CN206312882U - A kind of full absorption type wafer clamping apparatus - Google Patents
A kind of full absorption type wafer clamping apparatus Download PDFInfo
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- CN206312882U CN206312882U CN201621472905.XU CN201621472905U CN206312882U CN 206312882 U CN206312882 U CN 206312882U CN 201621472905 U CN201621472905 U CN 201621472905U CN 206312882 U CN206312882 U CN 206312882U
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- chip
- vacuum
- bonding
- installing plate
- viscous layer
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- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of full absorption type wafer clamping apparatus, including vacuum absorbing platform, installing plate is equipped with the adsorption plane of the vacuum absorbing platform, the one side being in contact with the adsorption plane of installing plate is bonding in vacuum face, bonding in vacuum face is smooth flat, the bonding in vacuum face of installing plate forms vacuum suction and is connected with the adsorption plane, the another side relative with bonding in vacuum face is chip stationary plane on installing plate, viscous layer is coated with chip stationary plane, arrangement is provided with the chip installation position for being used to place chip in multiple on viscous layer, chip at corresponding chip installation position with viscous layer bonding connection.Fixed the utility model has the advantage of the absorption that can effectively complete chip, for disposable processing more wafers provide basis, prevent from causing bad damage to chip processing, and effectively reduce the time of loading and unloading, greatly improve production efficiency, it is ensured that the stabilization of production.
Description
Technical field
The utility model is related to the adsorption plant that wafer grinding is processed, and in particular to a kind of full absorption type chip fixes dress
Put.
Background technology
Wafer is thinning, is that the wafer body in integrated circuit is made reduces size, in order to make more complicated integrated circuit.
The progress of ic manufacturing technology is first derived from the requirement of the market demand, next to that the requirement of competition.In integrated circuit system
In making, semiconductor silicon material due to its aboundresources, low cost of manufacture, good manufacturability is the important matrix material of integrated circuit.
From the point of view of integrated circuit section structure, most of integrated circuit is manufactured on the superficial surface layer of silicon substrate material.Due to manufacture
The requirement of technique, dimensional accuracy, geometric accuracy, surface cleanliness and surface crystallites lattice structure to chip propose very high wanting
Ask.Therefore in hundreds of road technological processes, relatively thin chip can not be used, can only be using certain thickness chip in technical process
Middle transmission, flow., it is necessary to the matrix material unnecessary to chip back surface removes certain thickness generally before integrated antenna package.
This technical process is referred to as chip back surface reduction process, and correspondence equipment is exactly wafer grinding machine, grinding head and the crystalline substance of thinning machine
Piece back side rotating contact, completes grinding thinning.
The absorption of known wafer grinding is an insoluble problem, and existing suction type is that individually chip is placed on
On the adsorption plane of vacuum adsorption table, the suction type can cause vacuum suction unstable, and feeding and blanking are inconvenient, especially can
The danger of damage wafers is produced, when multiple chips are adsorbed and processed simultaneously, once one of wafer breakage, the crystalline substance
Piece is connected with the absorption of vacuum adsorption table and just releases, and the wafer debris for continuing to be split when processing can produce harm to remaining chip,
Cause secondary damage；Even if find broken wafers in time, and shutdown remove, will also result in shutdown interrupt, influence processing efficiency and
Processing continuity.
Utility model content
The utility model is in order to solve weak point of the prior art, there is provided a kind of full absorption type wafer clamping apparatus,
The effective absorption for completing chip is fixed, and for disposably processing more wafers provide basis, prevents from causing bad to chip processing
Damage, and effectively reduce the time of loading and unloading, greatly improve production efficiency, it is ensured that the stabilization of production.
In order to solve the above technical problems, the utility model is adopted the following technical scheme that：A kind of full absorption type chip fixes dress
Put, including vacuum absorbing platform, be equipped with installing plate on the adsorption plane of the vacuum absorbing platform, installing plate with the absorption
The one side that face is in contact is bonding in vacuum face, and bonding in vacuum face is smooth flat, bonding in vacuum face and the suction of installing plate
Attached face forms vacuum suction connection, and the another side relative with bonding in vacuum face is chip stationary plane on installing plate, and chip is fixed
Viscous layer is coated with face, arrangement is provided with the chip installation position for being used to place chip in multiple on viscous layer, and chip is corresponding
With viscous layer bonding connection at chip installation position.
The chip installation position circumferentially uniform spread configuration of shape, and the axis of circumference where it and thinning machine grinding
The rotation axis coincident of head.
The beneficial effects of the utility model are：
The absorption that the utility model can effectively complete chip is fixed, for disposably processing more wafers provide basis,
Prevent from causing bad damage to chip processing, and effectively reduce the time of loading and unloading, greatly improve production efficiency, it is ensured that production
Stabilization.
The defect of easy damaged chip when the utility model especially overcomes existing chip absorption processing, the utility model is right
When multiple chips are adsorbed and processed simultaneously, once one of wafer breakage, the chip can be still bonded on viscous layer, after
The wafer debris split during continuous processing will not produce harm to remaining chip, it is to avoid cause secondary damage, so as to reduce midway
Downtime, it is ensured that processing efficiency and processing continuity.
Brief description of the drawings
Fig. 1 is front view of the present utility model；
Fig. 2 is the top view of installing plate in Fig. 1.
Specific embodiment
Specific embodiment of the present utility model is elaborated below in conjunction with accompanying drawing.
As depicted in figs. 1 and 2, a kind of full absorption type wafer clamping apparatus of the present utility model, including vacuum absorbing platform
1, installing plate 2, the one side being in contact with the adsorption plane of installing plate 2 are equipped with the adsorption plane of the vacuum absorbing platform
It is bonding in vacuum face, bonding in vacuum face is smooth flat, and bonding in vacuum face and the adsorption plane of installing plate 2 form vacuum suction
Connection, the another side relative with bonding in vacuum face is chip stationary plane on installing plate 2, and viscous layer is coated with chip stationary plane
3, arrangement is provided with multiple for placing the chip installation positions of chip on viscous layer 3, chip 4 at corresponding chip installation position with
The bonding connection of viscous layer 3.
The circumferentially uniform spread configuration of shape of chip installation position described in the present embodiment, and the axis of circumference where it with subtract
The rotation axis coincident of the grinding head 5 of thin machine.
The absorption that the utility model can effectively complete chip is fixed, for disposably processing more wafers provide basis,
Prevent from causing bad damage to chip processing, and effectively reduce the time of loading and unloading, greatly improve production efficiency, it is ensured that production
Stabilization.
The defect of easy damaged chip when the utility model especially overcomes existing chip absorption processing, the utility model is right
When multiple chips are adsorbed and processed simultaneously, once one of wafer breakage, the chip can be still bonded on viscous layer, after
The wafer debris split during continuous processing will not produce harm to remaining chip, it is to avoid cause secondary damage, so as to reduce midway
Downtime, it is ensured that processing efficiency and processing continuity.
The utility model before processing, is first fixed multiple chips with viscous layer bonding connection at correspondence chip installation position
Afterwards, the air extrusion in the middle of chip and viscous layer is gone out using rubber bar also；The installing plate of carry wafer is adsorbed onto afterwards
At the adsorption plane of vacuum adsorption table, then it is processed；After machining, cancel vacuum, you can the installing plate of carry wafer is whole
Individual to take off, process finishing effectively reduces the time of loading and unloading, while chip is firmly sticked on viscous layer, also will not be to chip
Processing causes bad damage.
The utility model simple structure, setting are flexible, easy to use, can be used for various processing absorption surfaces, it is adaptable to
The processing of more wafers.
Above example is only used to illustrative and not limiting the technical solution of the utility model, although with reference to above-described embodiment pair
The utility model has been described in detail, it will be understood by those within the art that：The utility model can still be entered
Row modification or equivalent, without deviating from any modification or partial replacement of spirit and scope of the present utility model, it all should
Cover in the middle of right of the present utility model.
Claims (2)
1. a kind of full absorption type wafer clamping apparatus, including vacuum absorbing platform, it is characterised in that：The vacuum absorbing platform
Installing plate is equipped with adsorption plane, the one side being in contact with the adsorption plane of installing plate is bonding in vacuum face, bonding in vacuum
Face is smooth flat, and bonding in vacuum face and the adsorption plane of installing plate form vacuum suction and are connected, connect with vacuum on installing plate
The relative another side of junction is chip stationary plane, and viscous layer is coated with chip stationary plane, and arrangement is provided with many on viscous layer
The individual chip installation position for placing chip, chip at corresponding chip installation position with viscous layer bonding connection.
2. full absorption type wafer clamping apparatus according to claim 1, it is characterised in that：The chip installation position is circumferentially
The uniform spread configuration of shape, and axis and the grinding head of thinning machine of circumference where it rotation axis coincident.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472905.XU CN206312882U (en) | 2016-12-30 | 2016-12-30 | A kind of full absorption type wafer clamping apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621472905.XU CN206312882U (en) | 2016-12-30 | 2016-12-30 | A kind of full absorption type wafer clamping apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206312882U true CN206312882U (en) | 2017-07-07 |
Family
ID=59248800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621472905.XU Active CN206312882U (en) | 2016-12-30 | 2016-12-30 | A kind of full absorption type wafer clamping apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206312882U (en) |
-
2016
- 2016-12-30 CN CN201621472905.XU patent/CN206312882U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200707 Address after: 221300 Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province, north of Huancheng North Road and east of Hongqi Road Patentee after: JIANGSU LILONG SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 2625, room 2, building 4, No. 451162, Yingbin Road, Zhengzhou, Henan Patentee before: ZHENGZHOU JINGRUN OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |