CN206595279U - C.S.P flip-chip LED encapsulation structures - Google Patents
C.S.P flip-chip LED encapsulation structures Download PDFInfo
- Publication number
- CN206595279U CN206595279U CN201720120205.2U CN201720120205U CN206595279U CN 206595279 U CN206595279 U CN 206595279U CN 201720120205 U CN201720120205 U CN 201720120205U CN 206595279 U CN206595279 U CN 206595279U
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- China
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- chip
- printing opacity
- led encapsulation
- adhesion layer
- opacity colloid
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Abstract
The utility model discloses a kind of C.S.P flip-chips LED encapsulation structure, monomer is encapsulated including LED, LED encapsulation monomers include chip, printing opacity colloid, pad and adhesion layer, the chip of LED encapsulation monomers is set for upside-down mounting, printing opacity colloid is coated with chip, bottom is exposed pad, it is characterised in that one layer of printing opacity high temperature resistant is coated between the contact surface of chip and printing opacity colloid and stickiness is extremely strong while having the adhesion layer of micro-structural.Using after this structure, it is possible to provide with printing opacity colloid it is bigger paste area, make printing opacity colloid and chip gluing more firm, the doubt for the separation that comes off is not had, simultaneously using the microstructure design of this adhesion layer, it more can effectively increase the purpose of the light extraction efficiency of chip, i.e. reduction total reflection probability.
Description
Technical field
The utility model is related to the encapsulating structure field of light emitting diode (LED), especially for C.S.P flip-chips
Improvement carried out by the structure of LED encapsulation monomers.
Background technology
In recent years, the phenomenon of global warming is increasingly serious, therefore, and carbon reduction has turned into countries in the world in recent years and advocated
Subject under discussion, therefore so that the various environment-friendly products with carbon reduction are gradually taken seriously, and light emitting diode (LED) just accord with
Close the main trend of world's energy-saving and emission-reduction.
So-called wafer-level package is the packing colloid closely chip size of chip circumference cladding, general commercially available without base
Plate, the structure of unsupported C.S.P flip-chips LED encapsulation monomers are as shown in figure 1, the chip 10 of LED encapsulation monomers 1 is
Installing is put, and in being coated with printing opacity colloid 20 on chip 10, bottom is exposed pad 11, such a C.S.P LED encapsulation monomer 1
Chip 10 is, directly to contact, to be binded by the plasticity of printing opacity colloid 20 itself with chip 10 with printing opacity colloid 20, but such a is connect
That closes pastes that intensity is weaker, causes LED to encapsulate monomer 1 subsequently using the phenomenon that colloid departs from is had, this phenomenon can be directly resulted in
Lumination of light emitting diode color significantly deviates primary colors block target, real not satisfactory, is to there is improved necessity.
Utility model content
The utility model main purpose is to encapsulate monomer in long-term use to solve presently commercially available C.S.P flip-chips LED
The phenomenon of colloid disengaging is had, the problem of lumination of light emitting diode color significantly deviates primary colors block target is directly resulted in.
To achieve the above object, the utility model, which provides the technical scheme used, is；C.S.P flip-chips LED encapsulation knots
Structure, including LED encapsulation monomers, LED encapsulation monomers include chip, printing opacity colloid, pad and adhesion layer, LED encapsulation monomers
Chip be that upside-down mounting is set, printing opacity colloid is coated with chip, bottom is exposed pad, the contact surface of chip and printing opacity colloid
Between coating one layer of printing opacity high temperature resistant and stickiness is extremely strong while having the adhesion layer of micro-structural.
After the technical solution of the utility model, it is possible to provide with printing opacity colloid it is bigger paste area, make printing opacity colloid
It is more firm with chip gluing, the doubt for the separation that comes off is not had, while by the microstructure design of this adhesion layer, more can be effectively
Increase the light extraction efficiency of chip, i.e. reduction total reflection probability.
Brief description of the drawings
Fig. 1 is the LED encapsulation monomer structure schematic diagrames of flip-chip in the prior art.
Fig. 2 is the LED encapsulation monomer structure schematic diagrames of the utility model flip-chip.
Fig. 3 is the LED encapsulation monomer processing procedure schematic diagrames of the utility model flip-chip.
