CN205005337U - Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye - Google Patents
Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye Download PDFInfo
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- CN205005337U CN205005337U CN201520695512.4U CN201520695512U CN205005337U CN 205005337 U CN205005337 U CN 205005337U CN 201520695512 U CN201520695512 U CN 201520695512U CN 205005337 U CN205005337 U CN 205005337U
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- earth connection
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Abstract
The utility model discloses a function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye, function paper tinsel include metal ground wire base plate, and adnexed one deck voltage varistor functional material layer, another side are for attaching copper circuit metal level on metal ground wire base plate. Metal ground wire base plate sculpture goes out the earth connection, printed circuit board has metal ground wire layer, voltage varistor functional material layer in proper order, attaches copper circuit metal level on the insulation board, attaching copper circuit metal level sculpture and becoming including circuit line and earthing pole, metal ground wire layer is according to the earth connection of circuit line and earthing pole sculpture play actual need, circuit line and earth connection different level crossing at least once, this intersect forms high voltage pulse release point in the twinkling of an eye, at the earth connection and attach between the copper circuit metal level and to be separated by voltage varistor functional material layer, the earth connection is connected with the earthing pole. The utility model discloses electric flux release is in the twinkling of an eye accomplished in the intersect that utilizes earth connection and circuit line to pass through functional material interval constitution, has left out the through -hole and constructed logical this process, and the messenger processes simplyr, and the cost is more practiced thrift.
Description
Technical field
The utility model relates to a kind of function paper tinsel and the printed circuit board (PCB) thereof with absorption instantaneous pressure electrical pulse energy; belong to electronic manufacturing technology field, for the manufacture of electronic circuit protection and pcb board provides a kind of feature board and the printed circuit board (PCB) that absorb instantaneous pressure electrical pulse energy.
Background technology
In the circuit of electronic equipment, for preventing instantaneous pressure electrical pulse energy, as the impact of electrostatic, surge and transient electrical potential field inductive energy, be mostly provided with the absorbing circuit of these transient energy, in order to avoid smash sensitive electron components and parts because of these transient energy.These absorbing circuits are all as TVS pipe, ceramic varistor, macromolecule static suppressor, capacitor etc. arrange to have come in circuit with discrete component at present.A large amount of pcb board areas can be taken in circuit because these discrete devices are arranged, accept or reject so only carry out balance in reduction equipment volume and the protection of raising circuitry in the protection of electronic equipment.This is also the reason that the electronic circuit of current electronic equipment does not obtain omnibearing anti-transient high-voltage discharge pulse shock protection.Also because consider from manufacturing cost, protection can not be provided to all pins of all Sensitive Apparatuses in circuit comprehensively.
Chinese patent ZL201220475284.6 mono-kind has the printed circuit board (PCB) of comprehensive anti-static function, take the method for Surface Mount High-molecular composite nanometer voltage variable resistance soft film, the shock problem of single layer board or double sided board and the anti-instantaneous pressure electrical pulse energy compared with the electronic circuit of low-density small-scale wiring unit can be solved completely, but to electronic circuit and the multilayer circuit board of extensive, high-density wiring, this scheme is obviously unable to do what one wishes.
In current pcb board production, central layer used is double-sided metal plate, and mostly wherein one side will be used for ground connection in using, another side is as Power supply pole.
Summary of the invention
The purpose of this utility model is to provide a kind of function paper tinsel and the printed circuit board (PCB) thereof with absorption instantaneous pressure electrical pulse energy, and this function paper tinsel is combined the absorption function with instantaneous pressure electrical pulse energy with existing central layer.
The technical solution of the utility model: a kind of function paper tinsel with absorption instantaneous pressure electrical pulse energy of the present utility model comprises metal earth layer, one deck voltage variable resistance function material layer that metal earth layer adheres to is attached copper circuit metal level at the another side of described voltage variable resistance function material layer.
Described voltage variable resistance function material layer is High-molecular composite nanometer voltage variable resistance soft film or high molecular polymer and miscible the obtained material of conducting particles.
Described voltage variable resistance functional material layer thickness is 100um ~ 120um.
A kind of printed circuit board (PCB) with absorption instantaneous pressure electrical pulse energy of the present utility model comprises insulation board and attached copper circuit metal level, and insulation board has metal earth layer, voltage variable resistance function material layer, attached copper circuit metal level successively; Attached copper circuit metal level is etched into and comprises circuit line and earth electrode, and metal earth layer etches the earth connection of actual needs according to circuit line and earth electrode; Circuit line intersects at least one times with earth connection in Different Plane, and this crosspoint forms instant high-voltage pulse release point, and separated by voltage variable resistance function material layer between earth connection and attached copper circuit metal level, earth connection is connected with earth electrode.
Described voltage variable resistance function material layer is similar to earth connection shape, wider than earth connection, is covered by earth connection along earth connection direction.
Described voltage variable resistance function material layer is High-molecular composite nanometer voltage variable resistance soft film or high molecular polymer and miscible the obtained material of conducting particles.
Described voltage variable resistance functional material layer thickness is 100um ~ 120um.
Advantage of the present utility model:
One, the utility model utilizes earth connection and circuit line to complete moment electric flux by the crosspoint formed between functional material discharge, and eliminate through hole structure and lead to this operation, make processing more simply, cost is more saved.
Two, the alternative multilayer through hole of interlayer intersection, makes work simplification but quality is more reliable.
Three, the area coverage of selection function material flexibly can reduce the parasitic capacitance of product further, improve the adaptability of product carrier current protection.
Accompanying drawing explanation
Fig. 1 is function foil construction schematic diagram of the present utility model.
Fig. 2 is the feature board structural representation having made earth connection.
Fig. 3 is the function foil construction schematic diagram having made the attached copper cash of circuit.
Fig. 4 is the perspective structure schematic diagram of the most basic printed circuit board (PCB) of the present utility model.
Fig. 5 is the sectional view of Fig. 4.
Fig. 6 is the perspective structure schematic diagram that voltage variable resistance function material layer only covers the printed circuit board (PCB) of earth connection.
Embodiment
As Fig. 1: a kind of function foil construction with absorption instantaneous pressure electrical pulse energy of the present utility model comprises metal earth substrate 1, one deck voltage variable resistance function material layer 2 of attachment on metal earth substrate 1 is attached copper circuit metal level 3 at the another side of described voltage variable resistance function material layer 2.
Described voltage variable resistance function material layer 2 is High-molecular composite nanometer voltage variable resistance soft film or high molecular polymer and miscible the obtained material of conducting particles.
Described voltage variable resistance function material layer 2 thickness is 100um ~ 120um.
Fig. 2 is the function foil construction schematic diagram having made earth connection:
Described metal earth substrate 1 etches the earth connection 1a of printed circuit board (PCB) actual needs.
Fig. 3 is the function foil construction schematic diagram having made the attached copper cash of circuit:
Described metal earth substrate 1 etches the earth connection 1a of printed circuit board (PCB) actual needs, be attached copper circuit metal level 3 at the another side of described voltage variable resistance function material layer 2, the attached copper cash 3a of the circuit that attached copper circuit metal level 3 is etched into circuit actual needs, the attached copper cash 3a of each circuit on attached copper circuit metal level 3 intersects at least one times with the earth connection 1a on metal earth substrate 1 in Different Plane, this crosspoint 3c is instant high-voltage pulse release point, is separated between earth connection 1a and the attached copper cash 3a of circuit by voltage variable resistance function material layer 2.
As Fig. 4, Fig. 5:
The printed circuit board (PCB) feature board with absorption instantaneous pressure electrical pulse energy of the present utility model comprises insulation board and attached copper circuit metal level, and insulation board 4 has metal earth layer 1, voltage variable resistance function material layer 2, attached copper circuit metal level 3 successively; Attached copper circuit metal level 3 is etched into and comprises circuit line 3a and earth electrode 3b, and metal earth layer 1 etches the earth connection 1a of actual needs according to circuit line 3a and earth electrode 3b; Circuit line 3a intersects at least one times with earth connection 1a in Different Plane, this crosspoint 3c forms instant high-voltage pulse release point, separated by voltage variable resistance function material layer 2 between earth connection 1a and attached copper circuit metal level 3, but earth connection 1a is connected with earth electrode 3b.
Fig. 6 is the perspective structure schematic diagram that voltage variable resistance function material layer only covers the printed circuit board (PCB) of earth connection:
The difference of this embodiment and Fig. 4 is that voltage variable resistance function material layer 2 does not cover whole circuit board, described voltage variable resistance function material layer 2 is similar to earth connection 1a shape, wider than earth connection 1a, along earth connection 1a direction, earth connection 1a is covered, earth connection 1a and circuit line 3a is separated.Earth connection 1a is that 0.8mm is wide, and voltage variable resistance functional material lines 2a is that 1.2mm is wide, can reduce distributed electrical capacity.
Manufacture method:
When adopting function paper tinsel to make printed circuit board (PCB):
1, according to different circuit, the metal earth substrate 1 of the function paper tinsel of Fig. 1 one side is etched earth connection 1a, as Fig. 2, the etching earth connection one side epoxy resin of Fig. 2 is pasted on the PP sheet of insulation board 4.
2, attached for the another side of function paper tinsel copper circuit metal level 3 is etched into circuit line 3a and the earth electrode 3b of circuit actual needs, as Fig. 3, see Fig. 4, each circuit line 3a is made to intersect at least one times with the earth connection 1a on metal earth substrate 1 in Different Plane, this crosspoint just defines instant high-voltage pulse release point 3c, separated by voltage variable resistance function material layer 2 between earth connection 1a and circuit line 3a, earth electrode 3b is connected on top with earth connection 1a.Comprehensive antistatic printed circuit board (PCB) is obtained after above-mentioned making.
Second method directly makes functional layer when making printed circuit board (PCB):
The printed circuit board (PCB) that voltage variable resistance function material layer only covers earth connection for Fig. 6:
1, insulation board 4 is plated metal earth substrate 1, according to the needs of different circuit, etch earth connection 1a.
2, voltage variable resistance functional material only overlaps with ground wire along earth connection 1a direction and slightly applies wider than earth connection, and earth connection 1a is that 0.8mm is wide, and voltage variable resistance functional material lines 2a is that 1.2mm is wide, need not completely spread whole printed circuit board (PCB).
3, attached copper circuit metal level 3 is plated again, be etched into circuit line 3a and the earth electrode 3b of circuit actual needs, during design, ensure that each circuit line 3a intersects at least one times with the earth connection 1a on metal earth substrate 1 in Different Plane, this crosspoint just defines instant high-voltage pulse release point 3c, separated by voltage variable resistance functional material lines 2a between earth connection 1a and circuit line 3a, earth electrode 3b and earth connection 1a are connected on top can reduce distributed electrical capacity.
For more multi-layered circuit board; need be only that half through hole (or vexed hole) of 25um is to function material layer surface with diameter by the attached copper cash needing to protect; then copper facing makes this attached copper cash and functional material be hooked together; and the corresponding points on the opposite (another side of functional material) making attached copper cash and functional material structure join a little are connected to the ground, the components and parts on this attached copper cash just can be protected.
In sum, core of the present utility model utilizes earth connection and circuit line to complete moment electric flux by the crosspoint that functional material interval is formed to discharge, and therefore, no matter how the shape of earth connection changes, and is all protection ranges of the present utility model.
Claims (7)
1. one kind has the function paper tinsel absorbing instantaneous pressure electrical pulse energy, comprise metal earth layer (1), it is characterized in that: in one deck voltage variable resistance function material layer (2) of the upper attachment of metal earth layer (1), be attached copper circuit metal level (3) at the another side of described voltage variable resistance function material layer (2).
2. according to claim 1 have the function paper tinsel absorbing instantaneous pressure electrical pulse energy, it is characterized in that: described voltage variable resistance function material layer (2) is High-molecular composite nanometer voltage variable resistance soft film or high molecular polymer and miscible the obtained material of conducting particles.
3. according to claim 1 and 2 have the function paper tinsel absorbing instantaneous pressure electrical pulse energy, it is characterized in that: voltage variable resistance function material layer (2) thickness is 100um ~ 120um.
4. one kind has the circuit board absorbing instantaneous pressure electrical pulse energy, comprise insulation board and attached copper circuit metal level, it is characterized in that: on insulation board (4), have metal earth layer (1), voltage variable resistance function material layer (2), attached copper circuit metal level (3) successively; Attached copper circuit metal level (3) is etched into and comprises circuit line (3a) and earth electrode (3b), and metal earth layer (1) etches the earth connection (1a) of actual needs according to circuit line (3a) and earth electrode (3b); Circuit line (3a) intersects at least one times with earth connection (1a) in Different Plane, this crosspoint (3c) forms instant high-voltage pulse release point, separated by voltage variable resistance function material layer (2) between earth connection (1a) and attached copper circuit metal level (3), earth connection (1a) is connected with earth electrode (3b).
5. according to claim 4 have the circuit board absorbing instantaneous pressure electrical pulse energy, it is characterized in that: described voltage variable resistance function material layer (2) is similar to earth connection (1a) shape, wider than earth connection (1a), along earth connection (1a) direction, earth connection (1a) is covered.
6. according to claim 4 or 5, there is the circuit board absorbing instantaneous pressure electrical pulse energy, it is characterized in that: described voltage variable resistance function material layer (2) is High-molecular composite nanometer voltage variable resistance soft film or high molecular polymer and miscible the obtained material of conducting particles.
7. the circuit board with absorption instantaneous pressure electrical pulse energy according to claim 4 or 5, is characterized in that: described voltage variable resistance function material layer (2) thickness is 100um ~ 120um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520695512.4U CN205005337U (en) | 2015-09-09 | 2015-09-09 | Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520695512.4U CN205005337U (en) | 2015-09-09 | 2015-09-09 | Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye |
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| Publication Number | Publication Date |
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| CN205005337U true CN205005337U (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520695512.4U Active CN205005337U (en) | 2015-09-09 | 2015-09-09 | Function paper tinsel and printed circuit board with absorb high -tension electricity pulse energy in twinkling of an eye |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
| CN113438796A (en) * | 2021-04-29 | 2021-09-24 | 武汉芯宝科技有限公司 | Circuit board capable of absorbing instant high-voltage pulse energy and manufacturing method |
| CN107635385B (en) * | 2017-07-31 | 2024-04-30 | 武汉芯宝科技有限公司 | ESD full-shielding functional foil, full-shielding functional foil circuit board and manufacturing method |
-
2015
- 2015-09-09 CN CN201520695512.4U patent/CN205005337U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
| CN107635385B (en) * | 2017-07-31 | 2024-04-30 | 武汉芯宝科技有限公司 | ESD full-shielding functional foil, full-shielding functional foil circuit board and manufacturing method |
| CN113438796A (en) * | 2021-04-29 | 2021-09-24 | 武汉芯宝科技有限公司 | Circuit board capable of absorbing instant high-voltage pulse energy and manufacturing method |
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