CN204157153U - There is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy - Google Patents
There is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy Download PDFInfo
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- CN204157153U CN204157153U CN201420241123.XU CN201420241123U CN204157153U CN 204157153 U CN204157153 U CN 204157153U CN 201420241123 U CN201420241123 U CN 201420241123U CN 204157153 U CN204157153 U CN 204157153U
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- metal
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- central layer
- electrical pulse
- instantaneous pressure
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- 238000000926 separation method Methods 0.000 claims abstract description 8
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Abstract
The utility model provides a kind of and has the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy, this function central layer comprise insulating barrier and insulating barrier upper and lower metal substrate composition basic central layer, one deck voltage variable resistance function material layer that the metal substrate of basic central layer one side adheres to, voltage variable resistance function material layer is arranged the full spaced metal blockage layer for absorbing instantaneous pressure electrical pulse energy.It is respectively the metal blockage of 0.8mm that metal blockage layer comprises length and width, and multiple metal blockage is separated by lateral separation, vertical interval, and mutually insulated is arranged in metal array of small squares, lateral separation, is vertically spaced apart 0.08mm.These metal blockages form electric flux and absorb array, are conducive to building moment electric flux uptake pathway in application.Instantaneous pressure electrical pulse energy absorbent core plate of the present utility model is applicable to being arranged in all multilayer circuit boards, makes the components and parts on circuit board produce screen effect to instantaneous pressure electrical pulse energy.
Description
Technical field
The utility model relates to a kind of functional circuit plate central layer with absorption instantaneous pressure electrical pulse energy, belongs to electronic manufacturing technology field, for the manufacture of electronic circuit protection and pcb board provides a kind of brand-new function core material.
Background technology
In the circuit of electronic equipment, for preventing instantaneous pressure electrical pulse energy, as the impact of electrostatic, surge and transient electrical potential field inductive energy, be mostly provided with the absorbing circuit of these transient energy, in order to avoid smash sensitive electron components and parts because of these transient energy.These absorbing circuits are all as TVS pipe, ceramic varistor, macromolecule static suppressor, capacitor etc. arrange to have come in circuit with discrete component at present.A large amount of pcb board areas can be taken in circuit because these discrete devices are arranged, accept or reject so only carry out balance in reduction equipment volume and the protection of raising circuitry in the protection of electronic equipment.This is also the reason that the electronic circuit of current electronic equipment does not obtain omnibearing anti-transient high-voltage discharge pulse shock protection.Also because consider from manufacturing cost, protection can not be provided to all pins of all Sensitive Apparatuses in circuit comprehensively.
Chinese patent ZL201220475284.6 mono-kind has the printed circuit board (PCB) of comprehensive anti-static function, take the method for Surface Mount High-molecular composite nanometer voltage variable resistance soft film, the shock problem of single layer board or double sided board and the anti-instantaneous pressure electrical pulse energy compared with the electronic circuit of low-density small-scale wiring unit can be solved completely, but to electronic circuit and the multilayer circuit board of extensive, high-density wiring, this scheme is obviously unable to do what one wishes.
There is a kind of scheme abroad at present: embedded by momentary pulse energy absorbing material in interlayer circuit board, then by laser drill, material surface is connected with protected element, this kind of scheme preferably of can yet be regarded as, but there is the defect being difficult to overcome:
1. material being embedded circuit board makes the risk of circuit board layering increase.
2. because its material thickness maximum limit is defined as 100um (exceed and will lose function).Rig accurate so is more also difficult to ensure each boring (between several um) on all four precision; one piece of circuit board tens at least; hundreds of needs the point of protection at most; if there is the thickness being connected to material of a point (hole) wrong, monoblock circuit board has just been scrapped.
3. in this scheme; the diameter in hole determines the contact area with material; to obtain larger electric flux leakage current; the area in hole just must be made enough large; Kong Yi great also will take the area of pcb board; multilayer circuit board generally carries out ganging up connecting with u hole (diameter is less than 10um); a little all be connected with material with u hole if this electric pulse is released; the protection point of such formation only possesses the drainage function of energy; but without to release bearing capacity, the energy of any point slightly transships and will puncture this and release a little.
