-18 | A kind of backlight module |
Country Status (1)
| Country | Link |
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| CN (1) | CN206710746U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108873148A (en) * | 2018-06-29 | 2018-11-23 | 维沃移动通信有限公司 | A kind of backlight module, display module and electronic equipment |
| CN113625490A (en) * | 2021-08-21 | 2021-11-09 | 南通市垲德利光电科技有限公司 | Assembled heat dissipation type backlight plate based on multilayer superposition |
-
2017
- 2017-05-18 CN CN201720555039.9U patent/CN206710746U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108873148A (en) * | 2018-06-29 | 2018-11-23 | 维沃移动通信有限公司 | A kind of backlight module, display module and electronic equipment |
| CN113625490A (en) * | 2021-08-21 | 2021-11-09 | 南通市垲德利光电科技有限公司 | Assembled heat dissipation type backlight plate based on multilayer superposition |
| CN113625490B (en) * | 2021-08-21 | 2022-05-24 | 南通市垲德利光电科技有限公司 | Assembled heat dissipation type backlight plate based on multilayer superposition |
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