CN201966243U - LED (light-emitting diode) capsulation spot welding structure - Google Patents
LED (light-emitting diode) capsulation spot welding structure Download PDFInfo
- Publication number
- CN201966243U CN201966243U CN2010206944273U CN201020694427U CN201966243U CN 201966243 U CN201966243 U CN 201966243U CN 2010206944273 U CN2010206944273 U CN 2010206944273U CN 201020694427 U CN201020694427 U CN 201020694427U CN 201966243 U CN201966243 U CN 201966243U
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- CN
- China
- Prior art keywords
- led
- pad
- coat
- welding
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
An LED (light-emitting diode) capsulation spot welding structure relates to a spot welding structure. In the prior art, a chip is fixed and connected with a circuit board through a welding manner, but the evenness of a fixed crystal face of a substrate is different, so welding becomes troublesome, the height of a weld wire needs to be ceaselessly adjusted, the speed is dropped, and the yield is influenced. The LED capsulation spot welding structure comprises a substrate, LED chips and a circuit board, wherein the circuit board is provided with conduction regions, connecting wires are welded between the conduction regions and the LED chips. The LED capsulation spot welding structure is characterized in that welding points through which the connecting wires are connected with the conduction regions are covered with reinforcing layers, the area of each reinforcing layer is larger than the area of each welding point, the middle part of each reinforcing layer is fixedly connected with each welding point, and the external parts of the reinforcing layers are fixedly connected with the conduction regions of the circuit board. By adopting the reinforcing layers with the area being larger than the area of the welding points, one ends of the connecting wires are reliably fixed on the conduction regions of the circuit board, the operation is simple and convenient, the height of a welding machine does not need to be ceaselessly adjusted, the working efficiency is high, the whole reliability of the product is good, the quality is good, and the production cost is low.
Description
Technical field
The present invention relates to a kind of welding spot structure.
Background technology
Along with the market demand improves constantly the high-power LED encapsulation technology, reliability to encapsulating products is also had higher requirement, particularly high-power integrated encapsulation, from the flow process of whole LED encapsulation, the welding of gold thread 4 is extremely important, if the not prison welding of gold thread 4 is solid, difficult before encapsulating, semi-finished product are prone to soldered ball and come off, and the phenomenon of gold thread 4 perks influences the conductivity of chip 1, the acceptance rate of finished product is low, reduced the quality of product integral body, the LED product is reprocessed frequently, and chip 1 is impaired serious, the reduction of luminous flux and light efficiency, thermal resistance increases, and influences light decay, causes problems such as shortening in useful life.Welding machine is when welding automatically, gold thread 4 is the pad 2 that adds soldered ball with the pad 2 of chip 1, and the pad 2 of gold thread 4 and wiring board 5 is not for adding the pad 2 of soldered ball, this pad 2 is less, connect comparatively fragile, so the reinforcing to this pad 2 is an important link, now normal employing is reinforced in the mode that pad 2 adds soldered ball, utilize ultrasonic gold wire bonder to burn ball, adjust power, pressure, and gold thread 4 and substrate fixed, ideally performance pad 2 that will not add soldered ball adds solid welding and reserves, (referring to Fig. 1), but there is obvious defects in this mode, in practical operation, no matter manually still is machine operation, in a collection of product, the solid crystal face evenness of substrate is inconsistent, all certain difference can be arranged, and is difficult to control to equally flat, can give and add the certain trouble of welding, the adjustment bonding wire height that need not stop causes speed to descend, and influences output.Present packaged type be difficult to satisfy as the 4th generation lighting source integrated-type LED technology and the requirement that increases of performance.
Summary of the invention
The technical assignment of the technical problem to be solved in the present invention and proposition is that the prior art scheme is improved and improved, and provides a kind of LED encapsulation welding spot structure, to reach the packaging efficiency height, to encapsulate firm purpose.For this reason, the present invention takes following technical scheme.
A kind of LED encapsulation welding spot structure, the LED encapsulating structure comprises substrate, be located at the led chip on the substrate and be positioned at the wiring board of substrate periphery, described wiring board is provided with a plurality of conduction regions that are used to connect led chip, be welded with connecting line between conduction region and the led chip, it is characterized in that: be covered with the back-up coat of area on connecting line and the pad that conduction region is connected greater than pad, the back-up coat middle part is affixed with pad, and its outside conduction region with wiring board is affixed.Adopt area to make an end secure fixation of connecting line on the conduction region of wiring board greater than the back-up coat of pad, easy and simple to handle, do not need the ceaselessly height of conversion welding machine, increase work efficiency, when guaranteeing the product global reliability, reduce the repair rate of chip and the use amount of connecting line, reduced production cost.This back-up coat can be formed by colloid curing, and the point of this colloid is annotated and can be formed by injector to inject.
As the further of technique scheme improved and replenish, the present invention also comprises following additional technical feature.
Described back-up coat is for being solidified the back-up coat that forms by conductive rubber.Colloid can be put on the pad by the mode of injection, overlays on the pad after conductive rubber solidifies, and has both made separating of connecting line and conduction region, also can be electrically connected by back-up coat.
Described back-up coat is the elargol back-up coat.Elargol by sintering curing on pad, good conductivity.
Described back-up coat is circular membranaceous back-up coat.
The pad that connecting line connects die terminals is the pad that adds soldered ball, and it connects the pad of conduction region end greater than connecting line.
Beneficial effect: adopt area to make an end secure fixation of connecting line on the conduction region of wiring board greater than the back-up coat of pad, easy and simple to handle, do not need the ceaselessly height of conversion welding machine, increase work efficiency, when guaranteeing the product global reliability, reduce the repair rate of chip and the use amount of connecting line, reduced production cost.
Description of drawings
Fig. 1 is existing encapsulation partial structurtes schematic diagram.
Fig. 2 is a partial structurtes schematic diagram of the present invention.
Embodiment
Below in conjunction with Figure of description technical scheme of the present invention is described in further detail.
As shown in Figure 2, the LED encapsulating structure comprises substrate, be located at the led chip 1 on the substrate and be positioned at the wiring board 5 of substrate periphery, described wiring board 5 is provided with a plurality of conduction regions that are used to connect led chip 1, be welded with connecting line 4 between conduction region and the led chip 1, be covered with the elargol back-up coat 3 of area on the pad 2 that connecting line 4 is connected with conduction region greater than pad 2, back-up coat 3 middle parts and pad 2 are affixed, and its outside conduction region with wiring board 5 is affixed, and back-up coat 3 is circular membranaceous back-up coat 3.Connecting line 4 connects the pad 2 of chip 1 end for adding the pad 2 of soldered ball, and it connects the pad 2 of conduction region end greater than connecting line 4.Chip 1 top is covered with light conversion layer, is embedded with connecting line 4 in the described light conversion layer.
LED encapsulation solder joint reinforcement means:
1) connecting line 4 welding step reach the connecting line 4 usefulness stitch welding machines welding between chip 1 and the wiring board 5 between the chip 1, the connecting line 4 between chip 1 and the wiring board 5, and it connects chip 1 end and directly adds the soldered ball connection, and connecting line 4 road plate ends do not add soldered ball and connect;
2) colloid injecting step, with in conductive silver glue is housed the some packing element elargol in the cavity is injected on the pad 2 that connecting line 4 is connected with conduction region, it is also excessive to wiring board 5 to make elargol can cover pad 2 fully;
3) colloid curing schedule will be put into baking box together with the substrate of chip 1, connecting line 4, conductive plate after the colloid injection is finished, and continue 40 minutes under 180 ℃ of temperature, and elargol solidify to form the circular membranaceous back-up coat 3 that covers pad 2.
More than a kind of LED encapsulation welding spot structure shown in Figure 2 be specific embodiments of the invention; substantive distinguishing features of the present invention and progress have been embodied; can be according to the use needs of reality; under enlightenment of the present invention; it is carried out the equivalent modifications of aspects such as shape, structure, all at the row of the protection range of this programme.
Claims (5)
1. a LED encapsulates welding spot structure, the LED encapsulating structure comprises substrate, be located at the led chip (1) on the substrate and be positioned at the wiring board (5) of substrate periphery, described wiring board (5) is provided with a plurality of conduction regions that are used to connect led chip (1), be welded with connecting line (4) between conduction region and the led chip (1), it is characterized in that: be covered with the back-up coat (3) of area on the pad (2) that connecting line (4) is connected with conduction region greater than pad (2), back-up coat (3) middle part is affixed with pad (2), and its outside conduction region with wiring board (5) is affixed.
2. a kind of LED encapsulation welding spot structure according to claim 1, it is characterized in that: described back-up coat (3) is for being solidified the back-up coat (3) that forms by conductive rubber.
3. a kind of LED encapsulation welding spot structure according to claim 2, it is characterized in that: described back-up coat (3) is an elargol back-up coat (3).
4. a kind of LED encapsulation welding spot structure according to claim 3, it is characterized in that: described back-up coat (3) is a circular membranaceous back-up coat (3).
5. a kind of LED encapsulation welding spot structure according to claim 1 is characterized in that: connecting line (4) connects the pad (2) of chip (1) end for adding the pad (2) of soldered ball, and it connects the pad (2) of conduction region end greater than connecting line (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206944273U CN201966243U (en) | 2010-12-31 | 2010-12-31 | LED (light-emitting diode) capsulation spot welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206944273U CN201966243U (en) | 2010-12-31 | 2010-12-31 | LED (light-emitting diode) capsulation spot welding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201966243U true CN201966243U (en) | 2011-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206944273U Expired - Fee Related CN201966243U (en) | 2010-12-31 | 2010-12-31 | LED (light-emitting diode) capsulation spot welding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201966243U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108430169A (en) * | 2018-05-29 | 2018-08-21 | 东莞立德精密工业有限公司 | The welding method of magnetic coil |
| CN109585405A (en) * | 2018-12-03 | 2019-04-05 | 北京遥感设备研究所 | A kind of vacuum electronic component mechanical environment adaptive system |
| CN113506786A (en) * | 2021-07-08 | 2021-10-15 | 哈尔滨工业大学 | Improved design method of interlayer connecting wire suitable for laminated packaging |
-
2010
- 2010-12-31 CN CN2010206944273U patent/CN201966243U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108430169A (en) * | 2018-05-29 | 2018-08-21 | 东莞立德精密工业有限公司 | The welding method of magnetic coil |
| CN109585405A (en) * | 2018-12-03 | 2019-04-05 | 北京遥感设备研究所 | A kind of vacuum electronic component mechanical environment adaptive system |
| CN113506786A (en) * | 2021-07-08 | 2021-10-15 | 哈尔滨工业大学 | Improved design method of interlayer connecting wire suitable for laminated packaging |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20131231 |