4. highly difficult machining accuracy must bring too high manufacturing cost, is unfavorable for applying in all electronic equipments.
In current pcb board production, central layer used is double-sided metal plate, and mostly wherein one side will be used for ground connection in using, another side is as Power supply pole.
Summary of the invention
The purpose of this utility model is the earth electrode utilizing existing central layer, extremely functional material is set on surface at this, and on functional material, arrange that electric pulse absorbs square, there is provided a kind of and have the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy, this central layer has the absorption function of instantaneous pressure electrical pulse energy.
The technical solution of the utility model: a kind of basic central layer that there is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy and comprise insulating barrier and the upper and lower metal substrate composition of insulating barrier of the present utility model, one deck voltage variable resistance function material layer that basic central layer metal substrate of composition adheres to, voltage variable resistance function material layer is arranged the full spaced metal blockage layer for absorbing instantaneous pressure electrical pulse energy.
Described voltage variable resistance function material layer is High-molecular composite nanometer voltage variable resistance soft film.
Described voltage variable resistance function material layer is high molecular polymer and miscible the obtained material of conducting particles.
It is respectively the metal blockage of 0.8mm that described metal blockage layer comprises length and width, and multiple metal blockage is separated by lateral separation, vertical interval, and mutually insulated is arranged in metal array of small squares, lateral separation, is vertically spaced apart 0.08mm.
Advantage of the present utility model:
1. the conducting particles itself used due to High-molecular composite nanometer voltage variable resistance soft film contains polyurethane and the epoxy resin of band response gene, it and metallic film material have good affinity, therefore this film and metallic film bond the central layer formed has fabulous peel strength (> 1.1N/mm), prepreg (being commonly referred to P sheet) in manufacturing with it and pcb board bonds, and there is not the possibility of layering.
2. because a metal covering of this central layer has been divided into the blockage of several 0.8mm × 0.8mm; when manufacturing multilayer circuit board with it; the any point in metal squares face need only be had to link up by the blind hole and central layer doing cured sheets (P sheet) by needing in circuit board surface or interlayer the attached copper cash protected; in pcb board copper-plating technique process; metal blockage on central layer must have at least one, and maximum four to produce with the blind hole on prepreg and are electrically connected.So just make all points of protection that needs on circuit board all can not obtain reliable protection with lacking.And implementing also and simply, circuit common board production technology all can be accomplished.
3., for the protection of larger current drain point, only need interval 0.8mm on attached copper cash that multiple blind hole is set, this protection point is connected with the multiple metal blockages on function central layer, thus obtains larger discharge power.Use very simply and flexibly.
4. manufacturing cost is extremely low, is conducive to spreading in the application of all electronic equipments.
5. the omnibearing protection function of round Realization electronic circuit.For the miniaturization of electronic equipment, improve functions of the equipments, enhancing equipment dependability provides wide design space.
Accompanying drawing explanation
Fig. 1 is the functional circuit plate central layer perspective view with absorption instantaneous pressure electrical pulse energy of the present utility model.
Fig. 2 is metal blockage layer schematic diagram.
Fig. 3 is that the utility model has the functional circuit plate central layer side-looking structural representation absorbing instantaneous pressure electrical pulse energy.
Embodiment
The utility model is technical support based on the technological invention of Chinese patent ZL201210314982.2, for the purpose of the electronic circuit thoroughly solving electronic equipment anti-instantaneous pressure electrical pulse energy shock problem.
Fig. 1, Fig. 3 are the functional circuit plate central layer perspective view with absorption instantaneous pressure electrical pulse energy of the present utility model.
The basic central layer that there is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy and comprise metal substrate 1 composition of insulating barrier 2 and insulating barrier about 2 of the present utility model, one deck voltage variable resistance function material layer 4 of attachment on the metal substrate 1 of basic central layer one side voltage variable resistance function material layer 4 is arrange the full metal blockage layer 3 for absorbing instantaneous pressure electrical pulse energy.
Usually, the thick h2 of insulating barrier 2 is 30um ~ 300um, the thick h1=7um ~ 12um of metal substrate 1 that insulating barrier is upper and lower, the thick h4=100um ~ 120um of voltage variable resistance function material layer 4, the thick h3=10um of metal blockage layer 3.
