CN206271740U - Concave surface support plate - Google Patents

Abstract

The utility model provides a kind of concave surface support plate, it is that the structure of the silicon chip support plate in board-like pecvd process is improved, the groove for loading silicon chip is offered on support plate, there is the loading end for holding silicon chip at the edge of groove, loading end uses curved form, curved surface is arranged at least two sides of carried silicon chip, is linear contact lay between curved surface and the edge of silicon chip.The silicon chip of support plate is carried contact surface and is improved to concave surface from existing platform terrace by the utility model, and then silicon chip edge contact to be contacted from face with support plate is changed into linear contact lay, the influence of edge effect can be greatly reduced, while avoiding around the generation plated.

Description

Concave surface support plate

Technical field

The utility model belongs to the process equipment technical field of photovoltaic products, is related to board-like PECVD plated films, PERC batteries The structure of the support plate in the solar battery sheet coating process such as back of the body passivation and plated film is improved, and in particular to a kind of concave surface support plate.

Background technology

In the silicon wafer fabrication process of solar cell, silicon chip is loaded by carbon fiber support plate, enters back into board-like PECVD lifes Producing line carries out plated film, it is seen that support plate loading is one necessary operation that silicon chip turns into the production process of cell piece.Existing support plate Structure as shown in figure 1, the part that support plate holds silicon chip during its work is step surface, facade is with the angle of plane on step surface 90 °, and in process of production, the loading end on silicon chip and support plate is always contact, work is produced by high temperature and accordingly After skill, in contact surface position, the film layer that support plate can be plated to silicon chip can produce certain influence, such as edge effect.

Through retrieval, Chinese patent literature CN205792426U discloses a kind of double-sided coating stone suitable for PERC cell pieces Black frame, as shown in figure 1, the graphite frame 1 including inner hollow, the top surface of each frame of graphite frame 1 is provided with step 3 With inclined-plane 4, step 3 and inclined-plane 4 are set from the inside to the outside, and the top of the vertical plane of step 3 connects the bottom on inclined-plane 4, multiple inclined-planes 4 Form up big and down small back taper hatch frame, the thickness of the height slightly larger than silicon chip 2 of the vertical plane of step 3, the width of step 3 Slightly larger than the reserved border width of silicon chip 2.It widens the width of graphite frame, on this basis, sets inclined-plane 4, inclined-plane 4 It is highly gentle decline, such that it is able to form the structure of gentle slope shape long, then coordinates step 3 so that the step surface and inclined-plane of step 3 Bottom height, that is, step 3 vertical plane height slightly larger than silicon chip thickness 0.2mm, so can effectively reduce The top surface of silicon chip and the drop on the top of graphite frame, and then in front plated film, can effectively prevent caused by shake suddenly Silicon chip drop, it is ensured that top and bottom plated film is normal, and up and down plated film without diffraction situation, it is also possible to preferably alleviation graphite side Influence of the frame height to the front edge of silicon chip in itself.But in process of production, the loading end on silicon chip and support plate is always Contact, by after high temperature and corresponding production technology, in contact surface position, the film layer plated to silicon chip can produce edge to imitate Should, influence product quality

The carrying way of contact to existing silicon chip support plate structure is further improved, by it to silicon chip film-coated marginal portion Influence be preferably minimized, just turn into this area technical problem urgently to be resolved hurrily.

The content of the invention

Goal of the invention：In order to overcome the deficiencies in the prior art, the utility model provides a kind of concave surface support plate.

Technical scheme：In order to solve the above technical problems, the concave surface support plate that the utility model is provided, offers use on support plate In the groove for loading silicon chip, there is the loading end for holding silicon chip at the edge of groove, the loading end is curved surface, the curved surface cloth Put at least two sides of carried silicon chip, be linear contact lay between the curved surface and the edge of silicon chip.

Specifically, the curved surface is arranged in the surrounding of silicon chip.So as to the surrounding to silicon chip is more stably lifted.

Specifically, the curved surface and contact line normal surface on make normal, the angle of the normal and silicon chip surface It is 46 ° ~ 86 °.

Specifically, the angle is 75 °.

Specifically, the height of the curved surface is 10 ~ 20 times of silicon wafer thickness.

Specifically, there is transition face between the top of the curved surface and support plate upper table mask.

Specifically, the transition face is vertical plane, and the deep gouge that vertical plane is formed with curved surface joining place can avoid silicon chip position Move.

Specifically, the curved surface is symmetrically, symmetrical with the center line for being lifted silicon chip, and inclined-plane is lifted to silicon chip applying Power is decomposed into vertical component and horizontal component, vertical component and silicon chip gravitational equilibrium, the horizontal component size phase of two symmetrical slopes Deng in the opposite direction, so as to cancel out each other, it is ensured that the stress of silicon chip is in poised state.

Beneficial effect：In the case that the utility model overcomes original platform terrace carrying, the contact surface of loading end is larger, And by the way of linear contact lay, can to greatest extent reduce mutual contact, it is to avoid and the generation of edge effect, improve electricity The plating membrane efficiency of pond piece.

Except the utility model recited above solve technical problem, constitute technical scheme technical characteristic and by this Outside the advantage that the technical characteristic of a little technical schemes is brought, the other technologies that concave surface support plate of the present utility model can be solved are asked The advantage that the other technical characteristics and these technical characteristics included in topic, technical scheme are brought, will make into one with reference to accompanying drawing Step detailed description.

Brief description of the drawings

Fig. 1 is the structural representation of existing silicon chip support plate；

Fig. 2 is the structural representation of the utility model embodiment 1；

Fig. 3 is the overall structure diagram of Fig. 2；

Fig. 4 is the A-A views of Fig. 3；

Fig. 5 is the partial enlarged drawing of Fig. 4；

Fig. 6 is the partial enlarged drawing of Fig. 2

In figure：Graphite frame 1, silicon chip 2, step 3, inclined-plane 4, concave surface 5, vertical plane 6.

Specific embodiment

Embodiment 1：

The concave surface support plate of the present embodiment is as shown in Fig. 2 with the concave surface 5 touched with the side edge of silicon chip 2, vertical plane 6, silicon chip 1 edge forms linear contact lay with concave surface 5, greatly reduces the contact area of silicon chip and support plate, and support plate is reduced to greatest extent to plating The influence that film production process is produced.Vertical plane 6 is set between the top of inclined entrusting surface and support plate upper table mask used as transition face, both Between formed deep gouge can avoid silicon chip displacement.

As shown in Fig. 3, Fig. 4 and Fig. 5, the groove with matrix arrangement on graphite frame 1, the edge of each groove is respectively provided with recessed Face 5 and vertical plane 6, plated film is carried out for carrying multi-disc silicon chip simultaneously.

As shown in fig. 6, the normal of silicon chip 2 and the contact point of concave surface 5, and the shape of silicon chip 2 C in an angle, by experimental technique, Angle C can obtain more excellent effect in the range of 46 ° to 86 °；Optimal effectiveness is obtained when C takes 75 °, side can be greatly reduced Edge effect influences, and the problem that other are likely to occur around plating etc. is not also obvious.Verified by the adjustment of different process several times, this reality With new concave form while minimum contact area is ensured, to silicon chip edge to lift stability also very good.

Implementation method of the present utility model is described in detail above in association with accompanying drawing, but the utility model is not limited to institute The implementation method of description.For one of ordinary skill in the art, in principle of the present utility model and the scope of technological thought It is interior, various changes, modification, replacement and deformation are carried out to these implementation methods and is still fallen within protection domain of the present utility model.

Claims (8)

1. a kind of concave surface support plate, offers the groove for loading silicon chip on the support plate, has for holding silicon at the edge of groove The loading end of piece, it is characterised in that：The loading end is curved surface, and the curved surface is arranged at least two sides of carried silicon chip On, it is linear contact lay between the curved surface and the edge of silicon chip.

2. concave surface support plate according to claim 1, it is characterised in that：The curved surface is arranged in the surrounding of silicon chip.

3. concave surface support plate according to claim 1, it is characterised in that：The curved surface and contact line normal surface on make Normal, the normal is 46 ° ~ 86 ° with the angle of silicon chip surface.

4. concave surface support plate according to claim 3, it is characterised in that：The angle is 75 °.

5. concave surface support plate according to claim 1, it is characterised in that：The height of the curved surface is the 10 ~ 20 of silicon wafer thickness Times.

6. concave surface support plate according to claim 1, it is characterised in that：Between the top of the curved surface and support plate upper table mask With transition face.

7. concave surface support plate according to claim 6, it is characterised in that：The transition face is vertical plane.

8. concave surface support plate according to claim 1, it is characterised in that：The curved surface is symmetrical.