CN206584143U - The stripping off device of cover-plate glass and display device - Google Patents
The stripping off device of cover-plate glass and display device Download PDFInfo
- Publication number
- CN206584143U CN206584143U CN201720101763.4U CN201720101763U CN206584143U CN 206584143 U CN206584143 U CN 206584143U CN 201720101763 U CN201720101763 U CN 201720101763U CN 206584143 U CN206584143 U CN 206584143U
- Authority
- CN
- China
- Prior art keywords
- cover
- point type
- plate glass
- type heater
- stripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The application provides a kind of cover-plate glass and the stripping off device of display device, and the purpose of this utility model is:In the step for regeneration in having the display device of cover-plate glass and display panel using resin bonding, efficiency is good and yield rate Peeled display panel and cover-plate glass well.The utility model is stripping off device, and it is the display panel and the stripping off device of cover-plate glass for the display device (500) for having cover-plate glass and display panel using resin bonding, it is characterised in that had:Mounting table (20), the mounting table (20) loads the display device;With point type heater (10), the point type heater (10) releases the hot blast heated for the resin progress to the display device in spot formula from the cover-plate glass side, and utilizes the point type heater (10) by the resin heat resolve.
Description
Technical field
The utility model is related to the manufacture device of display device, more particularly to for the cover-plate glass in step for regeneration and aobvious
Show the stripping off device of the separation of panel.
Background technology
It is following constitute for liquid crystal display device:Be configured with TFT substrate and counter substrate, and in TFT substrate and
Pixel electrode and thin film transistor (TFT) (TFT) etc. in liquid crystal, the TFT substrate are clamped between opposite electrode and is formed as rectangular,
The counter substrate is relative with TFT substrate.Also, by controlling the transmitance of light that is produced by liquid crystal molecule by each pixel
Form image.
In liquid crystal display device, cover-plate glass is used in order to protect surface.After the completion of liquid crystal display panel, using ultraviolet
Line solidified resin etc., liquid crystal display panel is adhered to by cover-plate glass.It is bonded after cover-plate glass, if being sent out in liquid crystal display device
Existing problem, then regenerate the liquid crystal display device or discard.
If being intended to regenerate liquid crystal display device, cover-plate glass and liquid crystal display panel must be separated.The side of the separation
Method is different according to the resin of bonding cover-plate glass and liquid crystal display panel.If resin is rotten under low temperature, bonding force loses this
The resin of sample, then take the method that liquid crystal display device is put into refrigerator-freezer cooling to peel off.But, according to liquid crystal display device
Specification is different, it is impossible to which the situation using such resin is also a lot.
On the other hand, when resin is thermoplastic resin, can take resin is cut off with the cutting off tool of wire-shaped
Method.Such cutting-off method is documented in such as patent document 1.
Prior art literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2011-048055 publications
The content of the invention
The invention problem to be solved
Exemplified by the separation method of the resin of cover-plate glass and liquid crystal display panel described in patent document 1 as shown in Figure 8
Method.It regard the part that the wire 501 used as cutting edge is provided with supporting member 502 as cutting off tool 500
Use.In Fig. 8, liquid crystal display panel 400 and cover-plate glass 300 are bonded using resin 250, so as to constitute Liquid Crystal Module 500.
By Liquid Crystal Module 500 be heated to as defined in after temperature, because resin 250 is thermoplastic, therefore resin 250 softens, using cutting
Breaking tool 500 can be cut off.
Make cutting off tool 500 shown in Fig. 8 along the side with cover-plate glass 300 or the main surface parallel of liquid crystal display panel 400
To movement, so as to cut off resin 250.But, because the thickness of resin 250 is tens of μm to 150 μm or so, therefore so
Cutting-off method need operate it is skilled, while the operating time is elongated.
The utility model for realize can independent of operator it is skilled, expeditiously by the cover-plate glass in step for regeneration
300 and liquid crystal display panel 400 separation device.
Means for solving the problems
The utility model is the utility model solved the above problems a little, and representational composition is as described below.
(1) stripping off device, it is by the display surface for the display device for having display panel and cover-plate glass using resin bonding
The stripping off device that plate and cover-plate glass are peeled off, it is characterised in that have:Mounting table, the mounting table loads the display device;
With point type heater, the point type heater is released from the cover-plate glass side is in for the resin to the display device
The hot blast heated to spot formula, using the point type heater by the resin heat resolve.
(2) in the stripping off device described in (1), it is characterised in that there are multiple point type heaters, and in multiple spots
The display device is heated.
Brief description of the drawings
Fig. 1 is the top view of liquid crystal display device.
Fig. 2 is Fig. 1 A-A sectional views.
Fig. 3 A are the top view according to stripping off device of the present utility model.
Fig. 3 B are the side view according to stripping off device of the present utility model.
Fig. 3 C are the side view of the stripping off device in action.
Fig. 4 A are the top view of the display device for the part for showing the hot blast by the generation of point type heater.
Fig. 4 B are the sectional view of the display device for the part for showing the hot blast by the generation of point type heater.
Fig. 5 A are the top view for showing the state after resin gasification.
Fig. 5 B are the sectional view for showing resin gasification and the state in space being formed between cover-plate glass and display panel.
Fig. 6 is to show to utilize " scraper " by cover-plate glass and the sectional view of the state of display device stripping.
Fig. 7 is the sectional view of organic EL display.
Fig. 8 is stripping cover-plate glass and the conventional example of display device.
Description of reference numerals
10 ... point type heaters, 11 ... point type heater heads, 12 ... crosspieces, 13 ... point type heater flow adjusters,
14 ... thermoregulators, 15 ... hot blasts, 20 ... mounting tables, 21 ... stop parts, 40 ... controllers, 50 ... tracks, 51 ... supporting plates,
100 ... TFT substrates, 101 ... lower polarizing plates, 150 ... driving IC, 160 ... flexible wiring substrates, 200 ... counter substrates, 201 ...
Upper deflection board, 250 ... resins, 251 ... gases, 252 ... spaces, 300 ... cover-plate glass, 350 ... scrapers, 400 ... liquid crystal displays
Panel, 500 ... cutting off tools, 501 ... wires, 502 ... supporting members, 600 ... device substrates, 610 ... organic EL luminous elements,
650 ... sealing resins, 230 ... viscous and material piece, 700 ... hermetic sealing substrates
Embodiment
The utility model is described in detail following with embodiment.Although in the following description, to liquid crystal
Showing device is illustrated, but the utility model is not limited to liquid crystal display device, and organic EL display is also suitable.
[embodiment 1]
Fig. 1 is the top view of Liquid Crystal Module, and Fig. 2 is the sectional view of Liquid Crystal Module.In Fig. 1, upside is configured with cover-plate glass
300.Although cover-plate glass 300 be with formed by the identical size of TFT substrate 100 in liquid crystal display panel, this is
Example, also has the situation that cover-plate glass 300 is bigger than liquid crystal display panel, also has cover-plate glass 300 smaller than liquid crystal display panel
Situation.
Fig. 2 is Fig. 1 A-A sectional views.In Fig. 2, TFT substrate 100 and counter substrate 200 are bonded using encapsulant,
Liquid crystal is clamped between TFT substrate 100 and counter substrate 200.TFT substrate 100 is formed larger than counter substrate 200, TFT bases
Plate 100 is portion of terminal for the part of 1, the driving IC150 for driving liquid crystal display panel is configured with, in addition, being connected with use
In the flexible wiring substrate 160 for being externally supplied power supply, signal.
In the downside of TFT substrate 100, lower polarizing plate 101 is pasted with, polarization is pasted with the upside of counter substrate 200
Plate 201.Liquid crystal display panel 400 is constituted by TFT substrate 100, counter substrate 200, lower polarizing plate 101, upper deflection board 201.
On upper deflection board 201, cover-plate glass 300 is pasted with using resin 250.This is to mechanically protect liquid crystal display panel
400.In this specification, the state that liquid crystal display panel 400 is provided with into cover-plate glass is referred to as Liquid Crystal Module 500 or liquid crystal
Showing device.
In Fig. 2, the thickness of cover-plate glass 300 is following for more than 0.5mm, 1.5mm or so.In addition, TFT substrate 100 and right
It is 0.2mm to 0.7mm or so to put the thickness of substrate 200, and the thickness of upper deflection board 201 and lower polarizing plate 101 is 0.13mm or so.
The thickness for being bonded the resin 250 of upper deflection board 201 and cover-plate glass 300 is 30 μm or so to 170 μm or so.
Resin 250 is UV (ultraviolet) solidified resin, can be initially highly viscous liquid or film.It is used as tree
Adipose membrane, can be used such as OCA (Optical Clear Adhesive), as the resin for being initially liquid, and such as OCR can be used
(Optical Clear Resin).No matter how, resin is thermoplastic resin.
If being pinpointed the problems in the state of Liquid Crystal Module is become, the Liquid Crystal Module is decomposed, and by a part portion
Part regenerates.The process is referred to as step for regeneration.For the stripping of existing cover-plate glass and liquid crystal display panel, operator's
It is skillfully required, while the discarded rate of the part in step for regeneration is also high.By using the regenerating unit in the utility model,
The stripping process of cover-plate glass and liquid crystal display panel can be easily carried out, recycled product rate can be also improved.
Fig. 3 A are the top view of stripping off device of the present utility model.In Fig. 3 A, Liquid Crystal Module 500 is placed in mounting table 20
On.Liquid Crystal Module 500 is by stop part 21 so that position is fixed.Mounting table 20 is can be applied to various liquid crystal display devices
The mode of size significantly formed, and by stop part 21 come the position of regulation Liquid Crystal Module 500.
In Fig. 3 A right side, point type heater (spot heater) 10 is configured to 2 row, each column 4.In the utility model
Point type heater 10 be nozzle, make hot blast from the nozzle spray so as to Liquid Crystal Module 500 in spot formula heat.
Because nozzle has 8, therefore Liquid Crystal Module 500 is heated at 8 in spot formula.Point type heater 10 is installed in crosspiece 12
On.Crosspiece 12 is installed in point type heater head 11.
Can move up and down point type heater head 11 using hydraulic cylinder.According to the signal from controller 40, point type adds
Hot device first 11 is moved up and down.In Fig. 3 A, in order to adjust the flow of hot blast by each each point type heater 10, therefore 8 are configured with
Point type heater flow adjuster 13.Signal from point type heater flow adjuster 13 is transferred into by controller 40
Each point type heater 10.
Mounting table 20 is guided by track 50, can be moved in the horizontal direction.Mounting table 20 is in a side via the quilt of supporting plate 51
Track 50 is guided.Fig. 3 A state shows configuration Liquid Crystal Module 500, the shape that mounting table 20 is moved to the left in mounting table 20
State.Set in mounting table 20 after Liquid Crystal Module 500, mounting table 20 is moved along the direction of white arrow, and Liquid Crystal Module 500 is configured
In the downside of point type heater 10.
Liquid Crystal Module 500 is fixed by stop part 21.It should be noted that in order to which Liquid Crystal Module 500 is fixed on into mounting table
On 20, the steam vent of multiple vacuum suctions is formed with mounting table 20 sometimes.
Fig. 3 B are the side view of stripping off device of the present utility model.In Fig. 3 B, the panel in the downside of mounting table 20 is configured
There is the thermoregulator 14 of the temperature of the hot blast for being flowed in point of adjustment formula heater.With each point type heater 10 accordingly,
Configure 8 thermoregulators 14.On the other hand, with point type heater 10 accordingly, the panel in upside configures 8 point type heating
Device flow regulator.In Fig. 3 B, configure on the track 50 in mounting table 20, mounting table 20 and be provided with Liquid Crystal Module 500.
On Fig. 3 B right side, point type heater 10 is installed on crosspiece 12.Because point type heater 10 is formed 2
Row, therefore in Fig. 3 B, it is only capable of seeing 4 of prostatitis.The crosspiece 12 of support point type heater 10 is installed in point type heater head
On 11.
In Fig. 3 B, Liquid Crystal Module 500 and mounting table 20 are guided by track 50 together, and the direction shown in white arrow is moved,
Liquid Crystal Module 500 is parked in the lower section of point type heater 10.On the other hand, point type heater 10 as shown in white arrow along lower direction
It is mobile.
As described above, Fig. 3 C is show that Liquid Crystal Module 500 and point type heater 10 are moved, and Liquid Crystal Module 500 is arrived
From the side view of the stripping off device of the state of the hot blast of point type heater 10.In Fig. 3 C, point type heater 10 and Liquid Crystal Module 500
Interval g for 10mm or so.As shown by arrows, hot blast is blowed and sprayed cover-plate glass to Liquid Crystal Module 500 across interval g.