Described voltage variable resistance functional material is layer 4 is High-molecular composite nanometer voltage variable resistance soft film.
Described voltage variable resistance function material layer 4 is high molecular polymer and miscible the obtained material of conducting particles.
Fig. 2 is metal blockage layer schematic diagram: it is respectively the metal blockage 3a of 0.8mm that described metal blockage layer 3 comprises length and width S, and multiple metal blockage is separated by lateral separation 3b, vertical interval 3c, and mutually insulated is arranged in metal array of small squares.Lateral separation 3b and the wide L=0.08mm of vertical interval 3c.When this pulse energy absorbs in arranged in arrays to circuit board line, pulse energy releasing network will be formed.Thus bring up one has screen effect environment to high electric field pulse for monoblock circuit board.
Have the method for the circuit board central layer absorbing instantaneous pressure electrical pulse energy described in the first manufacture, step is as follows:
1) be that the metal foil surface of 10um carries out degreasing and molecule activation process with General Physics mode and chemical mode by the metal surface of basic central layer and a thickness;
2) High-molecular composite nanometer voltage variable resistance soft film being placed in through the metal substrate 1 of the basic central layer of decontamination and thickness is between the metal forming of 10um, then it is together placed in pressure heat and covers machine, takes out nature cooling after hot pressing, obtains function central layer substrate;
3) by above-mentioned functions central layer substrate is pasted onto functional material surface metal forming with common etching mode by equidistantly for 0.08mm, length and width are respectively for the size of 0.8mm is processed, make the metal foil surfaces be attached in function material layer form the metal array of small squares combination of 0.8mm × 0.8mm equidistant arrangement, obtain instantaneous pressure electrical pulse energy absorbent core plate.
Step 2) pressure heat covers machine hot pressing temperature and is adjusted to 120 DEG C, and pressure is adjusted to 2 ㎏/cm
2, hot pressing one minute, rear taking-up cools naturally, obtains function central layer substrate.
High-molecular composite nanometer voltage variable resistance soft film used is the High-molecular composite nanometer voltage variable resistance soft film made in macromolecule matrix material weight 100 parts, conductive nano filler weight part 5.5 parts of ratios, and thickness is 120um.
The second manufactures the method for described functional circuit plate central layer, and step is as follows:
1) by the surface of basic central layer and the metal foil surface of 10um with General Physics degreasing and chemical molecular activation processing;
2) by 100 parts by weight, liquid macroimolecule polymer, the conductive nano fillers such as macromolecular material epoxy resin or polyamide, polyurethane, polyethers by weight 5.5 parts join in homogenizer, mixer rotating speed is adjusted to 3000rpm, and start is stirred 10min and obtained high-molecular composite nanometer voltage variable resistance material paste;
3) by step 2) the high-molecular composite nanometer voltage variable resistance material paste that obtains is with screen printing mode, the grid of 2cm × 2cm is printed on metal substrate 1 surface of treated basic central layer one side, to form substrate grid, the Altitude control of substrate grid is between 0.1mm ~ 0.12mm;
4) by step 3) the basic central layer of printed substrate grid is placed in hot setting case, temperature is adjusted to 120 DEG C of solidification 60min, take out tiling on coating machine, coating machine coating thickness is adjusted to 0.1mm ~ 0.12mm, by step 2) obtain high-molecular composite nanometer voltage variable resistance slurry and be coated in the grid of printing;
5) tiling of the metal forming of 10um is pasted the high-molecular composite nanometer voltage variable resistance material surface of coating, sturdy pressing, is placed in hot setting case, and temperature is adjusted to 150 DEG C, and solidification 90min obtains function central layer substrate;
6) by above-mentioned functions central layer substrate is attached to functional material aspect metal forming with common etching mode by equidistantly for 0.08mm, length and width are respectively for the size of 0.8mm is processed, make this metal foil surfaces form the metal array of small squares combination of 0.8mm × 0.8mm equidistant arrangement, obtain instantaneous pressure electrical pulse energy absorbent core plate.
Described metal forming selects Copper Foil.
