CN206273054U - The heat abstractor of VR all-in-ones - Google Patents

The heat abstractor of VR all-in-ones Download PDF

Info

Publication number
CN206273054U
CN206273054U CN201621450729.XU CN201621450729U CN206273054U CN 206273054 U CN206273054 U CN 206273054U CN 201621450729 U CN201621450729 U CN 201621450729U CN 206273054 U CN206273054 U CN 206273054U
Authority
CN
China
Prior art keywords
ones
housing
fin
heat abstractor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201621450729.XU
Other languages
Chinese (zh)
Inventor
张兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Techology Co Ltd
Original Assignee
Weifang Goertek Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weifang Goertek Electronics Co Ltd filed Critical Weifang Goertek Electronics Co Ltd
Priority to CN201621450729.XU priority Critical patent/CN206273054U/en
Application granted granted Critical
Publication of CN206273054U publication Critical patent/CN206273054U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses the heat abstractor of VR all-in-ones, heat abstractor includes the main fin being fixedly connected with the casing, and the basal plane shape of main fin is adapted with the shape of housing, and the side of main fin is formed with the boss protruded towards the master chip of VR all-in-ones.The basal plane of main fin carries out the configuration design of imitative housing, main fin to the heat distance of housing can so be shortened, heat can be made to be dispersed into extraneous air as soon as possible by housing, heat will not be made to accumulate in the enclosure interior of VR all-in-ones all the time, master chip is caused to occur the phenomenons such as core, frequency reducing, make full use of the radiating potentiality of housing to be radiated, VR all-in-ones is reached thermal equilibrium state as early as possible.

Description

The heat abstractor of VR all-in-ones
Technical field
The utility model belongs to VR all-in-one technical fields, and in particular to a kind of heat abstractor of VR all-in-ones.
Background technology
VR all-in-ones are exactly possess independent processor to be set while supporting that the wear-type virtual reality of HDMI inputs shows It is standby.Possesses the function of operation independent, input and output.Spoken parts in an opera some, be exactly that smart mobile phone eliminates communication module, increased The ability of display processing unit, strengthens location sensitive, and it is made headset equipment.The principle of imaging still employs single screen Split screen technology, is amplified with simple convex lens and shown.With the development of VR all-in-one technologies, the function of VR all-in-ones is also increasingly Abundant, the subject matter brought therewith is exactly increasing caloric value, therefore the heat dissipation problem of VR all-in-ones becomes at this stage It is badly in need of the hot issue for solving.
At this stage, the radiating mode of VR all-in-ones mainly has two kinds.It is a kind of be by the active heat removal mode of fan cooling, The immediate problem that this radiating mode is brought is exactly the noise problem of fan, and user is worn over the position of head, and noise can be by one Determine the amplification of degree, be also exactly fan reliability in itself and to dust-proof so the experience effect of user can be substantially reduced Property requirement, these all will turn into influence VR all-in-one service lifes obstacle.
Another is that, by the passive radiating mode of metal heat sink, traditional metal heat sink uses finned Fin 1, as shown in figure 1, when in use, to prevent the thermal boundary layer between fin 11 from interacting, in order to avoid influence heat dispersion, by Space inside VR all-in-ones is limited, so the number of fin 11 can not be effectively ensured, causes radiating effect undesirable, Further, since this kind of finned fin 1 cannot carry out the conduction of heat by the housing of VR all-in-ones, so working as VR all-in-ones Internal heat is gathered when to a certain extent, and radiating effect can be caused to be deteriorated, and thus this kind of metal heat sink can not be to VR mono- Body machine is effectively radiated.So in the case of passive radiating, how to be carried out in use to VR all-in-ones effectively Ground radiating turns into current hot issue urgently to be resolved hurrily.
The content of the invention
Technical problem to be solved in the utility model is:A kind of heat abstractor of VR all-in-ones is provided, in VR all-in-ones During use, can effectively be radiated.
In order to solve the above technical problems, the technical solution of the utility model is:The heat abstractor of VR all-in-ones, the radiating Device is arranged in the housing of the VR all-in-ones, it is characterised in that the heat abstractor includes:It is fixedly connected with the housing Main fin, the basal plane shape of the main fin is adapted with the shape of the housing, the side system of the main fin There is the boss protruded towards the master chip of the VR all-in-ones.
Further, thermal interfacial material is filled between the boss and the master chip.
Further, the main fin leaves the spacing of 1-2mm with the front portion of the housing.
Further, the main fin is metal fin.
Further, the metal fin is the metal fin of black.
Further, the heat abstractor also includes auxiliary fin, the shape of the auxiliary fin and the shape of the housing Shape is adapted, and the auxiliary fin is affixed on the front inner wall face of the housing.
Further, the auxiliary fin uses graphite heat radiation fin.
By adopting the above-described technical solution, the beneficial effects of the utility model are:
The heat abstractor of VR all-in-ones of the present utility model includes the main fin being fixedly connected with the housing of VR all-in-ones, The basal plane shape of main fin is adapted with the shape of housing, and the side of main fin is formed with convex towards the master chip of VR all-in-ones The boss for going out.The basal plane of main fin carries out the configuration design of imitative housing, can so shorten main fin to the hot spoke of housing Distance is penetrated, heat can be made to be dispersed into extraneous air as soon as possible by housing, heat will not be made to accumulate in enclosure interior all the time, Cause master chip to occur the phenomenons such as core, frequency reducing, make full use of the radiating potentiality of housing to be radiated, VR all-in-ones is reached as early as possible To thermal equilibrium state.
The main fin of the heat abstractor of VR all-in-ones of the present utility model uses the fin of the configuration design of imitative housing, Compare with finned fin, be not in the situation of hot boundary layer reciprocal effect radiating, and this kind of heat radiating fin structure is molded Simply, overall weight is smaller than finned fin, allows users to more cosily use VR all-in-ones.
The heat abstractor of VR all-in-ones of the present utility model imitates housing in the front inner wall of housing using heat conduction glue The graphite heat radiation fin of profile, the heat that will be dispersed into using graphite heat radiation fin on housing is carried out uniformly, in increase housing radiating surface While product, it is also possible to the temperature of housing is maintained below set point of temperature all the time.
Brief description of the drawings
Fig. 1 is the structural representation of finned heat sink that uses of VR all-in-ones of prior art;
Fig. 2 is the structural representation of the heat abstractor of VR all-in-ones of the present utility model;
Fig. 3 is the structural representation of the main fin in Fig. 2;
In figure, the finned fin of 1-, 11- fins, 2- housings, the main fin of 3-, 31- boss, 32- basal planes, 4- is auxiliary to be dissipated Backing.
Specific embodiment
The utility model is further illustrated with reference to the accompanying drawings and examples.
With reference to shown in Fig. 2 and Fig. 3, the main fin 3 in the heat abstractor of VR all-in-ones is fixedly connected on housing 2, Main fin 3 can be fixedly connected on housing 2 by screw, and certainly, main fin 3 and housing 2 can also be normal by other The mode that is fixedly connected of rule is attached.The side of main fin 3 is formed with the boss 31 protruded towards the master chip of VR all-in-ones, Stamping technology, the hollow boss 31 stamped out on main fin 3, in order to preferably be carried out to master chip can be utilized Radiating, thermal interfacial material is filled between the microvoid that boss 31 and master chip are produced, and is easy to improve the thermal diffusivity of main fin 3 Energy.The shape of basal plane 32 of main fin 3 is adapted with the shape of housing 2, and the basal plane 32 of main fin 3 carries out the outer of imitative housing 2 Shape is designed, and can so shorten main fin 3 to the heat distance of housing 2, and heat can be made to be distributed as soon as possible by housing 2 To in extraneous air, VR all-in-ones can be made to reach thermal equilibrium state as soon as possible.
Main fin 3 can select metal fin, in order to strengthen its capacity of heat transmission and thermal radiation capability, can be by gold Category fin is processed as black, and the metal fin of black can be that metal fin is obtained by anodic oxidation, or metal Fin can also be obtained by spraying nanometer carbon coating, it is of course also possible to be obtained by some other known preparation method.
The spacing of 1-2mm can be left between the front portion of main fin 3 and housing 2, so, main fin 3 both away from Shrinking away from theshell body 2 is closer, is easy to be radiated using housing 2, and main fin 3 will not abut directly on housing 2 again, can avoid main dissipating When backing 3 is close to housing 2, the temperature of housing 2 may exceed the temperature of regulation, reduce the experience sense of user.
Heat abstractor also includes auxiliary fin 4, and auxiliary fin 4 can select graphite heat radiation fin, the shape of graphite heat radiation fin Shape with housing 2 is adapted, and the shape of graphite heat radiation fin is also the imitated structure of housing 2, and graphite heat radiation fin is utilized Heat-conducting glue or other modes are pasted onto on the inwall of the front portion of housing 2, can so avoid forming localized heat on housing 2 Point, when making the heat radiation in housing 2 to housing 2, can as soon as possible uniformly on housing 2, making full use of dissipating for housing 2 Hot area, while 2 area of dissipation of housing is increased, it is also possible to make the temperature of housing 2 maintain below set point of temperature all the time.
After employing heat abstractor of the present utility model, during Consumer's Experience VR all-in-ones, the heat that master chip is produced Amount passes to the boss 31 on main fin 3 by thermal interfacial material, spreads to whole main fin 3, the heat on main fin 3 Amount is delivered on housing 2 by the graphite heat radiation fin being pasted onto in the front inner wall of housing 2, and heat is dispersed into the external world by housing 2 In air, so as to complete the radiating to VR all-in-ones.
Although the foregoing describing specific embodiment of the invention, it should be appreciated by those skilled in the art being retouched The embodiment stated is only a part of embodiment of the invention, and rather than whole embodiments, these are merely illustrative, this The protection domain of invention is to be defined by the appended claims.Those skilled in the art is without departing substantially from principle of the invention and reality On the premise of matter, under not by any performing creative labour, various changes or modifications can be made to these implementation methods, But these changes and modification each fall within protection scope of the present invention.

Claims (7)

  1. The heat abstractor of 1.VR all-in-ones, the heat abstractor is arranged in the housing of the VR all-in-ones, it is characterised in that institute Stating heat abstractor includes:The main fin being fixedly connected with the housing, basal plane shape and the housing of the main fin Shape be adapted, the side of the main fin is formed with the boss protruded towards the master chip of the VR all-in-ones.
  2. 2. the heat abstractor of VR all-in-ones as claimed in claim 1, it is characterised in that between the boss and the master chip Filled with thermal interfacial material.
  3. 3. the heat abstractor of VR all-in-ones as claimed in claim 1, it is characterised in that the main fin and the housing Leave the spacing of 1-2mm in front portion.
  4. 4. the heat abstractor of VR all-in-ones as claimed in claim 1, it is characterised in that the main fin is heat dissipation metal Piece.
  5. 5. the heat abstractor of VR all-in-ones as claimed in claim 4, it is characterised in that the metal fin is the gold of black Category fin.
  6. 6. the heat abstractor of the VR all-in-ones as described in any one of claim 1 to 5, it is characterised in that the heat abstractor is also Including auxiliary fin, the shape of the auxiliary fin is adapted with the shape of the housing, and the auxiliary fin is affixed on the shell On the front inner wall face of body.
  7. 7. the heat abstractor of VR all-in-ones as claimed in claim 6, it is characterised in that the auxiliary fin uses graphite radiating Piece.
CN201621450729.XU 2016-12-27 2016-12-27 The heat abstractor of VR all-in-ones Active CN206273054U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621450729.XU CN206273054U (en) 2016-12-27 2016-12-27 The heat abstractor of VR all-in-ones

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621450729.XU CN206273054U (en) 2016-12-27 2016-12-27 The heat abstractor of VR all-in-ones

Publications (1)

Publication Number Publication Date
CN206273054U true CN206273054U (en) 2017-06-20

Family

ID=59047578

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621450729.XU Active CN206273054U (en) 2016-12-27 2016-12-27 The heat abstractor of VR all-in-ones

Country Status (1)

Country Link
CN (1) CN206273054U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703635A (en) * 2017-11-17 2018-02-16 重庆创通联达智能技术有限公司 A kind of VR glasses and its radiator structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703635A (en) * 2017-11-17 2018-02-16 重庆创通联达智能技术有限公司 A kind of VR glasses and its radiator structure

Similar Documents

Publication Publication Date Title
KR102334326B1 (en) Hardware Shield device and Electronic devices comprising the Same
CN206100427U (en) Loudspeaker unit
CN205958846U (en) VRAR helmet that compact is wireless
CN204859243U (en) Take wireless cell -phone shell that charges of interface
WO2016155328A1 (en) Speaker module
CN206212529U (en) The thermal dispersant coatings structure of portable electronic devices
CN203455761U (en) Notebook computer suction type heat radiator
CN103209574A (en) Heat dissipation device and method of mobile terminal, and mobile terminal
CN206273054U (en) The heat abstractor of VR all-in-ones
CN104965576A (en) Energy-saving environmentally friendly computer heat dissipation system
CN203840687U (en) Heat radiator, circuit board heat radiation structure, and electronic device
CN206921019U (en) A kind of computer cabinet for carrying out heat energy conversion
CN105487233B (en) A kind of VR glasses and its radiator structure
CN214041883U (en) Head-mounted electronic equipment
CN207124842U (en) Heat radiation module and electronic equipment
CN205883330U (en) Forced air cooling cell -phone heat abstractor
CN212323818U (en) Charging seat and electronic equipment
CN206573836U (en) Camera module
KR102172714B1 (en) Computer case
CN107966814A (en) VR heads with heat sinking function are aobvious
CN106325388A (en) Host lower cover with performance of high heat dissipation for notebook computer
CN204790815U (en) Energy -concerving and environment -protective computer cooling system
CN202857205U (en) Heat radiation electromagnetic wave absorption paster
TWM539736U (en) Power device
CN203250254U (en) Notebook computer side face radiator with adjustable height

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20201027

Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building)

Patentee after: GoerTek Optical Technology Co.,Ltd.

Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268

Patentee before: Weifang Goertek Electronics Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230104

Address after: 266104 No. 500, Songling Road, Laoshan District, Qingdao, Shandong

Patentee after: GOERTEK TECHNOLOGY Co.,Ltd.

Address before: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronics office building)

Patentee before: GoerTek Optical Technology Co.,Ltd.

TR01 Transfer of patent right