CN206379369U - Multi-layer ceramic package - Google Patents
Multi-layer ceramic package Download PDFInfo
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- CN206379369U CN206379369U CN201621487882.XU CN201621487882U CN206379369U CN 206379369 U CN206379369 U CN 206379369U CN 201621487882 U CN201621487882 U CN 201621487882U CN 206379369 U CN206379369 U CN 206379369U
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Abstract
The utility model provides a kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip, in the accommodating chamber that multi-layer ceramic chip and one end open are formed through on the ceramic package body, the through hole that the accommodating chamber is formed from each potsherd is put together, and along the direction to the accommodating chamber opening, the inner wall section or whole of the accommodating chamber are stepped；Also include being covered on the stepped inwall of the accommodating chamber, and the metallic object being integrated is burnt altogether with each potsherd of the composition accommodating chamber, and because of the covering of the metallic object, and make it that the inwall of the accommodating chamber is tapered.Multi-layer ceramic package described in the utility model, by making accommodating chamber have the side perisporium being stepped, convenient that metal paste is arranged on step-like side perisporium to form the side perisporium of taper, metal paste can altogether burn with raw potsherd, attachment structure intensity is higher, with preferable practicality.
Description
Technical field
The utility model is related to ceramic packaging technology field, more particularly to a kind of Multi-layer ceramic package.
Background technology
Electronic Packaging is the shell of chip external application, plays a part of laying, fixes, seals, protecting chip, main bag
Include Plastic Package, Metal Packaging and ceramic package, wherein ceramic package because its thermal coefficient of expansion it is small, the advantages of service life is long should
With more and more extensive.
The forming method of ceramic package mainly includes dry pressing, hot die-casting method and the tape casting, wherein：The tape casting is crushing
Good powder is mixed and made into the slurry with certain viscosity with organic plasticizer solution by appropriate proportioning, and slurry is flowed down from container,
Scraped and be coated in special base band with certain thickness by scraper, peeled after drying, solidification from above as ceramic chips, then basis
The size and dimension of finished product such as needs to be punched green band, is laminated at the working process, and blank finished product to be sintered, Ye Jisheng is made
It is the ripe porcelain piece of just one-step forming after porcelain piece, sintering.For dry pressing and hot die-casting method, the tape casting is because can be by laminated ceramic chips
Metallization circuit can be laid on composition, every layer of ceramic chips or the aperture of filling metal paste is set, makes ceramic chips and metal paste
Burn and be integrated altogether with metallization circuit, it is adaptable to which high density integrated circuit is encapsulated, thus is developed rapidly.
But also have deficiency in the tape casting forming process, such as, and during the LED encapsulation of production ultraviolet, the side of chip installation cavity
Perisporium needs to make tapered, so that the side perisporium of taper can be fabricated to mirror surface, and the light beam that can come out chip emission
Diverging expansion, but influenceed by blank performance and punching technology, cylindricality through hole, therefore ultraviolet can only be processed on ceramic chips
LED encapsulation only makes bellmouth using dry pressing or hot die-casting method moulding process, then in the gluing taper gold of bellmouth side wall
Category system is made mirror surface, but dry pressing or hot die-casting method moulding process can not internally arrange metallization circuit, and metal
Body and ceramic joining intensity are poor, and ceramic package service life is short.
Utility model content
In view of this, the utility model is directed to a kind of Multi-layer ceramic package, is provided with overcoming the tape casting to make
There is the deficiency of the ceramic package of the chip installation cavity of taper.
To reach above-mentioned purpose, what the technical solution of the utility model was realized in：
A kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip, it is outer in the ceramics
The accommodating chamber of multi-layer ceramic chip and one end open is formed through on shell body, the accommodating chamber is formed from each ceramics
Through hole on piece is put together, and along the direction to the accommodating chamber opening, the inner wall section of the accommodating chamber or all in rank
Scalariform；
Also include being covered on the stepped inwall of the accommodating chamber, and with constituting each ceramics of the accommodating chamber
Piece burns the metallic object being integrated altogether, and because of the covering of the metallic object, and make it that the inwall of the accommodating chamber is tapered.
Further, the thickness of the potsherd is 0.05-0.35mm.
Further, the Multi-layer ceramic package includes the first layer potsherd that is from top to bottom sequentially stacked to eleventh floor
Potsherd, the accommodating chamber is formed from the through hole of the first layer potsherd to the 9th layer of potsherd and is put together.
Further, the through hole on first layer potsherd to the 4th layer of potsherd is square, and layer 5 potsherd is extremely
The through hole on 9th layer of potsherd is rounded, and the stepped inwall of the accommodating chamber is formed from layer 5 potsherd
The through-hole wall split on to the 8th layer of potsherd is formed.
Further, the first metallized area being open described in ring is laid with the upper surface of first layer potsherd.
Further, the second metallized area of spacing setting, the 3rd gold medal are laid with the lower surface of eleventh floor potsherd
Shu Hua areas and the 4th metallized area.
Further, it is formed with the upper surface of the tenth layer of potsherd and covers the fifth metal of the accommodating chamber bottom
Area, spaced apart 6th metallized area and the 7th metallized area are formed with the upper surface of layer 5 potsherd.
Further, second metallized area and the 6th metallized area are electrically connected, the 3rd metallized area and
The metallic object is electrically connected, and the 4th metallized area, the fifth metal area and the 7th metallized area are electrically connected.
Further, in the metallic object, first metallized area, second metallized area, the 3rd metal
Change area, the 4th metallized area, the fifth metal area, the 6th metallized area, the 7th metallized area are exposed
In on the surface of the ceramic package body covered with protective layer.
Further, the protective layer includes the nickel dam and layer gold for covering setting successively.
Relative to prior art, the utility model has the advantage that：
(1) Multi-layer ceramic package described in the utility model, by making accommodating chamber that there is the side perisporium being stepped, so that
Metal paste can be arranged on the side perisporium step of accommodating chamber, make side perisporium tapered, metal paste is total to raw potsherd
Burning, which is integrated, is fabricated to Multi-layer ceramic package, is metallic object after metal paste sintering, it is high with potsherd bonding strength, uses the longevity
Life length；And the ceramic package so made, metallization circuit can be laid on every layer of potsherd, it is adaptable to which making both needs taper
Minute surface, the internal Multi-layer ceramic package for needing to arrange metallization circuit again.
(2) thickness of potsherd is 0.05-0.35mm, it is easy to processing and punching good forming effect.
(3) potsherd is set to eleventh floor, is easy to arrangement accommodating chamber and internal metallization circuit.
(4) the through hole split on first layer to the 9th layer is formed into accommodating chamber, and step-like side perisporium is formed from the
Through hole split on five layers to the 8th layer potsherd is formed, and is easy to arrangement chip installation area and bonding region.
(5) the first metallized area of ring opening arrangement is set, is easy in the first metallized area welding metal ring.
(6) the second metallized area, the 3rd metallized area and the 4th metallized area are set in the lower surface of ceramic package body,
It is easy to the ceramic package being welded on circuit board.
(7) setting in fifth metal area can be easy to chip to weld, the arrangement of the 6th metallized area and the 7th metallized area
Bonding region can be used as.
(8) second metallized areas and the 6th metallized area are electrically connected, and the 3rd metallized area and metallic object are electrically connected, the 4th gold medal
Shu Hua areas, fifth metal area and the 7th metallized area are electrically connected, and meet processing technology needs, and can meet this multi-layer ceramics envelope
The use function of dress.
(9) protective layer can prevent metallic object and the first metallized area to the 7th metallized area from aoxidizing, and extend this ceramic package
The service life of shell.
(10) protective layer is set to the nickel dam being sequentially arranged and layer gold, can further improve oxidation-protective effect.
Brief description of the drawings
Constitute a part of accompanying drawing of the present utility model to be used for providing further understanding to of the present utility model, this practicality is new
The schematic description and description of type is used to explain the utility model, does not constitute to improper restriction of the present utility model.
In accompanying drawing：
Fig. 1 is the half sectional view of the Multi-layer ceramic package described in the utility model embodiment；
Fig. 2 is Fig. 1 A portions enlarged drawing；
Fig. 3 is the top view of the Multi-layer ceramic package described in the utility model embodiment；
Fig. 4 is the upward view of the Multi-layer ceramic package described in the utility model embodiment；
Fig. 5 is the top view of the first layer potsherd described in the utility model embodiment；
Fig. 6 is the second layer potsherd and the top view of third layer potsherd described in the utility model embodiment；
Fig. 7 is the top view of the 4th layer of potsherd described in the utility model embodiment；
Fig. 8 is the top view of the layer 5 potsherd described in the utility model embodiment；
Fig. 9 is the layer 6 potsherd and the top view of layer 7 potsherd described in the utility model embodiment；
Figure 10 is the top view of the 8th layer of potsherd described in the utility model embodiment；
Figure 11 is the top view of the 9th layer of potsherd described in the utility model embodiment；
Figure 12 is the top view of the tenth layer of potsherd described in the utility model embodiment；
Figure 13 is the perspective view that the eleventh floor potsherd described in the utility model embodiment is overlooked；
Description of reference numerals：
1- first layer potsherds, 2- second layer potsherds, 3- third layer potsherds, the 4th layer of potsherd of 4-, 5- layer 5s
Potsherd, 6- layer 6 potsherds, 7- layer 7 potsherds, the 8th layer of potsherd of 8-, the 9th layer of potsherd of 9-, the tenth layer of 10-
Potsherd, 11- eleventh floor potsherds, 12- metallic objects, 13- nickel dams, 14- layer gold, the metallized areas of 15- second, the gold medals of 16- the 3rd
Shu Hua areas, the metallized areas of 17- the 4th, 18- side metals area, the metallized areas of 19- the 6th, the metallized areas of 20- the 7th, 21-
One metallized area, 22- fifth metals area, 23- accommodating chambers, 2301- openings, 2302- through holes, 24- apertures, 25- lateral apertures.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can
To be mutually combined.
In addition, the first layer potsherd being previously mentioned in embodiment of the present utility model, second layer potsherd, third layer are made pottery
Ceramics, the 4th layer of potsherd, layer 5 potsherd, layer 6 potsherd, layer 7 potsherd, the 8th layer of potsherd, the 9th layer
Potsherd, the tenth layer of potsherd, first layer potsherd, the first metallized area, the second metallized area, the 3rd metallized area, four
In metallized area, fifth metal area, the 6th metallized area and the 7th metallized area first, second, third, fourth, the 5th,
Six, the seven, the eight, the nine, the tenth and the 11st be, for the ease of the utility model is described, not constitute to this reality
With new limitation.
Describe the utility model in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
The present embodiment is related to a kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip,
In the accommodating chamber that multi-layer ceramic chip and one end open are formed through on the ceramic package body, the accommodating chamber is by forming
It is put together in the through hole on each potsherd, and along the direction to the accommodating chamber opening, the inner wall part of the accommodating chamber
Divide or all stepped；Also include being covered on the stepped inwall of the accommodating chamber, and with constituting the accommodating chamber
Each potsherd burns the metallic object being integrated altogether, and because of the covering of the metallic object, and cause the inwall of the accommodating chamber into
Taper.
The Multi-layer ceramic package of the present embodiment, in the green stage, by making accommodating chamber that there is the side perisporium being stepped, from
And metal paste can be arranged on the side perisporium step of accommodating chamber, make side perisporium tapered, by metal paste and raw potsherd
Burn to be integrated altogether and be fabricated to Multi-layer ceramic package, be metallic object after metal paste sintering, it is high with potsherd bonding strength, uses
Long lifespan；And the ceramic package so made, metallization circuit can be laid on every layer of potsherd, it is adaptable to which making both needs cone
Shape minute surface, the internal Multi-layer ceramic package for needing to arrange metallization circuit again.
Based on above design philosophy, a kind of example arrangement of the present embodiment is as shown in Figures 1 to 4, ceramic by eleventh floor
Piece is constituted, and is referred to as first layer potsherd 1, second layer potsherd 2, third layer potsherd 3, the 4th layer of potsherd under upper successively
4th, layer 5 potsherd 5, layer 6 potsherd 6, layer 7 potsherd 7, the 8th layer of potsherd 8, the 9th layer of potsherd the 9, the tenth
Layer potsherd 10 and eleventh floor potsherd 11.The profile of first layer potsherd 1 to eleventh floor potsherd 11 is square, and it is removed
It can be square, can also be in other shapes, as it can be circle.
Specifically, the thickness of each potsherd is preferably 0.05-0.35mm, it is easy to processing and punching good forming effect.Each pottery
The thickness of ceramics is also smaller than 0.05mm certainly, and such smaller processing of potsherd thickness is inconvenient；It can be more than 0.35mm, such as
The larger punching molding effect of this potsherd thickness is poor.
On concrete structure, the structure of first layer potsherd 1 is as shown in figure 5, in the first potsherd centre side of being formed with
The through hole 2302 of shape, the through hole 2302 is the opening 2301 for constituting accommodating chamber 23, and in the region of the upper table face ring through hole 2302
The first metallized area 21 is provided with, is provided with two apertures 24, aperture 24 and is filled with the overlay area of the first metallization
Metallic object.Here, setting the first metallized area 21 to be easy to, in rear process welding metal ring, the first metallization can be also not provided with certainly
Area 21.And the holes in the overlay area of the first metallized area 21 may also be configured to other quantity except may be configured as two, such as
It can be one, three etc..
The structure of second layer potsherd 2 is as shown in fig. 6, in being formed with through hole 2302 and two apertures on the second potsherd
24, through hole 2302 and aperture 24 that through hole 2302 and aperture 24 on second layer potsherd 2 correspond on first layer potsherd 1 and
Set, positions and dimensions all same, and metallic object is also filled with aperture 24.The structure of third layer potsherd 3 and second
The structure of layer potsherd 2 is identical, no longer repeats herein.
Fig. 7 show the structure of the 4th layer of potsherd 4, corresponding to the through hole 2302 and aperture on third layer potsherd 3
24, it is formed with the through hole 2302 and aperture 24 of same size, aperture 24 and is filled with the same position of the 4th layer of potsherd 4
Metallic object, also, the semicircular lateral aperture 25 being arranged symmetrically is formed with the relative side of the 4th layer of potsherd 4, herein,
Lateral aperture 25 can be also not provided with.
Referring to Fig. 8, on layer 5 potsherd 5, corresponding to the aperture 24 and lateral aperture 25 on the 4th layer of potsherd 4,
Identical, which is set, is filled with metallic object in the aperture 24 and lateral aperture 25 for being formed with same size, aperture 24, here, can be not provided with
Lateral aperture 25；The centre of layer 5 potsherd 5 is formed with the through hole 2302 of circle, in the upper surface of the ring through hole 2302
On, it is formed with the 6th metallized area 19 and the 7th metallized area 20 away from arrangement, and in the He of the 6th metallized area 19 between left and right
The overlay area of 7th metallized area 20 is respectively disposed with the aperture 24 of three filling metal pastes, herein, the 6th metallized area 19
It is bonding region with the 7th metallized area 20, bonding region, can also cloth as needed except may be disposed so that shape and quantity shown in Fig. 8
Other shapes and quantity are set to, or be may be disposed on other potsherds.In addition, the 6th metallized area 19 and the 7th metallization
The overlay area of area 20 may also be configured to other quantity except that can set three apertures 24 respectively, as it can be one, two or four
It is individual.
The structure of layer 6 potsherd 6 is shown in Fig. 9, corresponding to the aperture 24 and lateral aperture 25 on layer 5 potsherd 5, in phase
With position be formed with the aperture 24 and lateral aperture 25 of identical size, aperture 24 and be filled with metallic object, can also be not provided with herein
Lateral aperture 25；In addition, through hole 2302 is formed with the centre of layer 6 potsherd 6, its size is less than layer 5 ceramics
The size of through hole 2302 on piece 5.The structure of layer 7 potsherd 7 is roughly the same with the structure of layer 6 potsherd 6, and difference is
The size of through hole 2302 on layer 7 potsherd 7 is less than the size of through hole 2302 on layer 6 potsherd 6, other structures it is identical
This is no longer repeated.
Such as Figure 10, on the 8th layer of potsherd 8, corresponding to the lateral aperture 25 on layer 7 potsherd 7, identical position shape
Into the lateral aperture 25 for having identical size, lateral aperture 25 herein can be not provided with.And corresponding to the connection on layer 7 potsherd 7 the
The aperture 24 of one metallized area 21, forms corresponding metallization transition region respectively, and transition region is covered with aperture 24, at this
The aperture 24 of aperture 24 and the first metallized area of connection 21 on layer 7 potsherd 7 is shifted to install, and is filled with metallic object,
This, can be not provided with the transition region that metallizes, and aperture 24 can be set, and need to make its positions and dimensions and the company on layer 7 potsherd 7
The aperture 24 of logical first metallized area 21 is identical；Corresponding to the 6th metallized area 19 of connection and the 7th gold medal on layer 7 potsherd 7
The aperture 24 in Shu Hua areas 20, the same position of the 8th layer of potsherd 8, which is formed with the aperture 24 of identical size, aperture 24, to be filled with
Metallic object.In addition, there also is provided through hole 2302 on the 8th layer of potsherd 8, its size is less than through hole on layer 7 potsherd 7
2302 sizes.
Figure 11 is shown on the structure of the 9th layer of potsherd 9, the through hole 2302 and the 8th layer of potsherd 8 of the center portion thereof position
The size of through hole 2302 is identical.Corresponding to the aperture 24 of connection metallization transition region on the 8th layer of potsherd 8, in the 9th layer of potsherd
9 same position is formed with the aperture 24 of identical size.On the side of the 9th layer of potsherd 9, it is formed with and the 8th layer of ceramics
Metallic object is disposed with the size of lateral aperture 25 and position identical lateral aperture 25 of piece 8, the side wall of lateral aperture 25, also,
Be disposed with three pieces of metallized areas on the upper surface of nine layers of potsherd 9, the metallized area of the left and right sides respectively with the 6th metallized area
19 are connected and are communicated to the position of lateral aperture 25 of corresponding side with the 7th metallized area 20, and middle metallized area is then communicated to
The position of lateral aperture 25 of lower both sides, here, the arrangement shape of three pieces of metallized areas and position are according to circuit communication and technique
Need and set, its shape and position can as needed change or can be arranged as required on the potsherd of other layers.
Tenth layer of potsherd 10 shown in Figure 12, corresponding to the lateral aperture 25 on the 9th layer of potsherd 9, identical position
The lateral aperture 25 for being formed with identical size is put, also, metallic object is disposed with the side wall of lateral aperture 25.In addition, in the tenth layer of pottery
Two pieces of metallized areas are provided with the upper surface of ceramics 10, specifically, in the strip metal area in left side and the 9th floor potsherd 9
Aperture 24 connect and extend to side；And the metallized area on right side can cover the bottom of accommodating chamber 23, and it is respectively communicated with supreme
The lateral aperture 25 of lower side and right edge, it can be easy to chip to weld, metalized shape and position on the tenth layer of potsherd 10
Also to be needed according to circuit communication relation and technique needs to set, its shape and position can as needed change or can be according to need
It is arranged on the potsherd of other layers.
Figure 13 is overlooks the perspective view of eleventh floor potsherd 11, and perspective view is to assume that eleventh floor potsherd 11 is
The pattern at bright the seen back side of eleventh floor potsherd 11.Corresponding to the lateral aperture 25 on the tenth layer of potsherd 10, the 11st
Layer potsherd 11 identical position is formed with the lateral aperture 25 of identical size, also, is disposed with metal on the side wall of lateral aperture 25
Body.The second metallized area 15, the and of the 3rd metallized area 16 of spacing arrangement are formed with the lower surface of eleventh floor potsherd 11
4th metallized area 17, wherein, the second metallized area 15 is connected with the lateral aperture 25 in left side, the 3rd metallized area 16 and up and down two
The lateral aperture 25 of side is connected, and the 4th metallized area 17 is connected with the lateral aperture 25 on right side.Herein, the second metallized area the 15, the 3rd
The metallized area 17 of metallized area 16 and the 4th can be easy to this Multi-layer ceramic package to be welded on circuit board, and its shape and position can roots
Needed according to circuit communication relation and technique needs to change, or may be disposed on the potsherd of other layers.
The setting of above structure so that accommodating chamber 23 is formed from first layer potsherd 1 to the 9th layer of potsherd 9
The through hole 2302 is stacked to be formed, and step-like side perisporium is formed from layer 5 potsherd 5 to the 8th layer of potsherd 8
Through hole 2302 is stacked to be formed, so as to set metal paste on step-like side perisporium step so that step-like side perisporium
It is tapered.In the structure, step-like side perisporium except can be by layer 5 potsherd 5 to the 8th layer of potsherd 8 through hole
2302 it is stacked formed, can also be formed by the through hole in other numbers of plies or other layer of potsherd is stacked, the inwall of accommodating chamber is except can
Part is stepped, can also be all stepped.
Also, said structure makes the second metallized area 15 and the 6th metallized area 19 be electrically connected, the He of the 3rd metallized area 16
Metallic object 12 is electrically connected, and the 4th metallized area 17, the metallized area 20 of fifth metal area 22 and the 7th are electrically connected, and meet technique need
Will, and meet this Multi-layer ceramic package use demand.
For effective anti-oxidation, in metallic object 12, the first metallized area 21, the metallization of the second metallized area the 15, the 3rd
Area 16, the 4th metallized area 17, fifth metal area 22, the 6th metallized area 19, the 7th metallized area 20 are exposed to outside ceramics
Covered with protective layer on the surface of shell body, and nickel dam 13 and layer gold 14 of the protective layer including covering setting successively.
It is last it should be noted that in above structure, through hole 2302, aperture 24, lateral aperture 25 on each layer potsherd, the
The metallized area 20 of one metallized area 21 to the 7th, the metallized area of non-label and the number of plies of potsherd are for multi-layer ceramics
Encapsulation use or circuit communication relation or technique need and set, and do not constitute to limitation of the present utility model.
Preferred embodiment of the present utility model is these are only, it is all in this practicality not to limit the utility model
Within new spirit and principle, any modification, equivalent substitution and improvements made etc. should be included in guarantor of the present utility model
Within the scope of shield.
Claims (10)
1. a kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip, it is characterised in that：In institute
The accommodating chamber that multi-layer ceramic chip and one end open are formed through on ceramic package body is stated, the accommodating chamber is formed from respectively
Through hole on the potsherd is put together, and along the direction to the accommodating chamber opening, the inner wall section of the accommodating chamber or
It is all stepped；
Also include being covered on the stepped inwall of the accommodating chamber, and be total to each potsherd of the composition accommodating chamber
The metallic object being integrated is burnt, and because of the covering of the metallic object, and make it that the inwall of the accommodating chamber is tapered.
2. Multi-layer ceramic package according to claim 1, it is characterised in that：The thickness of the potsherd is 0.05-
0.35mm。
3. Multi-layer ceramic package according to claim 1, it is characterised in that：The Multi-layer ceramic package is included from top to bottom
The first layer potsherd being sequentially stacked is to eleventh floor potsherd, and the accommodating chamber is formed from first layer potsherd to the 9th layer
The through hole on potsherd is put together.
4. Multi-layer ceramic package according to claim 3, it is characterised in that：On first layer potsherd to the 4th layer of potsherd
The through hole be square, the through hole on layer 5 potsherd to the 9th layer of potsherd is rounded, and the accommodating chamber is in
Stair-stepping inwall is formed from the through-hole wall split of the layer 5 potsherd to the 8th layer of potsherd and formed.
5. Multi-layer ceramic package according to claim 4, it is characterised in that：It is laid with the upper surface of first layer potsherd
The first metallized area being open described in ring.
6. Multi-layer ceramic package according to claim 5, it is characterised in that：Laid in the lower surface of eleventh floor potsherd
There are the second metallized area, the 3rd metallized area and the 4th metallized area that spacing is set.
7. Multi-layer ceramic package according to claim 6, it is characterised in that：It is formed with the upper surface of the tenth layer of potsherd
The fifth metal area of the accommodating chamber bottom is covered, spaced apart 6th gold medal is formed with the upper surface of layer 5 potsherd
Shu Hua areas and the 7th metallized area.
8. Multi-layer ceramic package according to claim 7, it is characterised in that：Second metallized area and the 6th gold medal
Shu Hua areas are electrically connected, and the 3rd metallized area and the metallic object are electrically connected, the 4th metallized area, the fifth metal
Change area and the 7th metallized area is electrically connected.
9. the Multi-layer ceramic package according to claim 7 or 8, it is characterised in that：In the metallic object, first metal
Change area, it is second metallized area, the 3rd metallized area, the 4th metallized area, the fifth metal area, described
6th metallized area, the 7th metallized area are exposed on the surface of the ceramic package body covered with protective layer.
10. Multi-layer ceramic package according to claim 9, it is characterised in that：The protective layer includes covering successively and set
Nickel dam and layer gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621487882.XU CN206379369U (en) | 2016-12-30 | 2016-12-30 | Multi-layer ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621487882.XU CN206379369U (en) | 2016-12-30 | 2016-12-30 | Multi-layer ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206379369U true CN206379369U (en) | 2017-08-04 |
Family
ID=59403782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621487882.XU Active CN206379369U (en) | 2016-12-30 | 2016-12-30 | Multi-layer ceramic package |
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| Country | Link |
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| CN (1) | CN206379369U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784247A (en) * | 2016-12-30 | 2017-05-31 | 河北鼎瓷电子科技有限公司 | Multi-layer ceramic package and its manufacturing process |
| CN108269743A (en) * | 2018-01-04 | 2018-07-10 | 河北中瓷电子科技有限公司 | Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block |
-
2016
- 2016-12-30 CN CN201621487882.XU patent/CN206379369U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784247A (en) * | 2016-12-30 | 2017-05-31 | 河北鼎瓷电子科技有限公司 | Multi-layer ceramic package and its manufacturing process |
| CN108269743A (en) * | 2018-01-04 | 2018-07-10 | 河北中瓷电子科技有限公司 | Step-like aluminium nitride ceramics block preparation method and step-like aluminium nitride ceramics block |
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