Core of the present utility model is combined with metal array of small squares by high-molecular composite nanometer voltage variable resistance material layer, forms high electric field pulse energy absorption array.This array structure is arranged in the circuit board, the lead-in wire (attached copper cash) of element circuit board needing anti-instantaneous pressure electric pulse protect is connected with any point metal blockage in array, or connect corresponding with the metal blockage in array for all attached copper cash on circuit board once (not needing to repeat to connect), will under Resistor-Capacitor Unit in circuit coordinates naturally, form moment electric flux uptake pathway, when any point in circuit is subject to high electric field pulse impact, the voltage variable resistance function material layer on the metal blockage surface of this some correspondence (will be generally 1ns) immediately and become conduction state from high-impedance state, this high voltage electric pulse is released over the ground.When after this fault offset, functional material reverts to high-impedance state at once.The sensitive components on circuit board is made to produce screen effect to instantaneous pressure electrical pulse energy.Therefore, on every employing high-molecular composite nanometer voltage variable resistance layer, utilize metal blockage to carry out combination of structuring the formation, the circuit board fabrication scheme that energy releases is carried out to instantaneous pressure electrical pulse energy, all belongs to protection range of the present utility model.
Claims (3)
1. one kind has the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy, comprise the basic central layer that insulating barrier (2) and the upper and lower metal substrate (1) of insulating barrier (2) form, it is characterized in that: in one deck voltage variable resistance function material layer (4) of the upper attachment of metal substrate (1) of basic central layer one side, voltage variable resistance function material layer (4) is arrange the full metal blockage layer (3) for absorbing instantaneous pressure electrical pulse energy.
2. according to claim 1 have the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy, it is characterized in that: described voltage variable resistance function material layer (4) is High-molecular composite nanometer voltage variable resistance soft film.
3. according to claim 1 and 2 have the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy, it is characterized in that: it is respectively the metal blockage (3a) of 0.8mm that described metal blockage layer (3) comprises multiple length and width, multiple metal blockage is separated by lateral separation (3b), vertical interval (3c), mutually insulated is arranged in metal array of small squares, and lateral separation (3b) and vertical interval (3c) is 0.08mm.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241123.XU CN204157153U (en) | 2014-05-09 | 2014-05-09 | There is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy |
| PCT/CN2015/078454 WO2015169234A1 (en) | 2014-05-09 | 2015-05-07 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
| EP15788619.3A EP3142469A4 (en) | 2014-05-09 | 2015-05-07 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241123.XU CN204157153U (en) | 2014-05-09 | 2014-05-09 | There is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy |
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| Publication Number | Publication Date |
|---|---|
| CN204157153U true CN204157153U (en) | 2015-02-11 |
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| CN201420241123.XU Expired - Lifetime CN204157153U (en) | 2014-05-09 | 2014-05-09 | There is the functional circuit plate central layer absorbing instantaneous pressure electrical pulse energy |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015169234A1 (en) * | 2014-05-09 | 2015-11-12 | 武汉芯宝科技有限公司 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
| CN103997845B (en) * | 2014-05-09 | 2017-01-04 | 武汉芯宝科技有限公司 | There is functional circuit plate central layer and the manufacture method absorbing instantaneous pressure electrical pulse energy |
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
-
2014
- 2014-05-09 CN CN201420241123.XU patent/CN204157153U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015169234A1 (en) * | 2014-05-09 | 2015-11-12 | 武汉芯宝科技有限公司 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
| CN103997845B (en) * | 2014-05-09 | 2017-01-04 | 武汉芯宝科技有限公司 | There is functional circuit plate central layer and the manufacture method absorbing instantaneous pressure electrical pulse energy |
| CN107635385A (en) * | 2017-07-31 | 2018-01-26 | 武汉芯宝科技有限公司 | ESD full-shield functions paper tinsel, ESD full-shields function paper tinsel circuit board and manufacture method |
| CN107635385B (en) * | 2017-07-31 | 2024-04-30 | 武汉芯宝科技有限公司 | ESD full-shielding functional foil, full-shielding functional foil circuit board and manufacturing method |
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| GR01 | Patent grant |