CN206282858U - optical sensor package body and cap - Google Patents
optical sensor package body and cap Download PDFInfo
- Publication number
- CN206282858U CN206282858U CN201620947062.8U CN201620947062U CN206282858U CN 206282858 U CN206282858 U CN 206282858U CN 201620947062 U CN201620947062 U CN 201620947062U CN 206282858 U CN206282858 U CN 206282858U
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- China
- Prior art keywords
- inwall
- cap
- package body
- optical sensor
- opening
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Light Receiving Elements (AREA)
Abstract
This disclosure relates to optical sensor package body and cap, wherein one or more embodiments are related to a kind of system in package (SiP) of the Optical devices for such as degree of approach sensing or optical distance measurement apparatus etc..One embodiment is related to a kind of optical sensor package body, and the optical sensor package body includes the sensor die and the luminescent device and cap of substrate coupling of substrate and substrate coupling.The cap is positioned around multiple side surfaces of the sensor die and covers at least a portion of the substrate.The cap includes the first side wall and second sidewall, the inwall with the first side surface and the second side surface and installation surface and the cover piece contacted with the first side wall and the second sidewall and the inwall.First side surface and second side surface are transverse to the installation surface, and the inwall includes being extended into from the installation surface opening of the inwall.First bonding agents material is arranged in the sensor die and is at least partially situated in the opening, and the inwall is fixed into the sensor die.
Description
Technical field
The embodiment of present disclosure is related to optical sensor package body, and in particular to optical sensor package body and cap, and
And relate more specifically to that there is the optical pickocff of the cap for comprising liquid or otherwise preventing adhesive material spilling to seal
Dress body.
Background technology
Optical pickocff (such as proximity sensor) is used to detect the presence of object nearby and can be connect in no physics
Touch do so in the case of object.Proximity sensor can be used in various electronic equipments, such as camera, phone (including intelligence
Phone), vehicle, machine and may wish to detect the other equipment of the presence of object nearby.The presence of object near detection
Afterwards, electronic equipment is configured for performing as mechanical features is moved into home, coupling or decoupling telecommunication
Function or any other desired function.
Proximity sensor generally includes the luminescent device such as light emitting diode (LED) and the light such as photodiode connects
Receive sensor.LED and photodiode are packaged in sensor encapsulation together.Briefly describe, LED is sealed by sensor
First opening of dress body is gone out by radiation-emitting.If object is reflected near sensor encapsulation, appropriate transmitting radiation
Leave object and back towards sensor encapsulation.The reflected radiation in part enters in sensor encapsulation close to the pole of photoelectricity two
Second opening of pipe.Photodiode receives reflected radiation and generates the electric signal of the radiation for indicating to receive.
Sensor encapsulation generally carries out telecommunication with imageing sensor processor.Imageing sensor processor sends out LED
Penetrate the electric signal for radiating and receiving the photodiode for carrying out the reflected radiation that self-indication is received.Typically, image sensing
Device processor is closed in the packaging body of its own, and sensor encapsulation and imageing sensor processor packaging body all couplings
Be connected to plate (such as circuit board) and by the plate with it is electrically coupled to each other.
Additionally, cap is generally included in proximity sensor packaging body.Cap includes the spoke for having launched
The opening penetrated and the opening for receiving reflected radiation.Blow vent can be included in cap, for that will be passed from internal
Gas in sensor packaging body is emitted into external environment condition, and especially such as cap is being attached on imageing sensor processor and plate
Heat treatment process in.Cap is attached in substrate and imageing sensor processor by adhesive material (such as viscose glue).However,
In viscose glue installation and/or solidification process, it may occur however that the problem that viscose glue overflows, wherein, viscose glue is along the inwall of cap to upstream
Move and blow vent may be blocked and the opening for launching or receiving light may be further covered.
Utility model content
One or more embodiments are related to a kind of for the system-level of Optical devices (such as degree of approach sensing or range unit)
Encapsulation (System in Package, SiP).One embodiment is related to a kind of optical sensor package body, optical pickocff envelope
Dress body includes substrate；Sensor die, sensor die is couple to substrate；Luminescent device, luminescent device is couple to substrate；And
Cap, cap is positioned at around the side surface of sensor die and covers at least a portion of substrate, and cap includes：First side
Wall and second sidewall, inwall, inwall have the first and second side surfaces and installation surface, and the first and second side surfaces are vertical
In installation surface, inwall includes that self installation surface extends into the opening of inwall, and cover piece, the cover piece and the first and second sides
Wall and inwall are in contact；And first bonding agents material, the first bonding agents material be located at sensor die on and at least
Part is located within opening, and inwall is fixed to sensor die by first bonding agents material.
In one embodiment, opening includes extending through the inwall and passing through from the installation surface of the inwall
The groove of the cover piece.
In one embodiment, opening includes prolonging from the installation surface and from first side surface of the inwall
Extend into the first recess of the inwall.
In one embodiment, further include to prolong from the installation surface and from second side surface of the inwall
The second recess of the inwall is extended into, the first bonding agents material is at least partially disposed within second recess.
In one embodiment, inwall includes extending outwardly beyond the extension of second side surface, wherein described open
Mouth includes being extended into from the installation surface the first recess of the inwall and the adjoining extension first surface.
In one embodiment, further include to extend into the inwall simultaneously from second side surface of the inwall
Second recess of the adjoining extension second surface.
In one embodiment, further include to extend into the inwall from first side surface of the inwall
3rd recess.
In one embodiment, luminescent device includes Vcsel (VCSEL) and light emitting diode
At least one of (LED).
In one embodiment, further include：It is positioned between the first side wall of the cover piece and the substrate
Second bonding agents material；And it is positioned at the 3rd bonding agent material between the second sidewall of the cover piece and the substrate
Material, described second and the 3rd adhesive material first and second side wall is individually secured to the substrate.
In one embodiment, first bonding agents, the second bonding agents and the 3rd bonding agent include viscose glue.
Another embodiment for providing is related to a kind of cap for optical sensor package body, cap to include：The first side wall
And second sidewall；Inwall；And cover piece, the cover piece is in contact with first and second side wall and the inwall, the inwall
Opening including extending into the inwall from the first surface of the inwall, the opening is configured for accommodating bonding agent
Material.
In one embodiment, opening includes extending into the inwall from first side surface of the inwall
Groove.
In one embodiment, groove extends through the inwall and through the cover piece.
In one embodiment, opening includes the first surface from the inwall and the first side table from the inwall
Face extends into the first recess of the inwall, and first side surface is transverse to the first surface.
In one embodiment, inwall is further included from the first surface of the inwall and from the inwall
Second side surface extends into the second recess of the inwall, and second side surface is relative and horizontal with first side surface
To in the first surface.
In one embodiment, inwall include transverse to the first surface the first side surface and the second side surface, with
And the extension of second side surface is extended outwardly beyond, wherein the opening includes the first surface from the inwall
Extend into the first recess of the inwall and the first surface of the adjoining extension.
In one embodiment, inwall further includes to be extended into described from first side surface of the inwall
Second recess of wall.
Specifically, cap allows adhesive material to be flowed into the opening formed in the inwall of cap, thus prevents from gluing
Connect agent material to be overflowed upwards along the side wall of cap, this spilling can cover light transmitting or the light-receiving of optical sensor package body
Opening.Additionally, this spilling (being prevented by cap provided herein and optical sensor package body) can be resulted in cap
In one or more ventilating openings obstruction.
In one or more embodiments, by filling with adhesive material the opening in inwall, cap can be attached to
Substrate and/or sensor die.For example, in embodiment, being open can include the inwall and cover piece that pass completely through cap and shape
Into groove.During then adhesive material can be applied in groove, through cover piece and in sensor die.In other embodiment
In, the opening in cap can be formed with only partially through inwall, and in this case, adhesive material can be applied in sensing
On the surface of device nude film, and the inwall of cap can be positioned on adhesive material.Therefore opening can accommodate bonding agent material
Stream, thus prevents from being overflowed upwards along the side surface of inwall.
Additionally, another embodiment is related to a kind of cap for optical sensor package body, cap to include：The first side wall
And second sidewall；Inwall；And cover piece, the cover piece is in contact with the first and second side walls and inwall, and inwall is included from inwall
First surface extends into the opening of inwall, and opening is configured for accommodating adhesive material.
Brief description of the drawings
Fig. 1 is the viewgraph of cross-section that the optical sensor package body of viscose glue overflow problem occurs wherein.
Fig. 2A is the top view of the optical sensor package body including cap of the embodiment according to present disclosure.
Fig. 2 B are the viewgraph of cross-section of the optical sensor package body shown in Fig. 2A.
Fig. 3 A to Fig. 3 C are that the displaying of the embodiment according to present disclosure is formed in optical sensing shown in Fig. 2A and Fig. 2 B
The viewgraph of cross-section of the method for device packaging body.
Fig. 4 is the viewgraph of cross-section of the optical sensor package body of another embodiment according to present disclosure.
Fig. 5 is the viewgraph of cross-section of the optical sensor package body of the still another embodiment according to present disclosure.
Specific embodiment
Fig. 1 illustrates the optical sensor package body 10 as known to possibility in the art.Optical sensor package body 10
Sensor die 14 including being fixed to substrate 12.Luminescent device 16 is fixed in substrate 12.Optical sensor package body 10
Cap 20 is further included, the cap 20 includes side wall 22, cover piece 24 and inwall 26.Cap 20 includes the first opening 32 and second
Opening 34, by first opening and the second opening, the light launched by luminescent device 16 is sent (for example, by the first opening
32), and by the sensor regions 18 that the light that object reflects is formed in sensor die 14 receive (for example, being opened by second
Mouth is 34).
First transparent window 42 and the second transparent window 44 attach on cap 20 (for example, as shown attach to cover piece
On 24 lower surface), and respectively the first blow vent 36 is formed between the first opening 32 and the first transparent window 42, and the
Two blow vents 38 are formed between the second opening 34 and the second transparent window 44.As indicated, cap 20 attaches to (example in substrate 12
Such as, side wall 22 is attached in substrate 12) and attach in sensor die 14 (for example, inwall 26 attaches to sensor die
On 14).Cap 20 is fixed by adhesive material (such as viscose glue 46).
As shown in figure 1, during or after the process that cap 20 is attached into substrate 12 and sensor die 14, viscose glue 46
(for example, being overflowed from the lower surface or side surface of inwall 26) can be overflowed from inwall 26 to exceed the side surface of inwall 26 and enter
And/or through blow vent 36,38 any one or both, thus blocking blow vent 36,38 and prevents or otherwise hinders
Air-flow passes through blow vent 36,38.This may for example occur in the installation of viscose glue 46 and/or solidification process.Additionally, such as Fig. 1 institutes
Show, viscose glue 46 can partially or even wholly cover the first opening 32 and the second opening one of 34 or both.
According to one or more embodiments that present disclosure is provided, Fig. 2A is to include the optical sensor package body of cap 120
200 top view, and Fig. 2 B are the viewgraph of cross-section intercepted along line 2B of the optical sensor package body 200 of Fig. 2A.Fig. 2A
With the optical sensor package body 200 of Fig. 2 B structurally and functionally similar with the optical package 10 shown in Fig. 1；However, light
It is different to learn the cap 120 of sensor encapsulation 200, and reduces or eliminates the cap 20 with the optical package 10 of Fig. 1
Associated viscose glue overflow problem.
Such as from Fig. 2A and Fig. 2 B, cap 120 includes side wall 122, cover piece 124 and inwall 126.Cap 120 is further
Including the first opening 32 and the second opening 34, first opening and second is open for sending the light launched by luminescent device 16
(for example, by first opening 32) and for receiving the light (for example, by second opening 34) reflected by object.
First transparent window 42 and the glued agent material 150 of the second transparent window 44 are adhered on cap 120 (for example, such as
Shown is adhered on the lower surface of cover piece 124), the adhesive material 150 can be arranged to for by the first transparency window
The transparent window 44 of mouth 42 and second is securely attaching to any material on cap 120.In one or more embodiments, it is bonded
Agent material 150 can be viscose glue.In other embodiments, adhesive material 150 can be any adhesive material, such as viscous cream,
Epoxy resin, film, adhesive tape etc..As shown in Figure 2 B, the first transparent window 42 and the second transparent window 44 can attach to cap
The lower surface (that is, the horizontal-extending part between inwall 126 and side wall 122 of cap 120) of the cover piece 124 of lid.
In one or more embodiments, and with the cap 20 shown in Fig. 1 contrast, cap 20 can be formed as transparent
There is no blow vent between window 42,44 and cover piece 124.Therefore, when compared with the cap 20 shown in Fig. 1, the height of cap 120
Can be lowered.
The inwall 126 of the cap 120 includes groove 160.As shown in Figure 2 B, groove 160 can be formed to pass completely through inwall
126 (for example, from upper surfaces of cover piece 124 through the lower surface or installation surface to inwall 126).However, at one or more
In embodiment, groove 160 can be formed as only partially within inwall 126.For example, groove 160 can be in the lower surface of inwall 126
Place has opening and can extend upward into the level of inwall 126 to the upper surface less than inwall 126.
Such as visible in the top view of Fig. 2A, groove 160 can have what is extended across the upper surface of the cover piece 124 of cap 120
Opening.Groove 160 can have different shape and/or size.For example, in one or more embodiments, groove 160 can be worn
Cross one or more through holes that the core of the inwall 126 of cap 120 is formed.Groove 160 can be by inwall 126
What the middle any method for forming groove or through hole was formed, for example, by etching, perforation, drilling etc. through cap 120 inwall 126.
As shown in Figure 2 B, optical sensor package body 200 includes the sensor die of the upper surface for being fixed on substrate 12
14.Briefly describe, substrate 12 includes one or more insulating barriers and conductive layer.The first surface 11 of substrate 12 is (for example, upper table
Face) include pad (not shown), and the second surface 13 (for example, lower surface) of substrate 12 includes pad or welding zone (not shown).
One on the via that pad on first surface 11 is formed by conductive trace and/or in substrate 12 and second surface 13 or
Multiple pads carry out telecommunication.The outer surface of the formation optical sensor package of second surface 13 body 200 of substrate 12, and the second table
Welding zone on face 13 is used to for optical sensor package body 200 to be electrically coupled to another device or plate (not shown).
Sensor die 14 is fixed in the first surface 11 of substrate 12 by adhesive material 252.Adhesive material 252
Any material for making sensor die 14 be held in place in assembling technology procedure can be arranged to.For example, bonding
Agent material 252 can be adhesive tape, viscous cream, viscose glue or any other suitable material.In one or more embodiments, bonding agent
Material 252 is die attached film.
Sensor die 14 is made up of semi-conducting material (such as silicon).Sensor die 14 includes active surface, the active table
Face includes one or more electric components (such as integrated circuit).Integrated circuit can be analog or digital circuit, the simulation or number
It is that word circuit is implemented as being formed in nude film and the electrical design according to nude film and the active device that function is electrically interconnected, passive
Device, conductive layer and dielectric layer.Specifically, sensor die 14 includes being formed the electric component of application specific integrated circuit (ASIC).
Therefore, as known in the art, sensor die 14 includes the circuit for sending, receiving and analyzing electric signal.
In the embodiment for being shown, active surface is located at the upper part of sensor die 14.The upper table bread of sensor die 14
Include the pad for sensor die to be electrically coupled to substrate 12.
As shown, luminescent device 16 is fixed on the first surface 11 of substrate 12.In alternative embodiments, can be by
Luminescent device 16 is positioned in sensor die 14.Luminescent device 16 can be fixed to substrate 12 by adhesive material 254
On first surface 11.Adhesive material 254 can apply to be fixed to luminescent device 16 upper surface of sensor die 14
Any material, such as adhesive tape, viscous cream, viscose glue, die attached film or any other suitable material.
Luminescent device 16 is configured for CF or frequency range transmitting radiation.In one embodiment, send out
Optical device 16 launches infrared (IR) radiation.Luminescent device 16 can be Vcsel (VCSEL) or luminous two
Pole pipe (LED) (for example, infrared LED).
Luminescent device 16 is electrically coupled to the sensor die 14 (for example, being directly electrically coupled to sensor die 14 and/or wearing
Cross the substrate 12 as shown in the embodiment of Fig. 2 B and be coupled directly to sensor die 14) and be configured for receiving telecommunications
Number (e.g., from the power signal of sensor die 14) and sent out with specific frequency or frequency range in response to receiving the signal
Penetrate radiation.Specifically, sensor die 14 is electrically coupled to substrate 12 by one or more Elecrical connectors, this one or more
Elecrical connector is in the embodiment shown conductor wire 62.Thus, the first end of conductor wire 62 is coupled to sensor
Bonding welding pad on nude film 14, and the second end of conductor wire 62 is coupled to the pad on the first surface 11 of substrate 12.Similarly, send out
Optical device 16 is electrically coupled to the first surface 11 of substrate 12 by one or more conductor wire 64.For example, the first of conductor wire 64
End can be coupled to the bonding welding pad on luminescent device 16, and the second end of conductor wire 64 can be coupled to the first table of substrate 12
Pad on face 11.In this way, luminescent device 16 can carry out telecommunication through substrate 12 and sensor die 14.
In another embodiment, Elecrical connector is conductive projection so that sensor die 14 and/or luminescent device 16
Substrate 12 is coupled to by flip-chip arrangement well known in the art.
Sensor die 14 include sensor regions 18, the sensor regions 18 be formed in the upper surface of sensor die 14 or
Otherwise it is coupled to the upper surface of sensor die 14.Luminescent device 16 is in response to the electricity that is received from sensor die 14
Signal transmitting radiation, and sensor regions 18 receive reflected radiation and for sensor die 14 provides the telecommunications for processing
Number.In one or more embodiments, sensor regions 18 can be or the array including light-sensitive element, e.g., photodiode battle array
Row, single-photon avalanche diode (SPAD) array and it is configured for the similar array of the reflected radiation of detection.
The side wall 122 of cap 120 is fixed on the first surface 11 of substrate 12, and the inwall 126 of cap 120 is fixed on
The upper surface of the sensor die 14 between luminescent device 16 and sensor regions 18.The glued agent material 146 of cap 120 is fixed,
The adhesive material can be any adhesive material and can be similar and different with those described above adhesive material.At one
In embodiment, adhesive material 146 is made up of the adhesive material for being configured for being formed light barrier, such as black glue.
In one or more embodiments, adhesive material 146 is flowable adhesive material.
The inwall 126 of cap 120 forms light barrier between luminescent device 16 and sensor regions 18.That is, cap 120 is interior
Wall 126 prevents the light projected from luminescent device 16 from being received by sensor regions 18 by inwall 126.Comparatively speaking, except by
Outside the light that two openings 34 receive, sensor regions 18 are optically isolated by cap 120.
Cap 120 can be formed by any rigidity or semi-rigid material (such as plastic material).In one embodiment,
Cap 120 is formed by liquid crystal plasticses.
In operation, sensor die 14 is configured for so that luminescent device 16 is by the first 32 launching lights of opening.
The light of transmitting is reflected by neighbouring object and is advanced through the second opening 34, and sensor regions 18 receive reflected light.Sensor
Nude film 14 receives signal and is configured for reason sensing unit 18 at when reflected light is received and gives birth to from sensor regions 18
Into signal.
The method that Fig. 3 A to Fig. 3 C illustrate the optical sensor package body 200 of manufacture Fig. 2A and Fig. 2 B according to each embodiment
Each different step.As shown in Figure 3A, there is provided cap 120, the cap can be the cap including groove 160 as shown in Figure 2 B
Lid 120.Similarly, there is provided substrate 12, wherein, sensor die 14 and luminescent device 16 respectively by adhesive material 252,
254 first surfaces 11 for attaching to substrate 12.As described above, sensor die 14 and luminescent device 16 pass through conductor wire respectively
62nd, 64 it is electrically coupled to substrate 12.
Adhesive material 146 is applied in the of substrate 12 at the position outside sensor die 14 and luminescent device 16
On one surface 11.Alternatively, adhesive material 146 can be applied in the lower surface of the side wall 122 of cap 120.The quilt of cap 120
Side wall 122 is positioned so as on adhesive material 146, and the inwall 126 including institute's groove 160 is positioned in biography
On the upper surface of sensor nude film 14.
As shown in Figure 3 B, cap 120 is dropped in substrate 12 so that viscous on the lower surface of side wall 122 and substrate 12
Agent material 146 is connect to contact.Downward pressure can be applied on cap 120 that cap 120 is positioned at into base as expected
On bottom 12.
As shown in Figure 3 C, cap 120 is attached to substrate 12 (that is, by adhesive material 146 by cap 120
Side wall 122 attach to substrate 12) after, groove 160 can completely or partially be filled out with glued agent material 146 (such as viscose glue)
Fill.Groove 160 can be put on the upper surface of sensor die 14 until appropriate adhesive material 146 by through groove 160
Adhesive material 146 filled groove 160 and be filled.Then adhesive material 146 can be left solidification, thus by cap
120 are securely attaching to substrate 12 and sensor die 14.
As pointed out above with respect to Fig. 2A and Fig. 2 B, groove 160 can be formed as only partially within inwall 126.For example,
Groove 160 can have opening at the lower surface of inwall 126 and can extend upward into inwall 126 to less than inwall 126
Upper surface level.In this case, a kind of method for forming the optical sensor package body with this cap
It is similar with the method shown in Fig. 3 A to Fig. 3 C；However, adhesive material 146 can be applied in the upper table of sensor die 14
On face and substrate 12 (for example, being used to for side wall 122 to be attached to substrate 12 as described above), at by cap top
Opening is with adhesive material 146 come filling slot 160.Then, cap can in a single step be forced into adhesive material 146
On, and putting on the adhesive material 146 on the upper surface of sensor die 14 can be pushed into the groove formed in inwall 126
Among 160.Therefore, adhesive material 146 can be moved up by groove 160, rather than the appearance overflowed more than inwall 126
Face.
Fig. 4 is that the cross section of the optical sensor package body 300 including cap 220 according to one or more embodiments regards
Figure.In addition to the difference that will be discussed below, the optical sensor package body 300 of Fig. 4 structurally and functionally with Fig. 2A and
The optical sensor package body 200 of Fig. 2 B is similar to.For purpose of brevity, optical sensor package body 200 and 300 is will not be described again herein
Total feature.
Between the optical sensor package body 300 shown in optical sensor package body 200 and Fig. 4 shown in Fig. 2A and Fig. 2 B
A difference be optical sensor package body 300 cap 220 include through inwall 226 groove.Another difference exists
Include step recess 262 in the inwall 226 of cap 220.With the cap 20 shown in Fig. 1 is with uniform profile and therefore works as cap
Lid 20 causes viscose glue 46 to overflow upwards and contrasted more than the inwall 26 of the outer surface of inwall 26, inwall 226 when attaching to substrate 12
Step recess 262 provided on every side of inwall 226 volume for cap 20 be mounted and solidify when (for example, work as
Cap 220 is forced into when on the adhesive material 146 put in substrate 12 and sensor die 14, and when bonding agent material
The solidification of material 146 is securely attaching to when in substrate 12 and sensor die 14 with by cap 220) accommodate adhesive material 146
Stream.
As shown in figure 4, optical sensor package body 300 can include the first blow vent 36 and the second blow vent 38, this
One blow vent and the second blow vent are located between first and second the 32,34 and first and second transparent windows 42,44 of opening respectively.
Additionally, as indicated, cap 220 can include the step extension positioned at side wall 222 with the joint of cover piece 224.
Fig. 5 is that the cross section of the optical sensor package body 400 including cap 320 according to one or more embodiments regards
Figure.In addition to the difference that will be discussed below, the optical sensor package body 400 of Fig. 5 is in light structurally and functionally with Fig. 4
Sensor encapsulation 400 is learned to be similar to.For purpose of brevity, the total spy of optical sensor package body 300 and 400 is will not be described again herein
Levy.
It is main between the optical sensor package body 400 shown in optical sensor package body 300 and Fig. 5 shown in Fig. 4
Difference is that the cap 320 of optical sensor package body 400 does not include step recess, but instead includes being formed at cap
Recess 361,362,363 in the various pieces of 320 inwall 326.These recesses 361,362,363 can be formed in same water
It is flat upper (that is, in the something in common with a distance from the upper surface of inwall 326 or lower surface), or they can be handed over relative to each other
It is wrong.For example, the first recess 361 can be formed as extending into inwall 326 from the first side surface 370, and the second recess 362 can be with
Be formed as extending into inwall 326 from the second side surface 372.As shown in figure 5, the first recess 361 and the second recess 362 can be with shapes
Into in same level.3rd recess 363 can be formed in different from the first recess 361 and the second recess 362 along inwall 326
Level on.Further, inwall 326 can include one or more extensions 380.As shown in figure 5, extension 380 can be with
It is a part for inwall 326, the extension stretches out (for example, the substantially vertical water relative to inwall 326 as shown
Level land) exceed the second side surface 372.Extension 380 includes first surface, second surface and the 3rd surface (for example, as shown
Upper surface, lower surface and side surface).
The recess 361,362,363 formed in inwall 326 provides body along every side of inwall 326 at different height
The long-pending stream for accommodating adhesive material 146 when cap 320 is mounted and solidifies.Additionally, what is formed in inwall 326 prolongs
Stretching thing 380 can provide the volume (that is, in the second recess 362 and the 3rd recess 363) of increase for accommodating bonding agent material
The stream of material 146, thus stores adhesive material 146 and prevents adhesive material 146 from being overflowed upwards along the side surface of inwall 326
And block blow vent or masking opening 32,34.Any number of recess may be formed in inwall 326 and can be along interior
Anywhere wall 326 positions.Further, one or more extensions 380 can be formed at any along inwall 326
Side, the recess for extending outwardly to form the volume with increase, the volume of the increase be used to store the stream of adhesive material and
Prevent or otherwise accommodate with the spilling of adhesive material.
As shown in figure 5, in one or more embodiments, cap 320 can include being connect with cover piece 324 positioned at side wall 322
Step extension at conjunction.
Any cap in cap described here is (for example, respectively optical sensor package body 200,300,400
Cap 120,220, optical sensor package body 320) can be included in different electronic installations and can be such as
It is coupled to microprocessor, power supply, memory or other this electronic units.Electronic installation includes optical sensing described herein
Device packaging body, can also include such as cell phone, smart phone, tablet PC, camera and/or may be located at clothes,
Wearable computing device in shoes, wrist-watch, glasses or other any wearable structures.In certain embodiments, this kind of electricity
Sub-device or optical sensor package body described here may be located at the vehicles such as steamer and automobile, robot or appoint
What in his removable frame or machine.
The various embodiments described above can be combined to provide further embodiment.In light of the above-detailed description, can be right
Embodiment makes these and other changes.In a word, in claims below, the term for being used be not construed as by
Claims are confined to specific embodiment disclosed in the specification and claims, but should be interpreted as including
The gamut of all possible embodiment, the equivalent for having the right to obtain together with these claims.Correspondingly, claims
Do not limited by present disclosure.
Claims (17)
1. a kind of optical sensor package body, it is characterised in that including：
Substrate；
Sensor die, the sensor die is couple to the substrate；
Luminescent device, the luminescent device is couple to the substrate；And
Cap, the cap is positioned at around the side surface of the sensor die and covers at least of the substrate
Point, the cap includes:
The first side wall and second sidewall,
Inwall, the inwall has the first and second side surfaces and installation surface, and first and second side surface is perpendicular to institute
Installation surface is stated, the inwall includes being extended into from the installation surface opening of the inwall, and
Cover piece, the cover piece is in contact with first and second side wall and the inwall；And
First bonding agents material, the first bonding agents material is located on the sensor die and is at least partially disposed at described opening
Within mouthful, the inwall is fixed to the sensor die by the first bonding agents material.
2. optical sensor package body as claimed in claim 1, it is characterised in that the opening includes the institute from the inwall
Installation surface is stated to extend through the inwall and pass through the groove of the cover piece.
3. optical sensor package body as claimed in claim 1, it is characterised in that the opening is included from the installation surface
And extend into the first recess of the inwall from first side surface of the inwall.
4. optical sensor package body as claimed in claim 3, it is characterised in that further include from the installation surface simultaneously
The second recess of the inwall, the first bonding agents material at least portion are extended into from second side surface of the inwall
Divide and be located within second recess.
5. optical sensor package body as claimed in claim 1, it is characterised in that the inwall includes extending outwardly beyond institute
The extension of the second side surface is stated, wherein the opening includes extending into the inwall from the installation surface and adjoining is described
First recess of extension first surface.
6. optical sensor package body as claimed in claim 5, it is characterised in that further include from described in the inwall
Second side surface extends into the second recess of the inwall and the adjoining extension second surface.
7. optical sensor package body as claimed in claim 6, it is characterised in that further include from described in the inwall
First side surface extends into the 3rd recess of the inwall.
8. optical sensor package body as claimed in claim 1, it is characterised in that the luminescent device includes Vertical Cavity Surface
At least one of emitting laser (VCSEL) and light emitting diode (LED).
9. optical sensor package body as claimed in claim 1, it is characterised in that further include：
It is positioned at the second bonding agents material between the first side wall of the cover piece and the substrate；And
It is positioned at the 3rd adhesive material between the second sidewall of the cover piece and the substrate, described second and the 3rd
First and second side wall is individually secured to the substrate by adhesive material.
10. optical sensor package body as claimed in claim 9, it is characterised in that the first bonding agents, described second are glued
Connecing agent and the 3rd bonding agent includes viscose glue.
11. a kind of caps for optical sensor package body, it is characterised in that the cap includes：
The first side wall and second sidewall；
Inwall；And
Cover piece, the cover piece is in contact with first and second side wall and the inwall, and the inwall is included from the inwall
First surface extends into the opening of the inwall, and the opening is configured for accommodating adhesive material.
12. caps as claimed in claim 11, it is characterised in that the opening includes first side table from the inwall
Face extends into the groove of the inwall.
13. caps as claimed in claim 12, it is characterised in that the groove extends through the inwall and through the lid
Part.
14. caps as claimed in claim 11, it is characterised in that the opening includes the first surface from the inwall
And the first recess of the inwall is extended into from the first side surface of the inwall, first side surface is transverse to described
One surface.
15. caps as claimed in claim 14, it is characterised in that the inwall further includes described from the inwall
One surface and the second recess of the inwall is extended into from the second side surface of the inwall, second side surface and institute
The first side surface is stated relatively and transverse to the first surface.
16. caps as claimed in claim 11, it is characterised in that the inwall is included transverse to the first of the first surface
Side surface and the second side surface and extend outwardly beyond the extension of second side surface, wherein the opening include from
The first surface of the inwall extends into the first recess of the inwall and the first surface of the adjoining extension.
17. caps as claimed in claim 16, it is characterised in that the inwall further includes described from the inwall
One side surface extends into the second recess of the inwall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620947062.8U CN206282858U (en) | 2016-08-26 | 2016-08-26 | optical sensor package body and cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620947062.8U CN206282858U (en) | 2016-08-26 | 2016-08-26 | optical sensor package body and cap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206282858U true CN206282858U (en) | 2017-06-27 |
Family
ID=59084667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620947062.8U Active CN206282858U (en) | 2016-08-26 | 2016-08-26 | optical sensor package body and cap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206282858U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785357A (en) * | 2016-08-26 | 2018-03-09 | 意法半导体研发(深圳)有限公司 | Anti- viscose glue for optical sensor package body overflows cap |
-
2016
- 2016-08-26 CN CN201620947062.8U patent/CN206282858U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785357A (en) * | 2016-08-26 | 2018-03-09 | 意法半导体研发(深圳)有限公司 | Anti- viscose glue for optical sensor package body overflows cap |
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