CN206349399U

CN206349399U - White light is without encapsulation LED flips lamp grain

Info

Publication number: CN206349399U
Application number: CN201621479988.5U
Authority: CN
Inventors: 黄智明; 许龙; 黄致诚
Original assignee: Power Light New Material Technology (shanghai) Co Ltd
Current assignee: Power Light New Material Technology (shanghai) Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2017-07-21
Anticipated expiration: 2026-12-30

Abstract

White light is without encapsulation LED flips lamp grain, middle side part is fluted under fluorescence ceramics paster (1), crystal covered chip (3) is embedded in the groove and stretches out P poles (2) and N poles (5) in fluorescence ceramics paster (1) bottom surface, the upper end of P poles (2) and N poles (5) is connected to crystal covered chip (3) bottom surface, and optical waveguide layer (4) is installed between crystal covered chip (3) and fluorescence ceramics paster (1).Illuminator grain quality consistency is excellent, possess all-round luminous, bloom efficiency, small volume, using convenient, simultaneously, because encapsulation process is not required to by the complicated process such as die bond, routing, sealing, in addition to human cost is reduced, substantial amounts of machinery equipment needed for conventional package is also saved, production cost is significantly reduced, industrial mass making is stood on.

Description

White light is without encapsulation LED flips lamp grain

Technical field

The utility model is related to the structure improved technology of LED product, especially white light without encapsulation LED flips lamp grain.

Background technology

In the prior art, LED light-emittingdiodes are then comprising the part that crystal grain, packaging body, gold thread, support etc. mainly light Crystal grain inside packaging body.The main component of packaging body is that epoxy resin is used for fixed support and can be the top system of packaging body Into can optically focused lens to control LED lighting angle.

LED can arbitrarily be changed as different kenels with the different packaging bodies for writing application.In the relevant position of LED support Elargol or insulating cement on point.There is the feux rouges, gold-tinted, yellowish green chip of backplate to what GaAs, SiC conductive substrates using silver Glue.To the blue and green light LED wafer of what sapphire dielectric substrate using insulating cement come fixed wafer.Processing procedure difficult point is in what dispensing There are detailed process requirements body height, dispensing position.Elargol is coated in LED backplates and then back with elargol LED is arranged on LED support, the remote high what dispensing of efficiency of standby glue but the applicable standby glue processing procedure of not all product.

The big factory of other LED grains, which is different from, without encapsulation white light LED actively pushes crystallite dimension encapsulation (CSP) skill Art, no encapsulation white light LEDs (EMC) high packaging thermal resistance conventional thermosetting with 3030 is compared, and the former thermal resistance is less than 1 DEG C/W, then Person then has 20 DEG C/W.Low thermal resistance LED, which is encapsulated in bulb market, can bring cost advantage, be exported with 10 watts of the said firm, 800 lumens LED bulb exemplified by, compare using 3030 EMC encapsulation and 1313 without encapsulation white light LEDs, wherein without encapsulation LED can save after Section encapsulation and lead frame expense, therefore in LED modules and mechanical aspects, total can save about 9% cost.

In the prior art, can be directly with existing surface due to using the engineering method without substrate fluorescent paster without encapsulation white light LEDs Mount technology (SMT) equipment carries out piece, to simplify manufacturing process, reduction thermal resistance.Moreover, no encapsulation white light LEDs size It is minimum, lamp plate area can be reduced 67% then, increase the elasticity of Design of Luminaires.

LED realizes the method for white light not full maturity using fluorescent material, thus severely impacts white light LEDs in illumination The application in field, specific operation is that the yellow fluorescent powder that can be stimulated by blue light, blue-ray LED core are applied on blue-light LED chip The blue light that piece is sent is complementarily shaped to white light with the gold-tinted that fluorescent material is sent.The shortcoming of the technology is the example hair in the fluorophor Penetrate spectrum and do not have continuous spectrum characteristic, colour rendering is poor, it is difficult to the requirement of low colour temperature illumination is met, while luminous efficiency is not enough Height by developing new high-efficiency fluorescence powder, it is necessary to be improved.

Utility model content

The purpose of this utility model is to provide white light without encapsulation LED flips lamp grain.

The purpose of this utility model will be realized by following technical measures：Middle side part is fluted under fluorescence ceramics paster, Crystal covered chip is embedded in the groove and P poles and N poles is stretched out in fluorescence ceramics paster bottom surface, and the upper end of P poles and N poles is connected to flip Die bottom surface, optical waveguide layer is installed between crystal covered chip and fluorescence ceramics paster.

Especially, a piece of ceramic radiating fin is pasted in crystal covered chip bottom surface.

Especially, fluorescence ceramics paster bottom periphery is in same plane.

Especially, buckle is fixedly mounted in fluorescence ceramics paster bottom edge.

Especially, it is in planform shape at the top of fluorescence ceramics paster.

Especially, fluorescence ceramics paster periphery foreign aid is square, circular or regular polygon.

Advantage and effect of the present utility model：Illuminator grain quality consistency is excellent, possesses all-round luminous, reliability and hair Light efficiency is high, small volume, using convenient, simultaneously as encapsulation process is not required to, by the complicated process such as die bond, routing, sealing, remove Reduce outside human cost, substantial amounts of machinery equipment needed for also saving conventional package significantly reduces production cost, stands on industry High-volume makes.

Brief description of the drawings

Fig. 1 is the structural representation of the utility model embodiment 1.

Reference includes：Fluorescence ceramics paster 1, P poles 2, crystal covered chip 3, optical waveguide layer 4, N poles 5.

Embodiment

The utility model includes：Fluorescence ceramics paster 1, P poles 2, crystal covered chip 3, optical waveguide layer 4 and N poles 5.

The utility model is described in further detail with reference to the accompanying drawings and examples.

Embodiment 1：As shown in Figure 1,1 time middle side part of fluorescence ceramics paster is fluted, and crystal covered chip 3 is embedded in the groove simultaneously And stretch out P poles 2 and N poles 5 in the bottom surface of fluorescence ceramics paster 1, the upper end of P poles 2 and N poles 5 is connected to the bottom surface of crystal covered chip 3, is covering Optical waveguide layer 4 is installed between brilliant chip 3 and fluorescence ceramics paster 1.

In foregoing, a piece of ceramic radiating fin is pasted in the bottom surface of crystal covered chip 3.

In foregoing, the bottom periphery of fluorescence ceramics paster 1 is in same plane.

In foregoing, buckle is fixedly mounted in the bottom edge of fluorescence ceramics paster 1.

In foregoing, the top of fluorescence ceramics paster 1 is in planform shape.

In foregoing, the periphery foreign aid of fluorescence ceramics paster 1 is square, circular or regular polygon.

In the present embodiment, fluorescence ceramics paster 1 is by carbon containing yellow or green diamond fluorescent material mixed aluminium oxides and adds Enter glue mixture, casting to mould baking forms groove shapes ceramic paster, and its groove is embedded in crystal covered chip 3.

In the utility model, the fluorescence ceramics of groove shapes are produced using a kind of carbonaceous material diamond phosphor material powder Paster 1, is coated in embedded groove above crystal covered chip 3 and side four sides is outer, and crystal covered chip 3 only exposes downwards in bottom surface P poles 2 and N poles 5.

Claims

1. white light is without encapsulation LED flips lamp grain, including fluorescence ceramics paster (1), P poles (2), crystal covered chip (3), optical waveguide layer (4) With N poles (5)；Characterized in that, middle side part is fluted under fluorescence ceramics paster (1), the embedded groove of crystal covered chip (3) and P poles (2) and N poles (5) are stretched out in fluorescence ceramics paster (1) bottom surface, and the upper end of P poles (2) and N poles (5) is connected to crystal covered chip (3) bottom Face, installs optical waveguide layer (4) between crystal covered chip (3) and fluorescence ceramics paster (1).

2. white light as claimed in claim 1 is without encapsulation LED flips lamp grain, it is characterised in that pasted in crystal covered chip (3) bottom surface A piece of ceramic radiating fin.

3. white light as claimed in claim 1 is without encapsulation LED flips lamp grain, it is characterised in that fluorescence ceramics paster (1) bottom surface week Side is in same plane.

4. white light as claimed in claim 1 is without encapsulation LED flips lamp grain, it is characterised in that fluorescence ceramics paster (1) bottom surface side Buckle is fixedly mounted in edge.

5. white light as claimed in claim 1 is without encapsulation LED flips lamp grain, it is characterised in that be at the top of fluorescence ceramics paster (1) Planform shape.

6. white light as claimed in claim 1 is without encapsulation LED flips lamp grain, it is characterised in that outside fluorescence ceramics paster (1) periphery Help square, circular or regular polygon.