CN206312127U - Multifunction emulation bus test equipment - Google Patents
Multifunction emulation bus test equipment Download PDFInfo
- Publication number
- CN206312127U CN206312127U CN201621453929.0U CN201621453929U CN206312127U CN 206312127 U CN206312127 U CN 206312127U CN 201621453929 U CN201621453929 U CN 201621453929U CN 206312127 U CN206312127 U CN 206312127U
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- CN
- China
- Prior art keywords
- pcie
- emulation
- heat dissipation
- plate
- test equipment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model discloses a kind of multifunction emulation bus test equipment, including upper cartridge body and lower box body, PCIe emulation boards and test motherboard are provided with the upper cartridge body, power module and power supply fan are provided with the lower box body, the lower box body is provided with the Peripheral Interface being connected with PCIe emulation boards, the centre of the test motherboard offers ventilation slot, radiator fan is provided with below the ventilation slot, airflow plate is provided with above the PCIe emulation boards, on the airflow plate louvre has been diffuseed to form from centre to surrounding, the first heat dissipation channel is formed between the lower section of the PCIe emulation boards and test motherboard, the second heat dissipation channel is formed between the top of the PCIe emulation boards and airflow plate.Multifunction emulation bus test equipment of the present utility model, is respectively formed heat dissipation channel such that it is able to greatly improve heat dispersion by the upper and lower of PCIe emulation boards, meets various Bus simulators and test function, and simple structure, it is easy to implement.
Description
Technical field
The utility model is related to a kind of bus test equipment, more particularly to a kind of multifunction emulation bus test equipment.
Background technology
Existing bus test equipment is, it is necessary to meet various Bus simulators and test function, Bus simulator collocation is various suitable
Orchestration, whole product can as fiber-optic signal, 1553 signals, AFDX signal analyzers, by customize software can support with serial ports,
The read-write of Ethernet controlling bus data.Various adapters can produce amount of heat, and the 7-PCIe of bus test equipment is imitated in addition
When true board runs, substantial amounts of heat itself can be also produced, therefore for multifunction emulation bus test equipment, it is necessary to dissipate well
Hot system.But, it is simple using fan blowing because heat generating spot is above board, it is extremely difficult to good radiating effect.Cause
This, it is necessary to the structure to existing bus test equipment is improved.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of multifunction emulation bus test equipment, can be significantly
Heat dispersion is improved, various Bus simulators and test function, and simple structure is met, it is easy to implement.
The utility model is to provide a kind of multifunction emulation bus to solve the technical scheme that above-mentioned technical problem is used
Test equipment, including upper cartridge body and lower box body, are provided with PCIe emulation boards and test motherboard, the lower box body in the upper cartridge body
In be provided with power module and power supply fan, the lower box body is provided with the Peripheral Interface being connected with PCIe emulation boards, wherein, it is described
Air-flow fixed plate is provided with below test motherboard, guiding gutter is formed with the air-flow fixed plate, the power module is fixed
In the lower section of air-flow fixed plate, the centre of the test motherboard offers ventilation slot, radiation air is provided with below the ventilation slot
Fan, is provided with airflow plate above the PCIe emulation boards, louvre, institute have been diffuseed to form to surrounding from centre on the airflow plate
State and form the first heat dissipation channel, the top of the PCIe emulation boards and airflow plate between the lower section of PCIe emulation boards and test motherboard
Between form the second heat dissipation channel.
The utility model contrast prior art has following beneficial effect：The multifunction emulation bus that the utility model is provided
Test equipment, is respectively formed heat dissipation channel such that it is able to greatly improve heat dispersion by the upper and lower of PCIe emulation boards, meets
Various Bus simulators and test function, and simple structure, it is easy to implement.
Brief description of the drawings
Fig. 1 is the utility model multifunction emulation bus test equipment front decomposition texture schematic diagram；
Fig. 2 is the utility model multifunction emulation bus test equipment back side decomposition texture schematic diagram；
Fig. 3 constitutes schematic diagram for the heat dissipation channel of the utility model multifunction emulation bus test equipment structure.
In figure：
The knob of 1 first knob, 2 spring 3 second
4 upper cartridge body, 5 airflow plate 6 fixes lock
The Board Under Test of 7 PCIe emulation boards, 8 fixed bolt 9
The radiator fan of 10 11 air-flow fixed plate of test motherboard 12
13 power supply fan, 14 power module 15 tests network interface
The power switch of 16 lower box body, 17 dividing plate 18
19 status switch, 20 SR 21 debugs serial ports
The debugging serial interface of 22 optical fiber interface 23
Specific embodiment
The utility model will be further described with reference to the accompanying drawings and examples.
Fig. 1 is the utility model multifunction emulation bus test equipment front decomposition texture schematic diagram；Fig. 2 is new this practicality
Type multifunction emulation bus test equipment back side decomposition texture schematic diagram.
Fig. 1 and Fig. 2, the multifunction emulation bus test equipment of the utility model offer are provided, including upper cartridge body 4 is with
Box body 16, is provided with PCIe emulation boards 7 and test motherboard 10 in the upper cartridge body 4, power supply mould is provided with the lower box body 16
Block 14 and power supply fan 13, the lower box body 16 are provided with the Peripheral Interface being connected with PCIe emulation boards 7, wherein, the test is female
The lower section of plate 10 is provided with air-flow fixed plate 11, and guiding gutter is formed with the air-flow fixed plate 11, and the power module 14 is consolidated
The lower section of air-flow fixed plate 11 is scheduled on, the centre of the test motherboard 10 offers ventilation slot, is provided with below the ventilation slot
Radiator fan 12, the top of the PCIe emulation boards 7 is provided with airflow plate 5, is diffuseed to form from centre to surrounding on the airflow plate 5
There is louvre, the first heat dissipation channel, the PCIe emulation boards are formed between the lower section of the PCIe emulation boards 7 and test motherboard 10
The second heat dissipation channel is formed between 7 top and airflow plate 5.
The multifunction emulation bus test equipment that the utility model is provided, with following function：
1) test function
Used as test equipment, product can carry out PCIe bus access, such as fiber buss plate to various Avionics data bus boards
Card, AFDX buses board, 1553 bus boards etc. and the functional performance to these boards is tested.
2) Bus simulator
Arrange in pairs or groups various adapters, whole product can be as fiber-optic signal, 1553 signals, AFDX signal analyzers, by fixed
Software processed can be supported with serial ports, the read-write of Ethernet controlling bus data.
3) video source function
Do not arrange in pairs or groups adapter when, product can be used as DVI video sources, and highest supports that the DVI videos of 1080P resolution ratio produce work(
Energy；During collocation video adapter, product can be used as various video source.
Knob locking switch utility model：Knob insertion box body after assembling, rotates, by the snap lock of spring after insertion
Firmly box body, makes it tightly be locked in equipment.In dismounting, turn knob can be with very convenient dismounting by the elastic force of spring.This
Knob locking mode is planted, instead of makes to be screwed, the inconvenient and influence to outward appearance for being brought.
Radiating utility model：When the PCIe simulation cards of the test equipment are run, itself return and produce substantial amounts of heat, it is necessary to very
Good radiating system, and heat generating spot is above board, so as to want to reach good radiating extremely difficult.It is imitative for PCIe
True board has carried out heat dissipation wind channel design, and to the equipment in horizontal plane any direction, the heat transfer free convection on surface can be used down
Row simplify formula and calculate：
Q2=2.5CA △ t1.25/D0.25
Wherein, Q2--- surfaces Natural Heat Convection amount (W)；C--- coefficients, during level board, it is 0.54 that heat faces up, down
It is 0.27；It is 0.59 during perpendicular flat board；A--- area of dissipations (m2)；The temperature difference (DEG C) of △ t--- heat exchange surfaces and fluid (air)；
D--- characteristic sizes, for erecting flat board or perpendicular cylinder, characteristic size is height H, and other are (long+wide)/2, and unit is m.
According to radiating computing formula, the heat sent when working PCle simulation cards carries out finite element analysis of heat transmission,
A-- heat removal surface areas (m2), if radiator is printed board, cooling surface area is 1.3 times of one side area, because the back side dissipates
Heat is about 30% above；The difference DEG C of main device surface temperature and temperature in chassis in Δ t-- air channels；Hc-- heat convections
Coefficient, it is relevant with duct dimension shape.
Carried out radiating board with the fan specified according to formula, but because the radiating position of the simulation card of the PCle exists
The top of circuit board, depends merely on fan and blows from the bottom up, can not carry out effective radiating to board euthermic chip, is devised for this
Exclusive Duct design, as shown in figure 3, to a flow direction specified of wind, entering to the specified location for needing radiating so as to reach
Row radiating.
Fan is placed in organic box body, by the ventilating opening of motherboard when being blown on wind direction, PCIe simulation cards bottom is blown to
Wind can disperse to surrounding, and tray interior structure design makes wind be flowed according to specified direction, the Duct design, and wind direction flowing is as schemed
The direction flowing of red arrow, finally flows out from specified air port again, can thus give PCIe simulation cards top heat generating spot
Radiated well.
Lower box body 16 is made up of components such as lucite:Material used by lower box body is lucite, processing work used
Skill is that integral type processes (non-board- is spliced), and opposing metallic alleviates weight and cost, and outward appearance in material
(translucent) more attractive in appearance.
Although the utility model is disclosed as above with preferred embodiment, so it is not limited to the utility model, any
Those skilled in the art, not departing from spirit and scope of the present utility model, when a little modification and perfect, therefore this can be made
The protection domain of utility model is when by being defined that claims are defined.
Claims (7)
1. a kind of multifunction emulation bus test equipment, including upper cartridge body (4) and lower box body (16), set in the upper cartridge body (4)
PCIe emulation boards (7) and test motherboard (10) are equipped with, power module (14) and power supply fan are provided with the lower box body (16)
(13), the lower box body (16) is provided with the Peripheral Interface being connected with PCIe emulation boards (7), it is characterised in that the test motherboard
(10) air-flow fixed plate (11) is provided with below, guiding gutter, the power module is formed with the air-flow fixed plate (11)
(14) lower section of air-flow fixed plate (11) is fixed on, the centre of the test motherboard (10) offers ventilation slot, the ventilation slot
Lower section be provided with radiator fan (12), airflow plate (5) is provided with above the PCIe emulation boards (7), on the airflow plate (5) by
It is middle to have diffuseed to form louvre to surrounding, form first between the lower section of the PCIe emulation boards (7) and test motherboard (10)
Heat dissipation channel, the second heat dissipation channel is formed between the top of the PCIe emulation boards (7) and airflow plate (5).
2. multifunction emulation bus test equipment as claimed in claim 1, it is characterised in that the two of the test motherboard (10)
Side is provided with fixed lock (6), and the upper cartridge body (4) is by pressing fixed lock (6) phase on knob and test motherboard (10)
Even, the airflow plate (5) is fixedly linked by fixed lock (6) and test motherboard (10), the PCIe emulation boards (7) and is tested
Plate (9) is fixedly linked by fixed bolt (8) and test motherboard (10).
3. multifunction emulation bus test equipment as claimed in claim 2, it is characterised in that the pressing knob includes fixing
Connected the first knob (1) and the second knob (3), spring (2), institute are provided between first knob (1) and the second knob (3)
State the second knob (3) put in fixed lock (6) and press rotate after fitted locking with the inner surface of fixed lock (6), it is described
Spring (2) in the locked condition, fits on the inside of one end and the first knob (1), the outer surface of the other end and fixed lock (6)
Fit.
4. multifunction emulation bus test equipment as claimed in claim 1, it is characterised in that the radiator fan (12) and electricity
Dividing plate (17) is set between source fan (13), and the air-flow of radiator fan (12) blowout after tested divulge information by the middle of motherboard (10)
After groove, along the first heat dissipation channel from being flowed to both sides in the middle of PCIe emulation boards (7) bottom, then pass through air-flow along the second heat dissipation channel
Louvre outflow on plate (5), upper cartridge body (4) both sides are setting ventilating opening positioned at the top of airflow plate (5) so that air-flow
The 3rd heat dissipation channel, first heat dissipation channel, the second heat dissipation channel and the are formed between the top of plate (5) and upper cartridge body (4)
Three heat dissipation channels join end to end successively.
5. multifunction emulation bus test equipment as claimed in claim 1, it is characterised in that radiated on the airflow plate (5)
Hole is from centre to surrounding circumferentially radial distribution.
6. multifunction emulation bus test equipment as claimed in claim 1, it is characterised in that the material of the upper cartridge body (4)
It is heat radiating metal, the lower box body (16) is integrally formed by lucite.
7. multifunction emulation bus test equipment as claimed in claim 1, it is characterised in that the Peripheral Interface includes test
Network interface (15), debugging serial ports (21), optical fiber interface (22) and debugging serial interface (23), are additionally provided with power supply and open on the lower box body (16)
Close (18), status switch (19) and SR (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621453929.0U CN206312127U (en) | 2016-12-28 | 2016-12-28 | Multifunction emulation bus test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621453929.0U CN206312127U (en) | 2016-12-28 | 2016-12-28 | Multifunction emulation bus test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206312127U true CN206312127U (en) | 2017-07-07 |
Family
ID=59246677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621453929.0U Withdrawn - After Issue CN206312127U (en) | 2016-12-28 | 2016-12-28 | Multifunction emulation bus test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206312127U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106776192A (en) * | 2016-12-28 | 2017-05-31 | 上海埃威航空电子有限公司 | Multifunction emulation bus test equipment |
-
2016
- 2016-12-28 CN CN201621453929.0U patent/CN206312127U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106776192A (en) * | 2016-12-28 | 2017-05-31 | 上海埃威航空电子有限公司 | Multifunction emulation bus test equipment |
| CN106776192B (en) * | 2016-12-28 | 2023-09-19 | 上海埃威航空电子有限公司 | Multifunctional simulation bus test equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170707 Effective date of abandoning: 20230919 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20170707 Effective date of abandoning: 20230919 |