CN107634023A - A kind of carbon fiber silicon chip of solar cell support plate - Google Patents
A kind of carbon fiber silicon chip of solar cell support plate Download PDFInfo
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- CN107634023A CN107634023A CN201710624011.0A CN201710624011A CN107634023A CN 107634023 A CN107634023 A CN 107634023A CN 201710624011 A CN201710624011 A CN 201710624011A CN 107634023 A CN107634023 A CN 107634023A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- 229920000049 Carbon (fiber) Polymers 0.000 title claims abstract description 19
- 239000004917 carbon fiber Substances 0.000 title claims abstract description 19
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000004140 cleaning Methods 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 23
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photovoltaic Devices (AREA)
Abstract
本发明公开了一种碳纤维太阳能电池硅片载板，包括：载板主体、载板主体背面两侧的载板导向条及载板主体背面阵列的载板加强筋，载板加强筋与载板导向条垂直；载板主体使用耐高温、耐腐蚀及高强度的碳纤维材料；载板主体上具有阵列的矩形孔，矩形孔的周侧具有第一台阶并与侧壁形成第一凹槽，第一台阶的周侧具有第二台阶并与侧壁形成第二凹槽，硅片的周侧与第二台阶面接触以被所述第二台阶承托。本发明的载板主体使用碳纤维材料，实现了载板的易于清洗性；阵列的载板加强筋加强了载板的抗变形能力；第一台阶及第二台阶设置使硅片下方的镂空面积更大，减少了硅片与载板的接触面积，硅片加热效率高。
The invention discloses a carbon fiber solar cell silicon chip carrier, comprising: a carrier body, carrier guide strips on both sides of the back of the carrier body, carrier ribs arrayed on the back of the carrier body, carrier ribs and the carrier The guide bar is vertical; the main body of the carrier board is made of high temperature resistant, corrosion resistant and high-strength carbon fiber material; the main body of the carrier board has an array of rectangular holes, and the peripheral side of the rectangular hole has a first step and forms a first groove with the side wall. The peripheral side of a step has a second step and forms a second groove with the side wall, and the peripheral side of the silicon chip is in contact with the second step to be supported by the second step. The main body of the carrier board of the present invention uses carbon fiber material, which realizes the ease of cleaning of the carrier board; the array of carrier board reinforcement ribs strengthens the deformation resistance of the carrier board; the setting of the first step and the second step makes the hollow area under the silicon chip more compact Large, reducing the contact area between the silicon wafer and the carrier plate, and the heating efficiency of the silicon wafer is high.
Description
技术领域technical field
本发明涉及太阳能电池生产技术领域，特别涉及一种碳纤维太阳能电池硅片载板。The invention relates to the technical field of solar cell production, in particular to a carbon fiber solar cell silicon chip carrier.
背景技术Background technique
常规能源资源的有限性和环境压力的增加，使世界上许多国家重新加强了对新能源和可再生能源技术发展的支持。新能源是二十一世纪世界经济发展中最具决定力的五大技术领域之一。太阳能是一种清洁、高效和永不衰竭的新能源，因此，各国政府都将太阳能资源利用作为国家可持续发展战略的重要内容。而光伏发电具有安全可靠、无噪声、无污染、制约少、故障率低、维护简便等优点，在我国西部广袤严寒、地形多样和居住分散的现实条件下，有着非常独特的作用。The limitation of conventional energy resources and the increase of environmental pressure have made many countries in the world re-strengthen their support for the development of new energy and renewable energy technologies. New energy is one of the five most decisive technological fields in the world economic development in the 21st century. Solar energy is a clean, efficient and inexhaustible new energy source. Therefore, governments of all countries regard the utilization of solar energy resources as an important content of national sustainable development strategies. Photovoltaic power generation has the advantages of safety and reliability, no noise, no pollution, less constraints, low failure rate, and easy maintenance. It plays a very unique role in the reality of the vast and cold, diverse terrain and scattered living conditions in western my country.
太阳能电池是光伏发电核心器件，在太阳能电池生产过程中，硅片放置在载板上，由载板承载进入太阳能电池镀膜设备，在设备中进行工艺制程反应，工艺制程中会生成氧化铝及氮化硅等物质，该物质附着能力较强，普通材料的载板被附着后难以清洗。同时，工艺制程的过程，腔室加热到400℃高温，最高达到600℃，在高温的环境中，载板受热变形也是一技术难题，变形过大，导致工艺效果差，产品性能不达标。电池镀膜设备输送线之间跨度大，传输系统由于结构受限，同时基于成本考虑，无法做到大功率、高扭矩，这样导致传输系统不能承受较重的载板，所以硅片载板的材料及结构是一大挑战，载板既要尺寸大、重量轻，同时要刚性好。此外，硅片在制程工艺中，硅片需要被加热，传统的硅片载板，硅片直接坐落在实心载板上，加热时间长，热量大部分被载板带走，能耗高且不利于硅片的受热。Solar cells are the core components of photovoltaic power generation. During the production process of solar cells, silicon wafers are placed on the carrier board, carried by the carrier board into the solar cell coating equipment, and the process reaction is carried out in the equipment. Aluminum oxide and nitrogen will be generated during the process. Substances such as silicon oxide have strong adhesion ability, and it is difficult to clean the carrier board of ordinary materials after being attached. At the same time, during the process of the process, the chamber is heated to a high temperature of 400°C, up to 600°C. In a high-temperature environment, thermal deformation of the substrate is also a technical problem. If the deformation is too large, the process effect is poor and the product performance is not up to standard. The transmission line of the battery coating equipment has a large span, and the transmission system cannot achieve high power and high torque due to the limited structure and cost considerations. This makes the transmission system unable to bear the heavy carrier board, so the material of the silicon wafer carrier board And the structure is a big challenge. The carrier board must be large in size, light in weight, and rigid at the same time. In addition, during the silicon wafer manufacturing process, the silicon wafer needs to be heated. With the traditional silicon wafer carrier, the silicon wafer is directly seated on the solid carrier. The heating time is long, and most of the heat is taken away by the carrier. It is conducive to the heating of the silicon wafer.
申请号为01420788733.1的中国实用新型专利提供了一种 PECVD 镀膜用防绕镀台阶框，包括用于承载硅片的载板边框，载板边框面向硅片的侧壁上设有台阶，硅片放置于载板边框的台阶上，台阶的内侧延伸部托住硅片，使得载板边框与硅片边缘间没有连通硅片上方和下方的缝隙。本实用新型能够有效阻止等离子体绕镀至硅片正面边缘，使得太阳能电池生产中硅片镀膜不存在饶镀现象，提高了产品的良率。但该种结构仍存在硅片与载板接触面积过大而被载板带走大量热量的问题，从而导致硅片受热效率低且能耗高。The Chinese utility model patent with the application number 01420788733.1 provides an anti-winding plating step frame for PECVD coating, including a carrier frame for carrying silicon wafers. There are steps on the side wall of the carrier frame facing the silicon wafers, and the silicon wafers are placed On the step of the frame of the carrier board, the inner extension of the step supports the silicon chip, so that there is no gap between the frame of the carrier board and the edge of the silicon chip connecting the top and bottom of the silicon chip. The utility model can effectively prevent the plasma from wrapping around and plating to the front edge of the silicon chip, so that the coating film of the silicon chip does not exist in the solar cell production, and improves the yield rate of the product. However, this structure still has the problem that the contact area between the silicon chip and the carrier is too large, and a large amount of heat is taken away by the carrier, resulting in low heating efficiency and high energy consumption of the silicon chip.
申请号为201621385774.1的中国实用新型专利提供了一种斜承载面碳纤维载板，是对板式PECVD工艺中的硅片载板的结构改进，在载板上开设有用于装载硅片的槽，槽的边沿具有用于托住硅片的承载面，承载面是向槽内倾斜的斜托面，斜托面布置在被承载硅片的至少两个侧边上。本实用新型将载板与硅片的接触面从现有的90°平台阶面改进成斜托面，进而将硅片和载板接触由面接触改成线接触，极大减少接触面，避免镀膜生产过程中的影响，避免膜层不利影响，提高了电池片的镀膜效率。该种结构虽然在申请号为01420788733.1的中国实用新型专利基础上将现有的90°平台阶面改进成斜托面以减小硅片与载板的接触面积，但是由于硅片与载板线接触，在长时间加热及硅片自身重力作用下，线接触的硅片与载板之间形成一定的咬合力而易于导致后续硅片不易取走，而且硅片受热后在自重情况下没有承托会产生下凹形变而影响硅片品质。The Chinese utility model patent with the application number 201621385774.1 provides a carbon fiber carrier plate with an inclined bearing surface, which is an improvement on the structure of the silicon chip carrier plate in the plate PECVD process. There are grooves for loading silicon chips on the carrier plate. The edge has a bearing surface for supporting the silicon chip, the bearing surface is a slanting surface inclined to the groove, and the slanting surface is arranged on at least two sides of the silicon chip to be carried. The utility model improves the contact surface between the carrier board and the silicon chip from the existing 90° platform step surface to an inclined support surface, and then changes the contact between the silicon chip and the carrier board from surface contact to line contact, greatly reducing the contact surface and avoiding The impact during the coating production process avoids the adverse effects of the film layer and improves the coating efficiency of the battery sheet. Although this kind of structure improves the existing 90° platform step surface into an inclined support surface on the basis of the Chinese utility model patent application number 01420788733.1 to reduce the contact area between the silicon chip and the carrier board, but because the silicon chip and the carrier board line Contact, under the long-term heating and the gravity of the silicon wafer itself, a certain biting force is formed between the silicon wafer and the carrier plate in line contact, which is easy to make the subsequent silicon wafer difficult to remove, and the silicon wafer has no bearing under its own weight after being heated. The support will produce concave deformation and affect the quality of silicon wafers.
因此，需要设计一种结构更合理载板以满足硅片镀膜需要。Therefore, it is necessary to design a carrier board with a more reasonable structure to meet the needs of silicon wafer coating.
发明内容Contents of the invention
为了解决上述问题，本发明提供了一种碳纤维太阳能电池硅片载板，包括：载板主体、载板导向条及载板加强筋；In order to solve the above problems, the present invention provides a silicon chip carrier for carbon fiber solar cells, including: a carrier body, a carrier guide strip and a carrier rib;
所述载板导向条通过第一螺钉配合第一螺母连接在所述载板主体背面两侧，所述载板加强筋通过第二螺钉配合第二螺母阵列连接在所述载板主体背面，且所述载板加强筋与所述载板导向条垂直，通过所述载板导向条配合传输体系实现所述载板本体的持续运行；The carrier board guide bar is connected to both sides of the back of the carrier board body through first screws and first nuts, and the carrier board reinforcing rib is connected to the back of the carrier board body through second screws and second nut arrays, and The reinforcing rib of the carrier board is perpendicular to the carrier board guide strip, and the continuous operation of the carrier board body is realized through the cooperation of the carrier board guide bar with the transmission system;
所述载板主体使用耐高温、耐腐蚀及高强度的碳纤维材料；The main body of the carrier plate is made of carbon fiber material with high temperature resistance, corrosion resistance and high strength;
所述载板主体上具有阵列的矩形孔，所述矩形孔的周侧具有第一台阶并与侧壁形成第一凹槽，所述第一台阶的周侧具有第二台阶并与侧壁形成第二凹槽，硅片的周侧与所述第二台阶面接触以被所述第二台阶承托。There is an array of rectangular holes on the main body of the carrier. The peripheral side of the rectangular hole has a first step and forms a first groove with the side wall. The peripheral side of the first step has a second step and forms a first groove with the side wall. In the second groove, the peripheral side of the silicon chip is in contact with the second step to be supported by the second step.
其中，所述载板导向条及载板加强筋使用耐高温、耐腐蚀及高强度的碳纤维材料。Wherein, the carrier board guide strip and the carrier board reinforcing rib are made of carbon fiber material with high temperature resistance, corrosion resistance and high strength.
其中，所述第一螺钉、第一螺母、第二螺钉及第二螺母使用耐高温、耐腐蚀及高强度的陶瓷材料。Wherein, the first screw, the first nut, the second screw and the second nut use high temperature resistant, corrosion resistant and high strength ceramic materials.
其中，所述第一凹槽的深度小于所述矩形孔的深度，所述第二凹槽的深度小于所述第一凹槽的深度，硅片的厚度小于等于所述第二凹槽的深度。Wherein, the depth of the first groove is less than the depth of the rectangular hole, the depth of the second groove is less than the depth of the first groove, and the thickness of the silicon wafer is less than or equal to the depth of the second groove .
本发明的有益效果：Beneficial effects of the present invention:
①载板主体使用碳纤维材料，该碳纤维材料具有耐高温、耐腐蚀及高强度的材料性能，实现了载板的易于清洗性；①The main body of the carrier board is made of carbon fiber material, which has high temperature resistance, corrosion resistance and high strength material properties, and realizes the easy cleaning of the carrier board;
②载板主体与载板导向条通过特殊材质的螺钉螺母连接，并在背面设置阵列的特殊材质的载板加强筋，与传统的载板相比较，结构新颖，抗变形能力加强；②The main body of the carrier board and the carrier board guide bar are connected by screws and nuts made of special materials, and an array of carrier board reinforcement ribs of special material is arranged on the back. Compared with the traditional carrier board, the structure is novel and the deformation resistance is enhanced;
③从载板结构入手，保证承载硅片的前提下，尽量减少硅片和载板的接触，使受热效果更好，因此本发明的第一台阶及第二台阶设置，使硅片下方的镂空面积更大，减少了硅片与载板的接触面积，实现了硅片的良好受热，硅片被加热更快。③ Starting from the structure of the carrier plate, under the premise of ensuring the carrying of the silicon chip, the contact between the silicon chip and the carrier plate is minimized to make the heating effect better. The area is larger, which reduces the contact area between the silicon wafer and the carrier, realizes good heating of the silicon wafer, and the silicon wafer is heated faster.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments.
图1为本发明实施例所公开的载板正面结构示意图；Fig. 1 is a schematic diagram of the front structure of the carrier board disclosed in the embodiment of the present invention;
图2为本发明实施例所公开的载板背面结构示意图；Fig. 2 is a schematic diagram of the back structure of the carrier disclosed in the embodiment of the present invention;
图3-5分别为本发明实施例所公开的载板正面装配图中A-A向、B-B向剖视图及B-B向剖视图中M部位放大结构示意图。3-5 are schematic diagrams of the enlarged structure of the M part in the A-A and B-B sectional views of the front assembly view of the carrier board disclosed in the embodiment of the present invention, and the B-B sectional view, respectively.
图中数字表示：The numbers in the figure indicate:
1.载板主体 2.第一螺钉 3.第二螺钉 4.硅片1. Carrier body 2. First screw 3. Second screw 4. Silicon chip
5.载板导向条 6.载板加强筋 7.第一螺母 8.第二螺母5. Carrier guide bar 6. Carrier rib 7. First nut 8. Second nut
9.第一台阶 10.第二台阶 11.第一凹槽 12.第二凹槽9. First step 10. Second step 11. First groove 12. Second groove
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
参考图1-4，本发明提供的碳纤维太阳能电池硅片载板，包括：载板主体1、载板导向条5及载板加强筋6；载板导向条5通过第一螺钉2配合第一螺母7连接在载板主体1背面两侧，载板加强筋6通过第二螺钉3配合第二螺母8阵列连接在载板主体1背面，且载板加强筋6与载板导向条5垂直，通过载板导向条5配合传输体系实现载板本体的持续运行；载板主体1、载板导向条5及载板加强筋6使用耐高温、耐腐蚀及高强度的碳纤维材料；第一螺钉2、第一螺母7、第二螺钉3及第二螺母8使用耐高温、耐腐蚀及高强度的陶瓷材料。Referring to Figures 1-4, the carbon fiber solar cell silicon chip carrier provided by the present invention includes: a carrier body 1, a carrier guide strip 5 and a carrier rib 6; the carrier guide strip 5 cooperates with the first screw 2 The nuts 7 are connected to both sides of the back of the main body 1 of the carrier, and the reinforcing ribs 6 of the carrier are connected to the back of the main body 1 of the carrier through the array of second screws 3 and the second nuts 8, and the reinforcing ribs of the carrier 6 are perpendicular to the guide bar 5 of the carrier, The continuous operation of the carrier body is realized through the carrier guide strip 5 and the transmission system; the carrier body 1, the carrier guide strip 5 and the carrier rib 6 are made of carbon fiber materials with high temperature resistance, corrosion resistance and high strength; the first screw 2 , the first nut 7 , the second screw 3 and the second nut 8 are made of ceramic materials with high temperature resistance, corrosion resistance and high strength.
参考图5，载板主体1上具有阵列的矩形孔，矩形孔的周侧具有第一台阶9并与侧壁形成第一凹槽11，第一台阶9的周侧具有第二台阶10并与侧壁形成第二凹槽12，硅片的周侧与第二台阶10面接触以被第二台阶10承托；第一凹槽11的深度小于矩形孔的深度，第二凹槽12的深度小于第一凹槽11的深度，硅片4的厚度小于等于第二凹槽12的深度。Referring to FIG. 5 , there are arrays of rectangular holes on the main body 1 of the carrier board. The peripheral side of the rectangular hole has a first step 9 and forms a first groove 11 with the side wall. The peripheral side of the first step 9 has a second step 10 and is connected with the side wall. The side wall forms a second groove 12, and the peripheral side of the silicon chip is in surface contact with the second step 10 to be supported by the second step 10; the depth of the first groove 11 is less than the depth of the rectangular hole, and the depth of the second groove 12 Less than the depth of the first groove 11 , the thickness of the silicon wafer 4 is less than or equal to the depth of the second groove 12 .
本发明的载板主体1使用碳纤维材料，该碳纤维材料具有耐高温、耐腐蚀及高强度的材料性能，实现了载板的易于清洗性；载板主体1与载板导向条5通过特殊材质的螺钉螺母连接，并在背面设置阵列的特殊材质的载板加强筋6，与传统的载板相比较，结构新颖，抗变形能力加强；从载板结构入手，保证承载硅片4的前提下，尽量减少硅片4和载板的接触，使受热效果更好，因此本发明的第一台阶9及第二台阶10设置，使硅片4下方的镂空面积更大，减少了硅片4与载板的接触面积，实现了硅片4的良好受热，硅片4被加热更快。。The carrier body 1 of the present invention uses carbon fiber material, which has high temperature resistance, corrosion resistance and high strength material properties, and realizes the easy cleaning of the carrier; the carrier body 1 and the carrier guide bar 5 are made of special materials Screws and nuts are connected, and an array of special material carrier ribs 6 is arranged on the back. Compared with the traditional carrier, the structure is novel and the deformation resistance is enhanced; Minimize the contact between the silicon chip 4 and the carrier plate, so that the heating effect is better, so the first step 9 and the second step 10 of the present invention are set to make the hollow area below the silicon chip 4 larger, reducing the contact between the silicon chip 4 and the carrier plate. The contact area of the plates realizes good heating of the silicon wafer 4, and the silicon wafer 4 is heated faster. .
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对上述实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to the above-described embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
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| CN201710624011.0A CN107634023A (en) | 2017-07-27 | 2017-07-27 | A kind of carbon fiber silicon chip of solar cell support plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110978720A (en) * | 2019-11-29 | 2020-04-10 | 无锡智上新材料科技有限公司 | Preparation method of high-temperature-resistant carbon fiber composite material carrier plate |
| CN111647877A (en) * | 2020-07-09 | 2020-09-11 | 梅耶博格光电设备(上海)有限公司 | Plate type PECVD (plasma enhanced chemical vapor deposition) coating carrier plate |
| CN111748797A (en) * | 2019-03-29 | 2020-10-09 | 中国电子科技集团公司第四十八研究所 | Graphite frame for flat plate type PECVD equipment |
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