CN106658953A - PCB of mobile terminal, and mobile terminal - Google Patents
PCB of mobile terminal, and mobile terminal Download PDFInfo
- Publication number
- CN106658953A CN106658953A CN201710141295.8A CN201710141295A CN106658953A CN 106658953 A CN106658953 A CN 106658953A CN 201710141295 A CN201710141295 A CN 201710141295A CN 106658953 A CN106658953 A CN 106658953A
- Authority
- CN
- China
- Prior art keywords
- mobile terminal
- layer
- pcb board
- weld pad
- testing weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims abstract description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Function (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a PCB of a mobile terminal, and the mobile terminal. The PCB comprises a top layer, a first dielectric layer and a reference layer, which are arranged sequentially; a test bonding pad is arranged on the top layer; an area, which is just opposite to the test bonding pad on the reference layer, is a reference area; a capacity reducing hole is formed in the reference layer; and at least one part of the capacity reducing hole is positioned in the reference area. Due to the arrangement, the area, where the test bonding pad is just opposite to the reference area mutually, can be reduced; therefore, the capacitance value of stray capacitance generated between the test bonding pad and the reference layer can be reduced; and thus, the signal quality of a USB signal line can be improved.
Description
Technical field
The application is related to technical field of mobile terminals, more particularly to a kind of pcb board and mobile terminal of mobile terminal.
Background technology
USB (Universal Serial Bus, the USB) holding wire of mobile terminal is carried out for convenience
Dew copper point is reserved in debugging, the generally outermost layer in PCB (Printed Circuit Board, printed circuit board (PCB)), and the dew copper point is
For testing weld pad.
In correlation technique, dielectric layer is provided between outermost layer and reference layer, wherein, reference layer is layers of copper, testing weld pad,
Dielectric layer and reference layer three form electric capacity, also, because testing weld pad is less with the distance between reference layer, weld in test
The capacitance of the parasitic capacitance produced between disk and reference layer is larger, and this is equivalent to be increased on the circuit of usb signal line
Electric capacity over the ground so that the rising edge edge of USB differential signals and trailing edge have impact on the quality of signal along slowing down, and cause test
As a result fail.
The content of the invention
The embodiment of the present application provides a kind of pcb board and mobile terminal of mobile terminal, can reduce parasitic capacitance
Capacitance, improves the signal quality of usb signal line.
The first aspect of the application provides a kind of pcb board of mobile terminal, including the top layer, first medium that set gradually
Layer and reference layer, on the top layer testing weld pad is provided with,
On the reference layer with the testing weld pad just to region be reference zone, offer on the reference layer drop hold
Hole, the drop is held at least a portion in hole and is located in the reference zone.
Preferably, the drop holds the area of the area more than or equal to the testing weld pad of the cross section in hole, described transversal
Face is the plane of the axis for holding hole perpendicular to the drop.
Preferably, the drop holds hole and runs through the first medium layer.
Preferably, the outline shape of the testing weld pad is identical with the outline shape that the drop holds hole.
Preferably, the outline shape that the outline shape of the testing weld pad holds hole with the drop is circle.
Preferably, a diameter of 1mm of the testing weld pad.
Preferably, also including some second dielectric layer, the quantity of the reference layer is multiple, the two neighboring reference layer
Separated by second dielectric layer.
Preferably, the drop appearance hole penetrates each reference layer and each second dielectric layer.
Preferably, the dielectric coefficient of the first medium layer and the second dielectric layer is 3～4.
The second aspect of the application provides a kind of mobile terminal, including the pcb board of mobile terminal, the mobile terminal
Pcb board is the pcb board of the mobile terminal described in any of the above-described.
The technical scheme that the application is provided can reach following beneficial effect：
The embodiment of the present application provides a kind of pcb board of mobile terminal, wherein, drop is opened up on reference layer and holds hole, the drop
Hold hole at least a portion be located at reference layer on testing weld pad just to region in, after being arranged such, testing weld pad with reference
Region area facing each other reduces, so as to reduce the electric capacity for producing the parasitic capacitance between testing weld pad and reference layer
Value, improves the signal quality of usb signal line.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary, this can not be limited
Application.
Description of the drawings
The schematic diagram of the top layer of the pcb board of the mobile terminal that Fig. 1 is provided for the embodiment of the present application；
The schematic diagram of the reference layer of the pcb board of the mobile terminal that Fig. 2 is provided for the embodiment of the present application；
The connection diagram when pcb board of the mobile terminal that Fig. 3 is provided for the embodiment of the present application is debugged.
Reference：
1- top layers；
11- testing weld pads；
2- reference layers；
21- drops hold hole；
3-USB stands；
4-TVS is managed.
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the enforcement for meeting the application
Example, and be used to explain the principle of the application together with specification.
Specific embodiment
Below by specific embodiment and combine accompanying drawing the application is described in further detail.
As shown in Figure 1-2, this application provides a kind of pcb board of mobile terminal, the pcb board includes the top layer for setting gradually
1st, first medium layer and reference layer 2.Wherein, testing weld pad 11 is provided with top layer 1, testing weld pad 11 is used to enter pcb board
Row debugging, it is generally the case that testing weld pad 11 is the dew copper point being arranged on top layer 1.
Reference layer 2 is used for laying signal wire, power line etc., and reference layer 2 is usually arranged as layers of copper, and first medium layer is setting
Insulating barrier between top layer 1 and reference layer 2, the dielectric coefficient of first medium layer is usually between 3～4.
In the application, in order to reduce the capacitive effect of testing weld pad 11, so as to the capacitive for reducing usb signal decays, hereby
Propose, drop is offered on reference layer 2 and holds hole 21, and at least a portion that drop holds hole 21 is located on reference layer 2 and test
Pad 11 just to region in, for the ease of description, can by reference layer 2 with testing weld pad 11 just to region be defined as ginseng
Examination district domain.
After above-mentioned scheme, the area facing each other with reference zone of testing weld pad 11 reduces, so as to reduce product
The capacitance of the raw parasitic capacitance between testing weld pad 11 and reference layer 2, improves the signal quality of usb signal line.
Further, in order that the capacitance of parasitic capacitance further reduces, the area of the cross section that preferred drop holds hole 21 is big
In or equal to the area of testing weld pad 11, so, equivalent to emptied on reference layer 2 with the facing portion of testing weld pad 11 point
Copper so that testing weld pad 11 will not produce electric capacity with the reference layer 2 closest with it, has reached further reduction parasitic capacitance
The purpose of capacitance, further improves the quality of signal.It should be noted that it is to hold perpendicular to drop that drop holds the cross section in hole 21
The plane of the axis in hole 21.
Understood according to aforementioned, first medium layer, the dielectric of first medium layer are provided between testing weld pad 11 and reference layer 2
Coefficient is that it can be seen from the computing formula C=ε A/h of capacitance, when dielectric coefficient ε is bigger, capacitance C is bigger between 3～4, by
This, the application arrange drop hold hole 21 run through first medium layer, that is to say, that on first medium floor with testing weld pad 11 just to area
Domain is partly emptied or is all emptied, with this so that first medium layer becomes dielectric by the larger insulating materials of original dielectric coefficient
The relatively small air of coefficient, because dielectric coefficient ε reduces, then capacitance C accordingly reduces.
Testing weld pad 11 holds hole 21 and could be arranged to identical shape with drop, it is also possible to be set to different shapes, this reality
In applying example, both preferred outline shape is identical, after being arranged such, can conveniently arrange drop appearance hole 21 so that drop and hold hole 21
Area can coincide with the area of testing weld pad 11, or cause drop to hold the profile in hole 21 and the profile of testing weld pad 11
Range difference locate at an arbitrary position equal, can so avoid distance reference region copper relatively far away from from being removed, so as to make
Area into reference layer 2 is relatively small, is unfavorable for the arrangement of holding wire, power line etc..In the present embodiment, for processing and manufacturing
Convenient, drop holds hole 21 and the outline shape of testing weld pad 11 is disposed as circle.
Additionally, during pcb board is debugged, testing weld pad 11 is used to be contacted with test fixture, electrical connection loop is formed,
In order to ensure reliably making electrical contact between testing weld pad 11 and test fixture, according to one embodiment, the size of testing weld pad 11
1mm is could be arranged to, the size ensure that testing weld pad 11 reliably makes electrical contact with test fixture, while can be with effectively utilizes
Space on top layer 1.
The pcb board of the mobile terminal that the application is provided, also including some second dielectric layer, the quantity of reference layer 2 be it is multiple,
And two neighboring reference layer 2 is separated by second dielectric layer.The wiring for being set to pcb board of multiple reference layers 2 provides more
Space, can cause pcb board that there are more functions.Wherein, the dielectric coefficient of second dielectric layer is between 3～4, to avoid
It is short-circuited between adjacent two reference layer 2.
It should be noted that according to first medium layer and the dielectric coefficient of second dielectric layer, its material for adopting for example may be used
With the composite being composited using epoxy resin, filler and glass fibre etc..
When including multiple reference layers 2 and some second dielectric layer, can further preferably drop appearance hole 21 and penetrate each reference
Layer 2 and each second dielectric layer so that the spacing between testing weld pad 11 and reference layer 2 is further increased, so that test
The capacitive decay of pad 11 is further reduced.
Fig. 3 shows the connection diagram during test of the usb signal line of the pcb board of mobile terminal.USB stands 3 are outer
Connection interface, USB stands 3 are electrically connected with CPU, and signal transmission, (the Transient Voltage of TVS pipe 4 are carried out between the two
Suppressors, transient voltage suppressor) effect be antistatic, testing weld pad 11 is the contact point of test fixture.
The second aspect of the application provides a kind of mobile terminal, and the mobile terminal includes the pcb board of mobile terminal, described
The pcb board of mobile terminal is the pcb board of the mobile terminal in any of the above-described embodiment.
The preferred embodiment of the application is the foregoing is only, the application is not limited to, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of pcb board of mobile terminal, it is characterised in that including the top layer, first medium layer and reference layer that set gradually,
Testing weld pad is provided with the top layer,
On the reference layer with the testing weld pad just to region be reference zone, offer on the reference layer drop hold hole,
The drop is held at least a portion in hole and is located in the reference zone.
2. the pcb board of mobile terminal according to claim 1, it is characterised in that the drop holds the area of the cross section in hole
More than or equal to the area of the testing weld pad, the cross section is the plane of the axis for holding hole perpendicular to the drop.
3. the pcb board of mobile terminal according to claim 1 and 2, it is characterised in that the drop holds hole and runs through described first
Dielectric layer.
4. the pcb board of mobile terminal according to claim 1 and 2, it is characterised in that the outline shape of the testing weld pad
It is identical with the outline shape that the drop holds hole.
5. the pcb board of mobile terminal according to claim 4, it is characterised in that the outline shape of the testing weld pad with
The outline shape that the drop holds hole is circle.
6. the pcb board of mobile terminal according to claim 5, it is characterised in that a diameter of 1mm of the testing weld pad.
7. the pcb board of mobile terminal according to claim 1 and 2, it is characterised in that also including some second dielectric layer,
The quantity of the reference layer is multiple, and the two neighboring reference layer is separated by second dielectric layer.
8. the pcb board of mobile terminal according to claim 7, it is characterised in that the drop holds hole and penetrates each reference
Layer and each second dielectric layer.
9. the pcb board of mobile terminal according to claim 7, it is characterised in that the first medium layer and described
The dielectric coefficient of second medium layer is 3～4.
10. the pcb board of a kind of mobile terminal, including mobile terminal, it is characterised in that the pcb board of the mobile terminal is right
Require the pcb board of the mobile terminal described in any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141295.8A CN106658953A (en) | 2017-03-13 | 2017-03-13 | PCB of mobile terminal, and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710141295.8A CN106658953A (en) | 2017-03-13 | 2017-03-13 | PCB of mobile terminal, and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658953A true CN106658953A (en) | 2017-05-10 |
Family
ID=58847085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710141295.8A Pending CN106658953A (en) | 2017-03-13 | 2017-03-13 | PCB of mobile terminal, and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658953A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107765168A (en) * | 2017-10-17 | 2018-03-06 | 郑州云海信息技术有限公司 | A kind of test point adding method of high-speed-differential cabling |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1852636A (en) * | 2005-04-23 | 2006-10-25 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved welded plate |
| CN101677487A (en) * | 2008-09-18 | 2010-03-24 | 日本电气株式会社 | Printed wiring board and method for manufacturing the same |
| US20100101850A1 (en) * | 2008-10-23 | 2010-04-29 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and method of manufacturing the same |
| CN105578731A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Mobile terminal, printed circuit board and manufacturing method thereof |
| CN105873356A (en) * | 2016-04-27 | 2016-08-17 | 浪潮电子信息产业股份有限公司 | PCB (printed circuit board) |
-
2017
- 2017-03-13 CN CN201710141295.8A patent/CN106658953A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1852636A (en) * | 2005-04-23 | 2006-10-25 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with improved welded plate |
| CN101677487A (en) * | 2008-09-18 | 2010-03-24 | 日本电气株式会社 | Printed wiring board and method for manufacturing the same |
| US20100101850A1 (en) * | 2008-10-23 | 2010-04-29 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and method of manufacturing the same |
| CN105578731A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Mobile terminal, printed circuit board and manufacturing method thereof |
| CN105873356A (en) * | 2016-04-27 | 2016-08-17 | 浪潮电子信息产业股份有限公司 | PCB (printed circuit board) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107765168A (en) * | 2017-10-17 | 2018-03-06 | 郑州云海信息技术有限公司 | A kind of test point adding method of high-speed-differential cabling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |