CN202989319U - Electroplating drag cylinder plate - Google Patents
Electroplating drag cylinder plate Download PDFInfo
- Publication number
- CN202989319U CN202989319U CN 201220426575 CN201220426575U CN202989319U CN 202989319 U CN202989319 U CN 202989319U CN 201220426575 CN201220426575 CN 201220426575 CN 201220426575 U CN201220426575 U CN 201220426575U CN 202989319 U CN202989319 U CN 202989319U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- substrate
- copper
- cylinder plate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to an electroplating drag cylinder plate. The conventional drag cylinder plate is high in cost, waste in substrate, high in copper recovery cost, complex in copper recovery process, and not environmental-friendly. The plating process drag cylinder plate is characterized by including a substrate. The substrate is a synthetic resin substrate. The upper surface and the lower surface of the substrate are both provided with an electroplating copper layer, wherein the electroplating copper layer is formed by chemical electroplating, and can be peeled. The substrate is an epoxy resin substrate. The peel strength of the electroplating copper layer is less than 2.0 pound/inch. The electroplating drag cylinder plate has the advantages that substrate can be recycled, process flow is simple, copper recovery is improved, pollution is reduced, etc.; belongs to a major breakthrough in the application of copper electroplating industry; and has a great improvement for process control, technical control, specially waste reduction, further use value optimization, and environmental improvement in the aspect of the copper electroplating industry.
Description
Technical field
The utility model relates to a kind of cylinder plate that drags, and particularly a kind of electroplating technology drags the cylinder plate.
Background technology
The plate (dragging the cylinder plate) of vacation in electro-coppering industry plating at present, most use copper-clad plates, using the shortcoming of copper-clad plate is that cost is high, waste base material (can not reclaim base material after dragging cylinder by copper-clad plate), the copper cost recovery is high, and the copper recovery process is complicated, not environmental protection.
The utility model content
The technical problems to be solved in the utility model is the defects that how to overcome prior art, provides a kind of electroplating technology to drag the cylinder plate.
For solving the problems of the technologies described above, this electroplating technology drags the cylinder plate, it is characterized in that: comprise base material, described base material is the synthetic resins base material, is equipped with copper electroplating layer on this base material upper surface and lower surface, and this copper electroplating layer is formed by chemical plating, and peelable.
So design, base material application capable of circulation reduces the waste of base material, and work flow is simple, and copper can directly reclaim not to be needed to process, and reduction is polluted, environmental protection.
As optimization, described base material is the epoxy resin base material.So design, described copper electroplating layer can be peeled off from this base material, can realize the base material cycle applications, reduces the waste of base material.
As optimization, the stripping strength of described copper electroplating layer is less than 2.0 pounds/inch.So design, make copper electroplating layer be easy to peel off on base material.
The utility model electroplating technology drags the cylinder plate, has base material application capable of circulation, work flow is simple, improves the recovery of copper rate, reduces the advantages such as pollution, belong to an important breakthrough in the application aspect the electro-coppering industry, to controlling in the flow process aspect the electro-coppering industry, technology is controlled, and particularly cuts the waste, further optimize use value, the control that improves the environmental protection aspect has great improvement.
Description of drawings
Drag the cylinder plate to be described further below in conjunction with accompanying drawing to this electroplating technology:
Fig. 1 is the perspective view that this electroplating technology drags the cylinder plate;
Fig. 2 is the cross-sectional view that this electroplating technology drags the cylinder plate.
In figure: 1 is that base material, 2 is copper electroplating layer.
Embodiment
Embodiment one: as shown in Figure 1, this electroplating technology drags the cylinder plate, it is characterized in that: comprise base material 1, described base material 1 is the synthetic resins base material, be equipped with copper electroplating layer 2 on this base material 1 upper surface and lower surface, this copper electroplating layer 2 is formed by chemical plating, and peelable.
Described base material 1 is the epoxy resin base material; The stripping strength of described copper electroplating layer 2 is less than 2.0 pounds/inch.
The utility model includes but not limited to above-mentioned embodiment, within any product that meets the description of these claims all falls into protection domain of the present utility model.
Claims (2)
1. an electroplating technology drags the cylinder plate, it is characterized in that: comprise base material, described base material is the synthetic resins base material, is equipped with copper electroplating layer on this base material upper surface and lower surface, and this copper electroplating layer is formed by chemical plating, and peelable.
2. electroplating technology as claimed in claim 1 drags the cylinder plate, it is characterized in that: described base material is the epoxy resin base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220426575 CN202989319U (en) | 2012-08-27 | 2012-08-27 | Electroplating drag cylinder plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220426575 CN202989319U (en) | 2012-08-27 | 2012-08-27 | Electroplating drag cylinder plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202989319U true CN202989319U (en) | 2013-06-12 |
Family
ID=48560515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220426575 Expired - Fee Related CN202989319U (en) | 2012-08-27 | 2012-08-27 | Electroplating drag cylinder plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202989319U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104619121A (en) * | 2014-12-31 | 2015-05-13 | 广州兴森快捷电路科技有限公司 | Plating accompanied plate |
| CN107278042A (en) * | 2017-08-07 | 2017-10-20 | 大连崇达电路有限公司 | A kind of circuit board VCP's accompanies plating plate |
-
2012
- 2012-08-27 CN CN 201220426575 patent/CN202989319U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104619121A (en) * | 2014-12-31 | 2015-05-13 | 广州兴森快捷电路科技有限公司 | Plating accompanied plate |
| CN104619121B (en) * | 2014-12-31 | 2018-10-19 | 广州兴森快捷电路科技有限公司 | Accompany plating plate |
| CN107278042A (en) * | 2017-08-07 | 2017-10-20 | 大连崇达电路有限公司 | A kind of circuit board VCP's accompanies plating plate |
| CN107278042B (en) * | 2017-08-07 | 2023-09-12 | 大连崇达电路有限公司 | Accompanying plating board of circuit board VCP |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20200827 |