CN206541848U - The LED support of water resistance and heat dispersion can be improved - Google Patents

The LED support of water resistance and heat dispersion can be improved Download PDF

Info

Publication number
CN206541848U
CN206541848U CN201720155186.7U CN201720155186U CN206541848U CN 206541848 U CN206541848 U CN 206541848U CN 201720155186 U CN201720155186 U CN 201720155186U CN 206541848 U CN206541848 U CN 206541848U
Authority
CN
China
Prior art keywords
trunk portion
water resistance
heat dispersion
insulating body
led support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720155186.7U
Other languages
Chinese (zh)
Inventor
马衡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Mayor Sheng Electronic Technology Co Ltd
Original Assignee
Dongguan Mayor Sheng Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Mayor Sheng Electronic Technology Co Ltd filed Critical Dongguan Mayor Sheng Electronic Technology Co Ltd
Priority to CN201720155186.7U priority Critical patent/CN206541848U/en
Application granted granted Critical
Publication of CN206541848U publication Critical patent/CN206541848U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of LED support for improving water resistance and heat dispersion, includes insulating body, thermal column and multiple conducting terminals;The surface of the insulating body is recessed to be formed with accommodating cavity;The thermal column and multiple conducting terminals are fixedly connected with plastic body produced by insert molding, the thermal column includes the first trunk portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion, the plurality of conducting terminal is distributed in the periphery of thermal column, and each conducting terminal is respectively provided with the fixed part and weld part for being integrally formed connection.The utility model is using radiating rod structure, chip is fixed on the upper surface of the 4th trunk portion, realize preferably heat dispersion, also, by using the trunk portion of various outer diameter, enable thermal column and insulating body strong bonded, more preferable water resistance is realized, in addition, being convexly equipped with triangle fin by the upper and lower surface in fixed part, so that insulating body and conducting terminal strong construction, further improve the overall water resistance of product.

Description

The LED support of water resistance and heat dispersion can be improved
Technical field
The utility model is related to LED support art, refers in particular to a kind of water resistance and heat dispersion of improving LED support.
Background technology
LED supports are a kind of base electronic components, are one of the critical elements of LED encapsulation, predominantly LED chips And its phase interconnection line provides mechanically supported, support, air-tightness protection and promotes the functions such as LED devices radiating.In recent years, with The raising of semi-conducting material and the perfect of packaging technology, luminous flux and light extraction efficiency, power-type LED is in urban landscape, friendship The special lighting fields such as logical mark, LCD backlights, automotive lighting, billboard are applied, and are strided forward to general illumination market.
LED support of the prior art is typically that chip is fixed on a metal sheet, radiating effect is not when in use It is good, and each conductive terminal structure is single, it is impossible to realize preferable water resistance.Therefore, it is necessary to current LED support knot Structure is improved.
Utility model content
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide one kind to be improved the utility model The LED support of water resistance and heat dispersion, it can effectively solve existing LED support thermal diffusivity and water proofing property is not good asks Topic.
To achieve the above object, the utility model is using following technical scheme:
A kind of LED support for improving water resistance and heat dispersion, includes insulating body, thermal column and multiple leads Electric terminal;The surface of the insulating body is recessed to be formed with accommodating cavity;The thermal column and multiple conducting terminals are inlayed with plastic body Embedding shaping is fixedly connected, the thermal column include from lower to upper successively be integrally formed connect and be coaxially disposed the first trunk portion, Second trunk portion, the 3rd trunk portion and the 4th trunk portion, the external diameter of the second trunk portion are more than the external diameter of the first trunk portion, the 3rd post The external diameter in body portion is more than the external diameter of the second trunk portion, and the external diameter of the 4th trunk portion is less than the external diameter of the first trunk portion, the first cylinder The bottom surface of the downwardly projecting insulating body in lower end in portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion are embedded in insulation originally In vivo, and the 4th trunk portion upper surface be located at accommodating cavity in and accommodating cavity protruding upward bottom surface, the upper surface of the 4th trunk portion For crystal bonding area;The plurality of conducting terminal is distributed in the periphery of thermal column, and each conducting terminal, which is respectively provided with, is integrally formed consolidating for connection Determine portion and weld part, fixed part is embedded in insulating body, and pad is provided with fixed part, the pad exposes the bottom surface of accommodating cavity, And the upper and lower surface of fixed part is convexly equipped with triangle fin.
As a kind of preferred scheme, the surface of the 3rd trunk portion is arranged with annular groove, and the annular groove is embedded in absolutely In edge body, annular groove is located at the periphery of the 4th trunk portion.
As a kind of preferred scheme, first trunk portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion are Cylinder.
As a kind of preferred scheme, the upper and lower surface of the fixed part is convexly equipped with multiple aforementioned triangular fins, multiple Triangle fin is intervally arranged.
As a kind of preferred scheme, insulating body is stretched out in the outer end of the fixed part, and the outer end of fixed part passes through a bending Portion is integrally formed with weld part and is connected, and the weld part horizontally outward extends.
As a kind of preferred scheme, the pad is built up by nickel dam and silver layer.
As a kind of preferred scheme, the thermal column is copper material.
As a kind of preferred scheme, the multiple conducting terminal is copper material.
As a kind of preferred scheme, the conducting terminal is six.
As a kind of preferred scheme, the madial wall radial symmetric of the accommodating cavity is provided with two first arc recess, for Every one first arc recess is symmetrically arranged with two second arc recess in the madial wall of accommodating cavity.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology Scheme is understood:
The utility model is using radiating rod structure, and chip is fixed on the upper surface of the 4th trunk portion, and realization is preferably radiated Performance, also, by using the trunk portion of various outer diameter so that thermal column can be realized more preferable with insulating body strong bonded Water resistance, in addition, being convexly equipped with triangle fin by the upper and lower surface in fixed part so that insulating body and conducting end Sub- strong construction, further improves the overall water resistance of product.
More clearly to illustrate architectural feature of the present utility model and effect, come below in conjunction with the accompanying drawings with specific embodiment pair The utility model is described in detail.
Brief description of the drawings
Fig. 1 is the front view of the preferred embodiment of the utility model;
Fig. 2 is the preferred embodiment sectional view of the utility model.
Accompanying drawing identifier declaration:
10th, insulating body 11, accommodating cavity
12nd, the first arc recess 13, the second arc recess
20th, thermal column 21, the first trunk portion
22nd, the second trunk portion 23, the 3rd trunk portion
24th, the 4th trunk portion 201, annular groove
30th, conducting terminal 31, fixed part
32nd, weld part 33, bending part
301st, triangle fin 40, pad
41st, silver layer.
Embodiment
It refer to shown in Fig. 1 and Fig. 2, that show the concrete structure of the preferred embodiment of the utility model, include Insulating body 10, thermal column 20 and multiple conducting terminals 30.
The surface of the insulating body 10 is recessed to be formed with accommodating cavity 11;In the present embodiment, the inner side of the accommodating cavity 11 Wall radial symmetric is provided with two first arc recess 12, for every one first arc recess 12 in the madial wall pair of accommodating cavity 11 Title is arranged with two second arc recess 13.
The thermal column 20 and multiple conducting terminals 30 are fixedly connected with the produced by insert molding of plastic body 10, and the thermal column 20 is wrapped Include the first trunk portion 21, the second trunk portion 22, the 3rd trunk portion for being integrally formed successively from lower to upper and connecting and being coaxially disposed 23 and the 4th trunk portion 24, the external diameter of the second trunk portion 22 is more than the external diameter of the first trunk portion 21, the external diameter of the 3rd trunk portion 23 More than the external diameter of the second trunk portion 22, the external diameter of the 4th trunk portion 24 is less than the external diameter of the first trunk portion 21, the first trunk portion 21 The downwardly projecting insulating body 10 in lower end bottom surface, the second trunk portion 22, the 3rd trunk portion 23 and the 4th trunk portion 24 are embedded in In insulating body 10, and the upper surface of the 4th trunk portion 24 is located in accommodating cavity 11 and the bottom surface protruding upward for housing 11 chambers, the 4th The upper surface of trunk portion 24 is crystal bonding area;In the present embodiment, the thermal column 20 is copper material, good heat dissipation effect, also, institute The surface for stating the 3rd trunk portion 23 is arranged with annular groove 201, and the annular groove 201 is embedded in insulating body 10, annular groove 201 are located at the periphery of the 4th trunk portion 24, to realize more preferable fire resistance characteristic, and make it that thermal column 20 is combined with insulating body 10 It is more firm;And, first trunk portion 21, the second trunk portion 22, the 3rd trunk portion 23 and the 4th trunk portion 24 are circle Cylindricality.
The plurality of conducting terminal 30 is distributed in the periphery of thermal column 20, and each conducting terminal 30, which is respectively provided with, is integrally formed connection Fixed part 31 and weld part 32, fixed part 31 is embedded in insulating body 10, pad 40 is provided with fixed part 31, the pad 40 Expose the bottom surface of accommodating cavity 11, and the upper and lower surface of fixed part 31 is convexly equipped with triangle fin 301.In the present embodiment, institute Multiple conducting terminals 30 are stated for copper material, the conducting terminal 30 is six, insulating body is stretched out in the outer end of the fixed part 31 10, the outer end of fixed part 31 is integrally formed by a bending part 33 with weld part 32 to be connected, and the weld part 32 horizontally outward extends, Also, the upper and lower surface of the fixed part 31 is convexly equipped with multiple aforementioned triangular fins 301, multiple triangle fins 301 are spaced Arrangement, to realize more preferable fire resistance characteristic, and causes conducting terminal 30 is combined with insulating body 10 more firm.In addition, described Pad 40 is by nickel dam(Do not show in figure)It is built up with silver layer 41.
In use, chip to be fixed on to the upper surface of the 4th trunk portion 24 of thermal column 20, three chips can be fixed, so Afterwards, each chip is welded into conducting with corresponding pad 40 respectively, then, toward accommodating cavity 11 in pour into encapsulation glue, by each Wafer package is good.
Design focal point of the present utility model is:The utility model is fixed on the 4th cylinder using radiating rod structure, chip The upper surface in portion, realizes preferably heat dispersion, also, by using the trunk portion of various outer diameter so that thermal column can be with Insulating body strong bonded, realizes more preferable water resistance, in addition, being convexly equipped with triangle by the upper and lower surface in fixed part Fin so that insulating body and conducting terminal strong construction, further improves the overall water resistance of product.
It is described above, only it is preferred embodiment of the present utility model, not technical scope of the present utility model is made Any limitation, therefore every any trickle amendment made according to technical spirit of the present utility model to above example, equivalent change Change with modification, in the range of still falling within technical solutions of the utility model.

Claims (10)

1. a kind of LED support for improving water resistance and heat dispersion, it is characterised in that:Include insulating body, thermal column And multiple conducting terminals;The surface of the insulating body is recessed to be formed with accommodating cavity;The thermal column and multiple conducting terminals with Plastic body produced by insert molding is fixedly connected, and the thermal column includes for being integrally formed successively from lower to upper and connecting and being coaxially disposed One trunk portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion, the external diameter of the second trunk portion are more than the outer of the first trunk portion Footpath, the external diameter of the 3rd trunk portion is more than the external diameter of the second trunk portion, and the external diameter of the 4th trunk portion is less than the external diameter of the first trunk portion, The bottom surface of the downwardly projecting insulating body in lower end of first trunk portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion are buried In in insulating body, and the 4th trunk portion upper surface be located in accommodating cavity and accommodating cavity protruding upward bottom surface, the 4th trunk portion Upper surface be crystal bonding area;The plurality of conducting terminal is distributed in the periphery of thermal column, and each conducting terminal, which is respectively provided with, to be integrally formed The fixed part and weld part of connection, fixed part are embedded in insulating body, and pad is provided with fixed part, and the pad exposes accommodating cavity Bottom surface, and the upper and lower surface of fixed part is convexly equipped with triangle fin.
2. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:Described The surface of three trunk portions is arranged with annular groove, and the annular groove is embedded in insulating body, and annular groove is located at the 4th trunk portion Periphery.
3. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:Described One trunk portion, the second trunk portion, the 3rd trunk portion and the 4th trunk portion are cylinder.
4. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described solid The upper and lower surface for determining portion is convexly equipped with multiple aforementioned triangular fins, and multiple triangle fins are intervally arranged.
5. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described solid Insulating body is stretched out in the outer end for determining portion, and the outer end of fixed part is integrally formed by a bending part with weld part to be connected, the weld part Horizontally outward extend.
6. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:The weldering Disk is built up by nickel dam and silver layer.
7. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described to dissipate Plume is copper material.
8. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described many Individual conducting terminal is copper material.
9. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described to lead Electric terminal is six.
10. the LED support according to claim 1 for improving water resistance and heat dispersion, it is characterised in that:It is described to hold The madial wall radial symmetric for putting chamber is provided with two first arc recess, for every one first arc recess in the inner side of accommodating cavity Wall is symmetrically arranged with two second arc recess.
CN201720155186.7U 2017-02-21 2017-02-21 The LED support of water resistance and heat dispersion can be improved Expired - Fee Related CN206541848U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720155186.7U CN206541848U (en) 2017-02-21 2017-02-21 The LED support of water resistance and heat dispersion can be improved

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720155186.7U CN206541848U (en) 2017-02-21 2017-02-21 The LED support of water resistance and heat dispersion can be improved

Publications (1)

Publication Number Publication Date
CN206541848U true CN206541848U (en) 2017-10-03

Family

ID=59948775

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720155186.7U Expired - Fee Related CN206541848U (en) 2017-02-21 2017-02-21 The LED support of water resistance and heat dispersion can be improved

Country Status (1)

Country Link
CN (1) CN206541848U (en)

Similar Documents

Publication Publication Date Title
CN201412704Y (en) Light source of integrated LED chip
CN102610735B (en) Light-emitting device with thermoelectric separated structure and manufacturing method of light-emitting device
CN101532612A (en) Method for manufacturing integrated LED chip light source
TW201101548A (en) LED package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
CN101621107B (en) Light-emitting diode with high light efficiency and encapsulation method thereof
CN203134860U (en) Packaging structure for small-medium power LED paster
CN201868429U (en) Embedded-type encapsulating structure of luminous diode
CN201149869Y (en) LED encapsulation structure
CN203260639U (en) High-luminous-efficiency and good-heat-dissipation COB light source
TW201330337A (en) LED chip structure, LED package substrate, LED package structure and method of forming same
CN201946596U (en) Light-emitting diode (LED) light source packaging structure with heat energy and electric energy separated heat dissipation
CN206541848U (en) The LED support of water resistance and heat dispersion can be improved
CN103822143A (en) LED (light emitting diode) street lamp light source module with silicon substrates
CN204045628U (en) A kind of surface-mounted LED light source of many bowls of cup structures
CN207883721U (en) A kind of LED light bar with excellent heat dispersion performance
CN202018987U (en) LED (light-emitting diode) packaging base
CN201556644U (en) Rectangular light spot power type LED encapsulating structure
CN203836739U (en) Silicon-substrate LED road lamp light source module
CN206541851U (en) Heat radiating type raised type LED support
CN210928141U (en) High-efficient radiating circuit board
CN201233892Y (en) Encapsulation construction for large power multiple LED chips
CN201103857Y (en) Integrated LED light source component
CN209801184U (en) Orange light LED luminotron
CN203445117U (en) Led packaging structure and automobile lamp
CN103511993A (en) Manufacturing method of LED lamp and LED lamp

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171003

CF01 Termination of patent right due to non-payment of annual fee