CN206331310U - The structure of controlling temperature and monitoring device of a kind of monitoring device - Google Patents
The structure of controlling temperature and monitoring device of a kind of monitoring device Download PDFInfo
- Publication number
- CN206331310U CN206331310U CN201621380603.XU CN201621380603U CN206331310U CN 206331310 U CN206331310 U CN 206331310U CN 201621380603 U CN201621380603 U CN 201621380603U CN 206331310 U CN206331310 U CN 206331310U
- Authority
- CN
- China
- Prior art keywords
- monitoring device
- semiconductor cooler
- temperature
- controlling temperature
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Studio Devices (AREA)
Abstract
The utility model provides the structure of controlling temperature and monitoring device, the radiating effect to improve monitoring device of a kind of monitoring device, is easy to imaging sensor to work at a suitable temperature.A kind of structure of controlling temperature of monitoring device, monitoring device includes housing, is arranged on the imaging sensor in housing, the structure of controlling temperature of monitoring device includes：Power supply unit in housing；The semiconductor cooler electrically connected in housing and with power supply unit, the first junction of semiconductor cooler is connected with imaging sensor heat conduction, and the second junction of semiconductor cooler is connected with housing heat conduction.The structure of controlling temperature for the monitoring device that the utility model is provided, by setting semiconductor cooler and directly being set to semiconductor cooler to be connected with imaging sensor heat conduction, it can freeze or heat directly to imaging sensor by semiconductor cooler, be easy to imaging sensor to work at a suitable temperature.
Description
Technical field
The utility model is related to monitoring device technical field, more particularly to a kind of structure of controlling temperature of monitoring device and monitoring are set
It is standby.
Background technology
Imaging sensor is the core component of monitoring device, is worked under higher or lower environment, is unfavorable for image
The normal display of sensor, for example：If imaging sensor can not effectively radiate in the case of a high temperature picture quality can be caused serious
Decline and even damage, therefore, preferable image property is shown in order to meet monitoring device, imaging sensor need to be ensured in reasonable work
Make temperature range.
Utility model content
The utility model provides the structure of controlling temperature and monitoring device of a kind of monitoring device, to improve dissipating for monitoring device
Thermal effect, is easy to imaging sensor to work at a suitable temperature.
To reach above-mentioned purpose, the utility model provides following technical scheme：
The utility model provides a kind of structure of controlling temperature of monitoring device, and the monitoring device includes housing, is arranged on institute
The imaging sensor in housing is stated, the structure of controlling temperature of the monitoring device includes：
Power supply unit in the housing；
The semiconductor cooler electrically connected in the housing and with said supply unit, the semiconductor cooler
The first junction be connected with described image sensor heat conduction, the second junction and the housing of the semiconductor cooler are led
It is thermally coupled.
The structure of controlling temperature for the monitoring device that the utility model is provided, by setting semiconductor cooler and directly partly leading
Chiller is set to be connected with imaging sensor heat conduction, can by semiconductor cooler directly to imaging sensor freeze or
Heating, is easy to imaging sensor to work at a suitable temperature.
In some optional embodiments, above-mentioned structure of controlling temperature also includes：
The conductive structure part in described image sensor is arranged at, the first junction of the semiconductor cooler passes through institute
Conductive structure part is stated to be connected with described image sensor heat conduction.The setting of conductive structure part is easy to semiconductor cooler and image to pass
Heat is preferably transmitted between sensor.
In some optional embodiments, the first junction of the semiconductor cooler and the conductive structure part it
Between provided with heat-conducting interface material layer.Heat Conduction Material is a kind of material for being commonly used to chip package and electronic radiation, is mainly used in
The microvoid produced during two kinds of materials and scraggly surface are filled up, reduces thermal resistance, the heat dispersion of device is improved.
In some optional embodiments, the housing includes：Fore shell, rear shell and the fore shell is arranged at towards institute
State rear shell one end and the rear shell towards the thermal insulation layer between described fore shell one end.The setting of thermal insulation layer is reduced between housing
Heat transfer.
In some optional embodiments, provided with the first boss for supporting the semiconductor cooler in the rear shell,
Provided with heat-conducting interface material layer between the second junction and the first boss of the semiconductor cooler.
The second boss coordinated with the first boss, institute are provided with some optional embodiments, in the fore shell
The one end for stating conductive structure part extends to the second boss and is fixedly connected with the second boss.
In some optional embodiments, above-mentioned structure of controlling temperature also includes：
Temperature sensor for detecting described image sensor temperature；
The controller being connected with the temperature sensor and said supply unit signal, the controller is according to the sensing
The sense of current for the temperature control said supply unit output that device is detected.
In some optional embodiments, said supply unit includes：Power supply and it is connected with the output end of the power supply
Current steering device.
The utility model additionally provides a kind of monitoring device, includes the temperature control knot of the monitoring device described in any of the above-described
Structure.Because above-mentioned structure of controlling temperature can improve the radiating effect of monitoring device, it is easy to imaging sensor work at a suitable temperature
Make, therefore the monitoring device that the utility model is provided, with preferable performance.
In some optional embodiments, the monitoring device is gun shaped video camera or cylinder type video camera.
Brief description of the drawings
The planar structure schematic diagram for the monitoring device that Fig. 1 provides for the utility model；
The three-dimensional cutaway view for the monitoring device that Fig. 2 provides for the utility model；
The dimensional structure diagram for the monitoring device that Fig. 3 provides for the utility model.
Reference：
1- housing 11- fore shells
Shell 2- imaging sensors after 12-
3- semiconductor cooler 4- conductive structure parts
5- heat-conducting interface materials layer 6- thermal insulation layers
7- temperature sensors
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with accompanying drawing to this practicality
It is new to be described in further detail, it is clear that described embodiment is only a part of embodiment of the utility model, rather than
Whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work
Under the premise of all other embodiment for being obtained, belong to the scope of the utility model protection.
As shown in Figure 1, Figure 2 and Figure 3, wherein：The planar structure signal for the monitoring device that Fig. 1 provides for the utility model
Figure；The three-dimensional cutaway view for the monitoring device that Fig. 2 provides for the utility model；The monitoring device that Fig. 3 provides for the utility model
Dimensional structure diagram.
The utility model provides a kind of structure of controlling temperature of monitoring device, and monitoring device includes housing 1, is arranged on housing 1
Interior imaging sensor 2, the structure of controlling temperature of monitoring device includes：
Power supply unit in housing 1；
The semiconductor cooler 3 electrically connected in housing 1 and with power supply unit, the first contact of semiconductor cooler 3
Place is connected with the heat conduction of imaging sensor 2, and the second junction of semiconductor cooler 3 is connected with the heat conduction of housing 1.
The structure of controlling temperature for the monitoring device that the utility model is provided, by setting semiconductor cooler 3 and directly by half
Conductor refrigerator 3 is set to be connected with the heat conduction of imaging sensor 2, can be by semiconductor cooler 3 directly to imaging sensor 2
Refrigeration is heated, and is easy to imaging sensor 2 to work at a suitable temperature.
Above-mentioned heat conduction connection, to refer to leading and can transmit heat each other between hot linked two parts, can two
Individual part is directly contacted, or mediate contact heat conduction.
Semiconductor cooler 3 is also referred to as peltier cooler, is a kind of based on semi-conducting material, may be used as small
The electronic component of type heat pump.By loading a relatively low DC voltage at the two ends of semiconductor cooler 3, heat will be from member
One end of part flows to the other end.Now, one end temperature of semiconductor cooler 3 will be reduced, and the temperature of the other end will be same
Shi Shangsheng.As long as it is worth noting that, changing the sense of current, it is possible to change the direction of hot-fluid, heat is transported into the other end.
So, it can just realize two kinds of functions of refrigeration and heating simultaneously on a semiconductor cooler 3.I.e. sometimes can be with the first contact
Place is that refrigeration end, the second junction are fire end, sometimes can be using the first junction as fire end, and the second junction is refrigeration end.
Further, above-mentioned structure of controlling temperature also includes：
The conductive structure part 4 on imaging sensor 2 is arranged at, the first junction of semiconductor cooler 3 passes through heat conduction knot
Component 4 is connected with the heat conduction of imaging sensor 2.The setting of conductive structure part 4 be easy to semiconductor cooler 3 and imaging sensor 2 it
Between preferably transmission heat.The specific material and shape of above-mentioned conductive structure part 4 are not limited, in order that it is more preferable to obtain conductive structure part 4
Be brought into close contact with imaging sensor 2, the shape of above-mentioned conductive structure part 4 and the upper surface of image acquisition units match.
For further heat conduction efficiency, it is provided between the first junction and conductive structure part 4 of semiconductor cooler 3
Heat-conducting interface material layer 5.Heat Conduction Material is a kind of material for being commonly used to chip package and electronic radiation, is mainly used in filling up two
The microvoid produced during material and scraggly surface are planted, reduces thermal resistance, the heat dispersion of device is improved.
The concrete shape of above-mentioned housing 1 can have a variety of, optionally, as shown in figure 3, housing 1 includes：Fore shell 11, rear shell
12 and fore shell 11 is arranged at towards one end of rear shell 12 and rear shell 12 towards the thermal insulation layer 6 between the one end of fore shell 11.Thermal insulation layer 6
Setting reduce housing 1 between heat transfer.
For the ease of fixed semiconductor cooler 3, the first boss of support semiconductor cooler 3, half are provided with rear shell 12
Provided with heat-conducting interface material layer 5 between the second junction and first boss of conductor refrigerator 3.
Accordingly, it is provided with the second boss coordinated with first boss in fore shell 11, one end of conductive structure part 4 extends to the
Two boss are fixedly connected with second boss.
For the ease of controlling the operating temperature of monitoring device, above-mentioned structure of controlling temperature also includes：
Temperature sensor 7 for the temperature of detection image sensor 2；
The controller being connected with temperature sensor 7 and power supply unit signal, the temperature that controller is detected according to sensor
Control the sense of current of power supply unit output.
When monitoring device is applied to cold district, (it is usually less than subzero 10 when the temperature that temperature sensor 7 is detected is too low
DEG C), semiconductor cooler 3 is started working, and now the first junction of semiconductor cooler 3 is fire end, and the second junction is
Refrigeration end, the first junction amount transfers heat to imaging sensor 2 by conductive structure part 4, and semiconductor cooler 3 is played pair
The effect that imaging sensor 2 is heated, so that imaging sensor 2 is maintained in of a relatively high operating temperature, due to semiconductor cooler 3
With the preferable efficiency of heating surface, therefore more traditional Electric heating is more efficient (it is more that the equal electric energy of consumption produces heat).
When monitoring device be applied to hot area, temperature sensor 7 detect temperature it is too high when (such as 80 DEG C), semiconductor
Refrigerator 3 is started working, and now the first junction of semiconductor cooler 3 is refrigeration end, and the second junction is fire end, heat conduction
Structural member 4 is by the first junction of the heat transfer of imaging sensor 2 to semiconductor cooler 3, and semiconductor cooler 3 is played pair
The effect that imaging sensor 2 freezes, so as to maintain imaging sensor 2 in relatively low operating temperature.
Above-mentioned power supply unit includes：Power supply and the current steering device being connected with the output end of power supply.Current steering device
The sense of current of power supply output can be changed.
The utility model additionally provides a kind of monitoring device, includes the temperature control knot of the monitoring device described in any of the above-described
Structure.Because above-mentioned structure of controlling temperature can improve the radiating effect of monitoring device, it is easy to the work at a suitable temperature of imaging sensor 2
Make, therefore the monitoring device that the utility model is provided, with preferable performance.
Above-mentioned monitoring device concrete structure can have a variety of, optionally, and monitoring device is that gun shaped video camera or cylinder type are taken the photograph
Camera.
Obviously, those skilled in the art can carry out various changes and modification without departing from this practicality to the utility model
New spirit and scope.So, if it is of the present utility model these modification and modification belong to the utility model claim and
Within the scope of its equivalent technologies, then the utility model is also intended to comprising including these changes and modification.
Claims (10)
1. a kind of structure of controlling temperature of monitoring device, the monitoring device includes housing, the image sensing in the housing is arranged on
Device, it is characterised in that the structure of controlling temperature of the monitoring device includes：
Power supply unit in the housing；
The semiconductor cooler electrically connected in the housing and with said supply unit, the of the semiconductor cooler
One junction is connected with described image sensor heat conduction, and the second junction of the semiconductor cooler connects with the housing heat conduction
Connect.
2. the structure of controlling temperature of monitoring device as claimed in claim 1, it is characterised in that also include：
The conductive structure part in described image sensor is arranged at, the first junction of the semiconductor cooler is led by described
Thermojunction component is connected with described image sensor heat conduction.
3. the structure of controlling temperature of monitoring device as claimed in claim 2, it is characterised in that the first of the semiconductor cooler connects
Provided with heat-conducting interface material layer between the conductive structure part at point.
4. the structure of controlling temperature of monitoring device as claimed in claim 3, it is characterised in that the housing includes：Fore shell, rear shell with
And the fore shell is arranged at towards one end of the rear shell and the rear shell towards the thermal insulation layer between described fore shell one end.
5. the structure of controlling temperature of monitoring device as claimed in claim 4, it is characterised in that provided with support described half in the rear shell
The first boss of conductor refrigerator, is provided with heat conduction circle between the second junction and the first boss of the semiconductor cooler
Cover material layer.
6. the structure of controlling temperature of monitoring device as claimed in claim 5, it is characterised in that be provided with and described first in the fore shell
The second boss that boss coordinates, one end of the conductive structure part, which extends to the second boss and fixed with the second boss, to be connected
Connect.
7. the structure of controlling temperature of the monitoring device as described in any one of claim 1~6, it is characterised in that also include：
Temperature sensor for detecting described image sensor temperature；
The controller being connected with the temperature sensor and said supply unit signal, the controller is examined according to the sensor
The sense of current of the temperature control said supply unit output measured.
8. the structure of controlling temperature of monitoring device as claimed in claim 7, it is characterised in that said supply unit includes：Power supply and
The current steering device being connected with the output end of the power supply.
9. a kind of monitoring device, it is characterised in that the temperature control knot including the monitoring device as described in any one of claim 1~8
Structure.
10. monitoring device as claimed in claim 9, it is characterised in that the monitoring device is gun shaped video camera or cylinder type
Video camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380603.XU CN206331310U (en) | 2016-12-15 | 2016-12-15 | The structure of controlling temperature and monitoring device of a kind of monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380603.XU CN206331310U (en) | 2016-12-15 | 2016-12-15 | The structure of controlling temperature and monitoring device of a kind of monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206331310U true CN206331310U (en) | 2017-07-14 |
Family
ID=59291161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621380603.XU Active CN206331310U (en) | 2016-12-15 | 2016-12-15 | The structure of controlling temperature and monitoring device of a kind of monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206331310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112904913A (en) * | 2021-01-18 | 2021-06-04 | 北京理工大学重庆创新中心 | Liquid crystal device temperature control system and temperature control method |
-
2016
- 2016-12-15 CN CN201621380603.XU patent/CN206331310U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112904913A (en) * | 2021-01-18 | 2021-06-04 | 北京理工大学重庆创新中心 | Liquid crystal device temperature control system and temperature control method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204904105U (en) | Electronic equipment constant temperature equipment | |
| CN207338673U (en) | The charging connector and vehicle of vehicle | |
| CN205561330U (en) | Quick constant temperature control box of small -size semiconductor high accuracy | |
| CN205028983U (en) | Power battery and car that has it | |
| CN105280586B (en) | The infrared movement heat abstractor of non-refrigeration type and heat dissipating method | |
| CN206947469U (en) | A kind of thermal management device of battery, battery bag and automobile | |
| CN105310816A (en) | Medical semiconductor cold and hot compress machine and cold and hot compress technology thereof | |
| CN109662360A (en) | A kind of isothermic garment for heating and freezing using power supply | |
| CN103323780A (en) | Thermoelectric material thermoelectric conversion performance testing system and method | |
| CN104302157A (en) | Airborne electronic module cooling device with cold accumulation function and operating method | |
| CN104684344A (en) | PCM (phase change material) cooling equipment, cooling system as well as method and unit for cooling system | |
| CN206331310U (en) | The structure of controlling temperature and monitoring device of a kind of monitoring device | |
| CN204761938U (en) | Electronic equipment constant temperature system | |
| CN203988596U (en) | A kind of medical semiconductor cooling hot compress machine | |
| CN208207164U (en) | Thermoelectric generator low-temperature characteristics experimental provision | |
| CN207834511U (en) | Heat management device of power battery under a kind of big temperature difference environment | |
| WO2022036928A1 (en) | Cold-hot circulation temperature-controlled sleep comforting pillow | |
| CN107091963B (en) | Soil thermoelectric generation experimental apparatus | |
| CN206394028U (en) | 3D printing shower nozzle and 3D printing equipment | |
| CN208672000U (en) | A kind of sensor with anti-freezing structure | |
| CN206322817U (en) | A kind of power battery thermal management system based on semiconductor chilling plate | |
| CN116867249A (en) | Heat dissipation method and related equipment | |
| CN207675881U (en) | A kind of temperature experimental provision | |
| CN211329442U (en) | Test card incubator structure | |
| CN201008464Y (en) | Cooling and warming mattress |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |