CN206134663U - Oblique loading end carbon fiber support plate - Google Patents
Oblique loading end carbon fiber support plate Download PDFInfo
- Publication number
- CN206134663U CN206134663U CN201621385774.1U CN201621385774U CN206134663U CN 206134663 U CN206134663 U CN 206134663U CN 201621385774 U CN201621385774 U CN 201621385774U CN 206134663 U CN206134663 U CN 206134663U
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- support plate
- silicon chip
- loading end
- carbon fiber
- oblique
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Abstract
The utility model provides an oblique loading end carbon fiber support plate is to the institutional advancement of the silicon chip support plate in the board -like PECVD technology, offers the groove that is used for loading the silicon chip on the support plate, and the border in groove has the loading end that is used for holding the silicon chip, and the loading end is that support face is arranged on being born the weight of two at least sides of silicon chip to one side to the oblique support face of inslot slope. The utility model discloses follow 90 current platform terraces with the support plate and the contact surface of silicon chip and improve into oblique support face, and then make silicon chip and support plate contact into line contact by the face contact, greatly reduce the contact surface, avoid the influence in the coating film production process, avoid rete adverse effect, improved the coating film efficiency of battery piece.
Description
Technical field
This utility model belongs to the process equipment technical field of photovoltaic products, is related to board-like PECVD plated films, PERC batteries
The structure of the support plate in the solar battery sheet coating process such as back of the body passivation and plated film is improved, and in particular to a kind of oblique loading end carbon is fine
Dimension support plate.
Background technology
In the silicon wafer fabrication process of solaode, silicon chip is loaded by carbon fiber support plate, enters back into board-like PECVD lifes
Producing line carries out plated film, it is seen that support plate loading is one necessary operation that silicon chip becomes in the production process of cell piece.Existing support plate
Structure as shown in figure 1, the part that support plate holds silicon chip during its work is step surface, facade is with the angle of plane on step surface
90, and in process of production, what the loading end on silicon chip and support plate was always contacted, work is produced through high temperature and accordingly
After skill, in contact surface position, the film layer that support plate can be plated to silicon chip can produce certain impact, such as edge effect.
Existing silicon chip support plate structure is improved, its impact to silicon chip film-coated marginal portion is preferably minimized, just into
For this area technical problem urgently to be resolved hurrily.
The content of the invention
Goal of the invention：In order to overcome the deficiencies in the prior art, it is fine that this utility model provides a kind of oblique loading end carbon
Dimension support plate.
Technical scheme：To solve above-mentioned technical problem, the oblique loading end carbon fiber support plate that this utility model is provided, in support plate
On offer groove for loading silicon chip, there is the loading end for holding silicon chip at the edge of groove, the loading end is to groove
Tilted inclined entrusting surface, the inclined entrusting surface is arranged at least two sides of carried silicon chip.
Specifically, the inclined entrusting surface is arranged in the surrounding of silicon chip, so as to more stably lift to the surrounding of silicon chip.
Specifically, the inclination angle of the inclined entrusting surface is 10-50, and using inclined-plane the edge of silicon chip is lifted, and is ensureing minimum connecing
Contacting surface realizes optimal supporting effect while product.
Specifically, the height of the inclined entrusting surface is 10 ~ 20 times of silicon wafer thickness.
Specifically, there is transition face between the top of the inclined entrusting surface and support plate upper table mask.
Specifically, the transition face is step surface, and the deep gouge that step surface is formed can avoid silicon chip displacement.
Specifically, the inclined entrusting surface is symmetrically, symmetrical with the center line for being lifted silicon chip, the support that inclined-plane is applied to silicon chip
Lifting force is decomposed into vertical component and horizontal component, vertical component and silicon chip gravitational equilibrium, the horizontal component size of two symmetrical slopes
It is equal, it is in opposite direction, so as to cancel out each other, it is ensured that the stress of silicon chip is in poised state.
Beneficial effect：The contact surface of support plate and silicon chip is modified to angle C by this utility model from existing 90 platform terrace
An inclined entrusting surface, and then by silicon chip and support plate contact by face contact make linear contact lay into, greatly reduce contact surface, it is to avoid plated film give birth to
Impact during product, it is to avoid film layer adverse effect, improves the plating membrane efficiency of cell piece.
Except this utility model recited above solve technical problem, constitute technical scheme technical characteristic and by this
Outside the advantage that the technical characteristic of a little technical schemes is brought, oblique loading end carbon fiber support plate of the present utility model can solve its
The advantage that the other technical characteristics and these technical characteristics included in his technical problem, technical scheme are brought, will combine accompanying drawing
It is described in more detail.
Description of the drawings
Fig. 1 is the structural representation of existing silicon chip support plate；
Fig. 2 is the structural representation of this utility model embodiment 1；
Fig. 3 is the overall structure diagram of Fig. 2；
Fig. 4 is the A-A views of Fig. 3；
Fig. 5 is the partial enlarged drawing of Fig. 4；
In figure：1 silicon chip, 2 existing support plates, 3 inclined-plane support plates.
Specific embodiment
Embodiment 1：
The inclined-plane support plate 3 of the present embodiment is as shown in Fig. 2 with the inclined entrusting surface touched with the side edge of silicon chip 1, the side of silicon chip 1
Edge forms linear contact lay with inclined entrusting surface, greatly reduces the contact area of silicon chip and support plate, support plate is reduced to greatest extent plated film is given birth to
The impact that product process is produced.Step-like transition face is formed between the top of inclined entrusting surface and support plate upper table mask, is easy to support plate to add
Work and upper piece when positioning.
As shown in figure 3, there is the groove of matrix arrangement on oblique loading end carbon fiber support plate, for carrying multi-disc silicon chip simultaneously
Carry out plated film.As shown in Figure 4 and Figure 5, the face of trough rim contact silicon chip edge is inclined-plane, and inclination angle C takes 10-50, is ensureing minimum
Contact area while, inclined-plane is lifted stability and can be optimal to silicon chip edge.
Embodiment of the present utility model is described in detail above in association with accompanying drawing, but this utility model is not limited to institute
The embodiment of description.For one of ordinary skill in the art, in principle of the present utility model and the scope of technological thought
It is interior, various changes, modification, replacement and deformation are carried out to these embodiments and is still fallen within protection domain of the present utility model.
Claims (6)
1. a kind of oblique loading end carbon fiber support plate, offers the groove for loading silicon chip on the support plate, has at the edge of groove
For holding the loading end of silicon chip, it is characterised in that：The loading end is to the tilted inclined entrusting surface of groove, the inclined entrusting surface arrangement
On at least two sides of carried silicon chip, the inclination angle of the inclined entrusting surface is 10-50 °.
2. oblique loading end carbon fiber support plate according to claim 1, it is characterised in that：The inclined entrusting surface is arranged in silicon chip
Surrounding.
3. oblique loading end carbon fiber support plate according to claim 1, it is characterised in that：The height of the inclined entrusting surface is silicon chip
10 ~ 20 times of thickness.
4. oblique loading end carbon fiber support plate according to claim 1, it is characterised in that：The top of the inclined entrusting surface and support plate
There is transition face between upper table mask.
5. oblique loading end carbon fiber support plate according to claim 4, it is characterised in that：The transition face is step surface.
6. oblique loading end carbon fiber support plate according to claim 1, it is characterised in that：The inclined entrusting surface is symmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385774.1U CN206134663U (en) | 2016-12-16 | 2016-12-16 | Oblique loading end carbon fiber support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385774.1U CN206134663U (en) | 2016-12-16 | 2016-12-16 | Oblique loading end carbon fiber support plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206134663U true CN206134663U (en) | 2017-04-26 |
Family
ID=58562441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621385774.1U Active CN206134663U (en) | 2016-12-16 | 2016-12-16 | Oblique loading end carbon fiber support plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206134663U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647877A (en) * | 2020-07-09 | 2020-09-11 | 梅耶博格光电设备(上海)有限公司 | Plate type PECVD (plasma enhanced chemical vapor deposition) coating carrier plate |
-
2016
- 2016-12-16 CN CN201621385774.1U patent/CN206134663U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111647877A (en) * | 2020-07-09 | 2020-09-11 | 梅耶博格光电设备(上海)有限公司 | Plate type PECVD (plasma enhanced chemical vapor deposition) coating carrier plate |
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