CN206574697U - The silicon wafer suction pen that wand prints phenomenon can be prevented effectively from - Google Patents
The silicon wafer suction pen that wand prints phenomenon can be prevented effectively from Download PDFInfo
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- CN206574697U CN206574697U CN201621472071.2U CN201621472071U CN206574697U CN 206574697 U CN206574697 U CN 206574697U CN 201621472071 U CN201621472071 U CN 201621472071U CN 206574697 U CN206574697 U CN 206574697U
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- wand
- pad pasting
- silicon wafer
- wafer suction
- suction pen
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Abstract
The utility model discloses a kind of silicon wafer suction pen for being prevented effectively from wand print phenomenon, including sucker and with the gas passage pipe for connecting its outside and internal pressure relief hole, also include a removably wand pad pasting panel, the wand pad pasting panel is layer structure, the bottom of the wand pad pasting panel is contacted with the nib of silicon wafer suction pen, and top layer is contacted with silicon chip.The bottom of the wand pad pasting panel is BOPET materials, and the top layer of the wand pad pasting panel is PE materials.The wand pad pasting panel is used for the ventilation sucker for preventing that wand pad pasting panel from shifting provided with one, and the ventilation sucker is ellipse.Compared with prior art, the technical program significantly improves the performance of wand, improve the electrical property and outward appearance of cell piece, and improve itself wear life in the environment, and pad pasting is readily replaceable, wand print phenomenon can be prevented effectively from, economic benefit is directly enhanced, is adapted to industrially promote the use of.
Description
Technical field
The utility model is related to technical field of solar cell manufacturing, and suction can be prevented effectively from more specifically to one kind
The silicon wafer suction pen of pen print phenomenon.
Background technology
During solar cell industry pecvd process, often slice, thin piece is set to be produced after PECVD sternly because of wand problem
The wand print of weight, has a strong impact on the outward appearance of cell piece.During solar cell industry pecvd process, it is necessary to slice, thin piece from general
Logical piece folder or the gaily decorated basket are transferred in graphite boat, can carry out related process.Some present producers use and PECVD device phase
Supporting automatic upper and lower film machine, but equipment cost is fairly expensive, so producer is and manual still to load and unload manually based on piece mostly
Slice, thin piece must be picked up and put or take place's graphite boat into again by handling piece with the wand of specialty.Now commonly used wand nib is all
It is made up of hard rubber, suction piece effect is fine, but disadvantage is that nib will seriously be ground after wand is using a period of time
Damage, impurity residual is had on such one side slice, thin piece, the slice, thin piece meeting after the normal process of battery, another aspect PECVD is influenceed
Because wand is worn and torn and produces white cut, the outward appearance of slice, thin piece is had a strong impact on.
As shown in figure 1, silicon wafer suction pen of the prior art includes gas passage pipe 2 and sucker 1, gas passage pipe 2 has
Its outside relief hole with inside is connected, sucker has rectangle bothrium, and rectangle bothrium is connected with gas passage pipe.Work as absorption
During silicon chip, relief hole is blocked, then makes gas passage pipe air-breathing, silicon chip air-breathing can be treated silicon chip being positioned over pre- by sucker
Behind fixed position, relief hole is opened wide, you can so that silicon chip is separated with sucker.
Because the written wear resistance of traditional wand is weak, just become very coarse using wand nib after a period of time.But
Cell piece surface matte is very small, easily damaged, so coarse nib can cause very big injury to matte, can cause electricity
Pond piece produces very big electric leakage, and has a strong impact on cell piece outward appearance, and the wand nib of abrasion has particulate contamination generation, this
Kind impurity, which is attached to cell piece surface, can also influence subsequent technique and electrical property.
Wand print problem occurs often in existing industry, but does not obtain enough attention, use for wand nor
Chang Danyi and passive, and actually wand print can have a strong impact on the outward appearance of cell piece, can decline cell piece grade, have a strong impact on
Economic benefit.
Utility model content
The purpose of this utility model is exactly that can effectively be kept away there is provided one kind to solve the above-mentioned problems in the prior art
Exempt from the silicon wafer suction pen that wand prints phenomenon, the silicon wafer suction pen can thoroughly solve wand print problem, so as to greatly optimize electricity
The outward appearance of pond piece, the electrical property of cell piece can be also improved to a certain extent.
The purpose of this utility model will be achieved by the following technical programs：The silicon chip that wand prints phenomenon can be prevented effectively from
Wand, including sucker and with connecting its outside gas passage pipe with internal pressure relief hole, in addition to one removably wand paste
Film surface plate, the wand pad pasting panel is layer structure, and the bottom of the wand pad pasting panel is contacted with the nib of silicon wafer suction pen,
Top layer is contacted with silicon chip.
Preferably, the bottom of the wand pad pasting panel is BOPET materials, and the top layer of the wand pad pasting panel is PE materials
Material.
Preferably, the wand pad pasting panel is used for the ventilation sucker for preventing that wand pad pasting panel from shifting provided with one.
Preferably, the ventilation sucker is ellipse.
Preferably, the thickness range of the primer is 0.5-1mm.
Preferably, the thickness range of the skin-material is 0.1-0.2mm.
Preferably, the outline of the wand pad pasting panel and the outline of silicon wafer suction pen nib match.
Preferably, the thickness of the wand pad pasting panel is 0.13 ~ 0.18mm.
The advantage of technical solutions of the utility model is mainly reflected in：Compared with prior art, the technical program is significantly improved
The performance of wand, improves the electrical property and outward appearance of cell piece, and improves itself wear life in the environment, and pastes
Film is readily replaceable, and from directly changing branch wand, directly enhances economic benefit, is adapted to industrially promote the use of.
Brief description of the drawings
Fig. 1 is the structural representation of traditional wand in the prior art；
Fig. 2 is the overall structure diagram of the utility model silicon wafer suction pen；
Fig. 3 is the left view of the utility model silicon wafer suction pen；
Fig. 4 is the contrast trend that changes over time of cell piece efficiency of the utility model prior art and the technical program
Figure；
1--- suckers, 2--- gas passage pipes, 3--- wand pad pasting panels, 4--- ventilation suckers, 5--- bottoms, 6--- tables
Layer, 7--- silicon wafer suction pens.
Embodiment
The purpose of this utility model, advantage and feature, will be schemed by the non-limitative illustration of preferred embodiment below
Show and explain.These embodiments are only the prominent examples using technical solutions of the utility model, all to take equivalent substitution or wait
Technical scheme formed by effect conversion, all fall within the utility model it is claimed within the scope of.
The utility model discloses a kind of silicon wafer suction pen for being prevented effectively from wand print phenomenon, as shown in Fig. 2 including sucker
1 and be provided with bothrium on its outside gas passage pipe 2 with internal pressure relief hole, the sucker 1 with connecting, the bothrium with it is described
Gas passage pipe is connected.The silicon wafer suction pen 7 also includes a removably wand pad pasting panel 3, and the wand pad pasting panel 3 is being used
During can change disposable, at any time, the wand pad pasting panel 3 is pasted on the surface of sucker 1, the wand pad pasting
Panel 3 is a layer structure, and the bottom of the wand pad pasting panel is contacted with the nib of silicon wafer suction pen, the wand pad pasting panel
Top layer contacted with silicon chip.
As shown in figure 3, the bottom 5 of the wand pad pasting panel is BOPET materials, the thickness range of the primer is
0.5-1mm.The BOPET materials are the foamed material of high temperature resistant and wear-resisting polyurethane structural, and the material film has good
Wearability and pliability, the wear-resistant of the bottom pad pasting undermine the electrical property that softness directly affects cell piece；The wand patch
The top layer 6 of film surface plate is PE materials, and the thickness range of the skin-material is 0.1-0.2mm.The PE thin-film materials have protection against the tide
Ability and wear resistance, the wear-resistant and moisture proof of the film layer can directly affect the outward appearance of cell piece and the resistance to used time of pad pasting
Between.The layer structure material of the wand pad pasting panel finally determines the performance of wand, and stable cell piece efficiency improves warp
Ji benefit.
During work, press gas passage pipe, block relief hole, extrude gas passage pipe, then need to inhale by sucker alignment
The silicon chip risen, silicon chip is held by silicon wafer suction pen, and silicon chip now can be just positioned over to predetermined position, unclamps relief hole, this
Just complete the movement to silicon chip.Because the surface mount of sucker has wand pad pasting panel, after using a period of time, wand patch
The surface of film surface plate will result in a certain degree of abrasion, because the wand pad pasting panel is to be removable installed in the silicon
In piece wand, now replaceable one new wand pad pasting panel, can thus reduce the injury caused to silicon wafer suede, have
Effect avoids wand from printing the generation of phenomenon, reduces the possibility of electric leakage, and also improves having no relations for silicon chip, while also avoiding
Frequent replacing silicon wafer suction pen, reduces the replacing amount of silicon wafer suction pen, reduces the production cost of silicon chip.
As shown in Fig. 2 the wand pad pasting panel is used to prevent from inhaling the ventilation sucker 4 that film surface plate is shifted provided with one,
In the present embodiment, the ventilation sucker 4 is preferably ellipse, and when silicon wafer suction pen is in adsorption process, the elliptical vent hole is
It can guarantee that the adsorption capacity of wand can guarantee that pad pasting will not be deformed or loosened again.The outline and silicon of the wand pad pasting panel
The outline of piece wand nib matches, and the thickness of the wand pad pasting panel is 0.13 ~ 0.18mm, described in the present embodiment
The thickness of wand pad pasting panel is preferably 0.15mm.
Fig. 4 is that cell piece efficiency changes with time tendency chart, and A is the cell piece efficiency using traditional wand with the time
Variation tendency, B is to be changed with time tendency chart using the cell piece efficiency of technical solutions of the utility model wand pad pasting panel.
It can be become apparent from from Fig. 4, after traditional wand was used to certain time, because traditional wand nib is ground
Damage serious, cause the electrical property of cell piece to be decreased obviously, and use the electrical property of the cell piece of wand pad pasting panel highly stable.
Application example：
Here is for using traditional wand of the prior art and using technical solutions of the utility model within 11 days
Wand pad pasting panel battery piece efficiency and the statistics of the specific data of aberration rate；
Table 1 is the cell piece efficiency and the statistics of aberration rate using traditional wand, and design parameter is as follows:
.Table 2 is the statistics of the cell piece efficiency and aberration rate that use wand pad pasting panel,
Design parameter is as follows:
.The battery produced it can be seen from above-mentioned Tables 1 and 2 using silicon wafer suction pen provided by the utility model
Piece conversion efficiency is improved, and aberration rate is reduced, and be effectively prevent wand print using silicon wafer suction pen drop and is also substantially increased
The performance of cell piece and life-span.
Compared with prior art, technical solutions of the utility model significantly enhance the performance of wand, improve battery
The electrical property and outward appearance of piece, and itself wear life in the environment is improved, and pad pasting is readily replaceable, and from directly changing
Branch wand, directly enhances economic benefit.
Compared with prior art, the technical program significantly improves the performance of wand, improves the electrical property of cell piece
And outward appearance, and itself wear life in the environment is improved, and pad pasting is readily replaceable, and from directly changing branch wand, directly
Connect and improve economic benefit, be adapted to industrially promote the use of.
The utility model still has numerous embodiments, all technologies formed by all use equivalents or equivalent transformation
Scheme, all falls within protection domain of the present utility model.
Claims (8)
1. the silicon wafer suction pen that wand prints phenomenon can be prevented effectively from, including sucker（1）It is outside with internal pressure relief hole with its is connected
Gas passage pipe（2）, it is characterised in that：Also include a removably wand pad pasting panel（3）, the wand pad pasting panel
（3）For layer structure, the bottom of the wand pad pasting panel is contacted with the nib of silicon wafer suction pen, and top layer is contacted with silicon chip.
2. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：
The wand pad pasting panel is used for the ventilation sucker for preventing that wand pad pasting panel from shifting provided with one（4）.
3. according to claim 2 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：
The ventilation sucker（4）For ellipse.
4. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：
The bottom of the wand pad pasting panel（5）For BOPET materials, the top layer of the wand pad pasting panel（6）For PE materials.
5. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：
The bottom（5）The thickness range of material is 0.5-1mm.
6. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：The top layer
（6）The thickness range of material is 0.1-0.2mm.
7. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：The wand patch
The outline of film surface plate and the outline of silicon wafer suction pen nib match.
8. according to claim 1 be prevented effectively from the silicon wafer suction pen that wand prints phenomenon, it is characterised in that：The wand patch
The thickness of film surface plate is 0.13 ~ 0.18mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472071.2U CN206574697U (en) | 2016-12-30 | 2016-12-30 | The silicon wafer suction pen that wand prints phenomenon can be prevented effectively from |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472071.2U CN206574697U (en) | 2016-12-30 | 2016-12-30 | The silicon wafer suction pen that wand prints phenomenon can be prevented effectively from |
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| CN206574697U true CN206574697U (en) | 2017-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621472071.2U Active CN206574697U (en) | 2016-12-30 | 2016-12-30 | The silicon wafer suction pen that wand prints phenomenon can be prevented effectively from |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133908A (en) * | 2017-12-06 | 2018-06-08 | 中建材浚鑫科技有限公司 | A kind of wand impression method for being used to solve silicon wafer suction pen |
-
2016
- 2016-12-30 CN CN201621472071.2U patent/CN206574697U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133908A (en) * | 2017-12-06 | 2018-06-08 | 中建材浚鑫科技有限公司 | A kind of wand impression method for being used to solve silicon wafer suction pen |
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Address after: 214400 No. 1011 Chengcheng Road, Shengang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: In building materials jetion science and Technology Co Ltd Address before: 214400 No. 1011 Chengcheng Road, Shengang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: China National Building Materials Group Corporation Jetion Solar (China) Co., Ltd. |