CN206506774U - The pcb board and mobile terminal of a kind of mobile terminal - Google Patents

Abstract

The application is related to the pcb board and mobile terminal of a kind of mobile terminal.The pcb board includes the top layer, first medium layer and reference layer set gradually, testing weld pad is set on the top layer, on the reference layer with the testing weld pad just to region be reference zone, drop is offered on the reference layer and holds hole, at least a portion that the drop holds hole is located in the reference zone.After being arranged such, testing weld pad reduces with reference zone area facing each other, so as to reduce the capacitance for producing the parasitic capacitance between testing weld pad and reference layer, improves the signal quality of usb signal line.

Description

The pcb board and mobile terminal of a kind of mobile terminal

Technical field

The application is related to technical field of mobile terminals, more particularly to a kind of mobile terminal pcb board and mobile terminal.

Background technology

USB (Universal Serial Bus, USB) signal wire of mobile terminal is carried out for convenience Debugging, generally reserves dew copper point, the dew copper point is in PCB (Printed Circuit Board, printed circuit board (PCB)) outermost layer For testing weld pad.

In correlation technique, dielectric layer is provided between outermost layer and reference layer, wherein, reference layer is layers of copper, testing weld pad, Dielectric layer and reference layer three form electric capacity, also, because testing weld pad and the distance between reference layer are smaller, in test weldering The capacitance of the parasitic capacitance produced between disk and reference layer is larger, and this is equivalent to add on the circuit of usb signal line Electric capacity over the ground so that the rising edge edge of USB differential signals and trailing edge have impact on the quality of signal along slowing down, and cause test As a result fail.

Utility model content

The embodiment of the present application provides the pcb board and mobile terminal of a kind of mobile terminal, can reduce parasitic capacitance Capacitance, improves the signal quality of usb signal line.

The first aspect of the application provides a kind of pcb board of mobile terminal, including top layer, the first medium set gradually Testing weld pad is provided with layer and reference layer, the top layer,

On the reference layer with the testing weld pad just to region be reference zone, drop is offered on the reference layer and is held Hole, at least a portion that the drop holds hole is located in the reference zone.

It is preferred that, the drop holds area of the area more than or equal to the testing weld pad of the cross section in hole, described transversal Face is the plane for the axis for holding hole perpendicular to the drop.

It is preferred that, the drop holds hole through first medium layer.

It is preferred that, the outline shape of the testing weld pad is identical with the outline shape that the drop holds hole.

It is preferred that, the outline shape that the outline shape of the testing weld pad holds hole with the drop is circle.

It is preferred that, a diameter of 1mm of the testing weld pad.

It is preferred that, in addition to some second dielectric layer, the quantity of the reference layer is multiple, the two neighboring reference layer Separated by second dielectric layer.

It is preferred that, the drop holds hole and penetrates each reference layer and each second dielectric layer.

It is preferred that, the dielectric coefficient of the first medium layer and the second dielectric layer is 3~4.

The second aspect of the application provides a kind of mobile terminal, includes the pcb board of mobile terminal, the mobile terminal Pcb board is the pcb board of the mobile terminal described in any of the above-described.

The technical scheme that the application is provided can reach following beneficial effect：

The embodiment of the present application provides a kind of pcb board of mobile terminal, wherein, drop is opened up on reference layer and holds hole, the drop Hold hole at least a portion be located at reference layer on testing weld pad just to region in, after being arranged such, testing weld pad with reference Region area facing each other reduces, so as to reduce the electric capacity for producing the parasitic capacitance between testing weld pad and reference layer Value, improves the signal quality of usb signal line.

It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary, this can not be limited Application.

Brief description of the drawings

The schematic diagram of the top layer of the pcb board for the mobile terminal that Fig. 1 provides for the embodiment of the present application；

The schematic diagram of the reference layer of the pcb board for the mobile terminal that Fig. 2 provides for the embodiment of the present application；

The connection diagram when pcb board for the mobile terminal that Fig. 3 provides for the embodiment of the present application is debugged.

Reference：

1- top layers；

11- testing weld pads；

2- reference layers；

21- drops hold hole；

3-USB stands；

4-TVS is managed.

Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the application Example, and be used to together with specification to explain the principle of the application.

Embodiment

The application is described in further detail below by specific embodiment and with reference to accompanying drawing.

As shown in Figure 1-2, this application provides a kind of pcb board of mobile terminal, the pcb board includes the top layer set gradually 1st, first medium layer and reference layer 2.Wherein, testing weld pad 11 is provided with top layer 1, testing weld pad 11 is used to enter pcb board Row debugging, it is generally the case that testing weld pad 11 is the dew copper point being arranged on top layer 1.

Reference layer 2 is used for laying signal wire, power line etc., and reference layer 2 is usually arranged as layers of copper, and first medium layer is setting Insulating barrier between top layer 1 and reference layer 2, the dielectric coefficient of first medium layer is usually between 3~4.

In the application, in order to reduce the capacitive effect of testing weld pad 11, so as to reduce the capacitive decay of usb signal, hereby Propose, drop is offered on reference layer 2 and holds hole 21, and at least a portion that drop holds hole 21 is located on reference layer 2 and test Pad 11 just to region in, for the ease of description, can by reference layer 2 with testing weld pad 11 just to region be defined as ginseng Examination district domain.

After above-mentioned scheme, testing weld pad 11 reduces with reference zone area facing each other, so as to reduce production The capacitance of the raw parasitic capacitance between testing weld pad 11 and reference layer 2, improves the signal quality of usb signal line.

Further, in order that the capacitance of parasitic capacitance further reduces, the area of the preferably cross section in drop appearance hole 21 is big In or equal to testing weld pad 11 area, so, equivalent to emptied on reference layer 2 with testing weld pad 11 facing portion point Copper so that testing weld pad 11 will not produce electric capacity with the reference layer 2 closest with it, has reached further reduction parasitic capacitance The purpose of capacitance, further improves the quality of signal.It should be noted that the cross section that drop holds hole 21 is to hold perpendicular to drop The plane of the axis in hole 21.

Understood according to foregoing, first medium layer, the dielectric of first medium layer are provided between testing weld pad 11 and reference layer 2 Coefficient be 3~4 between, it can be seen from the calculation formula C=ε A/h of capacitance, when dielectric coefficient ε is bigger, capacitance C is bigger, by This, the application set drop hold hole 21 through first medium layer, that is to say, that on first medium floor and testing weld pad 11 just to area Domain is partly emptied or all emptied, with this so that first medium layer becomes dielectric by the larger insulating materials of original dielectric coefficient The relatively small air of coefficient, because dielectric coefficient ε reduces, then capacitance C accordingly reduces.

Testing weld pad 11 holds hole 21 with drop and could be arranged to identical shape, it can also be provided that different shapes, this reality Apply in example, preferably both outline shape it is identical, after being arranged such, conveniently drop can be set to hold hole 21 so that drop holds hole 21 Area can coincide with the area of testing weld pad 11, or cause drop to hold the profile in hole 21 and the profile of testing weld pad 11 Range difference locate at an arbitrary position equal, can so avoid the copper of distance reference region relatively far away from from being removed, so as to make Area into reference layer 2 is relatively small, is unfavorable for the arrangement of signal wire, power line etc..In the present embodiment, for processing and manufacturing Convenient, drop holds hole 21 and the outline shape of testing weld pad 11 is disposed as circle.

In addition, during pcb board is debugged, testing weld pad 11 is used to contact with test fixture, electrical connection loop is formed, In order to ensure reliably being made electrical contact between testing weld pad 11 and test fixture, according to one embodiment, the size of testing weld pad 11 1mm is could be arranged to, the size is that ensure that testing weld pad 11 reliably makes electrical contact with test fixture, while can effectively utilize Space on top layer 1.

The pcb board for the mobile terminal that the application is provided, in addition to some second dielectric layer, the quantity of reference layer 2 be it is multiple, And two neighboring reference layer 2 is separated by second dielectric layer.The wiring for being set to pcb board of multiple reference layers 2 provides more Space, can cause pcb board that there are more functions.Wherein, the dielectric coefficient of second dielectric layer be 3~4 between, to avoid Short circuit occurs between adjacent two reference layer 2.

It should be noted that according to first medium layer and the dielectric coefficient of second dielectric layer, its material used for example may be used With the composite being composited using epoxy resin, filler and glass fibre etc..

Each reference is penetrated when including multiple reference layers 2 and during some second dielectric layer, can further preferably drop appearance hole 21 Layer 2 and each second dielectric layer so that the spacing between testing weld pad 11 and reference layer 2 is further increased, so that test The capacitive decay of pad 11 is further to be reduced.

Fig. 3 shows the connection diagram during test of the usb signal line of the pcb board of mobile terminal.USB stands 3 are outer Connection interface, USB stands 3 are electrically connected with CPU, and signal transmission, (the Transient Voltage of TVS pipe 4 are carried out between the two Suppressors, transient voltage suppressor) effect be antistatic, testing weld pad 11 is the contact point of test fixture.

The second aspect of the application provides a kind of mobile terminal, and the mobile terminal includes the pcb board of mobile terminal, described The pcb board of mobile terminal be any of the above-described embodiment in mobile terminal pcb board.

The preferred embodiment of the application is the foregoing is only, the application is not limited to, for the skill of this area For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair Change, equivalent substitution, improvement etc., should be included within the protection domain of the application.

Claims (10)

1. a kind of pcb board of mobile terminal, it is characterised in that including the top layer, first medium layer and reference layer set gradually, Testing weld pad is provided with the top layer,

On the reference layer with the testing weld pad just to region be reference zone, drop is offered on the reference layer and holds hole, At least a portion that the drop holds hole is located in the reference zone.

2. the pcb board of mobile terminal according to claim 1, it is characterised in that the drop holds the area of the cross section in hole More than or equal to the area of the testing weld pad, the cross section is the plane for the axis for holding hole perpendicular to the drop.

3. the pcb board of mobile terminal according to claim 1 or 2, it is characterised in that the drop holds hole and runs through described first Dielectric layer.

4. the pcb board of mobile terminal according to claim 1 or 2, it is characterised in that the outline shape of the testing weld pad It is identical with the outline shape that the drop holds hole.

5. the pcb board of mobile terminal according to claim 4, it is characterised in that the outline shape of the testing weld pad with The outline shape that the drop holds hole is circle.

6. the pcb board of mobile terminal according to claim 5, it is characterised in that a diameter of 1mm of the testing weld pad.

7. the pcb board of mobile terminal according to claim 1 or 2, it is characterised in that also including some second dielectric layer, The quantity of the reference layer is multiple, and the two neighboring reference layer is separated by second dielectric layer.

8. the pcb board of mobile terminal according to claim 7, it is characterised in that the drop holds hole and penetrates each reference Layer and each second dielectric layer.

9. the pcb board of mobile terminal according to claim 7, it is characterised in that the first medium layer and described the The dielectric coefficient of second medium layer is 3~4.

10. a kind of mobile terminal, includes the pcb board of mobile terminal, it is characterised in that the pcb board of the mobile terminal is right It is required that the pcb board of the mobile terminal described in any one of 1-9.