CN206533616U

CN206533616U - A kind of BGA circuit boards

Info

Publication number: CN206533616U
Application number: CN201720074402.5U
Authority: CN
Inventors: 陈冬弟; 白杨
Original assignee: Guangzhou Mei Wei Electronics Co Ltd
Current assignee: Guangzhou Mei Wei Electronics Co Ltd
Priority date: 2017-01-19
Filing date: 2017-01-19
Publication date: 2017-09-29
Anticipated expiration: 2027-01-19

Abstract

The utility model discloses a kind of BGA circuit boards, including a core material, an at least BGA components, at least two prepregs and at least two conductive plates, at least two prepregs are fixed on the opposite sides of the core material by the BGA component packages in the core material, each conductive plate is fixed on prepreg described in one, prepreg described in one is provided with an at least blind hole, the blind hole includes a conductive layer, and the BGA components are electrically connected by the conductive layer with the conductive plate.The utility model BGA circuit boards set in blind hole conductive layer by the radium-shine blind hole on prepreg, and BGA components are electrically connected by the conductive layer with conductive plate, while enhancing embedded BGA elements and parts board reliabilities, also significantly reduce circuit plate thickness.

Description

A kind of BGA circuit boards

Technical field

The utility model is related to a kind of circuit board, more particularly to a kind of small BGA circuit boards of thickness.

Background technology

With the development of science and technology, circuit board is widely used in various electrical equipment.BGA components electricity is buried in existing The hardened structure in road, the BGA components of internal layer are connected using tin cream+tin ball.BGA component circuit board structures, which are buried, in such there is scolding tin The problems such as cavity, component leg position resin filling cavity and welding assisted agent residuals, product reliability can be reduced, is further led Cause circuit board plate bursting.In addition, tin cream and tin ball significantly increase product thickness, the growth requirement of circuit board slimming is not met.

Utility model content

In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of reliability high, thickness of thin BGA circuit boards.

The purpose of this utility model is realized using following technical scheme：

A kind of BGA circuit boards, including a core material, at least a BGA components, at least two prepregs and at least two lead Electroplax, at least two prepregs are fixed on the opposite sides of the core material by the BGA component packages described In core material, each conductive plate is fixed on prepreg described in one, and prepreg described in one is provided with an at least blind hole, institute Stating blind hole includes a conductive layer, and the BGA components are electrically connected by the conductive layer with the conductive plate.

It is preferred that, the core material is provided with and the BGA component numbers identical accepting groove, each BGA members Device is contained in accepting groove described in one.

It is preferred that, at least two prepregs are parallel to each other and are located at the two ends of the accepting groove.

It is preferred that, the core material thickness is identical with the BGA components thickness.

It is preferred that, the core material thickness is 1.2mm.

Compared with prior art, the beneficial effects of the utility model are：

The utility model BGA circuit boards set in blind hole conductive layer, BGA by the radium-shine blind hole on prepreg Component is electrically connected by the conductive layer with conductive plate, while enhancing embedded BGA elements and parts board reliabilities, is also significantly dropped Low circuit plate thickness.

Brief description of the drawings

Fig. 1 is a structural representation of the utility model BGA circuit boards.

In figure：100th, BGA circuit boards；10th, core material；12nd, accepting groove；20th, BGA components；30th, prepreg；40、 Conductive plate；50th, blind hole；60th, conductive layer.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.

It should be noted that when component is referred to as " being fixed on " another component, it can be directly on another component Or can also have component placed in the middle.When a component is considered as " connection " another component, it can be directly connected to To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being arranged at " another component, it Can be set directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical ", " level ", "left", "right" and similar statement for illustrative purposes only.

Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include The arbitrary and all combination of one or more related Listed Items.

Referring to Fig. 1, a kind of BGA circuit boards 100 include a core material 10, some BGA components 20, two prepregs 30 and two conductive plates 40.

The core material 10 is provided with some accepting grooves 12, and the volume of the accepting groove 12 and the BGA components 20 are big Cause identical.The accepting groove 12 is a groove.The thickness of core material 10 is identical with the thickness of BGA components 20.It is described The thickness of core material 10 is 1.2mm.

The BGA components 20 are contained in the accepting groove 12, and two prepreg 30 is fixed on the core material The BGA components 20 are sealed in the core material 10 by 10 opposite sides.Each conductive plate 40 is fixed on an institute State prepreg 30.Two prepreg 30 is parallel to each other.

By radium-shine, some blind holes 50 are set on prepreg described in one 30.Pass through plating or chemistry in the blind hole 50 Method sets a conductive layer 60.The BGA components 20 are electrically connected by the conductive layer 60 with the conductive plate 40.

In another embodiment, the side of core material 10 can fix multilayer prepreg 30, in each layer of semi-solid preparation Radium-shine blind hole 50 on piece 30, and the setting conductive layer 60 in the blind hole 50.The prepreg 30 containing the different numbers of plies can be made Circuit board in BGA components 20 electrically connected by radium-shine blind hole 50 with the conductive plate 40.

The BGA circuit boards 100 are set by the radium-shine blind hole 50 on the prepreg 30, and in the blind hole 50 Conductive layer 60, the BGA components 20 are electrically connected by the conductive layer 60 with the conductive plate 40, in enhancing circuit board by property While, also significantly reduce circuit plate thickness.

It will be apparent to those skilled in the art that technical scheme that can be as described above and design, make other various It is corresponding to change and deformation, and all these change and deformation should all belong to the protection of the utility model claim Within the scope of.

Claims

1. a kind of BGA circuit boards, including a core material, at least a BGA components, at least two prepregs and at least two are conductive Plate, at least two prepregs are fixed on the opposite sides of the core material by the BGA component packages described interior In layer core plate, each conductive plate is fixed on prepreg described in one, it is characterised in that：Prepreg described in one is provided with least One blind hole, the blind hole includes a conductive layer, and the BGA components are electrically connected by the conductive layer with the conductive plate.

2. BGA circuit boards according to claim 1, it is characterised in that：The core material is provided with and the BGA components Quantity identical accepting groove, each BGA components are contained in accepting groove described in one.

3. BGA circuit boards according to claim 2, it is characterised in that：At least two prepregs are parallel to each other and position In the two ends of the accepting groove.

4. BGA circuit boards according to claim 1, it is characterised in that：The core material thickness and the BGA components Thickness is identical.

5. BGA circuit boards according to claim 4, it is characterised in that：The core material thickness is 1.2mm.