CN204659111U - A kind of novel photoactive formula dry film solder mask - Google Patents
A kind of novel photoactive formula dry film solder mask Download PDFInfo
- Publication number
- CN204659111U CN204659111U CN201520177317.2U CN201520177317U CN204659111U CN 204659111 U CN204659111 U CN 204659111U CN 201520177317 U CN201520177317 U CN 201520177317U CN 204659111 U CN204659111 U CN 204659111U
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- Prior art keywords
- film
- solder mask
- dry film
- coating layer
- pet film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to a kind of novel photoactive formula dry film solder mask; comprise PET film; described PET film is arranged at dry film solder mask body outer surface and as first hierarchical structure; this PET film inboard arranges one deck photosensitive solder resist coating layer, described photosensitive solder resist coating layer outer surface wrap up one deck composite protection film and this composite protection film as the 3rd level.The utility model beneficial effect is: the non-stimulated smell of environmental protection; Consistency of thickness, can two-sided while pressing, pliability is good; Be applicable to soft hard circuit board to use, rete cleanliness factor is high, speed of production is exceedingly fast, photonasty is good, high adhesion force, resolution are high, is applicable to high-precision circuit board and windows use.
Description
Technical field
The utility model relates to a kind of coating material, particularly relates to a kind of novel photoactive formula dry film solder mask.
Background technology
Soldering-resistance layer, as a kind of heat-resisting coating material, is applied to selected region, and to prevent follow-up weld period, solder deposition is in this; Solder mask material can be liquid or dry film, and two types all will meet the requirement of this regulation.Some soldering-resistance layer formula also has certain insulating properties, and is not considering that the occasion of high voltage situation is often used as surface insulation thing; In addition, soldering-resistance layer is very effective for the surface damage preventing PCB in assembly operation.
This case is it is important to note that the product on existing market is by screen printing ink frowziness, and environmental pollution impact is large, and the production cycle is long, and efficiency is low, high to technical matters dependence.
This case is the alkali-developable photosensitive dry film solder mask researched and developed for the welding resistance of the outer shades of colour of high-precision circuit board, compared with liquid solder mask in the past, circuit is windowed more accurate, solder mask thickness more height evenly can two-sided while pressing, pre-inking is pre-baked, after pressing, chemical development improves speed of production greatly, decrease the dust adhesion at pre-baked printing process, and penetrating odor in production process produces, solve traditional solder mask toxic odor to employee's health and the ambient influnence problem to environmental protection.
Therefore, for above aspect, need reasonably to improve prior art.
Utility model content
For above defect, the utility model provides a kind of novel photoactive formula dry film solder mask, to solve many deficiencies of prior art.
For achieving the above object, the utility model is by the following technical solutions:
A kind of novel photoactive formula dry film solder mask; comprise PET film; described PET film is arranged at dry film solder mask body outer surface and as first hierarchical structure; this PET film inboard arranges one deck photosensitive solder resist coating layer, described photosensitive solder resist coating layer outer surface wrap up one deck composite protection film and this composite protection film as the 3rd level.
Correspondingly, the photosensitive solder resist coating layer between described composite protection film and PET film is as second level;
Described photosensitive solder resist coating layer is arranged in the interlayer between composite protection film and PET film;
State composite protection film and can be set to one or more layers.
The beneficial effect of novel photoactive formula dry film solder mask described in the utility model is:
(1) the non-stimulated smell of environmental protection;
(2) consistency of thickness, can two-sided while pressing, pliability is good;
(3) be applicable to soft hard circuit board to use, rete cleanliness factor is high, speed of production is exceedingly fast, photonasty is good, high adhesion force, resolution are high, is applicable to high-precision circuit board and windows use.
Accompanying drawing explanation
With reference to the accompanying drawings the utility model is described in further detail below.
Fig. 1 is the structural representation of novel photoactive formula dry film solder mask described in the utility model embodiment.
In figure:
1, PET film; 2, photosensitive solder resist coating layer; 3, composite protection film.
Detailed description of the invention
As shown in Figure 1, novel photoactive formula dry film solder mask described in the utility model embodiment, comprise PET film 1, described PET film 1 is arranged at dry film solder mask body outer surface and as first hierarchical structure, this PET film 1 inboard arranges one deck photosensitive solder resist coating layer 2, described photosensitive solder resist coating layer 2 outer surface wrap up one deck composite protection film 3 and this composite protection film 3 as the 3rd level, meanwhile, the photosensitive solder resist coating layer 2 between described composite protection film 3 and PET film 1 is as second level; By the setting of three levels, can consistency of thickness be made, can two-sided while pressing, pliability is good; Be applicable to soft hard circuit board to use, rete cleanliness factor is high, speed of production is exceedingly fast, photonasty is good, high adhesion force, resolution are high, is applicable to high-precision circuit board and windows use.
The above-mentioned description to embodiment can understand and apply this case technology for the ease of those skilled in the art, person skilled in the art obviously can make various amendment to these examples easily, and General Principle described herein is applied in other embodiment and need not through performing creative labour.Therefore, this case is not limited to above embodiment, and those skilled in the art is according to the announcement of this case, and the improvement made for this case and amendment all should in the protection domains of this case.
Claims (4)
1. a novel photoactive formula dry film solder mask; comprise PET film; it is characterized in that: described PET film is arranged at dry film solder mask body outer surface and as first hierarchical structure; this PET film inboard arranges one deck photosensitive solder resist coating layer, described photosensitive solder resist coating layer outer surface wrap up one deck composite protection film and this composite protection film as the 3rd level.
2. novel photoactive formula dry film solder mask according to claim 1, is characterized in that: the photosensitive solder resist coating layer between described composite protection film and PET film is as second level.
3. novel photoactive formula dry film solder mask according to claim 1, is characterized in that: described photosensitive solder resist coating layer is arranged in the interlayer between composite protection film and PET film.
4. novel photoactive formula dry film solder mask according to claim 1, is characterized in that: described composite protection film can be set to one or more layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520177317.2U CN204659111U (en) | 2015-03-27 | 2015-03-27 | A kind of novel photoactive formula dry film solder mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520177317.2U CN204659111U (en) | 2015-03-27 | 2015-03-27 | A kind of novel photoactive formula dry film solder mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204659111U true CN204659111U (en) | 2015-09-23 |
Family
ID=54129535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520177317.2U Expired - Fee Related CN204659111U (en) | 2015-03-27 | 2015-03-27 | A kind of novel photoactive formula dry film solder mask |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204659111U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172804A (en) * | 2017-07-11 | 2017-09-15 | 苏州城邦达力材料科技有限公司 | A kind of photosensitive cover layer and product |
-
2015
- 2015-03-27 CN CN201520177317.2U patent/CN204659111U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172804A (en) * | 2017-07-11 | 2017-09-15 | 苏州城邦达力材料科技有限公司 | A kind of photosensitive cover layer and product |
| CN107172804B (en) * | 2017-07-11 | 2023-12-26 | 昆山倬跃蓝天电子科技有限公司 | Photosensitive covering film and product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20180327 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |