CN206506491U - Solar power generation component chip seal pressure formula terminal box - Google Patents
Solar power generation component chip seal pressure formula terminal box Download PDFInfo
- Publication number
- CN206506491U CN206506491U CN201720236623.8U CN201720236623U CN206506491U CN 206506491 U CN206506491 U CN 206506491U CN 201720236623 U CN201720236623 U CN 201720236623U CN 206506491 U CN206506491 U CN 206506491U
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- China
- Prior art keywords
- copper conductor
- chip
- terminal box
- power generation
- solar power
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- Withdrawn - After Issue
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
Solar power generation component chip seal pressure formula terminal box.The exploitation manufacture of terminal box is combined together with semiconductor packaging there is provided a kind of, the solar power generation component chip seal pressure formula terminal box of product automation degree is lifted.Including box body, N number of chip, N number of connection sheet and N+1 copper conductor, N >=1, box body is provided with least one storage tank, and box body is provided with a horizontal bar;N number of copper conductor is provided with chip placing position, and N+1 copper conductor is provided with positioned at the extraction position of the horizontal bar top surface;Chip is fixedly welded on the placement position of the copper conductor;N+1 copper conductor is connected in series by the chip, connection sheet;Placement position, chip and the connection sheet of the copper conductor are poured fixation by casting glue and are encapsulated in the storage tank.The utility model makes terminal box product structure compacter, material using more reasonable, product development speed faster, be more easy to realize automated production, with more the market competitiveness.
Description
Technical field
The utility model is related to solar power generation component terminal box, more particularly to a kind of solar power generation component chip
Seal pressure formula terminal box.
Background technology
Solar power generation component is mounted in the important component in solar power generation component with terminal box, and it is component that it, which has,
Middle cell piece provides bypass protection effect and the effect that can outwards transmit that component generates electricity.Solar power system is exactly to pass through
Terminal box output cable and patched in component by some pieces of electrification components, carry out series and parallel connection and realizes electricity generation, and lead to
Electric power storage or inversion are crossed, electric power or grid-connected power supply are provided to electric consumer.
Terminal box is for the principle that cell piece provides bypass protection:Solar power generation component in solar power plant system exists
Generated electricity under the normal illumination of sunlight, outwards export electric energy.But when some position in irradiation electrification component sunlight by object or
Person's shadow of object is blocked, and the silicon cell at the position is transformed into resistance states by generating state, series connection with it is other
Electrification component normal power generation under sunlight irradiation, electric current produces larger consumption heating, makes electricity by the cell piece of resistance states
Pond piece and component backboard burn, and this phenomenon is referred to as the hot spot phenomenon of component.To prevent the generation of hot spot phenomenon, using in the sun
In often string silicon cell group in energy electrification component, one bypass diode of reverse parallel connection, when hot spots condition occurs, diode
Forward conduction, electric current is outwards exported by bypass diode, protects silicon cell not to be burned out the safe work with electrification component
Make.
Bypass diode is designed to be arranged in terminal box, is generally fitted with three bypasses two in conventional terminal box at present
/ 3rd cell pieces in pole pipe, respectively solar power generation component provide bypass protection.Therefore solar power generation component is used
Terminal box has bypass protection and electric energy output function simultaneously.
For many years, terminal box have passed through multiple improvement and development.
The terminal box of prior art manufacture, typically by monomer diode package device, terminal box body(Box body, lid)、
Internal copper conductive radiating fins(Copper conductor), output cable and connector composition.Diode is assembled or used paster by clamping
Formula diode is assembled on the copper conductive radiating fins of junction box by reflow soldering;The copper conduction for assembling diode dissipates
Backing is installed in terminal box body by plastics rivet hot again.Therefore terminal box production mounting process step is various, manpower consumption
It is larger.
The producing and selling of terminal box have higher access door, are performed at present according to IEC-61215 standards, prior art
The terminal box of production is solving the problems such as sealing property, temperature rise model and internal gas expand, and has certain difficulty.
Numerous photovoltaic module products encapsulated with many diode chip for backlight unit are occurred in that on Vehicles Collected from Market.
Its scheme is that three diode chip for backlight unit are integrated in an injection molding body, can simplify terminal box manufacturer welding assembly two
The processing step of pole pipe.But in terms of structure and application requirement, module is still fixed on junction box with the method installed, too
After terminal box is installed in electrification component by Yang Neng components manufacturer, thorax in box body is stilled need to irrigate fluid sealant, product is in production
With in application without clear superiority.
Because photovoltaic module is influenceed by structure and technique, its larger packaging body volume and different materials at work,
Acted on by temperature change, material expand is produced stress to chip, certain influence can be there is to product service life.
Photovoltaic bypass diode (led) module fixes clamping with terminal box body by plastic pallet, makes limited junction box
Heat-dissipating space can not be effectively utilized, so as to limit operating current handling capacity.Needed in terminal box production application
More complicated production equipment, could carry out Automated assembly.
Photovoltaic module product can have following defect in actual production and application:
1st, most of photovoltaic module products are using the ultrasonic wave aluminium wire bonding technology shown in Figure 35, and wave welding head of ultrasonic wave 10 is by aluminium
Silk is connected on diode chip for backlight unit and on the conductor of photovoltaic module.This mode has at 2 points, one, photovoltaic diode adopts
Schottky processing chip is used, the diode PN junction of the technique is located at below the surface aluminum metal layer of chip, supersonic bonding stress
It can act on diode chip for backlight unit, its pressure and amplitude of vibration are slightly larger, i.e., easily PN junction is come to harm, influence product service life,
It is less than normal, easily there is false connection.Accordingly, it would be desirable to which using the expensive process equipment of very volume, technological requirement could be met and steady
It is qualitative;2nd, due to being below the metal materials such as copper, silver as welding material, its electric conductivity and thermal conductivity using aluminium wire, light is caused
The pressure drop for lying prostrate module product is higher, and operationally, photovoltaic module product caloric value is higher, and power consumption is higher, weak heat-dissipating.
2nd, using the technique of high-pressure injection, as shown in figure 36, thermoset resin material was wrapped up to the chip week being welded
Enclose.This injection technique is in injection moulding process, and plastics are in the presence of injecting head, with high effluxvelocity and pressure, injection
Into cavity body of mould, it can act directly on diode chip for backlight unit and connection aluminium strip, cause chip by from from resin material
Compression, and aluminium strip tension.Due to the stress concentration in injection moulding process, cause inside modules structural deformation, reduce
The unfailing performance of module.
3rd, existing photovoltaic module product by three diode chip for backlight unit generally using copper conductor side is distributed in, with thermosetting tree
Fat material is by the side seal.When photovoltaic module locally produces hot spot effect, wherein one or two chip, which is started working, to be produced
Heat, due to the thermal conductivity of exterior packaging material and copper copper conductor, the temperature of euthermic chip, which can be passed rapidly, to be replaced onto neighbouring chip, is made
Its temperature rises.And now photovoltaic module does not occur the part of hot spot effect also in normal power generation, its generating voltage acting in opposition
In on corresponding diode chip for backlight unit.Based on the hot properties of Schottky diode chip, now reverse leakage current increase, due to leakage
Electric current will not saturation, the junction temperature of chip PN junction can be caused further to raise so that reverse leakage current increases again, now shape
Into diode chip for backlight unit heating vicious circle, equalization point is exceeded when serious, diode chip for backlight unit can be breakdown, photovoltaic module product loses
Effect.
4th, the diode chip for backlight unit of existing photovoltaic module product is concentrated together, and using thermosetting resin parcel.In work shape
Under state diode chip for backlight unit produce heat can not fast spread, be restricted the operating current of terminal box.
5th, there is the process of secondary operation to semiconductor devices in the terminal box of prior art production:Monomer encapsulates diode
Need to be connected with copper conductor by crimping or reflow soldering;Photovoltaic module is needed by press-fiting and the plastics in terminal box body
Tray fixing clip connects;The high temperature of Reflow Soldering causes different expansions to different materials, can influence the internal stress and compactness of device;Pressure
Connecing can be such that device is influenceed by external pressure, and photovoltaic module plastic body easily occurs and bursts apart and be broken, and the quality brought that is pressurized
Hidden danger;
6th, photovoltaic module needs higher development cost, and single with terminal box model corresponding relation, it is impossible to adapt to wiring
The exploitation and development of box, installation between the two coordinate requirement higher, and the exploitation for adding both sides coordinates difficulty.
Utility model content
The utility model solves photovoltaic module stress greatly for problem above there is provided one kind, and local temperature is high, and radiating is not
Uniformly, the problem of junction box heat-dissipating space utilization rate is low, product development input is larger.By the exploitation manufacture and half of terminal box
Conductor encapsulation technology combines together, and effectively lifting properties of product reduce product cost and development cost simultaneously, and lifting product is automatic
The solar power generation component of change degree chip seal pressure formula terminal box.
The technical solution of the utility model is:Including box body, N number of chip, N number of connection sheet and N+1 copper conductor, N >=1,
The box body is provided with least one storage tank, and the box body is higher than the storage tank groove provided with an apical side height
The horizontal bar at bottom;
N number of copper conductor is corresponded with N number of chip in N+1 copper conductor, and N number of copper conductor is provided with chip placing position, N+1
Individual copper conductor is provided with positioned at the extraction position of the horizontal bar top surface;
The chip is fixedly welded on the placement position of the copper conductor and adjacent copper conductor is connected to by connection sheet
Connection position on;
N+1 copper conductor is connected in series by the chip, connection sheet, forms the bypass circuit with output end;
Placement position, chip and the connection sheet of the copper conductor are poured fixation by casting glue and are encapsulated in the storage tank, institute
The position of drawing for stating copper conductor is located on the horizontal bar, higher than the top surface of the casting glue.
Technique connection strap is provided between adjacent copper conductor.
As N > 1, technique connection ring is set between at least two copper conductors.
As N > 1, the connection position of connection output end is additionally provided with first and last copper conductor.
As N > 2, the chip sets up separately in the both sides of the horizontal bar.
Convergent belt perforating holes are provided with the horizontal bar, the convergent belt perforating holes are by the back side of the box body through described
Horizontal bar;The lower mouth of the convergent belt perforating holes is big, suitable for reading small;
The position of drawing of the copper conductor is provided with the corresponding threading hole of convergent belt perforating holes.
The box portion of terminal box is designed with one or more opened upper end storage glue grooves by the utility model(Hold
Put groove)Plastic body;According to the requirement of the various models of terminal box and radiating Spreading requirements, the number of storage tank is set.Provided with two
Individual or two or more storage tank box body, its storage tank is set to set on horizontal bar, horizontal bar between two rows distribution, two row's storage tanks
Provided with convergent belt perforating holes, the extraction position of copper conductor is provided with threading hole, is easy to place convergent belt according to Client application, such
Distributed architecture mode can disperse the thermal source generated heat during diode operation, make full use of the limited radiating of junction box empty
Between, reduce influence each other.
Copper conductor in the utility model is provided with chip placing position and located at the extraction position of horizontal bar top surface so that will weld
The local copper conductor of diode chip for backlight unit is carried, sinking processing is carried out by bending, chip and part copper conductor is embedded into
In corresponding storage tank.Poured again with high heat conduction, high mechanical properties epoxide-resin glue to storage tank, after solidification, diode core
Piece has obtained sealing protection, and copper conductor is also fixed on terminal box body, forms terminal box;
The utility model is poured using high heat conduction, high mechanical properties epoxide-resin glue by low pressure, static temperature solidification, real
The high-strength structure that protection, copper conductor and box body are now packaged to diode chip for backlight unit is fixed, and high pressure is avoided in production process
The mechanical shock that injected plastics material jet is produced to chip, and high-pressure injection moulding jet of material deform copper conductor, and produce to core
Piece pulls power;
Copper conductor in the utility model is not only that terminal box provides circuit path, it is often more important that carried for diode chip for backlight unit
For radiating condition, the bending of copper conductor carries out sinking processing, adds its developed area, be diode chip for backlight unit work there is provided
More fully radiating condition;
Meanwhile, after the epoxy resin cure that the heat-conducting mediums such as alumina powder, silicon powder are filled with storage tank, from plane side
Fully contacted to facade direction with copper conductor, the operating temperature of quick reduction chip improves 30% electric current handling capacity, more
Plus the efficient properties of product for improving terminal box.
N+1 copper conductor is connected in series by chip, connection sheet, in order to eliminate in manufacturing process, relative between copper conductor
It is mobile, pull stress to what chip was caused.The utility model devises technique company in punching copper conductor between each copper conductor
Ring or technique connection strap are connect, multiple copper conductors is temporarily forming an entirety.After chip welding and embedding solidification is completed, with brill
Cut or punching mode, remove technique connection ring or technique connection strap.
The utility model spans monomer encapsulation diode terminal box, the encapsulation manufacturing process of photovoltaic module terminal box, saves
The actions such as secondary welding, secondary assembling are omited.By the encapsulation technology conjunction manufactured and designed with semiconductor diode of terminal box
Two be one, it is to avoid secondary welding and installs the hidden danger of quality brought to terminal box product;Substantially increase the exploitation of terminal box
Speed;Eliminate mutual break-in and adjustment process of the terminal box manufacturer with semiconductor diode package manufacturer;Make terminal box
Product structure is compacter, material using more reasonable, product development speed faster, be more easy to realize automated production, product system
Cause this lower, with more the market competitiveness.
Brief description of the drawings
Fig. 1 is the structural representation of the first embodiment of the utility model,
Fig. 2 is the structural representation of box body in Fig. 1,
Fig. 3 is the sectional view in A-A faces in Fig. 2,
Fig. 4 is the structural representation of copper conductor framework in Fig. 1,
Fig. 5 is that Fig. 4 is left view,
Fig. 6 is the attachment structure schematic diagram of copper conductor framework and chip in Fig. 1,
Fig. 7 is the attachment structure schematic diagram of copper conductor and chip in Fig. 1,
Fig. 8 is Fig. 7 top view,
Fig. 9 is the structural representation of embedding in box body in the utility model,
Figure 10 is the structural representation of the optimal enforcement mode in the utility model,
Figure 11 is the structural representation one of box body exit in Fig. 1,
Figure 12 is the structural representation two of box body exit in Fig. 1,
Figure 13 is the structural representation of second of embodiment of the utility model,
Figure 14 is the structural representation of box body in Figure 13,
Figure 15 is the sectional view in B-B faces in Figure 14,
Figure 16 is the structural representation of copper conductor framework in Figure 13,
Figure 17 is Figure 16 left view,
Figure 18 is the attachment structure schematic diagram of copper conductor and chip in Figure 13,
Figure 19 is the structural representation of the third embodiment of the utility model,
Figure 20 is the structural representation of box body in Figure 19,
Figure 21 is the sectional view in C-C faces in Figure 20,
Figure 22 is the structural representation of copper conductor framework in Figure 19,
Figure 23 is Figure 22 left view,
Figure 24 is the structural representation one of box body exit in Figure 19,
Figure 25 is the structural representation two of box body exit in Figure 19,
Figure 26 is the attachment structure schematic diagram of copper conductor framework and chip in Figure 19,
Figure 27 is the structural representation of the 4th kind of embodiment of the utility model,
Figure 28 is the structural representation of box body in Figure 27,
Figure 29 is the sectional view in D-D faces in Figure 28,
Figure 30 is the structural representation of copper conductor framework in Figure 27,
Figure 31 is Figure 30 left view,
Figure 32 is the structural representation one of box body exit in Figure 27,
Figure 33 is the structural representation two of box body exit in Figure 27,
Figure 34 is the attachment structure schematic diagram of copper conductor framework and chip in Figure 27,
Figure 35 is the structural representation of ultrasonic wave aluminium wire bonding in the prior art,
Figure 36 is the structural representation of high-pressure injection processes in the prior art;
1 is box body in figure, and 11 be storage tank, and 12 be horizontal bar, and 120 be convergent belt perforating holes, and 13 be locating dowel, and 14 be taper
Blind hole, 2 be chip, and 3 be connection sheet, and 4 be copper conductor, and 41 be placement position, and 42 be to draw position, and 420 be threading hole, and 43 be connection
Position, 5 be casting glue, and 6 be technique connection strap, and 7 be technique connection ring, and 8 be fin, and 9 be copper conductor framework, and 10 be supersonic welding
Head.
Embodiment
The utility model is as shown in Fig. 1-34, including box body 1, N number of chip 2, N number of connection sheet 3 and N+1 copper conductor 4, N
>=1, N round numbers, the box body are provided with least one storage tank 11, and the box body holds provided with an apical side height higher than described
Put the horizontal bar 12 of groove bottom land;
The shape of storage tank can be designed as square, oval and polygon-shaped according to product requirement;
Storage tank being distributed as in terminal box:Terminal box containing a storage tank, storage tank is distributed in terminal box
Side;Terminal box containing two or more storage tanks, storage tank is distributed in terminal box both sides or surrounding;The purpose is to most
The scattered pyrotoxin of limits, utilize limited terminal box heat-dissipating space;
N number of copper conductor is corresponded with N number of chip in N+1 copper conductor 4, and N number of copper conductor is provided with chip placing position 41,
N+1 copper conductor is provided with positioned at the extraction position 42 of the horizontal bar top surface;So that the copper conductor is not contour with least two
Face;
So, the diode chip for backlight unit and copper conductor sinking position being welded with diode chip for backlight unit copper conductor are embedded into box body and housed
In groove, poured by high heat conduction, high mechanical properties epoxide-resin glue, seal and be fixed in box body;
It can be embedded in each storage tank and seal, fix a chips or multiple chips;It can be embedded in and seal, two copper are led
The sinking position of body or the sinking position of multiple copper conductors;Copper conductor containing multiple sinking positions, its sinking position respectively by
It is embedded into storage tank different in terminal box.
Sunk type copper conductor is formed by red copper, brass or alloyed copper by being punched bending.Under low level plane after bending is
Heavy position, each copper conductor contains one or more sinking positions;Sinking position is distributed in the side or a few sides or centre of copper conductor
Position.
As shown in Figure 19,27, in only one of which chip, two copper conductors, wherein, a copper conductor is pacified provided with chip
Extraction position is equipped with set, two copper conductors;
As shown in Fig. 1,13, when there is three chips, four copper conductors, wherein, three copper conductors are provided with chip placing
Position, four copper conductors, which are provided with, draws position;
The chip is fixedly welded on the placement position of the copper conductor and adjacent copper conductor is connected to by connection sheet
Connection position 43 on;
N+1 copper conductor is connected in series by the chip, connection sheet, forms the bypass circuit with output end;Wiring
The N faces of diode chip for backlight unit are welded on copper conductor in box, and the P of diode chip for backlight unit is bridged by being welded to connect piece with side copper conductor
Connection, realizes concatenation connection, and is exported using copper conductor as node, welds convergent belt for client and connection output cable is used.
As N=1, a node is formed;Or as N > 1, form N+1 node;
The placement position of the copper conductor, chip, the connection position of connection sheet and adjacent copper conductor pour solid by casting glue 5
Surely it is encapsulated in the storage tank, the position of drawing of the copper conductor is located on the horizontal bar, higher than the top surface of the casting glue.
Technique connection strap 6 is provided between adjacent copper conductor, multiple copper conductors is temporarily forming an entirety, in order to eliminate system
During making, relatively moved between copper conductor, stress is pullled to what chip was caused.
As N > 1, technique connection ring 7 is set between at least two copper conductors, make multiple copper conductors be temporarily forming one it is whole
Body, in order to eliminate in manufacturing process, relatively moves between copper conductor, stress is pullled to what chip was caused.
As N > 1, the connection position of connection output end is additionally provided with first and last copper conductor.Such as Figure 19,27 institutes
Show, as N=1, connection position of the copper conductor provided with connection output end;In only one of which chip, it is necessary to several chipsets
Conjunction is used.
Provided with gap and being electrically connected by chip and connection sheet between adjacent copper conductor, as N > 1, first with
Connection output end is additionally provided with last copper conductor(That is exit)Connection position, i.e., first copper conductor have positive pole cable
Exit, last copper conductor has negative pole cable exit, and positive pole cable exit and negative pole cable exit are respectively provided with
In the outside of box body;
As shown in Figure 11,12, positive pole cable connection exit and negative pole cable connect the setting of exit, and its direction is vertical
Directly in box body;
Positive pole cable connects exit and negative pole cable connects the setting of exit, and its direction is parallel to box body;
Positive pole cable connects exit and negative pole cable connects the setting of exit, and its direction is any angle with box body;
As N > 2, the chip sets up separately in the both sides of the horizontal bar.Such distributed architecture mode can make diode
The thermal source generated heat during work disperses, and makes full use of the heat-dissipating space that junction box is limited, reduces influence each other.
Convergent belt perforating holes 120 are provided with the horizontal bar 12, the convergent belt perforating holes are passed through by the back side of the box body
Wear the horizontal bar;The lower mouth of the convergent belt perforating holes is big, suitable for reading small, plays guide effect, is easy to convergent belt to place;
The position 42 of drawing of the copper conductor is provided with the corresponding threading hole 420 of convergent belt perforating holes.
The upper strata ladder plane of sunk type copper conductor(Draw position)Provided with the threading hole for client's erecting and welding convergent belt
And welded disc;Copper conductor containing a sinking position, it is set for the threading hole and welded disc of client's erecting and welding convergent belt
In the side of copper conductor;Copper conductor containing two or more sinking positions, it wears for client's erecting and welding convergent belt
String holes and welded disc are arranged on copper conductor middle part.
The solar power generation component processing method of chip seal pressure formula terminal box, comprises the following steps:
1), copper conductor processing, by copper sheet punching molding, formed adjacent copper conductor be connected as a single entity by technique attachment structure,
And there is the copper conductor framework 9 in gap each other;
Technique connection ring or technique connection strap are provided between each copper conductor, each copper conductor is temporarily connected as entirety, complete
Into after chip welding, pouring, solidification, technique connection ring or technique connection strap are removed;
2), chip connection, chip is welded on copper conductor by connection sheet, is formed and is led with the copper of bypass circuit structure
Body framework;
3), embedding, the copper conductor framework described in upper step is placed in box body, toward pouring epoxy resin in storage tank
Glue, chip and connection sheet are encapsulated within epoxide-resin glue, solidification;
4), cut-out, Cutting process attachment structure, be made.
As shown in figures 1 to 6, step 1) in technique attachment structure be technique connection strap, the technique connection strap be located at horizontal bar
On, technique connection strap is connected between the extraction position of adjacent conductor,
Step 4)In, the technique connection strap between adjacent copper conductor is cut off by bicker.
The utility model slot milling on box body horizontal bar, to facilitate in terminal box in storage tank after epoxy resin cure,
The punching for carrying out technique connection strap is removed.
As shown in figures 13-18, step 1) in technique attachment structure be technique connection ring;
Step 3)In, locating dowel 13 is provided with the storage tank of the box body, the locating dowel is located in technique connection ring, institute
The bottom surface for stating box body is provided with the tapered blind hole 14 consistent with locating dowel center line;
Step 4)In, by drilling, through tapered blind hole, remove the technique connection ring between adjacent copper conductor.
The utility model is provided with the locating dowel being engaged with copper conductor technique connection ring in box body storage tank, and in box
Body back side position corresponding with locating dowel sets tapered blind hole, play the guiding role, and technique is removed exactly by drilling to facilitate
Connection ring.
Also include fin 8, the fin is encapsulated within epoxide-resin glue, plays a part of radiating, fin can
For copper sheet, aluminium flake etc..
Claims (6)
1. solar power generation component chip seal pressure formula terminal box, including box body, N number of chip, N number of connection sheet and N+1
Copper conductor, N >=1, it is characterised in that
The box body is provided with least one storage tank, and the box body is provided with an apical side height higher than the storage tank bottom land
Horizontal bar;
N number of copper conductor is corresponded with N number of chip in N+1 copper conductor, and N number of copper conductor is provided with chip placing position, N+1 copper
Conductor is provided with positioned at the extraction position of the horizontal bar top surface;
The chip is fixedly welded on the placement position of the copper conductor and the company of adjacent copper conductor is connected to by connection sheet
Connect on position;
N+1 copper conductor is connected in series by the chip, connection sheet, forms the bypass circuit with output end;
Placement position, chip and the connection sheet of the copper conductor are poured fixation by casting glue and are encapsulated in the storage tank, the copper
The position of drawing of conductor is located on the horizontal bar, higher than the top surface of the casting glue.
2. solar power generation component according to claim 1 chip seal pressure formula terminal box, it is characterised in that adjacent
Technique connection strap is provided between copper conductor.
3. solar power generation component according to claim 1 chip seal pressure formula terminal box, it is characterised in that work as N
During > 1, technique connection ring is set between at least two copper conductors.
4. solar power generation component according to claim 1 chip seal pressure formula terminal box, it is characterised in that work as N
During > 1, the connection position of connection output end is additionally provided with first and last copper conductor.
5. solar power generation component according to claim 1 chip seal pressure formula terminal box, it is characterised in that work as N
During > 2, the chip sets up separately in the both sides of the horizontal bar.
6. solar power generation component according to claim 1 chip seal pressure formula terminal box, it is characterised in that in institute
Horizontal bar is stated provided with convergent belt perforating holes, the convergent belt perforating holes run through the horizontal bar by the back side of the box body;It is described to converge
Flow the lower mouth with perforating holes big, suitable for reading small;
The position of drawing of the copper conductor is provided with the corresponding threading hole of convergent belt perforating holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720236623.8U CN206506491U (en) | 2017-03-10 | 2017-03-10 | Solar power generation component chip seal pressure formula terminal box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720236623.8U CN206506491U (en) | 2017-03-10 | 2017-03-10 | Solar power generation component chip seal pressure formula terminal box |
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Publication Number | Publication Date |
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Family
ID=59832957
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CN201720236623.8U Withdrawn - After Issue CN206506491U (en) | 2017-03-10 | 2017-03-10 | Solar power generation component chip seal pressure formula terminal box |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106685342A (en) * | 2017-03-10 | 2017-05-17 | 江苏通灵电器股份有限公司 | Chip low-pressure package type junction box for solar power generation module and processing method of chip low-pressure package type junction box |
-
2017
- 2017-03-10 CN CN201720236623.8U patent/CN206506491U/en not_active Withdrawn - After Issue
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106685342A (en) * | 2017-03-10 | 2017-05-17 | 江苏通灵电器股份有限公司 | Chip low-pressure package type junction box for solar power generation module and processing method of chip low-pressure package type junction box |
CN106685342B (en) * | 2017-03-10 | 2018-06-19 | 江苏通灵电器股份有限公司 | Solar power generation component chip seal pressure formula terminal box and its processing method |
WO2018161661A1 (en) * | 2017-03-10 | 2018-09-13 | 江苏通灵电器股份有限公司 | Low-pressure chip packaging type junction box and processing method thereof for solar power generation assembly |
US11264946B2 (en) | 2017-03-10 | 2022-03-01 | Jiangsu Tonglin Electric Co., Ltd | Low-pressure chip packaging type junction box and processing method thereof for solar power generation assembly |
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