CN206579308U - Circuit substrate automatic stamping device - Google Patents
Circuit substrate automatic stamping device Download PDFInfo
- Publication number
- CN206579308U CN206579308U CN201720255177.5U CN201720255177U CN206579308U CN 206579308 U CN206579308 U CN 206579308U CN 201720255177 U CN201720255177 U CN 201720255177U CN 206579308 U CN206579308 U CN 206579308U
- Authority
- CN
- China
- Prior art keywords
- substrate
- circuit substrate
- seal
- affixing
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 title claims abstract description 190
- 230000005540 biological transmission Effects 0.000 claims abstract description 42
- 230000000694 effects Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008676 import Effects 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a kind of circuit substrate automatic stamping device, constituted by circuit substrate translator unit and by circuit substrate part of affixing one's seal；The continuous signeting operation of circuit substrate can be realized, from supply bin carrying substrate to platform of affixing one's seal, by transmission device after affixing one's seal, substrate reception disposably fulfils assignment；Substrate is supplied with the posture piled up, and can disposably put into 100 substrates, and suction nozzle can hold substrate one by one when carrying, and carry out automatic sealing, without artificial operation；Affix one's seal distinctive calibration and fixed design on platform, it is ensured that the accuracy affixed one's seal, the direction of the camera of top to confirm substrate, it is ensured that accuracy；Set after circuit substrate supply, storage, can almost reach Unmanned operation, only need personnel in equipment startup, machine switching, supply substrate, manual degree is substantially reduced, and has saved production cost；Import after equipment, daily output quantity can reach 22,000pcs/ days (11h), substantially increase the efficiency for operation of affixing one's seal.
Description
Technical field
The utility model belongs to circuit board manufacturing area, more particularly to a kind of circuit substrate automatic stamping device.
Background technology
At present, it is with an official seal affixed using manually completing on circuit substrate, the hand-held seal of workman, dip in ink, it is laggard
Imprinted on every piece of circuit substrate of row.In this way, everyone daily completes the task of affixing one's seal of 4000 pieces of circuit substrates.If according to
Factory produces the calculating of 24000 pieces of circuit substrates daily, needs 6 workmans to carry out operations daily, so unusual labor intensive.Meanwhile,
Because artificial affix one's seal can not ensure that dynamics is uniform, so it sometimes appear that shallow, the dynamics substandard product such as not enough of affixing one's seal, causes serious
Waste.In order to effectively reduce, personnel are artificial, improve the efficiency for operation of affixing one's seal, greatly promote productivity ratio and operation quality of affixing one's seal,
Therefore research and develop and introduce and operation of affixing one's seal is carried out to circuit substrate using machine.
The content of the invention
For the deficiencies in the prior art, the utility model provides a kind of circuit substrate automatic stamping device, can
The continuous automatic sealing operation of circuit substrate is realized, and dynamics is uniform, accuracy rate is high, effective reduction personnel are artificial, improve lid
Zhang Zuoye efficiency, greatly improve productivity ratio and operation quality of affixing one's seal.
In order to solve the above-mentioned technical problem, the utility model is achieved through the following technical solutions：
A kind of circuit substrate automatic stamping device, is constituted by circuit substrate translator unit and by circuit substrate part of affixing one's seal；
Supply frame substrate is provided with the right side of circuit substrate translator unit, circuit substrate is deposited in supply frame substrate, in supply
With the first transmission device is provided with frame substrate, for the lifting of circuit substrate in control base board frame, on supply frame substrate
First sensor and first substrate suction nozzle are provided with, the first vertical cylinder is arranged at the top of the first suction nozzle and connected with the first suction nozzle
Connect；Storage frame substrate is provided with the left of circuit substrate translator unit, in storage with being provided with the 3rd transmission dress in frame substrate
Put, for the lifting of circuit substrate in control base board frame, in storage with being provided with second sensor and second substrate on frame substrate
Suction nozzle, the second vertical cylinder is arranged at the top of second substrate suction nozzle and is connected with second substrate suction nozzle, first substrate suction nozzle with
First cylinder, the second cylinder and second substrate suction nozzle set and are provided with one end on the same track of the second transmission device；Circuit
What substrate affixed one's seal part affixes one's seal platform on the above-mentioned track, is fixedly installed and is connect for the benchmark of permanent circuit substrate on platform of affixing one's seal
Head, is movably set with the Y-direction shift joint and X-direction shift joint for adjusting vertical and horizontal position, affixes one's seal under platform
Side is provided with the 4th transmission device and fiveth transmission device vertical with the 4th transmission device setting direction, for controlling platform of affixing one's seal
Camera is additionally provided with above movement in X-axis, Y direction, platform of affixing one's seal, camera is connected with laser seal-affixing machine.
The described supply frame substrate being provided with the track of the second transmission device from the right side of circuit substrate translator unit
Top is extended to above the storage frame substrate in left side.
Described playscript with stage directions body of affixing one's seal forms stair-stepping cuboid for surrounding, and it includes top-down upper plate with
Plate, the length of upper plate and the wide length and width for being respectively less than lower plate, the tall and big height in lower plate；Fixed in upper panel surface at long side edge
1-3 benchmark joint is provided with, being fixedly installed 1-2 benchmark close to edge surface in the short side adjacent with this long side connects
Head, is provided with height and upper plate height the first groove of identical, groove from edge Qi Xiang centers on another long side and is provided with work
Dynamic Y-direction shift joint, is provided with the second groove same as described above, groove from edge Qi Xiang centers on another short side and sets
The X-direction shift joint of activity is equipped with, is being affixed one's seal by benchmark joint and two shift joints come permanent circuit substrate on platform
Position.Slided by benchmark joint and two shift joints in groove, when circuit substrate is placed on the upper plate simultaneously
During with the benchmark junction contacts, the X-direction shift joint and Y-direction shift joint are moved and circuit substrate are positioned
And fixation.
Through hole is provided with the upper plate of described platform of affixing one's seal, described benchmark joint uses the externally threaded nut of one end band
Install in this through hole.
Band externally threaded nut in one end is respectively connected with described X-direction shift joint and Y-direction shift joint, to solid
Set the tone the circuit substrate of whole good position.
The length of the first described groove is the 1/3-1/2 of upper plate bond length, and the length of the second groove is the long side of upper plate
The 1/3-1/2 of length.
At most 100 circuit substrates can be placed in described supply frame substrate.
Described the first cylinder and the second cylinder is to move up and down formula cylinder.
Described Y-direction shift joint and X-direction shift joint synergy accurate calibration circuit substrate is being affixed one's seal on platform
Position.
Relative to prior art, the beneficial effects of the utility model are：
(1) circuit substrate automatic stamping device of the present utility model can realize the continuous signeting operation of circuit substrate；
(2) present apparatus is from supply bin carrying substrate to platform of affixing one's seal, by transmission device after affixing one's seal, by substrate reception, one
Secondary property fulfils assignment；
(3) circuit substrate of the present apparatus is supplied with the posture piled up, and can disposably put into 100 circuit substrates, suction nozzle exists
Circuit substrate can one by one be held during carrying, carry out automatic sealing, without artificial operation；
(4) distinctive calibration and fixed design on the platform of affixing one's seal of the present apparatus, it is ensured that the accuracy affixed one's seal, top
Direction of the camera to confirm circuit substrate, it is ensured that accuracy；
(5) present apparatus only needs personnel in equipment startup, machine switching, supply substrate or other emergency cases,
Manual degree is substantially reduced, and has saved production cost；
(6) production efficiency of the present apparatus can reach 22000pcs/ days (11h), substantially increase the efficiency for operation of affixing one's seal.
Brief description of the drawings
Fig. 1 is a kind of structural representation of circuit substrate automatic stamping device of the utility model；
Fig. 2 is the dotted portion structural representation affixed one's seal under platform in Fig. 1；
Fig. 3 is the structural representation of platform of affixing one's seal in Fig. 1；
Wherein, the 1, first transmission device；2nd, supply frame substrate；3rd, first substrate suction nozzle；4th, the first cylinder；5th, the second gas
Cylinder；6th, second substrate suction nozzle；7th, the second transmission device；8th, storage frame substrate；9th, the 3rd transmission device；10th, first sensor；
11st, second sensor；12nd, affix one's seal platform；12-1, upper plate；12-2, lower plate；13rd, benchmark joint；14th, Y-direction shift joint；14-
1st, the first groove；15th, X-direction shift joint；15-1, the second groove；16th, the 4th transmission device；17th, the 5th transmission device；18、
Camera；100th, laser seal-affixing machine；101st, circuit substrate.
Embodiment
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings：
Referring to an a kind of specific embodiment of circuit substrate automatic stamping device of the utility model shown in Fig. 1 to Fig. 3,
As can be seen that the utility model is by the first transmission device 1, supply frame substrate 2, first substrate suction nozzle 3, the first cylinder 4, second
Cylinder 5, second substrate suction nozzle 6, the second transmission device 7, store with frame substrate 8, the 3rd transmission device 9, first sensor 10, the
Circuit substrate translator unit and moved by platform 12 of affixing one's seal, benchmark joint 13, Y-direction that two sensors 11, circuit substrate 101 are constituted
Joint 14, X-direction shift joint 15, the 4th transmission device 16, the 5th transmission device 17, camera 18,100 groups of laser seal-affixing machine
Into circuit substrate affix one's seal part constitute；Supply frame substrate 2, circuit substrate are provided with the right side of circuit substrate translator unit
101 deposit in supply frame substrate 2, in supply with the first transmission device 1 is provided with frame substrate 2, for control base board frame
The lifting of interior circuit substrate, the base of first sensor 10 and first is provided with the side of circuit substrate 101 on frame substrate 2 in supply
Plate suction nozzle 3, the first cylinder 4 is vertically installed in the top of the first suction nozzle 3 and is connected with the first suction nozzle 3；Circuit substrate translator unit
Left side be provided with storage frame substrate 8, in storage with the 3rd transmission device 9 is provided with frame substrate 8, for control base board frame
The lifting of interior circuit substrate, in storage with being provided with second sensor 11 and second substrate suction nozzle 6, the second cylinder 5 on frame substrate 8
It is vertically installed in the top of second substrate suction nozzle 6 and is connected with second substrate suction nozzle 6；The cylinder 4 of first substrate suction nozzle 3 and first,
Second cylinder 5 is set with second substrate suction nozzle 6 to be provided with the same track of the second transmission device 7 at one end, and this track is certainly electric
The top of supply frame substrate 2 on the right side of base board translator unit extends to the storage in left side with frame substrate 8；Circuit substrate is affixed one's seal
Part is located on the track between the cylinder 4 of first substrate suction nozzle 3 and first, the second cylinder 5 and second substrate suction nozzle 6, platform of affixing one's seal
Fixed benchmark joint 13, Y-direction shift joint 14 and X-direction shift joint 15 are provided with 12, for adjustment circuit substrate
In the position on platform of affixing one's seal, be provided with the lower section for platform 12 of affixing one's seal the 4th transmission device 16 and with the side of setting of the 4th transmission device 16
To the 5th vertical transmission device 17, for movement of the platform 12 in X-axis, Y direction that control to affix one's seal.The top of platform 12 affixing one's seal also
Camera 18 is provided with, the direction to confirm substrate, it is ensured that accuracy, camera 18 is connected with laser seal-affixing machine 100.
At most 100 circuit substrates 101 can be placed in described supply frame substrate 2.
The first described cylinder 4 and the cylinder moving direction of the second cylinder 5 are to move up and down.
As shown in figure 3, the described body of platform 12 of affixing one's seal forms stair-stepping cuboid for surrounding, it is included from top to bottom
Upper plate 12-1 and lower plate 12-2, upper plate 12-1 length and the wide length and width for being respectively less than lower plate 12-2 are tall and big in lower plate 12-2's
It is high；3 benchmark joints 13 are fixedly installed at long side edge in upper panel surface, with this it is long while adjacent short side close to while
Surface is fixedly installed 2 benchmark joints 13 at edge, and height and upper plate height are provided with from edge Qi Xiang centers on another long side
The Y-direction shift joint 14 of activity is provided with identical the first groove 14-1, groove, on another short side from edge in
The heart is provided with the X-direction shift joint 15 for the activity of being provided with the second groove 15-1 same as described above, groove, passes through benchmark joint
13 and two shift joints carry out permanent circuit substrate 101 in the position on platform 12 of affixing one's seal.Pass through benchmark joint 13 and two
Shift joint is slided in groove, when circuit substrate 101 is placed on the upper plate 12-1 and is contacted with the benchmark joint 13
When, the X-direction shift joint 15 and Y-direction shift joint 14 are moved and circuit substrate 101 are positioned and fixed.
Affix one's seal platform 12 upper plate 12-1 on be provided with through hole, described benchmark joint 12 uses the externally threaded nut of one end band
Install in this through hole.
Band externally threaded nut in one end is respectively connected with described X-direction shift joint 15 and Y-direction shift joint 14, is used
With the circuit substrate 101 of fixed adjustment good position.
The length of the first described groove 14-1 is the 1/2 of upper plate bond length, and the second groove 15-1 length is upper plate
The 1/2 of long edge lengths.
The application method to the utility model circuit substrate automatic stamping device is described in detail below：
In use, placing 100 circuit substrates in supply frame substrate, supply substrate is controlled by the first transmission device
Circuit substrate in frame rises, and state is changed into " ON " after first sensor perceives height needed for circuit substrate rises to supply
Afterwards, the first transmission device stops rising, and the first cylinder rises (air-breathing), after control first substrate suction nozzle holds circuit substrate,
Circuit substrate is carried to by the control of the second transmission device above platform of affixing one's seal, subsequent first cylinder declines (exhaust), to cut
The absorption affinity of disconnected first substrate suction nozzle, circuit substrate, which is placed on, affixes one's seal on platform；Meeting after circuit substrate is placed on platform of affixing one's seal
Benchmark joint is touched, so as to control Y-direction shift joint and X-direction shift joint movement to position and consolidate circuit substrate
Calmly, the movement in circuit substrate X-direction and Y direction after the 4th transmission device and the control of the 5th transmission device are fixed, will
Circuit substrate is moved under camera, the pattern on camera identification circuit substrate, it is consistent with pre-stored patterns after then by the 4th
The position of affixing one's seal that transmission device and the control of the 5th transmission device are moved under laser seal-affixing machine, is covered by laser on circuit substrate
Chapter；After the completion of affixing one's seal, platform of affixing one's seal is moved to the extracting position of circuit substrate, for the Y-direction shift joint for positioning and fixing
Restored with X-direction shift joint, unclamp circuit substrate, the second cylinder rises (air-breathing), control second substrate suction nozzle by circuit base
After plate is held, circuit substrate is carried to by storage frame substrate by the control of the second transmission device, by the 3rd transmission device control
Circuit substrate declines in storage frame substrate processed, realizes the automatic sealing to circuit substrate.
While the circuit substrate for having covered chapter is moved into storage frame substrate, used by the control supply of the first transmission device
Circuit substrate in frame substrate rises, and the first cylinder rises (air-breathing), after control first substrate suction nozzle holds circuit substrate, leads to
Circuit substrate is carried to and affixed one's seal above platform by the control for crossing the second transmission device, continues to complete affixing one's seal next time, circulating repetition
Absorption, the action carried, placed are with implementing circuit substrate automatic sealing.
The utility model can realize the continuous signeting operation of circuit substrate, from supply bin carrying substrate to platform of affixing one's seal,
By transmission device after affixing one's seal, substrate reception disposably fulfils assignment；Substrate is supplied with the posture piled up, and can disposably be thrown
Enter 100 substrates, suction nozzle can hold substrate one by one when carrying, and carry out automatic sealing, without artificial operation；Affix one's seal platform
Upper distinctive calibration and fixed design, it is ensured that the accuracy affixed one's seal, the direction of the camera of top to confirm substrate,
Ensure accuracy；Set after circuit substrate supply, storage, can almost reach Unmanned operation, only in equipment startup, machine
Personnel are needed when switching, supply substrate supply substrate or other emergency cases, manual degree is substantially reduced, and has saved production
Cost；Import after equipment, daily output quantity can reach 22,000pcs/ days (11h), substantially increase the efficiency for operation of affixing one's seal.
Exemplary description is done to the utility model above, it should explanation, do not departed from core of the present utility model
In the case of the heart, it is any it is simple deformation, modification or other skilled in the art can not spend creative work etc.
Protection domain of the present utility model is each fallen within replacing.
Claims (8)
1. a kind of circuit substrate automatic stamping device, it is characterised in that：Affixed one's seal by circuit substrate translator unit and by circuit substrate
Part is constituted；Supply frame substrate is provided with the right side of circuit substrate translator unit, circuit substrate deposits in supply frame substrate
It is interior, in supply with the first transmission device is provided with frame substrate, for the lifting of circuit substrate in control base board frame, used in supply
It is provided with first sensor and first substrate suction nozzle on frame substrate, the first vertical cylinder is arranged at the top of the first suction nozzle and with
One suction nozzle is connected；Storage frame substrate is provided with the left of circuit substrate translator unit, is provided with frame substrate in storage
Three transmission devices, for the lifting of circuit substrate in control base board frame, storage be provided with frame substrate second sensor and
Second substrate suction nozzle, the second vertical cylinder is arranged at the top of second substrate suction nozzle and is connected with second substrate suction nozzle, the first base
Plate suction nozzle and the first cylinder, the second cylinder and second substrate suction nozzle set the same track for being provided with the second transmission device at one end
On；What circuit substrate affixed one's seal part affixes one's seal platform on the above-mentioned track, is fixedly installed on platform of affixing one's seal for permanent circuit substrate
Benchmark joint, be movably set with the Y-direction shift joint and X-direction shift joint for adjusting vertical and horizontal position, cover
The 4th transmission device and therewith orthogonal 5th transmission device are provided with below chapter platform, for control to affix one's seal platform X-axis,
Camera is additionally provided with above movement in Y direction, platform of affixing one's seal, camera is connected with laser seal-affixing machine.
2. circuit substrate automatic stamping device according to claim 1, it is characterised in that：Described playscript with stage directions body of affixing one's seal is four
Week forms stair-stepping cuboid, and it includes top-down upper plate and lower plate, the length of upper plate and the wide length for being respectively less than lower plate
And width, the tall and big height in lower plate；1-3 benchmark joint is fixedly installed at long side edge in upper panel surface, is grown with this
The adjacent short side in side is fixedly installed 1-2 benchmark joint close to edge surface, from edge Qi Xiang centers on another long side
The Y-direction shift joint that activity is provided with height and upper plate height the first groove of identical, groove is provided with, on another short side
The X-direction shift joint for the activity of being provided with the second groove same as described above, groove is provided with from edge Qi Xiang centers, passes through base
Quasi- joint and two shift joints carry out permanent circuit substrate in the position on platform of affixing one's seal；Pass through benchmark joint and two movements
Joint is slided in groove, and when circuit substrate is placed on the upper plate and during with the benchmark junction contacts, the X-direction is moved
Dynamic joint and Y-direction shift joint are moved and circuit substrate are positioned and fixed.
3. circuit substrate automatic stamping device according to claim 2, it is characterised in that：In the upper plate of described platform of affixing one's seal
On be provided with through hole, described benchmark joint is installed in this through hole using the externally threaded nut of one end band.
4. circuit substrate automatic stamping device according to claim 2, it is characterised in that：Described X-direction shift joint
With the externally threaded nut of one end band, the circuit substrate to fixed adjustment good position are respectively connected with Y-direction shift joint.
5. circuit substrate automatic stamping device according to claim 2, it is characterised in that：The length of the first described groove
For the 1/3-1/2 of upper plate bond length, the length of the second groove is the 1/3-1/2 of the long edge lengths of upper plate.
6. circuit substrate automatic stamping device according to claim 1, it is characterised in that：Described is provided with the second transmission
The storage frame substrate in left side is extended to above supply frame substrate on the track of device from the right side of circuit substrate translator unit
Top.
7. circuit substrate automatic stamping device according to claim 1, it is characterised in that：The first described cylinder and second
Cylinder is to move up and down formula cylinder.
8. circuit substrate automatic stamping device according to claim 1, it is characterised in that：In described supply frame substrate
At most 100 circuit substrates can be placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255177.5U CN206579308U (en) | 2017-03-16 | 2017-03-16 | Circuit substrate automatic stamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255177.5U CN206579308U (en) | 2017-03-16 | 2017-03-16 | Circuit substrate automatic stamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206579308U true CN206579308U (en) | 2017-10-24 |
Family
ID=60114320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720255177.5U Expired - Fee Related CN206579308U (en) | 2017-03-16 | 2017-03-16 | Circuit substrate automatic stamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206579308U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109515015A (en) * | 2018-11-15 | 2019-03-26 | 红塔烟草(集团)有限责任公司 | A kind of trade mark pressing steel stamp device of more specification cigarette products |
-
2017
- 2017-03-16 CN CN201720255177.5U patent/CN206579308U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109515015A (en) * | 2018-11-15 | 2019-03-26 | 红塔烟草(集团)有限责任公司 | A kind of trade mark pressing steel stamp device of more specification cigarette products |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171024 |