CN206402512U - Flexible PCB - Google Patents
Flexible PCB Download PDFInfo
- Publication number
- CN206402512U CN206402512U CN201621193825.0U CN201621193825U CN206402512U CN 206402512 U CN206402512 U CN 206402512U CN 201621193825 U CN201621193825 U CN 201621193825U CN 206402512 U CN206402512 U CN 206402512U
- Authority
- CN
- China
- Prior art keywords
- layer
- flexible pcb
- reinforcement
- ink
- conductive circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002787 reinforcement Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 description 10
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 7
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 4
- -1 Polyethylene Terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920000344 molecularly imprinted polymer Polymers 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
A kind of flexible PCB, the flexible PCB includes a substrate layer and first conductive circuit layer on the surface of substrate layer one, first conductive circuit layer includes an at least weld pad, the flexible PCB also includes one and strengthens ink layer, the reinforcement ink layer is on the substrate layer and relative with the bond pad locations, and the reinforcement ink layer is for the reinforcement flexible PCB.Compared with prior art, the flexible PCB that the utility model is provided, will not increase the thickness of the flexible PCB, be conducive to the miniaturization of above-mentioned flexible PCB.
Description
Technical field
The utility model is related to circuit board making field, more particularly to a kind of flexible PCB containing reinforced sheet.
Background technology
Flexible PCB has flexible nature, in order to be conducive to part to weld and support part, the flexible electrical of soldering part
The back side in road plate region need to paste reinforced sheet.
Current industry frequently with cut or stamp shaping hard FR4 or steel disc as reinforced sheet, such reinforced sheet is usual
For the rectangle reinforced sheet of make versus buy, fitted in using pure glue as medium on flexible PCB.In this way, flexible PCB can be increased
Thickness, be unfavorable for circuit board miniaturization development.
Utility model content
In view of this, the utility model offer is a kind of will not increase the thickness of circuit board and be conducive to circuit board miniaturization hair
The flexible PCB of exhibition.
A kind of flexible PCB, the flexible PCB is located at first on the surface of substrate layer one including a substrate layer and one
Conductive circuit layer, first conductive circuit layer includes an at least weld pad, and the flexible PCB also includes one and strengthens ink layer, should add
Strong ink layer is on the substrate layer and relative with the bond pad locations, and the reinforcement ink layer is for the reinforcement flexible PCB.
The reinforcement ink layer for the flexible PCB that the utility model is provided can be formed directly into this by way of printing
In conductive circuit layer, compared with prior art, bonding of the prior art is eliminated in the structure of the flexible PCB of this case and is added
The glue-line of strong piece, can reduce the thickness of the flexible PCB.
Brief description of the drawings
A kind of sectional view for flexible PCB containing reinforced sheet that Fig. 1 provides for the utility model first embodiment.
Fig. 2 is the top view of the flexible PCB containing reinforced sheet shown in Fig. 1.
Fig. 3 is a kind of sectional view for flexible PCB containing reinforced sheet that present embodiment second embodiment is provided.
Fig. 4 is a kind of sectional view for flexible PCB containing reinforced sheet that present embodiment 3rd embodiment is provided.
Fig. 5 is a kind of sectional view for flexible PCB containing reinforced sheet that present embodiment fourth embodiment is provided.
Main element symbol description
| Flexible PCB | 100,200,300,400 |
| Substrate layer | 11,21 |
| First surface | 111 |
| Second surface | 112 |
| First conductive circuit layer | 12,22 |
| Conducting wire | 121 |
| Weld pad | 122 |
| Nickel-gold layer | 123 |
| Second conductive circuit layer | 13,23 |
| First cover layer | 14 |
| Opening | 141 |
| Second cover layer | 15,25 |
| Strengthen ink layer | 16,26 |
| Electronic component | 20 |
Following embodiment will further illustrate the utility model with reference to above-mentioned accompanying drawing.
Embodiment
Reach technological means and effect that predetermined utility model purpose is taken for the utility model can be expanded on further, with
Lower combination accompanying drawing 1~3 and better embodiment, to the tool of the hollow out flexible circuit board of the utility model offer and preparation method thereof
Body embodiment, structure, feature and its effect, make as described in detail below.
Fig. 1~2 are referred to, the utility model first embodiment provides a kind of flexible PCB 100, the flexible PCB
100 include one insulation substrate layers 11, one first conductive circuit layer 12, one second conductive circuit layer 13, one first cover layer 14,
One second cover layer 15 and one strengthens ink layer 16.
The substrate layer 11 includes a first surface 111 and a second surface 112 opposite with the first surface 111.
Wherein, the substrate layer 11 has a pliability, its material generally can select polyimides (polyimide, PI), poly- pair
PET (Polyethylene Terephthalate, PET) or PEN
(Polyethylene Naphthalate, PEN), polyethylene (polyethylene, PE), Teflon (Teflon), liquid crystal are high
Molecularly Imprinted Polymer (liquid crystal polymer, LCP), polyvinyl chloride (polyvinyl chloride polymer,
The one kind in material such as PVC),.In the present embodiment, the material of the substrate layer 11 is PET.
First conductive circuit layer 12 is formed on the first surface 111, and first conductive circuit layer 12 includes at least one
Bar conducting wire 121 and at least a weld pad 122.The weld pad 122 is used to electrically connect exterior electrical components 20.
Second conductive circuit layer 13 is formed on the second surface 12.
First cover layer 14 is formed on the surface away from the first surface 111 of first conductive circuit layer 12, should
First cover layer 14 includes at least one opening 141, the quantity of at least one opening 141 and the quantity one of at least one weld pad 122
Cause, the position of at least one opening 141 and the position of at least one weld pad 122 are corresponded.Each weld pad 122 is from right therewith
Expose and in the opening 141 answered.A nickel-gold layer 123 is formed with the exposed surface of each weld pad 122, to protect the weldering
Pad 122.
In the present embodiment, second cover layer 15 is formed in second conductive circuit layer 13 away from the second surface
On 112 surface.
The reinforcement ink layer 16 is directly printed on the surface away from second conductive circuit layer 13 of second cover layer 15
On, the reinforcement ink layer 16 and at least one position of weld pad 122 are relative.
Wherein, size of the size of the reinforcement ink layer 16 not less than the weld pad group that at least one weld pad 122 is constituted.
Wherein, the shape of the weld pad group of the shape and at least one of the reinforcement ink layer 16 weld pad 122 composition is identical.
In the present embodiment, profile printing of the reinforcement ink layer 16 along the flexible PCB 100 is formed.In other words,
The reinforcement ink layer 16 is located at the position at the close edge of the flexible PCB 100.
The material of the reinforcement ink layer 16 is heat fixed type ink or resin.The reinforced ink layer 16 can be with the side of printing
The ink of required shape and thickness is printed onto on the flexible PCB 100 by formula.
Because liquid ink has certain mobility, therefore special screen painting is needed, dried after being completed for printing through boiler
It is roasting to make ink solidification, hardening, so as to form the ink or resin bed of stabilization and play a part of reinforcement circuit board.
In the present embodiment, the material of the reinforcement ink layer 16 is resin ink, its model PHP-900 IR-6P.It is logical
Cross the thickness requirement that repeatedly printing can reach most reinforced sheets.
Referring to Fig. 3, the utility model second embodiment provides a kind of flexible PCB 200, the flexible PCB 200
Structure and the structure of the flexible PCB 100 are essentially identical, and its distinctive points is：The flexible PCB 200 includes an insulation
Substrate layer 21, one first conductive circuit layer 22, one second conductive circuit layer 23, one first cover layer 24, one second cover layer 25
And one strengthen ink layer 26.The reinforcement ink layer 26 is formed in second conductive circuit layer 23, and second cover layer 26 is covered
Second conductive circuit layer 23 and the reinforcement ink layer 26.
Referring to Fig. 4, the utility model 3rd embodiment provides a flexible PCB 300, the knot of the flexible PCB 300
The structure for the flexible PCB 100 that structure is provided with the utility model first embodiment is essentially identical, and its distinctive points is：This is soft
Property circuit board 300 reinforcement ink layer 36 be not along the flexible PCB 300 profile printing form, but inside contract printing and
Into.In other words, the reinforcement ink layer 16 of the flexible PCB 300 is located at the non-edge position of the flexible PCB 300.
Referring to Fig. 5, the utility model fourth embodiment provides a flexible PCB 400, the knot of the flexible PCB 400
The structure for the flexible PCB 200 that structure is provided with the utility model second embodiment is essentially identical, and its distinctive points is：This is soft
Property circuit board 400 reinforcement ink layer 26 be not along the flexible PCB 400 profile printing form, but inside contract printing and
Into.In other words, the reinforcement ink layer 26 of the flexible PCB 400 is located at the non-edge position of the flexible PCB 400.
The flexible PCB that the utility model is provided, it is using above-mentioned reinforcement ink layer as reinforced sheet to above-mentioned flexible circuit
Plate carries out reinforcement, can be formed due to strengthening ink layer by way of printing, therefore, it can adjust above-mentioned according to actual needs
Strengthen shape, size and the thickness of ink layer, be conducive to the miniaturization of above-mentioned flexible PCB.In addition, the flexibility of this case
The glue-line of bonding reinforced sheet of the prior art is eliminated in the structure of circuit board, the thickness of the flexible PCB can be reduced.
It is described above, only it is better embodiment of the present utility model, it is not any to the utility model formal
Limitation, although the utility model has been that better embodiment is disclosed above, is not limited to the utility model, any to be familiar with
Professional and technical personnel, is not departing from the range of technical solutions of the utility model, when the technology contents using the disclosure above
Make a little change or be modified to the equivalent implementations of equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent variations and the modification made according to technical spirit of the present utility model to embodiment of above,
In the range of still falling within technical solutions of the utility model.
Claims (10)
1. a kind of flexible PCB, the flexible PCB is located at first on the surface of substrate layer one including a substrate layer and one leads
Electric line layer, first conductive circuit layer includes an at least weld pad, it is characterised in that the flexible PCB also includes one and strengthens oil
Layer of ink, the reinforcement ink layer is on the substrate layer and relative with the bond pad locations, and the reinforcement ink layer is for the reinforcement flexibility
Circuit board.
2. flexible PCB as claimed in claim 1, it is characterised in that the flexible PCB also includes one second conducting wire
Layer, second conductive circuit layer is located on a surface of the substrate layer and, the reinforcement ink opposite with first conductive circuit layer
Layer is located on the surface away from the substrate layer of second conductive circuit layer.
3. flexible PCB as claimed in claim 1, it is characterised in that the flexible PCB also includes one and be located at this first leading
The first cover layer on electric line layer, first cover layer includes at least one opening, at least quantity of the opening and at least one
The quantity of the weld pad is identical, and at least one opening is relative with least one bond pad locations and corresponds, each weld pad from
The corresponding opening in expose come.
4. flexible PCB as claimed in claim 2, it is characterised in that the flexible PCB also includes one second cover layer,
Second cover layer is located between second conductive circuit layer and the strong ink layer.
5. flexible PCB as claimed in claim 2, it is characterised in that the flexible PCB also includes one second cover layer,
Second cover layer covers second conductive circuit layer and the reinforcement ink layer.
6. flexible PCB as claimed in claim 1, it is characterised in that the material of the reinforcement ink layer is resin ink, should
The product type of resin ink is PHP-900IP-6R.
7. flexible PCB as claimed in claim 1, it is characterised in that the size of the reinforcement ink layer is more than or equal at least one
The size of the weld pad group of individual weld pad composition.
8. flexible PCB as claimed in claim 1, it is characterised in that the shape of the reinforcement ink layer and at least one weldering
The shape for padding the weld pad group of composition is identical.
9. flexible PCB as claimed in claim 1, it is characterised in that the reinforcement ink layer is located at leaning on for the flexible PCB
The position of proximal edge.
10. flexible PCB as claimed in claim 1, it is characterised in that the reinforcement ink layer is located at the flexible PCB
Non-edge position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621193825.0U CN206402512U (en) | 2016-11-03 | 2016-11-03 | Flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621193825.0U CN206402512U (en) | 2016-11-03 | 2016-11-03 | Flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206402512U true CN206402512U (en) | 2017-08-11 |
Family
ID=59507395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621193825.0U Expired - Fee Related CN206402512U (en) | 2016-11-03 | 2016-11-03 | Flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206402512U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785021A (en) * | 2019-11-07 | 2020-02-11 | 江苏上达电子有限公司 | Manufacturing method for COF ink reinforcement |
| CN112118681A (en) * | 2019-06-20 | 2020-12-22 | 北京梦之墨科技有限公司 | Manufacturing method of circuit board |
| WO2022000173A1 (en) * | 2020-06-29 | 2022-01-06 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method therefor |
-
2016
- 2016-11-03 CN CN201621193825.0U patent/CN206402512U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112118681A (en) * | 2019-06-20 | 2020-12-22 | 北京梦之墨科技有限公司 | Manufacturing method of circuit board |
| CN110785021A (en) * | 2019-11-07 | 2020-02-11 | 江苏上达电子有限公司 | Manufacturing method for COF ink reinforcement |
| WO2022000173A1 (en) * | 2020-06-29 | 2022-01-06 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method therefor |
| CN114365584A (en) * | 2020-06-29 | 2022-04-15 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
| TWI770547B (en) * | 2020-06-29 | 2022-07-11 | 大陸商慶鼎精密電子（淮安）有限公司 | Circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 |