CN206272954U - A kind of reliability multi-layer PCB board high - Google Patents
A kind of reliability multi-layer PCB board high Download PDFInfo
- Publication number
- CN206272954U CN206272954U CN201621466209.8U CN201621466209U CN206272954U CN 206272954 U CN206272954 U CN 206272954U CN 201621466209 U CN201621466209 U CN 201621466209U CN 206272954 U CN206272954 U CN 206272954U
- Authority
- CN
- China
- Prior art keywords
- layer
- pcb board
- intermediate layer
- top layer
- layer pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of reliability multi-layer PCB board high, including the top layer, intermediate layer and the bottom that from top to bottom set gradually, one end of the top layer, intermediate layer and bottom is provided with through hole, and the top layer, intermediate layer and bottom are fixed by a plastic cement screw and the cooperation of the through hole；At least include a ground plane, a bus plane and an electro-magnetic screen layer in the intermediate layer, the ground plane is disposed adjacent and is arranged in pairs with bus plane, and the surface of the top layer and bottom is provided with an oxidation resistant protective layer.The multi-layer PCB board that the utility model is provided, it has capability of electromagnetic shielding good, and yields is high, the advantages of antioxygenic property is good.
Description
Technical field
The utility model is related to pcb board technical field, more particularly to a kind of reliability multi-layer PCB board high.
Background technology
As the increasingly sophisticated of the modern electronic product opering characteristic of electric apparatus and the height to power supply, signal etc. for thus bringing will
Ask, the number of plies of corresponding pcb board is more and more in production technology, the number of plies of existing some multi-layer PCB boards is from more next six
Layer, eight layers etc. increase to more than ten layers, the even up to tens layers having.Because the number of plies of multi-layer PCB board increases, can cause each
Certain electromagnetic interference can be produced so as to have impact on the performance of component on multi-layer PCB board between layer.In addition, traditional by weldering
Connect or method that fastener fixes multi-layer PCB board, it is difficult to the phenomenon of the PCB short circuits for avoiding triggering because there is metallic particles, from
And cause PCB to be scrapped.Further, since multi-layer PCB board was guaranteed the quality with certain time limit, if by the bag of multi-layer PCB board
After assembly and disassembly are lower, when the environment residing for it is more moist, it is easily caused multi-layer PCB board and is failed because of oxidation and scrap.
Utility model content
To overcome the problem of the deficiencies in the prior art and presence, the utility model provides a kind of reliability multi-layer PCB high
Plate, the multi-layer PCB board has capability of electromagnetic shielding good, and yields is high, the advantages of antioxygenic property is good.
The utility model is achieved through the following technical solutions：A kind of reliability multi-layer PCB board high, including by upper
Under the top layer, intermediate layer and the bottom that set gradually, one end of the top layer, intermediate layer and bottom is provided with through hole, institute
Top layer, intermediate layer and bottom is stated to be fixed by a plastic cement screw and the cooperation of the through hole；At least include in the intermediate layer
One ground plane, a bus plane and an electro-magnetic screen layer, the ground plane are disposed adjacent and are arranged in pairs with bus plane, the top
The surface of layer and bottom is provided with an oxidation resistant protective layer.
It is preferred that being provided with an adhered layer between the nut of the top layer and the plastic cement screw；The plastic cement screw
Screw rod is arranged with the cushion of an insulation.
Preferably, the one or both sides of the top layer, intermediate layer and bottom are provided with heat conductive insulating glue-line.
The reliability multi-layer PCB board high that the utility model is provided, its by setting an electro-magnetic screen layer in intermediate layer,
And by ground plane and the paired setting of bus plane, so that the capability of electromagnetic shielding of multi-layer PCB board can be effectively improved, and then can be effective
Improve the performance of the component on multi-layer PCB board；In addition, oxidation resistant protective layer is set by top layer and bottom, can be effective
The antioxygenic property of multi-layer PCB board is improved, the shelf-life of multi-layer PCB board is improved；Additionally, being fixed by being pressed using plastic cement screw
Multi-layer PCB board, can effectively prevent the phenomenon of short circuit, and effectively lift yields.
Brief description of the drawings
Fig. 1 is the cross-sectional view of multi-layer PCB board described in the utility model embodiment.
Wherein, drawing reference numeral is：10- top layers, 20- intermediate layers, 21- electro-magnetic screen layers, 30- bottoms, 40- plastic cement screws,
50- oxidation resistant protective layers, 60- adhered layers, 70- cushions, 80- heat conductive insulating glue-lines.
Specific embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with the drawings and specific embodiments the utility model is made into
One step is described in detail.
As shown in Figure 1, a kind of reliability multi-layer PCB board high, including top layer 10, the centre for from top to bottom setting gradually
Layer 20 and bottom 30, one end of the top layer 10, intermediate layer 20 and bottom 30 is provided with through hole, the top layer 10, in
Interbed 20 and bottom 30 are fixed by a plastic cement screw 40 and the cooperation of the through hole；At least include one in the intermediate layer 20
Ground plane, a bus plane and an electro-magnetic screen layer 21, the ground plane are disposed adjacent and are arranged in pairs with bus plane, the top
The surface of layer 10 and bottom 30 is provided with an oxidation resistant protective layer 50.In the present embodiment, by top layer 10 and bottom 30
Surface set an oxidation resistant protective layer 50 can effectively improve the antioxygenic property of multi-layer PCB board, so as to multi-layer PCB board can be improved
Shelf-life.Described intermediate layer 20 is mainly used in wiring, intermediate layer 20 to be set according to actual needs for the number of plies for connecting up
Put, the number of plies for being such as used to connect up can be six layers, eight layers, ten layers.As preferred embodiment, the top layer 10 and the plastic cement
An adhered layer 60 is provided between the nut of screw 40, the screw rod of the plastic cement screw 40 is arranged with the cushion of an insulation
70.The adhered layer 60 is used for preferably fixed number plastic cement screw 40, and the cushion 70 then can protected preferably
While top layer 10, intermediate layer 20 and bottom 30, more preferable fixation is may also function as.
Used as one of preferred embodiment, the material of the electro-magnetic screen layer 21 is metal whisker or conducting polymer
Nano wire., as the constituent material of electro-magnetic screen layer 21, effectively protected by using metal whisker or conducting polymer nano wire
While demonstrate,proving the shielding properties of multi-layer PCB board, can also effectively strengthen the intensity of pcb board.Additionally, the ground in the intermediate layer 20
The line layer structure that is disposed adjacent and is arranged in pairs with bus plane, can realize good Capacitance Coupled and control pcb board well
EMI, so as to effectively improve the shielding properties of multi-layer PCB board.
Used as one of preferred embodiment, the one or both sides of the top layer 10, intermediate layer 20 and bottom 30 set
It is equipped with heat conductive insulating glue-line 80.Using the heat conductive insulating glue-line 80, the heat conductivility of the multi-layer PCB board can be strengthened, so as to have
Effect slows down the ageing time of the component on multi-layer PCB board, strengthens the life-span of multi-layer PCB board.
Compared with prior art, the multi-layer PCB board that the present embodiment is provided, it is electromagnetically shielded by setting one in intermediate layer
Layer, and by ground plane and the paired setting of bus plane, so as to the capability of electromagnetic shielding of multi-layer PCB board, Jin Erke can be effectively improved
Effectively improve the performance of the component on multi-layer PCB board；In addition, oxidation resistant protective layer is set by top layer and bottom, can
The antioxygenic property of multi-layer PCB board is effectively improved, the shelf-life of multi-layer PCB board is improved；Additionally, being pressed by using plastic cement screw
Fixed multi-layer PCB board, can effectively prevent the phenomenon of short circuit, and effectively lift yields.
Above-described embodiment is preferably implementation of the present utility model, is not to restriction of the present utility model, not
On the premise of departing from inventive concept of the present utility model, it is any it is obvious replacement protection domain of the present utility model it
It is interior.
Claims (5)
1. a kind of reliability multi-layer PCB board high, including top layer, intermediate layer and the bottom for from top to bottom setting gradually, it is special
Levy and be：One end of the top layer, intermediate layer and bottom is provided with through hole, and the top layer, intermediate layer and bottom pass through
One plastic cement screw is fixed with the cooperation of the through hole；At least include a ground plane, a bus plane and an electricity in the intermediate layer
Magnetic masking layer, the ground plane is disposed adjacent and is arranged in pairs with bus plane, and the surface of the top layer and bottom is provided with one
Oxidation resistant protective layer.
2. multi-layer PCB board according to claim 1, it is characterised in that：The nut of the top layer and the plastic cement screw it
Between be provided with an adhered layer.
3. multi-layer PCB board according to claim 2, it is characterised in that：The screw rod of the plastic cement screw is arranged with an insulation
Cushion.
4. the multi-layer PCB board according to any one in claims 1 to 3, it is characterised in that：The top layer, intermediate layer with
And the one or both sides of bottom are provided with heat conductive insulating glue-line.
5. multi-layer PCB board according to claim 4, it is characterised in that：The material of the electro-magnetic screen layer is metal whisker
Or conducting polymer nano wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621466209.8U CN206272954U (en) | 2016-12-29 | 2016-12-29 | A kind of reliability multi-layer PCB board high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621466209.8U CN206272954U (en) | 2016-12-29 | 2016-12-29 | A kind of reliability multi-layer PCB board high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206272954U true CN206272954U (en) | 2017-06-20 |
Family
ID=59047783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621466209.8U Expired - Fee Related CN206272954U (en) | 2016-12-29 | 2016-12-29 | A kind of reliability multi-layer PCB board high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206272954U (en) |
-
2016
- 2016-12-29 CN CN201621466209.8U patent/CN206272954U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201374868Y (en) | Circuit board structure | |
| CN104363743A (en) | Electromagnetic wave radiation shield cover for printed circuit board | |
| CN206272954U (en) | A kind of reliability multi-layer PCB board high | |
| US8779298B2 (en) | Electronic circuit | |
| CN206061284U (en) | A kind of anti-tampering pcb board for high voltage distribution box | |
| CN107846834A (en) | Power model | |
| CN108054641A (en) | A kind of corrosion-resistant power cabinet with shielded layer | |
| CN205005337U (en) | Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye | |
| CN204836777U (en) | Multilayer high frequency blind hole PCB circuit board | |
| CN201207755Y (en) | Static electricity conducting construction for circuit board | |
| CN203368912U (en) | Flexible differential impedance board | |
| CN210609835U (en) | Multilayer radiation-proof PCB | |
| CN205071463U (en) | PCB circuit board anti -electromagnetic interference structure | |
| CN105263303B (en) | A kind of device and method for for substrate shielding electromagnetic radiation | |
| CN205082045U (en) | Take circuit plate structure of electromagnetic shield membrane | |
| CN202998662U (en) | Printed circuit board with blind holes and buried hole | |
| CN209572208U (en) | A kind of circuit board with electrostatic prevention structure | |
| CN208675596U (en) | A kind of multilayer circuit board of high intensity | |
| CN206932466U (en) | A kind of antistatic formula circuit board | |
| CN207783252U (en) | A kind of HDI high-density circuit boards with electro-magnetic screen function | |
| CN201563292U (en) | Grounding structure of circuit board | |
| CN204859883U (en) | Drive circuit shield assembly | |
| CN205657915U (en) | Anticreep welds printed circuit board | |
| CN202998658U (en) | Printed circuit board with two blind holes arranged at the same side | |
| CN205378338U (en) | Electromagnetic interference resistance printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20211229 |