CN206251426U - A kind of Rigid Flex - Google Patents
A kind of Rigid Flex Download PDFInfo
- Publication number
- CN206251426U CN206251426U CN201621248867.XU CN201621248867U CN206251426U CN 206251426 U CN206251426 U CN 206251426U CN 201621248867 U CN201621248867 U CN 201621248867U CN 206251426 U CN206251426 U CN 206251426U
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- utility
- model
- rigid flex
- copper foil
- line
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of Rigid Flex, including：Substrate, pure glue-line, copper foil layer and ink layer；The pure glue-line is set on the substrate, and the copper foil layer is arranged on pure glue-line, and the ink layer is arranged on copper foil layer.Through the above way, the utility model can effectively avoid producing bubble at the high-low-position of Rigid Flex, in case causing circuit to disconnect after etching.
Description
Technical field
The utility model is related to Rigid Flex field, more particularly to a kind of Rigid Flex.
Background technology
At present, the production method of existing Rigid Flex be exposed when dielectric layer using traditional dry film, circuit
Make；But the position that dry film has difference of height in pressing can produce bubble, cause circuit to disconnect after etching.
Utility model content
The utility model can effectively avoid soft or hard knot mainly solving the technical problems that provide a kind of Rigid Flex
Bubble is produced at the high-low-position of plywood, in case causing circuit to disconnect after etching；Its simple structure, handling ease.
In order to solve the above technical problems, the technical scheme that the utility model is used is：A kind of Rigid Flex is provided,
Including：Substrate, pure glue-line, copper foil layer and ink layer；The pure glue-line is set on the substrate, and the copper foil layer is arranged on pure
On glue-line, the ink layer is arranged on copper foil layer.
Preferably, the thickness of the ink layer is not less than 6 μm.
The beneficial effects of the utility model are：The utility model can effectively avoid being produced at the high-low-position of Rigid Flex
Anger bubble, in case causing circuit to disconnect after etching.
Brief description of the drawings
Fig. 1 is a kind of cross section structure diagram of the utility model Rigid Flex one preferred embodiment.
Specific embodiment
Preferred embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings, so that advantage of the present utility model
Can be easier to be readily appreciated by one skilled in the art with feature, it is apparent clear and definite so as to be made to protection domain of the present utility model
Define.
Fig. 1 is referred to, the utility model embodiment includes：
A kind of Rigid Flex, including：Substrate, pure glue-line, copper foil layer and ink layer；The pure glue-line is arranged on the base
On plate, the copper foil layer is arranged on pure glue-line, and the ink layer is arranged on copper foil layer, and ink layer is fitted in copper foil layer completely
On, bubble will not be produced.The thickness of the ink layer is not less than 6 μm, can reach anti-etching effect well, and ink layer
Flowing Surface flat and drying property are very good.Using simple to operate, different size can be produced dip-coating ink with the plank of thickness.It is special
Be not that immersion oil ink is to control thickness by lifting speed, do not result in the waste of ink, can preferably control production quality and
Process cost.
The utility model can effectively avoid producing bubble at the high-low-position of Rigid Flex, in case causing line after etching
Road disconnects；Its simple structure, handling ease.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in
Other related technical fields, are similarly included in scope of patent protection of the present utility model.
Claims (2)
1. a kind of Rigid Flex, it is characterised in that including：Substrate, pure glue-line, copper foil layer and ink layer；The pure glue-line sets
Put on the substrate, the copper foil layer is arranged on pure glue-line, the ink layer is arranged on copper foil layer.
2. a kind of Rigid Flex according to claim 1, it is characterised in that：The thickness of the ink layer is not less than 6 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621248867.XU CN206251426U (en) | 2016-11-16 | 2016-11-16 | A kind of Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621248867.XU CN206251426U (en) | 2016-11-16 | 2016-11-16 | A kind of Rigid Flex |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206251426U true CN206251426U (en) | 2017-06-13 |
Family
ID=58999786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621248867.XU Active CN206251426U (en) | 2016-11-16 | 2016-11-16 | A kind of Rigid Flex |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206251426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455304A (en) * | 2016-11-16 | 2017-02-22 | 苏州市华扬电子股份有限公司 | Flexible-rigid combined plate |
-
2016
- 2016-11-16 CN CN201621248867.XU patent/CN206251426U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455304A (en) * | 2016-11-16 | 2017-02-22 | 苏州市华扬电子股份有限公司 | Flexible-rigid combined plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215164 Huang Qiao Jie Dao Mu Xiang Cun, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
|
| CP03 | Change of name, title or address |