Wherein：1st, LED encapsulates monomer, and 10, chip, 11, pad, 20, printing opacity colloid, 30, adhesion layer.
Embodiment
As shown in Fig. 2 the utility model system provides a kind of C.S.P flip-chips LED encapsulation structure, it is so-called chip
Level encapsulation (Chip Scale Package), including LED encapsulation monomers 1, LED encapsulation monomers 1 are mainly by chip 10, printing opacity
Colloid 20, pad 11 and adhesion layer 30 are constituted, and the chip 10 of LED encapsulation monomers 1 is set for upside-down mounting, in cladding on chip 10
There is printing opacity colloid 20, bottom is exposed pad 11, one layer of printing opacity is coated between the contact surface of chip 10 and printing opacity colloid 20
High temperature resistant and stickiness is extremely strong while having the adhesion layer 30 of micro-structural；Pass through said structure, it is possible to provide bigger with printing opacity colloid
Area is pasted, makes printing opacity colloid and chip gluing more firm, the doubt for the separation that comes off is not had, while by the micro- of this adhesion layer
Structure design, more can effectively increase the light extraction efficiency (reduction total reflection probability) of chip.
Foregoing be referred to as micro-structural refers to that adhesion layer 30 itself is not a plane with the contact surface of printing opacity colloid 20, can be sawtooth
Face, wavy surface or other random fluctuation faces, pass through this micro-structural, it is possible to provide with printing opacity colloid 20 it is bigger paste area.
Fig. 3 show the LED encapsulation monomer processing procedure schematic diagrames of the utility model flip-chip, and it is mainly on support plate 40
Setting one layer is used for the fixation film of the position of fixed chip 10, is fixing some chips 10 of film surface distributed, and the chip 10 is in
Array is distributed, and gap is left between adjacent chip 10, is first coated with one layer of printing opacity high temperature resistant on the surface of chip 10 and stickiness is extremely strong
There is the adhesion layer 30 of micro-structural simultaneously, the printing opacity colloid 20 of one layer of encapsulation is then covered in the array of chip 10, then drying
Solidify the printing opacity colloid 20 of encapsulation, then cut from the gap of the array of chip 10, be allowed to be divided into C.S.P LED to seal
Monomer 1 is filled, C.S.P LED finally are encapsulated into monomer 1 removes from fixed film.
Claims (2)
1. a kind of C.S.P flip-chips LED encapsulation structure, including LED encapsulation monomers, LED encapsulation monomers include chip, printing opacity
Colloid, pad and adhesion layer, the chip of LED encapsulation monomers are set for upside-down mounting, are coated with printing opacity colloid on chip, bottom is outer
The pad of dew, it is characterised in that one layer of printing opacity high temperature resistant is coated between the contact surface of chip and printing opacity colloid and stickiness is extremely strong same
When there is the adhesion layer of micro-structural.
2. C.S.P flip-chips LED encapsulation structure as claimed in claim 1, it is characterised in that：Adhesion layer therein is so-called micro-
Structure refers to that adhesion layer is not in itself a plane with printing opacity colloid contact surface, is serrated face, wavy surface or other random fluctuations
Face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720120205.2U CN206595279U (en) | 2017-02-09 | 2017-02-09 | C.S.P flip-chip LED encapsulation structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720120205.2U CN206595279U (en) | 2017-02-09 | 2017-02-09 | C.S.P flip-chip LED encapsulation structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206595279U true CN206595279U (en) | 2017-10-27 |
Family
ID=60128348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720120205.2U Expired - Fee Related CN206595279U (en) | 2017-02-09 | 2017-02-09 | C.S.P flip-chip LED encapsulation structures |
Country Status (1)
| Country | Link |
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| CN (1) | CN206595279U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108110094A (en) * | 2017-12-22 | 2018-06-01 | 湘能华磊光电股份有限公司 | A kind of silica total incapsulation LED chip and preparation method thereof |
-
2017
- 2017-02-09 CN CN201720120205.2U patent/CN206595279U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108110094A (en) * | 2017-12-22 | 2018-06-01 | 湘能华磊光电股份有限公司 | A kind of silica total incapsulation LED chip and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171027 Termination date: 20190209 |