CN206394028U - 3D printing shower nozzle and 3D printing equipment - Google Patents
3D printing shower nozzle and 3D printing equipment Download PDFInfo
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- CN206394028U CN206394028U CN201720056359.XU CN201720056359U CN206394028U CN 206394028 U CN206394028 U CN 206394028U CN 201720056359 U CN201720056359 U CN 201720056359U CN 206394028 U CN206394028 U CN 206394028U
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- heat
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- shower nozzle
- semiconductor refrigerating
- printing
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Abstract
The utility model discloses a kind of 3D printing shower nozzle and 3D printing equipment, the 3D printing shower nozzle includes the nozzle and trunnion being connected, the first heat-conducting piece is connected with the nozzle, the second heat-conducting piece is connected with the trunnion, also include semiconductor refrigerating part, the hot junction of the semiconductor refrigerating part is connected with first heat-conducting piece, and the cold end of the semiconductor refrigerating part is connected with second heat-conducting piece.3D printing shower nozzle and 3D printing equipment that the utility model is provided, two ends produce the characteristic of the temperature difference when making full use of the work of semiconductor refrigerating part, meet the dual requirementses of 3D printing shower nozzle heating melt and trunnion radiating, one device realizes heating effect and radiating effect simultaneously, well balanced in structure design and technique effect；Meanwhile, there is no noise when using；Again, the heating power of semiconductor refrigerating part rationally make use of to be more than the characteristic of refrigeration work consumption, the perfection for realizing the characteristic and the demand of 3D printing shower nozzle of the element agrees with.
Description
Technical field
The utility model is related to printing technique, and in particular to a kind of 3D printing shower nozzle and 3D printing equipment.
Background technology
Since 1980s, the characteristics of 3D printing technique is because of its high efficiency, low cost obtains more and more extensive
Ground application, in the prior art, according to the difference of its forming method, 3D printing technique can be divided into stereolithography
(Stcmolithography, SLA), laminated solid mass manufacture (Laminated Object Manufacturing, LOM), selection
Laser sintered (the Selective Laster of property
Sintering, SLS), Fused Deposition Modeling (Fused Deposition Modeling, FDM) etc. it is different
Classification, wherein, the most essential difference of FDM rapid prototyping systems and other systems is not use laser system, therefore cost
It is minimum, it is also a kind of 3D printing technique being most widely used at present.
Specifically, FDM techniques are that the low melting point filamentary material (such as PLA or ABS) of solid-state is heated into semi-molten state,
Then extruded to carry out printing processing.In the prior art, 3D printing shower nozzle includes nozzle, heat block, the trunnion being connected,
Heater is provided with heat block, silk enters nozzle from trunnion, by heating devices heat into semi-molten state at nozzle
After extrude.In use, the heat of heater has inevitably passed to the silk in trunnion to said mechanism, easily
The silk softening that heated up in trunnion is resulted in blockage, in order to solve the problem, heat abstractor be set on trunnion in the prior art,
The temperature of trunnion and its internal silk is reduced by heat abstractor, it is ensured that enter silk before nozzle and be constantly in solid state, from
And ensure the unobstructed of charging.Heat abstractor of the prior art is mostly fan and radiating block, and dissipating for trunnion is realized by fan
Heat.
It is in place of the deficiencies in the prior art, one is, it is necessary to which arrangement adds simultaneously in narrow space on nozzle and trunnion
Thermal and heat abstractor, arrangement difficulty are larger, so as to be difficult on technique effect and structure design reach preferable equilibrium-like
State, the reliability that works long hours is not good；Second, fan is room temperature to the trunnion radiating limit, this causes silk enters from trunnion to spray
The condition of high temperature is in before mouth, it prevents that the ability of putty is relatively weak.Third, fan rotation have certain noise and
Vibrations, and increase shower nozzle weight, it is unfavorable for high accuracy and flying print；Cooperated fourth, relying on multi-part, any component goes out
Existing failure, can cause printing to fail, system reliability is not good enough.
Utility model content
The purpose of this utility model is to provide a kind of 3D printing shower nozzle and 3D printing equipment, to solve on of the prior art
State weak point.
To achieve these goals, the utility model provides following technical scheme：
The first heat-conducting piece is connected with a kind of 3D printing shower nozzle, including the nozzle and trunnion being connected, the nozzle, it is described
The second heat-conducting piece, in addition to semiconductor refrigerating part are connected with trunnion, the hot junction of the semiconductor refrigerating part is led with described first
Warmware is connected, and the cold end of the semiconductor refrigerating part is connected with second heat-conducting piece.
Above-mentioned 3D printing shower nozzle, first heat-conducting piece, semiconductor refrigerating part and the second heat-conducting piece are abutted successively.
Above-mentioned 3D printing shower nozzle, between first heat-conducting piece and the semiconductor refrigerating part, and described second leads
Liquid metals pad is provided between warmware and the semiconductor refrigerating part.
Above-mentioned 3D printing shower nozzle, first heat-conducting piece, semiconductor refrigerating part and the second heat-conducting piece are tubular knot
Structure, each tubular structure is mutually abutted with end.
The end of above-mentioned 3D printing shower nozzle, first heat-conducting piece and/or second heat-conducting piece sets limited location knot
Structure, the semiconductor refrigerating part is embedded on the position limiting structure.
Above-mentioned 3D printing shower nozzle, in addition to heat insulation cylinder, the heat insulation cylinder are embedded in the semiconductor refrigerating part, described
Heat insulation cylinder is coated at the connectivity part of the nozzle and trunnion.
Heat preservation member is provided with above-mentioned 3D printing shower nozzle, the outer wall of first heat-conducting piece.
Above-mentioned 3D printing shower nozzle, the semiconductor refrigerating part includes multiple semiconductor chilling plates bonded to each other, arbitrarily
Two adjacent semiconductor chilling plates are fitted with hot junction and cold end.
Above-mentioned 3D printing shower nozzle, in addition to temperature sensor, the detection part of the temperature sensor are embedded in described
In one heat-conducting piece.
A kind of 3D printing equipment, including body and the shower nozzle being arranged on the body, the shower nozzle is that above-mentioned 3D is beaten
Print shower nozzle.
In the above-mentioned technical solutions, the 3D printing shower nozzle that the utility model is provided, makes full use of semiconductor refrigerating part to work
When two ends produce the temperature difference characteristic, meet 3D printing shower nozzle heating melt and trunnion radiating dual requirementses, a device is simultaneously
Realize that heating effect and radiating effect are well balanced in structure design and technique effect, meanwhile, there is no noise when using, then
It is secondary, it rationally make use of the heating power of semiconductor refrigerating part to be more than the characteristic of refrigeration work consumption, realize the characteristic and 3D of the element
The perfection of the demand of printing head agrees with；Finally, an element realizes heating and heat sinking function, and reliability is higher, it is to avoid
The additional faults that multicomponent work is brought.
Because above-mentioned 3D printing shower nozzle has above-mentioned technique effect, the 3D printing equipment comprising the 3D printing shower nozzle should also have
There is corresponding technique effect.
Brief description of the drawings
, below will be to institute in embodiment in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only described in the utility model
Some embodiments, for those of ordinary skill in the art, other accompanying drawings can also be obtained according to these accompanying drawings.
The structural representation for the 3D printing shower nozzle that Fig. 1 provides for the utility model embodiment；
The sectional view for the 3D printing shower nozzle that Fig. 2 provides for the utility model embodiment；
The decomposing schematic representation for the 3D printing shower nozzle that Fig. 3 provides for the utility model embodiment.
Description of reference numerals：
1st, nozzle；2nd, trunnion；3rd, the first heat-conducting piece；4th, the second heat-conducting piece；5th, semiconductor refrigerating part；6th, liquid metals pad
Piece；7th, position limiting structure；8th, heat insulation cylinder；9th, heat preservation member；10th, temperature sensor；11st, adapter；12nd, teflon pipe.
Embodiment
In order that those skilled in the art more fully understands the technical solution of the utility model, below in conjunction with accompanying drawing pair
The utility model is further detailed.
As Figure 1-3, a kind of 3D printing shower nozzle 1 that the utility model embodiment is provided, including the He of nozzle 1 being connected
It is connected with trunnion 2, nozzle 1 on first heat-conducting piece 3, trunnion 2 and is connected with the second heat-conducting piece 4, in addition to semiconductor refrigerating part 5,
The hot junction of semiconductor refrigerating part 5 is connected with the first heat-conducting piece 3, and the cold end of semiconductor refrigerating part 5 is connected with the second heat-conducting piece 4.
Specifically, trunnion 2 is used to supply silk to nozzle 1, silk is heated into molten condition with defeated in nozzle 1 by solid
Go out printing, the first heat-conducting piece 3 is connected on nozzle 1, its effect connected is to provide heat for nozzle 1, and the second heat-conducting piece 4 connects
It is connected on trunnion 2, its effect connected is used to take away the heat of trunnion 2, the first heat-conducting piece 3 and the second heat-conducting piece 4 itself are simultaneously
Heat or manufacture low temperature are not produced, and the wherein hot junction of semiconductor refrigerating part 5 transmits heat to nozzle by the first heat-conducting piece 3, real
Existing silk melting, trunnion 2 transmits heat to the cold end of semiconductor refrigerating part 5 by the second heat-conducting piece 4, realizes that trunnion cools, the
Two heat-conducting pieces 4 are only the media for transmitting heat, although therefore both effects are different, can be identical material completely in theory
The cylinder of matter and structure, such as aluminum.Semiconductor refrigerating part 5 is also thermoelectric module, and it is imitated using the Peltier of semi-conducting material
Should, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the two ends of galvanic couple
With releasing heat, the purpose for heating and freezing can be realized simultaneously with this, semiconductor refrigerating is prior art, and the present embodiment is no longer
Repeat its specific internal structure and operation principle.In the present embodiment, the hot junction of semiconductor refrigerating part 5 is connected with the first heat-conducting piece 3,
To transmit heat to nozzle 1 by the first heat-conducting piece 3, the cold end of semiconductor refrigerating part 5 is connected with the second heat-conducting piece 4, to pass through
Second heat-conducting piece 4 absorbs heat from trunnion 2, to avoid the silk that the partial heat is heated in trunnion 2 from its heating is softened and is led
Cause to block, in the present embodiment, the part such as semiconductor refrigerating part 5, the first heat-conducting piece 3, the second heat-conducting piece 4, nozzle 1 and trunnion 2
The implication and effect being connected are exactly to carry out heat transfer, no matter its concrete structure, such as the first heat-conducting piece 3 can be cuboid,
Square, cylindric or other polymorphic structures, it can only can also be fitted part with fully wrapped around nozzle 1 with nozzle 1, its
It can directly be fitted with nozzle 1, to nozzle 1 can also transmit heat by other conductive structures, it is only necessary to ensure that it can be by
Enough heat transfers are able to thawing to nozzle 1 with the silk for causing it internal, uniquely what was certain was that its material is
The material of excellent thermal conductivity, the second heat-conducting piece 4 and other parts are same, it is only necessary to which ensure semiconductor refrigerating part 5 can be sufficient
That measures absorbs heat from target structure.
The 3D printing shower nozzle 1 that the present embodiment is provided, the hot junction of semiconductor refrigerating part 5 produces high temperature, and passes through the first heat conduction
High temperature is passed to nozzle 1 by part 3, make it that the silk in nozzle 1 is melted, and the cold end of semiconductor refrigerating part 5 produces low temperature,
And absorbing heat from trunnion 2 by the second heat-conducting piece 4 makes it cool, to cause the silk in trunnion 2 to be in solid state all the time.
In the present embodiment, conversion head 11, soon slotting etc. structure can be also provided with away from one end of nozzle 1 on trunnion 2, these
Structure refers to dependency structure of the prior art.Teflon pipe 12 can be also embedded in trunnion 2 to be thermally shielded and lubricate.
The 3D printing shower nozzle that the utility model embodiment is provided, two ends produce temperature when making full use of the work of semiconductor refrigerating part
The characteristic of difference, meets the dual requirementses of 3D printing shower nozzle heating melt and trunnion radiating, and a device realizes heating effect simultaneously
It is well balanced in structure design and technique effect with radiating effect, meanwhile, there is no noise, again, semiconductor system when using
Cold part mainly uses its heat generation characteristic in the utility model, secondly rationally utilizes its refrigeration characteristic.
Semiconductor refrigerating part 5 is in its course of work, in addition to heat transfer is absorbed to hot junction from cold end, also self-resistance
The heating that characteristic is brought, so big with hot junction heating power, the small characteristic of cold end refrigeration work consumption, this characteristic is perfectly agreed with
The demand of 3D printing shower nozzle, 3D printing shower nozzle needs more power to be heated to melt material, and only needs relatively small number of
Power absorbs heat from trunnion 2 prevents material from being melted in advance in trunnion 2；Simultaneously as semiconductor refrigerating part 5 possesses refrigeration work(
Can, compared to fan cooling, trunnion can be cooled to below room temperature by it, and effect is more preferable.
In the present embodiment, further, the first heat-conducting piece 3, the heat-conducting piece 4 of semiconductor refrigerating part 5 and second are abutted successively,
That is the end and the hot junction of semiconductor refrigerating part 5 of the first heat-conducting piece 3 fit, the cold end of semiconductor refrigerating part 5 and the second heat conduction
Part 4 fits, and is arranged so as on the one hand so that more compact in structure, another aspect also make it that heat transfer effect is preferable.It is preferred that
, the first heat-conducting piece 3, the heat-conducting piece 4 of semiconductor refrigerating part 5 and second are tubular structure, such as cylindrical structure, each cylindrical structure
Mutually abutted with the end of axial direction.Through hole is offered along central axis on each tubular structure, nozzle 1 and trunnion 2 are fixed on this
In a little through holes so that overall structure arrangement is relatively reasonable.
In the present embodiment, further, between the first heat-conducting piece 3 and semiconductor refrigerating part 5, and the second heat-conducting piece 4
Liquid metals pad 6, the end of the first heat-conducting piece 3 and the end of semiconductor refrigerating part 5 are provided between semiconductor refrigerating part 5
Liquid metals pad 6, liquid metals are accompanied between the end of the end and semiconductor refrigerating part 5 of portion and the second heat-conducting piece 4
The thermal conductivity factor of pad 6 is higher, ensures that semiconductor refrigerating part 5 efficiently can carry out heat friendship with corresponding structure by pad
Change.
In the present embodiment, further, the end of the first heat-conducting piece 3 and/or the second heat-conducting piece 4 is provided with position limiting structure
7, semiconductor refrigerating part 5 is embedded on position limiting structure 7, and position limiting structure 7 is used to positioning and fixing semiconductor refrigerating part 5, such as first leads
The end of warmware 3 sets fluted as position limiting structure 7, and the end of semiconductor refrigerating part 5 is caught in spacing to realize in the groove
And fixation, so that both connections are more firm.Further, it is provided with heat preservation member on the outer wall of the first heat-conducting piece 3
9, heat preservation member 9 is used to be incubated for the first heat-conducting piece 3, prevents that its heat is excessive, it is ensured that most of heat is used for heated nozzle 1, then
Further, heat preservation member 9 is coated on the first heat-conducting piece 3, and the end of heat preservation member 9 is provided with first heat-conducting piece 3 of direction
First radial extension of heart axis, and the second radial direction that the end of semiconductor refrigerating part 5 is provided with away from its center axis is prolonged
Extending portion, after the second radial extension is embedded in the groove of the end of the first heat-conducting piece 3, the second radial extension fits in first radially
On extension, i.e., heat preservation member 9 wraps up the end on the first heat-conducting piece 3 with semiconductor refrigerating part 5, on the one hand realizes
The firm connection of three, on the other hand ensure heat transfer stabilization and efficiently.
In the present embodiment, position limiting structure 7, insulation construction are equally applicable for the second heat-conducting piece 4.
In the present embodiment, further, in addition to heat insulation cylinder 8, heat insulation cylinder 8 is embedded in semiconductor refrigerating part 5, heat insulation cylinder
8 are coated at the connectivity part of nozzle 1 and trunnion 2, and heat insulation cylinder 8 is used to prevent semiconductor refrigerating part 5 from directly connecing with nozzle 1 and trunnion 2
Touch.
In the present embodiment, further, semiconductor refrigerating part 5 includes a multiple semiconductor chilling plate bonded to each other,
Adjacent semiconductor chilling plate is fitted with hot junction and cold end, it is preferred that the end fitted can form integral structure, such as
Some potsherd is the hot junction of a semiconductor chilling plate, meanwhile, it is the cold end of another semiconductor chilling plate, Duo Geban again
Conductor cooling piece overlapped in series is conducive to lifting to heat and refrigeration, and such as hot junction of single semiconductor chilling plate and cold end are actual
The temperature difference is 50-60 degree, and two then can reach nearly 100 degree, thereafter by that analogy.
In the present embodiment, further, in addition to temperature sensor 10, the detection part of temperature sensor 10 is embedded in first
In heat-conducting piece 3, temperature sensor 10 is used for the temperature for detecting the first heat-conducting piece 3 so that nozzle 1 is in efficient humidity province all the time
In.
The utility model embodiment also provides a kind of 3D printing equipment, including body and the shower nozzle being arranged on body, spray
Head is above-mentioned 3D printing shower nozzle.Can be which part when single 3D printing equipment has multiple 3D printing shower nozzle shower nozzles,
As one be 3D printing shower nozzle that the utility model embodiment is provided, can also its whole shower nozzle be all that the utility model is implemented
The 3D printing shower nozzle that example is provided.3D printing equipment can be all kinds of 3D printers, as using plastics or metal as raw material
The 3D printer of printer or every field, such as jewelry, industrial design, engineering construction, automobile, Aero-Space, medical treatment
The 3D printer in the field such as industry and education.
In the above-mentioned technical solutions, because above-mentioned 3D printing shower nozzle has above-mentioned technique effect, the 3D printing shower nozzle is included
3D printing equipment should also have corresponding technique effect.
Some one exemplary embodiments of the present utility model are only described by way of explanation above, undoubtedly, for
One of ordinary skill in the art, can be with a variety of in the case of without departing from spirit and scope of the present utility model
Mode is modified to described embodiment.Therefore, above-mentioned accompanying drawing and description are inherently illustrative, should not be construed as
Limitation to the utility model claims.
Claims (10)
1. it is connected with the first heat-conducting piece, the larynx on a kind of 3D printing shower nozzle, including the nozzle and trunnion being connected, the nozzle
The second heat-conducting piece is connected with pipe, it is characterised in that also including semiconductor refrigerating part, the hot junction of the semiconductor refrigerating part and institute
The connection of the first heat-conducting piece is stated, the cold end of the semiconductor refrigerating part is connected with second heat-conducting piece.
2. 3D printing shower nozzle according to claim 1, it is characterised in that first heat-conducting piece, semiconductor refrigerating part with
And second heat-conducting piece abut successively.
3. 3D printing shower nozzle according to claim 2, it is characterised in that first heat-conducting piece and the semiconductor refrigerating
Liquid metals pad is provided between part, and between second heat-conducting piece and the semiconductor refrigerating part.
4. 3D printing shower nozzle according to claim 3, it is characterised in that first heat-conducting piece, semiconductor refrigerating part with
And second heat-conducting piece be tubular structure, each tubular structure is mutually abutted with end.
5. 3D printing shower nozzle according to claim 4, it is characterised in that first heat-conducting piece and/or described second lead
The end of warmware is provided with position limiting structure, and the semiconductor refrigerating part is embedded on the position limiting structure.
6. 3D printing shower nozzle according to claim 2, it is characterised in that also including heat insulation cylinder, the heat insulation cylinder is embedded in
In the semiconductor refrigerating part, the heat insulation cylinder is coated at the connectivity part of the nozzle and trunnion.
7. 3D printing shower nozzle according to claim 1, it is characterised in that be provided with guarantor on the outer wall of first heat-conducting piece
Warm part.
8. 3D printing shower nozzle according to claim 1, it is characterised in that the semiconductor refrigerating part includes multiple mutual patches
The semiconductor chilling plate of conjunction, two semiconductor chilling plates of arbitrary neighborhood are fitted with hot junction and cold end.
9. 3D printing shower nozzle according to claim 1, it is characterised in that also including temperature sensor, the TEMP
The detection part of device is embedded in first heat-conducting piece.
10. a kind of 3D printing equipment, including body and the shower nozzle that is arranged on the body, it is characterised in that the shower nozzle is
3D printing shower nozzle described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720056359.XU CN206394028U (en) | 2017-01-17 | 2017-01-17 | 3D printing shower nozzle and 3D printing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720056359.XU CN206394028U (en) | 2017-01-17 | 2017-01-17 | 3D printing shower nozzle and 3D printing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206394028U true CN206394028U (en) | 2017-08-11 |
Family
ID=59519192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720056359.XU Active CN206394028U (en) | 2017-01-17 | 2017-01-17 | 3D printing shower nozzle and 3D printing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206394028U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106696270A (en) * | 2017-01-17 | 2017-05-24 | 河南行星智能电子科技有限公司 | 3D printing nozzle and 3D printing equipment |
| CN108327269A (en) * | 2018-01-25 | 2018-07-27 | 广州迈普再生医学科技有限公司 | A kind of semiconductor temperature biology 3D printing nozzle |
| CN110027214A (en) * | 2019-05-24 | 2019-07-19 | 杭州捷诺飞生物科技股份有限公司 | 3D printing spray head |
-
2017
- 2017-01-17 CN CN201720056359.XU patent/CN206394028U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106696270A (en) * | 2017-01-17 | 2017-05-24 | 河南行星智能电子科技有限公司 | 3D printing nozzle and 3D printing equipment |
| CN108327269A (en) * | 2018-01-25 | 2018-07-27 | 广州迈普再生医学科技有限公司 | A kind of semiconductor temperature biology 3D printing nozzle |
| CN110027214A (en) * | 2019-05-24 | 2019-07-19 | 杭州捷诺飞生物科技股份有限公司 | 3D printing spray head |
| CN110027214B (en) * | 2019-05-24 | 2024-04-30 | 杭州捷诺飞生物科技股份有限公司 | 3D prints shower nozzle |
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