CN206394028U - 3D printing shower nozzle and 3D printing equipment - Google Patents

Abstract

The utility model discloses a 3D printing nozzle and 3D printing equipment. The 3D printing nozzle includes a connected nozzle and a throat, the nozzle is connected with a first heat-conducting element, and the throat is connected with a second heat-conducting element , further comprising a semiconductor cooling element, the hot end of the semiconductor cooling element is connected to the first heat-conducting element, and the cold end of the semiconductor cooling element is connected to the second heat-conducting element. The 3D printing nozzle and 3D printing equipment provided by the utility model make full use of the characteristics of the temperature difference between the two ends of the semiconductor refrigeration element when it is working, and meet the dual requirements of heating the molten material of the 3D printing nozzle and dissipating heat from the throat. One device simultaneously realizes the heating effect and heat dissipation The effect is a good balance between structural design and technical effect; at the same time, there is no noise during use; thirdly, the characteristics of the heating power of the semiconductor refrigeration element is greater than the cooling power, and the characteristics of the element and the requirements of the 3D printing nozzle are realized. perfect fit.

Description

3D printing nozzle and 3D printing equipment

technical field

The utility model relates to printing technology, in particular to a 3D printing nozzle and 3D printing equipment.

Background technique

Since the 1980s, 3D printing technology has been more and more widely used because of its high efficiency and low cost. In the existing technology, according to the different molding methods, 3D printing technology can be divided into stereolithography ( Stcmolithography, SLA), laminated object manufacturing (Laminated Object Manufacturing, LOM), selective laser sintering (Selective Laster

Sintering, SLS), fused deposition manufacturing (Fused Deposition Modeling, FDM) and other different classifications. Among them, the most essential difference between the FDM rapid prototyping system and other systems is that it does not use a laser system, so it has the lowest cost and is currently the most widely used. A 3D printing technology.

Specifically, the FDM process is to heat a solid low-melting filament material (such as PLA or ABS, etc.) to a semi-molten state, and then extrude it for printing. In the prior art, the 3D printing nozzle includes a connected nozzle, a heating block, and a throat. The heating block is equipped with a heating device. The filament enters the nozzle from the throat, and is heated by the heating device at the nozzle to a semi-molten state and then extruded. . During the use of the above-mentioned mechanism, the heat of the heating device is inevitably transferred to the silk material in the throat, which is easy to cause the silk material to heat up and soften in the throat and cause blockage. In order to solve this problem, a device is installed on the throat in the prior art The heat dissipation device, through which the temperature of the throat and the internal silk material is reduced, ensures that the silk material is always in a solid state before entering the nozzle, so as to ensure the smooth feeding. Most of the heat dissipation devices in the prior art are fans and heat dissipation blocks, and the heat dissipation of the throat is realized through the fans.

The disadvantages of the prior art are: firstly, it is necessary to arrange the heating device and the cooling device in the narrow space on the nozzle and the throat, and the arrangement is difficult, so that it is difficult to achieve an ideal balance between the technical effect and the structural design , the long-term working reliability is not good; secondly, the cooling limit of the fan to the throat is room temperature, which makes the silk material still in a high temperature state before entering the nozzle from the throat, and its ability to prevent material blocking is relatively weak. Third, the rotation of the fan has a certain amount of noise and vibration, and increases the weight of the nozzle, which is not conducive to high-precision and high-speed printing; fourth, it relies on multiple components to work together, and any component failure will lead to printing failure. Poor.

Utility model content

The purpose of this utility model is to provide a 3D printing nozzle and 3D printing equipment to solve the above-mentioned deficiencies in the prior art.

In order to achieve the above object, the utility model provides the following technical solutions:

A 3D printing nozzle, comprising a connected nozzle and a throat, the nozzle is connected to a first heat conduction element, the throat is connected to a second heat conduction element, and a semiconductor refrigeration element, the semiconductor refrigeration element The hot end is connected to the first heat conduction element, and the cold end of the semiconductor cooling element is connected to the second heat conduction element.

In the above-mentioned 3D printing nozzle, the first heat conduction element, the semiconductor cooling element and the second heat conduction element are in contact with each other in sequence.

In the above-mentioned 3D printing nozzle, liquid metal gaskets are arranged between the first heat conduction element and the semiconductor refrigeration element, and between the second heat conduction element and the semiconductor refrigeration element.

In the above-mentioned 3D printing nozzle, the first heat conduction element, the semiconductor cooling element and the second heat conduction element are all cylindrical structures, and the ends of each cylindrical structure are in contact with each other.

In the above-mentioned 3D printing nozzle, the ends of the first heat conduction element and/or the second heat conduction element are provided with a limiting structure, and the semiconductor cooling element is embedded in the limiting structure.

The above-mentioned 3D printing nozzle further includes a heat insulation cylinder, the heat insulation cylinder is embedded in the semiconductor cooling element, and the heat insulation cylinder is externally placed at the connection between the nozzle and the throat.

In the above-mentioned 3D printing nozzle, the outer wall of the first heat-conducting member is provided with a thermal insulation member.

For the above-mentioned 3D printing nozzle, the semiconductor cooling element includes a plurality of semiconductor cooling sheets that are attached to each other, and any two adjacent semiconductor cooling sheets are bonded with a hot end and a cold end.

The above-mentioned 3D printing nozzle further includes a temperature sensor, and the detection part of the temperature sensor is embedded in the first heat conducting member.

A 3D printing device includes a body and a spray head arranged on the body, and the spray head is the above-mentioned 3D printing spray head.

In the above technical solution, the 3D printing nozzle provided by the utility model makes full use of the characteristics of the temperature difference between the two ends of the semiconductor refrigeration element when it is working, and meets the dual requirements of heating the molten material of the 3D printing nozzle and heat dissipation of the throat, and realizes the heating effect at the same time with one device It is a good balance between the structure design and the technical effect of heat dissipation effect. At the same time, there is no noise when using it. Thirdly, the characteristic that the heating power of the semiconductor cooling element is greater than the cooling power is rationally used, and the characteristics of the element and the requirements of the 3D printing nozzle are realized. The perfect fit; Finally, one element realizes the heating and cooling functions, which has high reliability and avoids additional failures caused by multi-element work.

Since the above-mentioned 3D printing nozzle has the above-mentioned technical effect, the 3D printing equipment including the 3D printing nozzle should also have the corresponding technical effect.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. For some embodiments described, those skilled in the art can also obtain other drawings according to these drawings.

Fig. 1 is a schematic structural diagram of a 3D printing nozzle provided by an embodiment of the present invention;

Fig. 2 is a cross-sectional view of the 3D printing nozzle provided by the embodiment of the present invention;

Fig. 3 is an exploded schematic diagram of the 3D printing nozzle provided by the embodiment of the present invention.

Explanation of reference signs:

1. Nozzle; 2. Throat; 3. The first heat conducting part; 4. The second heat conducting part; 5. Semiconductor cooling part; 6. Liquid metal gasket; 7. Limiting structure; Insulation piece; 10. Temperature sensor; 11. Adapter; 12. Teflon tube.

detailed description

In order to make those skilled in the art better understand the technical solution of the utility model, the utility model will be further introduced in detail below in conjunction with the accompanying drawings.

As shown in Figure 1-3, a 3D printing nozzle 1 provided by the embodiment of the present invention includes a connected nozzle 1 and a throat 2, the nozzle 1 is connected with a first heat conducting member 3, and the throat 2 is connected with a The second heat conduction element 4 also includes a semiconductor cooling element 5 , the hot end of the semiconductor cooling element 5 is connected to the first heat conduction element 3 , and the cold end of the semiconductor cooling element 5 is connected to the second heat conduction element 4 .

Specifically, the throat pipe 2 is used to supply the filament to the nozzle 1, and the filament is heated from a solid in the nozzle 1 to a molten state to output printing. To provide heat, the second heat conduction element 4 is connected to the throat pipe 2, and its connection is used to take away the heat from the throat pipe 2. The first heat conduction element 3 and the second heat conduction element 4 themselves do not generate heat or produce low temperature, Wherein the hot end of the semiconductor cooling element 5 transfers heat to the nozzle through the first heat conducting element 3 to realize silk melting, and the throat pipe 2 transfers heat to the cold end of the semiconductor cooling element 5 through the second heat conducting element 4 to realize cooling of the throat pipe. The second heat-conducting member 4 is only a medium for transferring heat, so although the functions of the two are different, they can be of the same material and structure in theory, such as a cylinder made of aluminum. The semiconductor cooling element 5 is also called a thermoelectric cooling sheet, which utilizes the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple, thereby The purpose of heating and cooling can be realized at the same time. Semiconductor refrigeration is a prior art, and the specific internal structure and working principle thereof will not be repeated in this embodiment. In this embodiment, the hot end of the semiconductor cooling element 5 is connected to the first heat conduction element 3 to transfer heat to the nozzle 1 through the first heat conduction element 3, and the cold end of the semiconductor refrigeration element 5 is connected to the second heat conduction element 4 to pass heat through the first heat conduction element 3. The second heat conduction element 4 absorbs heat from the throat pipe 2, so as to avoid the part of the heat heating the silk material in the throat pipe 2 to make it warm up and soften and cause blockage. In this embodiment, the semiconductor refrigeration element 5, the first heat conduction element 3, the second The meaning and function of the connection of the two heat-conducting elements 4, the nozzle 1 and the throat pipe 2 are to transfer heat, regardless of its specific structure, such as the first heat-conducting element 3 can be a rectangular parallelepiped, a cube, a cylinder or other special-shaped structures. The nozzle 1 can be completely wrapped, or only partly attached to the nozzle 1. It can be directly attached to the nozzle 1, and can also transfer heat to the nozzle 1 through other heat-conducting structures. It only needs to ensure that it can transfer a sufficient amount of heat to the nozzle 1. Nozzle 1 is enough to melt the silk material inside it. The only thing that can be determined is that its material is a material with excellent thermal conductivity. The second heat conduction member 4 and other components are the same, only need to ensure that the semiconducting cooling member 5 can be enough. Absorb heat from the target structure.

In the 3D printing nozzle 1 provided in this embodiment, the hot end of the semiconductor cooling element 5 generates high temperature, and transmits the high temperature to the nozzle 1 through the first heat conduction element 3, so that the filament in the nozzle 1 can be melted, and the semiconductor cooling element 5 The cold end generates low temperature, and absorbs heat from the throat 2 through the second heat conducting element 4 to cool down, so that the silk material in the throat 2 is always in a solid state.

In this embodiment, the end of the throat pipe 2 facing away from the nozzle 1 is also provided with structures such as a conversion head 11 and a quick plug-in. For these structures, reference may be made to related structures in the prior art. A Teflon tube 12 can also be embedded in the throat pipe 2 for heat insulation and lubrication.

The 3D printing nozzle provided by the embodiment of the utility model makes full use of the characteristics of the temperature difference between the two ends of the semiconductor refrigeration element when it is working, and meets the dual requirements of heating the melt material of the 3D printing nozzle and cooling the throat. One device simultaneously realizes the heating effect and the heat dissipation effect. Good balance between structural design and technical effect, at the same time, there is no noise when in use, and again, the semiconductor refrigeration unit mainly utilizes its heating characteristics in the utility model, and secondly utilizes its cooling characteristics rationally.

During the working process of the semiconductor refrigeration unit 5, in addition to absorbing heat from the cold end and transferring it to the hot end, it also has heat generated by its own resistance characteristics, so it has the characteristics of high heating power at the hot end and low cooling power at the cold end. Perfectly fit the needs of 3D printing nozzles, 3D printing nozzles need more power to heat to melt the material, but only need relatively less power to absorb heat from the throat 2 to prevent the material from melting in the throat 2 in advance; at the same time, Since the semiconductor cooling element 5 has a cooling function, it can cool the throat below the room temperature, and the effect is better than that of a fan for heat dissipation.

In this embodiment, further, the first heat conduction element 3, the semiconductor cooling element 5 and the second heat conduction element 4 are sequentially contacted, that is, the end of the first heat conduction element 3 is attached to the hot end of the semiconductor cooling element 5, and the semiconductor cooling element 5 The cold end of the cooling element 5 is attached to the second heat conducting element 4 , such an arrangement makes the structure more compact on the one hand, and on the other hand makes the heat transfer effect better. Preferably, the first heat conduction element 3 , the semiconductor cooling element 5 and the second heat conduction element 4 are all cylindrical structures, such as cylindrical structures, and the axial ends of each cylindrical structure are in contact with each other. Each cylindrical structure is provided with through holes along the central axis, and the nozzle 1 and the throat pipe 2 are fixed in these through holes, so that the overall structural arrangement is more reasonable.

In this embodiment, further, a liquid metal gasket 6 is provided between the first heat conduction element 3 and the semiconductor refrigeration element 5, and between the second heat conduction element 4 and the semiconductor refrigeration element 5, and the first heat conduction element 3 A liquid metal gasket 6 is sandwiched between the end and the end of the semiconductor cooling element 5, and the end of the second heat conducting element 4 and the end of the semiconductor cooling element 5. The thermal conductivity of the liquid metal gasket 6 is relatively high. The gasket ensures that the semiconductive cooling element 5 can efficiently exchange heat with the corresponding structure.

In this embodiment, further, the end of the first heat conduction element 3 and/or the second heat conduction element 4 is provided with a limiting structure 7, and the semiconductor cooling element 5 is embedded in the limiting structure 7, and the limiting structure 7 is used for positioning And fix the semiconductive cooling element 5, such as the end of the first heat conduction element 3 is provided with a groove as a limiting structure 7, the end of the semiconductive cooling element 5 is snapped into the groove to realize positioning and fixing, so that both connection is more stable. Furthermore, the outer wall of the first heat-conducting member 3 is provided with an insulating member 9, and the insulating member 9 is used to keep the first heat-conducting member 3 insulated to prevent its heat from overflowing and ensure that most of the heat is used to heat the nozzle 1. Further, The thermal insulation element 9 is overlaid on the first heat conduction element 3, and the end of the thermal insulation element 9 is provided with a first radial extension towards the central axis of the first heat conduction element 3, while the end of the semiconductor refrigeration element 5 is provided with a The second radial extension of the axis, after the second radial extension is embedded in the groove at the end of the first heat conduction element 3, the second radial extension is attached to the first radial extension, that is, the heat preservation element 9 Wrapping the first heat conduction element 3 and the end of the semiconductor cooling element 5, on the one hand realizes the stable connection of the three, and on the other hand ensures the stability and high efficiency of heat transfer.

In this embodiment, the limiting structure 7 and the heat preservation structure are also applicable to the second heat conducting element 4 .

In this embodiment, further, it also includes a heat insulation cylinder 8, which is embedded in the semi-conductor cooling element 5, and the heat insulation cylinder 8 is overlaid on the connection between the nozzle 1 and the throat pipe 2, and the heat insulation cylinder 8 is used for Prevent the semi-conductor cooling element 5 from directly contacting the nozzle 1 and the throat pipe 2 .

In this embodiment, further, the semiconductive refrigeration unit 5 includes a plurality of semiconductive refrigeration sheets that are attached to each other, and the adjacent semiconductive refrigeration sheets are attached with a hot end and a cold end, preferably, the attached ends It can form an integrated structure. For example, a certain ceramic chip is the hot end of a semiconductor cooling chip, and at the same time, it is the cold end of another semiconductor cooling chip. The series stacking of multiple semiconductor cooling chips is beneficial to improve the heating and cooling effects. For example, the actual temperature difference between the hot end and the cold end of a single semiconductor refrigeration chip is 50-60 degrees, and two can reach nearly 100 degrees, and so on.

In this embodiment, further, it also includes a temperature sensor 10, the detection part of the temperature sensor 10 is embedded in the first heat conduction member 3, and the temperature sensor 10 is used to detect the temperature of the first heat conduction member 3, so that the nozzle 1 is always at an efficient within the temperature range.

The embodiment of the utility model also provides a 3D printing device, which includes a body and a nozzle arranged on the body, and the nozzle is the above-mentioned 3D printing nozzle. When a single 3D printing device has multiple 3D printing nozzles, it can be part of them, such as one is the 3D printing nozzle provided by the embodiment of the present invention, or all of the nozzles can be the 3D printing nozzle provided by the embodiment of the present invention. print nozzle. 3D printing equipment can be all kinds of 3D printers, such as printers made of plastic or metal, or 3D printers in various fields, such as jewelry, industrial design, engineering construction, automobiles, aerospace, medical industry, and education, etc. 3D printers in the field.

In the above technical solution, since the above-mentioned 3D printing head has the above-mentioned technical effect, the 3D printing equipment including the 3D printing head should also have the corresponding technical effect.

Some exemplary embodiments of the present utility model have been described above only by way of illustration. Needless to say, those skilled in the art can use various Modifications are made to the described embodiments. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present utility model.

Claims (10)

1. it is connected with the first heat-conducting piece, the larynx on a kind of 3D printing shower nozzle, including the nozzle and trunnion being connected, the nozzle The second heat-conducting piece is connected with pipe, it is characterised in that also including semiconductor refrigerating part, the hot junction of the semiconductor refrigerating part and institute The connection of the first heat-conducting piece is stated, the cold end of the semiconductor refrigerating part is connected with second heat-conducting piece.

2. 3D printing shower nozzle according to claim 1, it is characterised in that first heat-conducting piece, semiconductor refrigerating part with And second heat-conducting piece abut successively.

3. 3D printing shower nozzle according to claim 2, it is characterised in that first heat-conducting piece and the semiconductor refrigerating Liquid metals pad is provided between part, and between second heat-conducting piece and the semiconductor refrigerating part.

4. 3D printing shower nozzle according to claim 3, it is characterised in that first heat-conducting piece, semiconductor refrigerating part with And second heat-conducting piece be tubular structure, each tubular structure is mutually abutted with end.

5. 3D printing shower nozzle according to claim 4, it is characterised in that first heat-conducting piece and/or described second lead The end of warmware is provided with position limiting structure, and the semiconductor refrigerating part is embedded on the position limiting structure.

6. 3D printing shower nozzle according to claim 2, it is characterised in that also including heat insulation cylinder, the heat insulation cylinder is embedded in In the semiconductor refrigerating part, the heat insulation cylinder is coated at the connectivity part of the nozzle and trunnion.

7. 3D printing shower nozzle according to claim 1, it is characterised in that be provided with guarantor on the outer wall of first heat-conducting piece Warm part.

8. 3D printing shower nozzle according to claim 1, it is characterised in that the semiconductor refrigerating part includes multiple mutual patches The semiconductor chilling plate of conjunction, two semiconductor chilling plates of arbitrary neighborhood are fitted with hot junction and cold end.

9. 3D printing shower nozzle according to claim 1, it is characterised in that also including temperature sensor, the TEMP The detection part of device is embedded in first heat-conducting piece.

10. a kind of 3D printing equipment, including body and the shower nozzle that is arranged on the body, it is characterised in that the shower nozzle is 3D printing shower nozzle described in claim any one of 1-9.