Fig. 4 A are the Liquid Crystal Module 500 for the combination for being shown as liquid crystal display panel 400 and cover-plate glass 300 from cover plate glass
The side of glass 300 is blowed and sprayed the top view of the state of hot blast by point type heater 10.In Fig. 4 A, the part shown in hacures passes through for hot blast
Point type heater 10 blows and sprays the part of the cover-plate glass 300 to Liquid Crystal Module 500.The diameter of the spot blowed and sprayed by hot blastFor example
For 10mm.
Fig. 4 B are Fig. 4 A B-B sectional views.In Fig. 4 B, the hot blast 15 shown in white arrow is blowed and sprayed to Liquid Crystal Module 500
Cover-plate glass 300.Then, region shown in hacures is heated in resin 250.Because the thickness of resin is 30 μm to a 150 μm left sides
The right side, it is very thin, therefore with the region of the region same degree of point type heater, being heated immediately.
Although the setting value of hot blast 15 is 300 DEG C or so, the part of resin 250 is 250 DEG C to 260 DEG C or so.Resin
250 be thermoplasticity, with the property of 250 DEG C to 260 DEG C or so gasifications.Because if resin 250 gasifies, volumetric expansion, because
This is intended to work the power that cover-plate glass 300 and liquid crystal display panel 400 are peeled by the resin of gasification.
Fig. 5 A are the top view for showing the state.In Fig. 5, the area after being heated by point type heater 10 in spot formula
Domain, deposits the gas 251 of resin 250 after disassembly.By the gas 251, to cover-plate glass 300 and liquid crystal display panel 400
The stress peeled is acted, heated in spot formula around formed space 252.For the part, without resin
250 bonding forces produced.
Fig. 5 B are Fig. 5 A sectional view.As shown in Figure 5 B, the gas 251 for decomposing and producing by resin 250, more
In region, cover-plate glass 10 and liquid crystal display panel 400 are peeled off.Therefore, although cover-plate glass 10 and liquid crystal display panel 400 are viscous
Then, but bonding force becomes very weak.
In stripping off device shown in Fig. 3 C, the irradiation of the hot blast from point type heater 10 untill such state is reached
Time is 20 seconds to 30 seconds or so.In Fig. 3 C, Liquid Crystal Module 500 becomes after Fig. 5 A or Fig. 5 B state, and mounting table 20 is to the left
It is mobile, Liquid Crystal Module 500 is arranged at the position shown in Fig. 3 B, and take out Liquid Crystal Module 500.
Bonding force for cover-plate glass 300 and liquid crystal display panel 400 as described so becomes very weak liquid crystal mould
Block 500, if the sharp scraper 350 in front end is inserted into the part of resin 250 as illustrated in fig. 6, by cover-plate glass 300 and liquid crystal
Show that panel 400 is simply peeled away.Because resin 250 is thermoplastic, therefore during insertion scraper 350, resin 250 is the shape of softening
State.Therefore, it is possible to be readily inserted into scraper 350.The thickness t of scraper 350 is calculated as such as 500 μm with main block part.Scraper 350
Material there is heat resistance, in addition, although the preferably scraper of the plastics with intensity, but can also be the scraper of metal.
It should be noted that for cover-plate glass 300, it can become strengthened glass, implement the process of intensive treatment
In, 400 DEG C or so of heat can be applied.Therefore, in above-mentioned stripping process, even if applying 300 DEG C or so of hot blast, cover-plate glass
300 is also indeformable or rotten.
As described above, by using this stripping off device, can not need operator it is skilled, in a short time by cover plate glass
Glass 300 and liquid crystal display panel 400 are peeled off.Further, since the stripping in the utility model is the gas gasified using resin
Peel off, therefore will not mechanically injury regeneration part, additionally it is possible to improve recycled product rate.
In explanation above, multiple is formed as to point type heater 10 and is illustrated.But, the viewing area of display device
Domain hour, even if point type heater 10 is 1, can also play effect of the present utility model.Even if this is due to by spot
The position heated is at 1, to be gasified by resin decomposition, stress is peeling between cover-plate glass and display panel likes
It is constant.
Although the explanation of the above is carried out liquid crystal display device as premise, the utility model can be also applicable
In the regeneration of organic EL display.Fig. 7 is the sectional view of organic EL display.In Fig. 7, it is formed with device substrate 600
Machine EL light-emitting components 610 etc..Sealing resin 650 is formed in order to protect organic EL luminous element 610, in addition, sealing resin 650
Effect with bonding device substrate 600 and hermetic sealing substrate 700.Hermetic sealing substrate is usually formed with glass, and this is to separate
The intrusion of moisture.Hermetic sealing substrate 700 also has the effect as cover-plate glass.
After adhering and sealing substrate 700, when being pinpointed the problems in organic EL display, it is necessary to by organic EL display point
Solve and regenerate.In the step for regeneration, by using the utility model, hermetic sealing substrate 600 and hermetic sealing substrate can be efficiently carried out
700 stripping.
Claims (7)
1. stripping off device, it is by the display panel and lid of the display device for having display panel and cover-plate glass using resin bonding
The stripping off device that glass sheet is peeled off, it is characterised in that have:
Mounting table, the mounting table loads the display device;With
Point type heater, the point type heater is released for the resin to the display device from the cover-plate glass side
The hot blast heated in spot formula is carried out,
, can be by the display panel and the cover-plate glass point by the resin heat resolve using the point type heater
From.
2. stripping off device as claimed in claim 1, it is characterised in that there are multiple point type heaters, and in multiple spots
Point is heated to the display device.
3. stripping off device as claimed in claim 1, it is characterised in that the mounting table can be from the mounting display device
Position is moved to the position heated using the point type heater.
4. stripping off device as claimed in claim 1, it is characterised in that the point type heater can be moved up and down, to described
When display device is heated, heated in the position declined from common position.
5. the stripping off device as any one of Claims 1-4, it is characterised in that the point type heater heating until
The resin is set to gasify, so that the cover-plate glass be peeled off from the display panel.
6. stripping off device as claimed in claim 5, it is characterised in that the point type heater be formed with it is multiple, can be by every
The individual point type heater adjusts the flow of hot blast.
7. stripping off device as claimed in claim 5, it is characterised in that the point type heater be formed with it is multiple, can be by every
The individual point type heater adjusts the flow of hot blast.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016017751A JP2017138378A (en) | 2016-02-02 | 2016-02-02 | Device peeling cover glass from display device |
JP2016-017751 | 2016-02-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206584143U true CN206584143U (en) | 2017-10-24 |
Family
ID=59564825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720101763.4U Active CN206584143U (en) | 2016-02-02 | 2017-01-25 | The stripping off device of cover-plate glass and display device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2017138378A (en) |
CN (1) | CN206584143U (en) |
-
2016
- 2016-02-02 JP JP2016017751A patent/JP2017138378A/en active Pending
-
2017
- 2017-01-25 CN CN201720101763.4U patent/CN206584143U/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017138378A (en) | 2017-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100967688B1 (en) | Acf attaching apparatus, flat panel display manufacturing apparatus and flat panel display | |
KR20160146699A (en) | Substrate separation apparatus for stacked body | |
CN102152590A (en) | Sheet adhesive method, sheet adhesive apparatus, laminated products and transcription process products | |
JP2008201629A (en) | Manufacturing method of electrooptical device, separating method of substrate, and substrate separating device | |
KR20080076711A (en) | Method and apparatus for separating bonded glass plates | |
CN108807227B (en) | Cutting device and cutting method for cutting display panel and display panel | |
CN101125324B (en) | Film forming method, discharging droplet method and droplet discharging device | |
CN206584143U (en) | The stripping off device of cover-plate glass and display device | |
JP2009076606A (en) | Mounting device and mounting method for electronic component | |
US6797926B2 (en) | Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus | |
CN206725881U (en) | Resin removing device | |
CN105810629B (en) | Supporting table, chip bonding method and device | |
JP2010251488A (en) | Substrate cutting method and substrate cutter | |
KR20060070141A (en) | Semiconductor chip package molding apparatus having cleaning pin | |
KR101619784B1 (en) | The apparatus for attaching the flexible sheet to others | |
JP2004025584A (en) | Ink jet head and method for producing the same | |
JP4046076B2 (en) | Electronic component mounting device | |
US7934976B2 (en) | Apparatus and method for scribing substrate | |
JP5113641B2 (en) | Display panel IC circuit element mounting apparatus and display panel | |
KR20070111788A (en) | Apparatus and method for cutting liquid crystal display panel | |
KR20050022409A (en) | Brittleness Material Cutting Apparatus using Laser Beam and Its Cutting Method | |
JP4252433B2 (en) | LSI chip removal apparatus and LSI chip repair method | |
JP2002184809A (en) | Tape-affixing method and device | |
JP2007324237A (en) | Method and apparatus for repairing semiconductor module | |
KR20120043868A (en) | Method of cutting substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |