CN106784247A - Multi-layer ceramic package and its manufacturing process - Google Patents
Multi-layer ceramic package and its manufacturing process Download PDFInfo
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- CN106784247A CN106784247A CN201611259621.7A CN201611259621A CN106784247A CN 106784247 A CN106784247 A CN 106784247A CN 201611259621 A CN201611259621 A CN 201611259621A CN 106784247 A CN106784247 A CN 106784247A
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- Prior art keywords
- potsherd
- layer
- accommodating chamber
- ceramic package
- area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention provides a kind of Multi-layer ceramic package and its manufacturing process, including the ceramic package body being stacked by multi-layer ceramic chip, in the accommodating chamber that multi-layer ceramic chip and one end open are formed through on the ceramic package body, the through hole that the accommodating chamber is formed from each potsherd is put together, and along the direction to the accommodating chamber opening, the inner wall section of the accommodating chamber or all stepped；Also include being covered on the stepped inwall of the accommodating chamber, and burn the metallic object being integrated altogether with each described potsherd for constituting the accommodating chamber, and because of the covering of the metallic object, and cause that the inwall of the accommodating chamber is tapered.Multi-layer ceramic package of the present invention, there is the side perisporium being stepped by making accommodating chamber, convenient that metal paste is arranged on step-like side perisporium to form the side perisporium of taper, metal paste can altogether burn with raw potsherd, attachment structure intensity is higher, with preferable practicality.
Description
Technical field
The present invention relates to ceramic packaging technology field, more particularly to a kind of Multi-layer ceramic package, while the invention further relates to
The manufacturing process of the Multi-layer ceramic package.
Background technology
Electronic Packaging is the shell of chip external application, plays a part of to lay, fixes, seals, protecting chip, main bag
Include Plastic Package, Metal Packaging and ceramic package, wherein ceramic package because its thermal coefficient of expansion it is small, should the advantages of long service life
With more and more extensive.
The forming method of ceramic package mainly includes dry pressing, hot die-casting method and the tape casting, wherein：The tape casting is crushing
Good powder is mixed and made into the slurry with certain viscosity with organic plasticizer solution by appropriate proportioning, and slurry is flowed down from container,
Scraped with certain thickness by scraper and be coated in special base band, peeled from above as ceramic chips after drying, solidification, then basis
The size and dimension of finished product such as needs to be punched green band, is laminated at the working process, is made blank finished product to be sintered, Ye Jisheng
Porcelain piece, is the ripe porcelain piece of just one-step forming after sintering.For dry pressing and hot die-casting method, the tape casting is because can be by laminated ceramic chips
Metallization circuit can be laid on composition, every layer of ceramic chips or the aperture of filling metal paste is set, make ceramic chips and metal paste
Burnt altogether with metallization circuit and be integrated, it is adaptable to which high density integrated circuit is encapsulated, thus is developed rapidly.
But also there is deficiency in the tape casting forming process, such as, when production ultraviolet LED is encapsulated, the side of chip installation cavity
Perisporium needs to make tapered, the side perisporium of taper can be fabricated into mirror surface, and can be by chip emission light beam out
Diverging expansion, but influenceed by blank performance and punching technology, cylindricality through hole, therefore ultraviolet can only be processed on ceramic chips
LED encapsulation only makes bellmouth using dry pressing or hot die-casting method moulding process, then in the gluing taper gold of bellmouth side wall
Category system is made mirror surface, but dry pressing or hot die-casting method moulding process can not internally arrange metallization circuit, and metal
Body is poor with ceramic joining intensity, and ceramic package service life is short.
The content of the invention
In view of this, the present invention is directed to propose a kind of Multi-layer ceramic package, has cone to overcome the tape casting to produce
The deficiency of the ceramic package of the chip installation cavity of shape.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way：
A kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip, it is outer in the ceramics
The accommodating chamber of multi-layer ceramic chip and one end open is formed through on shell body, the accommodating chamber is formed from each ceramics
Through hole on piece is put together, and along the direction to the accommodating chamber opening, the inner wall section of the accommodating chamber or all in rank
Scalariform；
Also include being covered on the stepped inwall of the accommodating chamber, and with constitute each described ceramics of the accommodating chamber
Piece burns the metallic object being integrated altogether, and because of the covering of the metallic object, and cause that the inwall of the accommodating chamber is tapered.
Further, the thickness of the potsherd is 0.05-0.35mm.
Further, the Multi-layer ceramic package includes the ground floor potsherd that is from top to bottom sequentially stacked to eleventh floor
Potsherd, the accommodating chamber is formed from the through hole of the ground floor potsherd to the 9th layer of potsherd and is put together.
Further, the through hole on ground floor potsherd to the 4th layer of potsherd is square, and layer 5 potsherd is extremely
The through hole on 9th layer of potsherd is rounded, and the step-like receiving cavity wall is formed from layer 5 potsherd to
The through-hole wall split on eight layers of potsherd is formed.
Further, the first metallized area being open described in ring is laid with the upper surface of ground floor potsherd；In the tenth
The lower surface of one layer of potsherd is laid with the second metallized area, the 3rd metallized area and the 4th metallized area of spacing setting；In
The upper surface of the tenth floor potsherd is formed with the fifth metal area for covering the accommodating chamber bottom；In the upper of layer 5 potsherd
Surface is formed with spaced apart 6th metallized area and the 7th metallized area.
Further, second metallized area and the 6th metallized area are electrically connected, the 3rd metallized area and
The metallic object is electrically connected, and the 4th metallized area, the fifth metal area and the 7th metallized area are electrically connected.
Relative to prior art, the present invention has the advantage that：
Multi-layer ceramic package of the present invention, has the side perisporium being stepped by making accommodating chamber, so as to can hold
Receive chamber side perisporium step on arrange metal paste, make side perisporium tapered, it is one that metal paste is burnt altogether with raw potsherd
System is made Multi-layer ceramic package, is metallic object after metal paste sintering, and it is high with potsherd bonding strength, long service life；
And so make ceramic package, can be laid on every layer of potsherd metallization circuit, it is adaptable to make both needed taper minute surface,
The internal Multi-layer ceramic package for needing to arrange metallization circuit again.
A kind of manufacturing process of Multi-layer ceramic package as described above, comprises the following steps：
A, get the raw materials ready, prepare the ceramic chips of each potsherd；
B, punching, the punching on each described ceramic chips for being used to be formed the accommodating chamber, to form the through hole；
C, lamination, each ceramic chips are stacked, and each through-hole wall split is formed the accommodating chamber；
D, hollow metal, make metal paste flow through in step-like receiving cavity wall, and the indwelling of part metals slurry in
Accommodate on the step on cavity wall, so that it is tapered to accommodate cavity wall；
E, lamination, each ceramic chips to being stacked apply pressure combines each layer potsherd；
F, sintering, combining ceramic chips are sintered in sintering furnace and form ripe porcelain piece.
Further, there is step e0 before step e：By under ambient pressure, the cone that can be fitted with the side perisporium of taper
Shape mould is put into the accommodating chamber；
There is step e1 after step e：Take out the taper die.
Further, there is step d0 before Step d：Pasted in the upper surface of the ceramic chips for forming the accommodating chamber opening
Film, other regions of the film covering in addition to the accommodating chamber opening；
There is step d1 after Step d：Remove the film.
Further, there is step c0 before step c：Metal paste and printed metallization are filled on each ceramic chips
Area.
Multi-layer ceramic package manufacturing process of the invention, by the through hole of the punching different-diameter on each ceramic chips, and more
On the potsherd of opening, through-hole diameter it is bigger, stacked ceramic chips can form step-like side perisporium, so as to using sky
The step of heart metallizes makes the indwelling of metallization cream in the metal pulp charge level that taper is formed on step, and metal paste can be common with ceramic chips
Burning forms foregoing Multi-layer ceramic package, is metallic object after metal paste sintering, overcomes existing Multi-layer ceramic package manufacture work
Skill cannot be produced, the problem of the accommodating chamber of the metallic object with taper, so the Multi-layer ceramic package metallic object of manufacture and pottery
Ceramics is the common structure burnt and be integrated, and bonding strength is high, long service life, and metallization electricity can be arranged on each potsherd
Road, can make not only had needed taper minute surface, Multi-layer ceramic package that is internal but also needing arrangement metallization circuit.
Brief description of the drawings
The accompanying drawing for constituting a part of the invention is used for providing a further understanding of the present invention, schematic reality of the invention
Apply example and its illustrate, for explaining the present invention, not constitute inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the half sectional view of the Multi-layer ceramic package described in the embodiment of the present invention；
Fig. 2 is the A portions enlarged drawing of Fig. 1；
Fig. 3 is the top view of the Multi-layer ceramic package described in the embodiment of the present invention；
Fig. 4 is the upward view of the Multi-layer ceramic package described in the embodiment of the present invention；
Fig. 5 is the top view of the ground floor potsherd described in the embodiment of the present invention；
Fig. 6 is the second layer potsherd and the top view of third layer potsherd described in the embodiment of the present invention；
Fig. 7 is the 4th layer of top view of potsherd described in the embodiment of the present invention；
Fig. 8 is the top view of the layer 5 potsherd described in the embodiment of the present invention；
Fig. 9 is the layer 6 potsherd and the top view of layer 7 potsherd described in the embodiment of the present invention；
Figure 10 is the 8th layer of top view of potsherd described in the embodiment of the present invention；
Figure 11 is the 9th layer of top view of potsherd described in the embodiment of the present invention；
Figure 12 is the tenth layer of top view of potsherd described in the embodiment of the present invention；
Figure 13 is the perspective view that the eleventh floor potsherd described in the embodiment of the present invention is overlooked；
Description of reference numerals：
1- ground floor potsherds, 2- second layer potsherds, 3- third layer potsherds, the 4th layer of potsherd of 4-, 5- layer 5s
Potsherd, 6- layer 6 potsherds, 7- layer 7 potsherds, the 8th layer of potsherd of 8-, the 9th layer of potsherd of 9-, the tenth layer of 10-
Potsherd, 11- eleventh floor potsherds, 12- metallic objects, 13- nickel dams, 14- layer gold, the metallized areas of 15- second, the gold medals of 16- the 3rd
Shu Hua areas, the metallized areas of 17- the 4th, 18- side metals area, the metallized areas of 19- the 6th, the metallized areas of 20- the 7th, 21-
One metallized area, 22- fifth metals area, 23- accommodating chambers, 2301- openings, 2302- through holes, 24- apertures, 25- lateral apertures.
Specific embodiment
It should be noted that in the case where not conflicting, the embodiment in the present invention and the feature in embodiment can phases
Mutually combination.
In addition, the ground floor potsherd being previously mentioned in an embodiment of the present invention, second layer potsherd, third layer are ceramic
Piece, the 4th layer of potsherd, layer 5 potsherd, layer 6 potsherd, layer 7 potsherd, the 8th layer of potsherd, the 9th layer of pottery
Ceramics, the tenth layer of potsherd, ground floor potsherd, the first metallized area, the second metallized area, the 3rd metallized area, the 4th gold medal
In Shu Hua areas, fifth metal area, the 6th metallized area and the 7th metallized area first, second, third, fourth, the 5th,
6th, the seven, the eight, the nine, the tenth and the 11st is, for the ease of present invention is described, not constitute to limit of the invention
System.
Describe the present invention in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
The present embodiment is related to a kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip,
In the accommodating chamber that multi-layer ceramic chip and one end open are formed through on the ceramic package body, the accommodating chamber is by forming
It is put together in the through hole on each potsherd, and along the direction to the accommodating chamber opening, the inner wall part of the accommodating chamber
Divide or all stepped；Also include being covered on the stepped inwall of the accommodating chamber, and with constitute the accommodating chamber
Each potsherd burns the metallic object being integrated altogether, and because of the covering of the metallic object, and cause the inwall of the accommodating chamber into
Taper.
The Multi-layer ceramic package of the present embodiment, in the green stage, has the side perisporium being stepped by making accommodating chamber, from
And metal paste can be arranged on the side perisporium step of accommodating chamber, make side perisporium tapered, by metal paste and raw potsherd
Burn to be integrated altogether and be fabricated to Multi-layer ceramic package, be metallic object after metal paste sintering, it is high with potsherd bonding strength, uses
Long lifespan；And the ceramic package for so making, metallization circuit can be laid on every layer of potsherd, it is adaptable to which making both needs cone
Shape minute surface, the internal Multi-layer ceramic package for needing to arrange metallization circuit again.
Based on above design philosophy, a kind of example arrangement of the present embodiment is as shown in Figures 1 to 4, ceramic by eleventh floor
Piece is constituted, by being referred to as ground floor potsherd 1, second layer potsherd 2, third layer potsherd 3, the 4th layer of potsherd under upper successively
4th, layer 5 potsherd 5, layer 6 potsherd 6, layer 7 potsherd 7, the 8th layer of potsherd 8, the 9th layer of potsherd the 9, the tenth
Layer potsherd 10 and eleventh floor potsherd 11.Ground floor potsherd 1 to the profile of eleventh floor potsherd 11 is square, and it is removed
Can be square, can also be in other shapes, such as it can be circle.
Specifically, the thickness of each potsherd is preferably 0.05-0.35mm, it is easy to processing and punching good forming effect.Each pottery
The thickness of ceramics is also smaller than 0.05mm certainly, and such smaller processing of potsherd thickness is inconvenient；It can be more than 0.35mm, such as
The larger punching molding effect of this potsherd thickness is poor.
On concrete structure, the structure of ground floor potsherd 1 is as shown in figure 5, in the first potsherd centre side of being formed with
The through hole 2302 of shape, the through hole 2302 is the opening 2301 for constituting accommodating chamber 23, and in the region of the upper table face ring through hole 2302
The first metallized area 21 is provided with, is provided with two apertures 24, aperture 24 in the overlay area of the first metallization and is filled with
Metallic object.Here, set the first metallized area 21 to be easy to, in rear operation welding metal ring, the first metallization can be also not provided with certainly
Area 21.And the holes in the overlay area of the first metallized area 21 may also be configured to other quantity except may be configured as two, such as it
It can be one, three etc..
The structure of second layer potsherd 2 is as shown in fig. 6, in being formed with through hole 2302 and two apertures on the second potsherd
24, the through hole 2302 and aperture 24 on second layer potsherd 2 are corresponding to the through hole 2302 and aperture 24 on ground floor potsherd 1
Set, positions and dimensions all same, and metallic object is also filled with aperture 24.The structure of third layer potsherd 3 and second
The structure of layer potsherd 2 is identical, no longer repeats herein.
Fig. 7 show the 4th layer of structure of potsherd 4, corresponding to through hole 2302 and aperture 24 on third layer potsherd 3,
It is formed with the same position of the 4th layer of potsherd 4 and metal is filled with the through hole 2302 and aperture 24 of same size, aperture 24
Body, also, the semicircular lateral aperture 25 being arranged symmetrically is formed with the 4th layer of relative side of potsherd 4, herein, may be used also
It is not provided with lateral aperture 25.
Referring to Fig. 8, on layer 5 potsherd 5, corresponding to aperture 24 and lateral aperture 25 on the 4th layer of potsherd 4,
Identical sets and metallic object is filled with the aperture 24 and lateral aperture 25 for being formed with same size, aperture 24, here, can be not provided with
Lateral aperture 25；The centre of layer 5 potsherd 5 is formed with the through hole 2302 of circle, in the upper surface of the ring through hole 2302
On, the 6th metallized area 19 and the 7th metallized area 20 between left and right away from arrangement are formed with, and in the He of the 6th metallized area 19
The overlay area of 7th metallized area 20 is respectively disposed with three apertures 24 of filling metal paste, herein, the 6th metallized area 19
It is bonding region with the 7th metallized area 20, bonding region, can also cloth as needed except may be disposed so that shape and quantity shown in Fig. 8
Other shapes and quantity are set to, or be may be disposed on other potsherds.In addition, the 6th metallized area 19 and the 7th metallization
The overlay area of area 20 may also be configured to other quantity except that can be respectively provided with three apertures 24, and such as it can be one, two or four
It is individual.
The structure of layer 6 potsherd 6 is shown in Fig. 9, corresponding to aperture 24 and lateral aperture 25 on layer 5 potsherd 5, in phase
Same position is formed with and metallic object is filled with the aperture 24 and lateral aperture 25 of same size, aperture 24, can also be not provided with herein
Lateral aperture 25；In addition, through hole 2302 is formed with the centre of layer 6 potsherd 6, its size is less than layer 5 ceramics
The size of through hole 2302 on piece 5.The structure of layer 7 potsherd 7 is roughly the same with the structure of layer 6 potsherd 6, and difference is
The size of through hole 2302 on layer 7 potsherd 7 less than the size of through hole 2302 on layer 6 potsherd 6, other structures it is identical
This is no longer repeated.
Such as Figure 10, on the 8th layer of potsherd 8, corresponding to the lateral aperture 25 on layer 7 potsherd 7, identical position shape
Into the lateral aperture 25 for having same size, lateral aperture 25 herein can be not provided with.And correspond to the connection on layer 7 potsherd 7
The aperture 24 of one metallized area 21, forms corresponding metallization transition region respectively, and transition region is coated with aperture 24, at this
The aperture 24 of the first metallized area of connection 21 on aperture 24 and layer 7 potsherd 7 is shifted to install, and filled with metallic object,
This, can be not provided with the transition region that metallizes, and aperture 24 can be set, and need to make the company on its positions and dimensions and layer 7 potsherd 7
The aperture 24 of logical first metallized area 21 is identical；Corresponding to connection the 6th metallized area 19 and the 7th gold medal on layer 7 potsherd 7
The aperture 24 in Shu Hua areas 20, the same position of the 8th layer of potsherd 8 is formed with the aperture 24 of same size, aperture 24 and is filled with
Metallic object.In addition, there also is provided through hole 2302 on the 8th layer of potsherd 8, its size is less than through hole on layer 7 potsherd 7
2302 sizes.
Figure 11 shows the 9th layer of structure of potsherd 9, on the through hole 2302 and the 8th layer of potsherd 8 of the center portion thereof position
The size of through hole 2302 is identical.Corresponding to the aperture 24 that metallization transition region is connected on the 8th layer of potsherd 8, in the 9th layer of potsherd
9 same position is formed with the aperture 24 of same size.On the 9th layer of side of potsherd 9, it is formed with and the 8th layer of ceramics
The size of lateral aperture 25 of piece 8 and position identical lateral aperture 25, are disposed with metallic object on the side wall of lateral aperture 25, also,
Be disposed with three pieces of metallized areas on nine layers of upper surface of potsherd 9, the metallized area of the left and right sides respectively with the 6th metallized area
19 are connected with the 7th metallized area 20 and are communicated to the position of lateral aperture 25 of corresponding side, and the metallized area of centre is then communicated to
The position of lateral aperture 25 of lower both sides, here, the arrangement shape of three pieces of metallized areas and position are according to circuit communication and technique
Need and set, its shape and position can as needed change or can be arranged as required on the potsherd of other layers.
Tenth layer of potsherd 10 shown in Figure 12, corresponding to the lateral aperture 25 on the 9th layer of potsherd 9, identical position
The lateral aperture 25 for being formed with same size is put, also, metallic object is disposed with the side wall of lateral aperture 25.Additionally, in the tenth layer of pottery
Two pieces of metallized areas are provided with the upper surface of ceramics 10, specifically, in the strip metal area in left side and the 9th floor potsherd 9
Aperture 24 connect and extend to side；And the metallized area on right side can cover the bottom of accommodating chamber 23, and it is respectively communicated with supreme
The lateral aperture 25 of lower side and right edge, it can be easy to chip to weld, metalized shape and position on the tenth layer of potsherd 10
Also to be needed according to circuit communication relation and technique needs to set, its shape and position can as needed change or can be according to need
It is arranged on the potsherd of other layers.
Figure 13 is the perspective view for overlooking eleventh floor potsherd 11, and perspective view is hypothesis eleventh floor potsherd 11 and is
The pattern at bright the seen back side of eleventh floor potsherd 11.Corresponding to the lateral aperture 25 on the tenth layer of potsherd 10, the 11st
Layer potsherd 11 identical position is formed with the lateral aperture 25 of same size, also, is disposed with metal on the side wall of lateral aperture 25
Body.Spaced apart second metallized area 15, the and of the 3rd metallized area 16 are formed with the lower surface of eleventh floor potsherd 11
4th metallized area 17, wherein, the second metallized area 15 is connected with the lateral aperture 25 in left side, the 3rd metallized area 16 and upper and lower two
The lateral aperture 25 of side is connected, and the 4th metallized area 17 is connected with the lateral aperture 25 on right side.Herein, the second metallized area the 15, the 3rd
The metallized area 17 of metallized area 16 and the 4th can be easy to this Multi-layer ceramic package to be welded on circuit board, and its shape and position can roots
Needed according to circuit communication relation and technique needs to change, or may be disposed on the potsherd of other layers.
The setting of above structure so that accommodating chamber 23 is formed from institute of the ground floor potsherd 1 to the 9th layer of potsherd 9
The stacking of through hole 2302 is stated to be formed, and step-like side perisporium is formed from the leading to the 8th layer of potsherd 8 of layer 5 potsherd 5
The stacking of hole 2302 is formed, so that metal paste can be set on step-like side perisporium step so that step-like side perisporium is in
Taper.In the structure, step-like side perisporium except can be by layer 5 potsherd 5 to the 8th layer of potsherd 8 through hole 2302
Stacking is formed, and can be also laminated by the through hole in other numbers of plies or other layer of potsherd and be formed, and the inwall of accommodating chamber can be in partly rank
Scalariform, can also be all stepped.
Also, said structure makes the second metallized area 15 and the 6th metallized area 19 be electrically connected, the He of the 3rd metallized area 16
Metallic object 12 is electrically connected, and the 4th metallized area 17, the metallized area 20 of fifth metal area 22 and the 7th are electrically connected, and meet technique need
Will, and meet this Multi-layer ceramic package use demand.
For effective anti-oxidation, metallized in metallic object 12, the first metallized area 21, the second metallized area the 15, the 3rd
Area 16, the 4th metallized area 17, fifth metal area 22, the 6th metallized area 19, the 7th metallized area 20 are exposed to outside ceramics
Protective layer is coated with the surface of shell body, and protective layer includes covering successively the nickel dam 13 and layer gold 14 of setting.
In above structure, through hole 2302, aperture 24, lateral aperture 25, the first metallized area 21 on each layer potsherd to
Seven metallized areas 20, the metallized area of non-label and the number of plies of potsherd are for Multi-layer ceramic package and use or circuit company
Clearance system or technique need and set, and are not construed as limiting the invention.
Invention also provides a kind of manufacturing process for preparing foregoing Multi-layer ceramic package, comprise the following steps：
A, get the raw materials ready, prepare the ceramic chips of each potsherd；
B, punching, the punching on each described ceramic chips for being used to be formed the accommodating chamber, to form the through hole；
C, lamination, each ceramic chips are stacked, and each through-hole wall split is formed the accommodating chamber；
D, hollow metal, make metal paste flow through in step-like receiving cavity wall, and the indwelling of part metals slurry in
Accommodate on the step on cavity wall, so that it is tapered to accommodate cavity wall；
E, lamination, each ceramic chips to being stacked apply pressure combines each layer potsherd；
F, sintering, combining ceramic chips are sintered in sintering furnace and form ripe porcelain piece.
Multi-layer ceramic package manufacturing process of the invention, by the through hole of the punching different-diameter on each ceramic chips, and more
On the potsherd of opening, through-hole diameter it is bigger, stacked ceramic chips can form step-like side perisporium, so as to using sky
The step of heart metallizes makes the indwelling of metallization cream in the metal pulp charge level that taper is formed on step, and metal paste can be common with ceramic chips
Burning forms foregoing Multi-layer ceramic package, is metallic object after metal paste sintering, overcomes existing Multi-layer ceramic package manufacture work
Skill cannot be produced, the problem of the accommodating chamber of the metallic object with taper, so the Multi-layer ceramic package metallic object of manufacture and pottery
Ceramics is the common structure burnt and be integrated, and bonding strength is high, long service life, and metallization electricity can be arranged on each potsherd
Road, can make not only had needed taper minute surface, Multi-layer ceramic package that is internal but also needing arrangement metallization circuit.
Specifically, in b step, using perforating press to each ceramic chips punching, if the layer is in addition to through hole 2302, also
With aperture 24 and lateral aperture 25, punching small holes 24, lateral aperture 25 and through hole 2302 are answered.
There is step c0 before step c, to the aperture 24 on each ceramic chips using filling perforation machine filling metal paste, and utilize
Press printing metallized area, so as to ground floor potsherd 1 shown in Fig. 5 to Figure 13 to eleventh floor potsherd 11 can be obtained
Structure.Certainly, on the potsherd without aperture 24 or metallized area, the step can be omitted.
In step c, using laminating machine lamination, technological parameter is preferably：80 ± 5KN of pressure, 10 ± 1min of time, temperature
70 ± 2 DEG C, technological parameter is not limited to above-mentioned numerical value, can specifically adjust as needed.By this step, layer 5 can be made pottery respectively
Ceramics 5 to the 8th layer of potsherd 8, the 9th layer of potsherd 9 to the lamination of eleventh floor potsherd 11, in case Step d is used.
There is step d0 before Step d, it would be desirable to which the stacked ceramic chips bottom surface of hollow metal pastes film, described thin
Film covers other regions in addition to hollow metal hole, and film is preferably PET film, is to make foregoing Multi-layer ceramic package
Example, pastes film, in case carrying out Step d using laminator in the bottom surface of the 8th layer of potsherd 8 and eleventh floor potsherd 11
When prevent the metal paste in aperture 24 from flowing out, its bottom surface can also be formed and protect and prevent ceramic chips from deforming, it is so obtained
Multi-layer ceramic package flatness and presentation quality are higher, and the yield rate of product can be greatly improved.
In Step d, it would be desirable to which the stacked ceramic chips of hollow metal are positioned in vacuum adsorption table, using printing machine
Vacuumized while type metal slurry, can respectively make metal paste along through hole 2302 or the wall flow of lateral aperture 25, with can
Indwelling is so obtained layer 55 to the 8th layers of ceramics of potsherd on the step of stairstepping side perisporium and the side wall of lateral aperture 25
Indwelling has metal paste on the step-like side perisporium of piece 8, and side perisporium is tapered, and the 9th layer of potsherd 9 to eleventh floor is made pottery
The side wall indwelling of lateral aperture 25 of ceramics 11 has metal paste, there is step d1 after Step d, and what is pasted in removable d0 steps is thin
Film.
Had step e0 before step e, by under ambient pressure, the taper die that can be fitted with step-like side perisporium puts
Enter in the accommodating chamber 23, specifically, taper die is suspended in the accommodating chamber 23, namely taper die should not be with when placing
The side perisporium laminating of taper, in case step e is used.The setting of taper die, can make the side perpendicular wall surfaces of the taper of making smooth,
Presentation quality is high, and using effect is good, and the trouble whole, subsequent technique can be avoided to repair, certainly, tapered side perisporium can be excused from a college course after sintering
The low Multi-layer ceramic package of surface quality requirements, step e0 can be omitted.
Before taper die is put into, lamination step is also repeated, such as manufacture foregoing Multi-layer ceramic package, this time needed
To ground floor potsherd 1, second layer potsherd 2, third layer potsherd 3, the 4th layer of potsherd 4, layer 5 potsherd 5 to the 8th
Layer potsherd 8 it is stacked after ceramic chips, the 9th layer of potsherd 9 to the lamination of eleventh floor potsherd 11 it is stacked after ceramic chips
Carry out lamination.
In step e, the ceramic chips after all being stacked are packed using vacuum machine, be then laminated with laminating machine, work
Skill parameter is preferably：300 ± 10Psi of pressure, preheating time 5min, 10 ± 1min of dwell time, 70 ± 1 DEG C of temperature, technique ginseng
Number is not limited to above-mentioned numerical value, can specifically adjust as needed.When this step is carried out, as pressure increases, raw cook component strain, cone
Shape mould is gradually fitted completely with the side perisporium of taper, and offside perisporium plays shaping operation, packaging is removed after the completion of lamination and completes e steps
Suddenly, there can be step e1 after step e, take out taper die.
For improve production efficiency, on each layer of potsherd can array be disposed with multigroup through hole 2302, aperture 24, lateral aperture
25 or metallization pattern, fervent step can be increased after step e when so making, i.e., using hot-cutting machine by single multilayer pottery
The sideline of porcelain encapsulation completely cuts through, that is, form the green part of single Multi-layer ceramic package.In this step can also incomplete cut-off,
Namely the potsherd of part layer is only cut when earnestly, so operation need to increase step f1 after f steps, break disconnected to divide by fervent line
From each Multi-layer ceramic package.
F steps are carried out, the green part after lamination is sintered in sintering furnace and is formed foregoing Multi-layer ceramic package.
The manufacturing process of this Multi-layer ceramic package is not limited to above-mentioned steps, can also be needed to increase other steps according to technique,
Such as inspection, nickel plating, gold-plated step, or can sequence of process steps be adjusted, it is every it is based on above step, make to have and bore
The Multi-layer ceramic package manufacturing process of the side perisporium of shape is within protection scope of the present invention.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (10)
1. a kind of Multi-layer ceramic package, including the ceramic package body being stacked by multi-layer ceramic chip, it is characterised in that：In institute
The accommodating chamber that multi-layer ceramic chip and one end open are formed through on ceramic package body is stated, the accommodating chamber is formed from respectively
Through hole on the potsherd is put together, and along to the accommodating chamber opening direction, the inner wall section of the accommodating chamber or
It is all stepped；
Also include being covered on the stepped inwall of the accommodating chamber, and be total to each described potsherd for constituting the accommodating chamber
The metallic object that burning is integrated, and because of the covering of the metallic object, and cause that the inwall of the accommodating chamber is tapered.
2. Multi-layer ceramic package according to claim 1, it is characterised in that：The thickness of the potsherd is 0.05-
0.35mm。
3. Multi-layer ceramic package according to claim 1, it is characterised in that：The Multi-layer ceramic package is included from top to bottom
To eleventh floor potsherd, the accommodating chamber is formed from ground floor potsherd to the 9th layer to the ground floor potsherd being sequentially stacked
The through hole on potsherd is put together.
4. Multi-layer ceramic package according to claim 3, it is characterised in that：On ground floor potsherd to the 4th layer of potsherd
The through hole be square, the through hole on layer 5 potsherd to the 9th layer of potsherd is rounded, the step-like appearance
Cavity wall of receiving is formed from the through-hole wall split of the layer 5 potsherd to the 8th layer of potsherd and is formed.
5. Multi-layer ceramic package according to claim 4, it is characterised in that：It is laid with the upper surface of ground floor potsherd
The first metallized area being open described in ring；The second metallization of spacing setting is laid with the lower surface of eleventh floor potsherd
Area, the 3rd metallized area and the 4th metallized area；The covering accommodating chamber bottom is formed with the upper surface of the tenth layer of potsherd
Fifth metal area；Spaced apart 6th metallized area and the 7th metallization are formed with the upper surface of layer 5 potsherd
Area.
6. Multi-layer ceramic package according to claim 5, it is characterised in that：Second metallized area and the 6th gold medal
Shu Hua areas are electrically connected, and the 3rd metallized area and the metallic object are electrically connected, the 4th metallized area, the fifth metal
Change area and the 7th metallized area is electrically connected.
7. a kind of manufacturing process of Multi-layer ceramic package as claimed in claim 1, it is characterised in that comprise the following steps：
A, get the raw materials ready, prepare the ceramic chips of each potsherd；
B, punching, the punching on each described ceramic chips for being used to be formed the accommodating chamber, to form the through hole；
C, lamination, each ceramic chips are stacked, and each through-hole wall split is formed the accommodating chamber；
D, hollow metal, make metal paste flow through in step-like receiving cavity wall, and part metals slurry indwelling is in receiving
On step on cavity wall, so that it is tapered to accommodate cavity wall；
E, lamination, each ceramic chips to being stacked apply pressure combines each layer potsherd；
F, sintering, combining ceramic chips are sintered in sintering furnace and form ripe porcelain piece.
8. a kind of Multi-layer ceramic package manufacturing process according to claim 7, it is characterised in that：
There is step e1 before step e：By under ambient pressure, the taper die that can be fitted with the side perisporium of taper be put into it is described
In accommodating chamber；
There is step e2 after step e：Take out the taper die.
9. a kind of Multi-layer ceramic package manufacturing process according to claim 7, it is characterised in that：
There is step d0 before Step d：Film, the film are pasted in the upper surface of the ceramic chips for forming the accommodating chamber opening
Cover other regions in addition to the accommodating chamber opening；
There is step d1 after Step d：Remove the film.
10. a kind of Multi-layer ceramic package manufacturing process according to claim 7, it is characterised in that：
There is step c0 before step c：Metal paste and printed metallization area are filled on each ceramic chips.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611259621.7A CN106784247A (en) | 2016-12-30 | 2016-12-30 | Multi-layer ceramic package and its manufacturing process |
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| CN111945202A (en) * | 2020-07-21 | 2020-11-17 | 中国电子科技集团公司第十三研究所 | Blind hole electroplating method for ceramic leadless shell |
| CN112025925A (en) * | 2020-08-10 | 2020-12-04 | 深圳陶陶科技有限公司 | Contrast color ceramic and preparation method and application thereof |
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