CN206241467U - A kind of laser processing device for carrying out multiaspect processing to workpiece - Google Patents
A kind of laser processing device for carrying out multiaspect processing to workpiece Download PDFInfo
- Publication number
- CN206241467U CN206241467U CN201621286915.4U CN201621286915U CN206241467U CN 206241467 U CN206241467 U CN 206241467U CN 201621286915 U CN201621286915 U CN 201621286915U CN 206241467 U CN206241467 U CN 206241467U
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- Prior art keywords
- laser
- workpiece
- scanning galvanometer
- processing
- processing device
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- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 230000011514 reflex Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000003754 machining Methods 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The utility model discloses a kind of laser processing device for carrying out multiaspect processing to workpiece, it includes laser and scanning galvanometer, the Laser Transmission of the laser emitting is to scanning galvanometer, the laser outlet side of the scanning galvanometer is used to place workpiece to be processed, multiple laser reflection mechanisms are provided with around workpiece, the laser reflection mechanism is oppositely arranged with the sidepiece of workpiece, the laser of the scanning galvanometer outgoing reflexes to the sidepiece of workpiece by laser reflection mechanism, the sidepiece of workpiece is made to produce Laser Processing track by the deflection of scanning galvanometer and/or laser reflection mechanism.The utility model can carry out three-dimensional processing to multiple faces of workpiece, and then adapt to various application occasions.
Description
Technical field
The utility model is related to laser process equipment, more particularly to a kind of adds for carrying out the laser of multiaspect processing to workpiece
Frock is put.
Background technology
The essence of Laser Processing is to form a rhegmalypt in material surface using the high-energy-density after Laser Focusing, so
The telecontrol equipment by aiding in forms machining shape afterwards.Existing laser processing device as shown in figure 3, the outgoing of laser 10 swash
Light is scanned through galvanometer 11 and transmits to the surface of workpiece 100, wherein, due to the rectilinear propagation properties of light so that swept utilizing
When retouching galvanometer system to cut, Laser Processing is confined to plane or the small Machining of Curved Surface of gradient.Cannot be from multiple sides to work
Part carries out three-dimension process so that laser process equipment is restricted in actual applications.
Utility model content
The technical problems to be solved in the utility model is, in view of the shortcomings of the prior art, there is provided one kind can be to workpiece
Multiple faces carry out three-dimensional processing, and then adapt to the laser processing device of various application occasions.
In order to solve the above technical problems, the utility model is adopted the following technical scheme that.
A kind of laser processing device for carrying out multiaspect processing to workpiece, it includes laser and scanning galvanometer, institute
The Laser Transmission of laser emitting is stated to scanning galvanometer, the laser outlet side of the scanning galvanometer is used to place work to be processed
Part, is provided with multiple laser reflection mechanisms around workpiece, the laser reflection mechanism is used for the laser of scanning galvanometer outgoing is anti-
The sidepiece of workpiece is incident upon, makes the sidepiece of workpiece produce Laser Processing by the deflection of scanning galvanometer and/or laser reflection mechanism
Track.
Preferably, the laser reflection mechanism is four, and four laser reflection branch constructions are in the surrounding of workpiece.
Preferably, beam expanding lens is provided between the laser and scanning galvanometer, the beam expanding lens is used to adjust laser beam
Spot size.
Preferably, the laser reflection mechanism is disposed adjacent with scanning galvanometer.
In laser processing device disclosed in the utility model, the laser beam of laser emitting is scanned through galvanometer and transmits to mistake
Laser reflection mechanism, because laser reflection mechanism is arranged at the sidepiece of workpiece and relative with workpiece so that laser beam passes through laser
Reflecting mechanism and reflex to the sidepiece of workpiece, and then sidepiece to workpiece is laser machined, in scanning galvanometer and laser reflection
Under the deflection of mechanism coordinates, realize the multiaspect processing to workpiece, compared to existing laser process equipment for, it is of the present utility model plus
Work scope is wider, and suitable for various application occasions.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model laser processing device.
Fig. 2 is the top view of laser reflection mechanism and workpiece.
Fig. 3 is the structural representation of existing laser processing device.
Specific embodiment
The utility model is described in more detail with reference to the accompanying drawings and examples.
The utility model discloses a kind of laser processing device for carrying out multiaspect processing to workpiece, with reference to Fig. 1 and Fig. 2
Shown, it includes laser 1 and scanning galvanometer 2, the Laser Transmission of the outgoing of the laser 1 to scanning galvanometer 2, the scanning
The laser outlet side of galvanometer 2 is used to place workpiece 100 to be processed, and multiple laser reflection mechanisms 3 are provided with around workpiece 100,
The laser reflection mechanism 3 is used for the sidepiece of the laser reflection of the outgoing of scanning galvanometer 2 to workpiece 100, by scanning galvanometer 2
And/or laser reflection mechanism 3 deflection and make workpiece 100 sidepiece produce Laser Processing track.
In above-mentioned laser processing device, the laser beam of the outgoing of laser 1 is scanned through galvanometer 2 and transmits to laser reflection machine excessively
Structure 3, because laser reflection mechanism 3 is arranged at the sidepiece of workpiece 100 and relative with workpiece 100 so that laser beam is anti-by laser
Penetrate mechanism 3 and reflex to the sidepiece of workpiece 100, and then sidepiece to workpiece 100 is laser machined, scanning galvanometer 2 with swash
Under the deflection of light reflecting mechanism 3 coordinates, the multiaspect processing to workpiece, for existing laser process equipment, this practicality are realized
The new range of work is wider, and suitable for various application occasions.
In process, beam of laser can be reflexed to by laser reflection mechanism 3 and carried out on workpiece by side processing,
Beam of laser can be carried out light-splitting processing, reflex to multiple sidepieces of workpiece after formation multiple laser simultaneously.
Further, the laser reflection mechanism 3 can be laser mirror, or other have the machine of laser reflection function
Structure.
Further, scanning galvanometer 2 and laser reflection mechanism 3 can be driven by mechanisms such as motors and realize deflection.
Used as a kind of preferred embodiment, the laser reflection mechanism 3 is four, and four laser reflection mechanisms 3 are divided into workpiece
100 surrounding.
In embodiment, beam expanding lens 4 is provided between the laser 1 and scanning galvanometer 2, the beam expanding lens 4 is used to adjust sharp
The spot size of light beam.Laser beam expanding lens mainly have two purposes：One is the diameter of expanded beam；The second is reducing laser
The angle of divergence of beam, therefore, it is used for laser focusing system, the angle of divergence of a branch of light beam for being expanded, and expands than being inversely proportional
Example change, compares with without the light beam for expanding, and the light beam after expanding can be focused smaller, and the multiplying power of laser bundle-enlarging collimation mirror is
The enlargement ratio of beam diameter.It is optical invariant from the spot size and angle of divergence product of the laser beam of laser output, closely
It is seemingly certain value.
Further, the laser reflection mechanism 3 is disposed adjacent with scanning galvanometer 2.Wherein, because laser beam is closer to work
Hot spot power highest at part, so laser reflection mechanism 3 is placed on the present embodiment the position close proximity to scanning galvanometer 2,
So that spot diameter of the laser beam in laser reflection mechanism 3 be larger, power is relatively low, and then reduce laser beam to laser reflection machine
The damage of structure 3.
The utility model is also disclosed a kind of laser processing for carrying out multiaspect processing to workpiece, and the method is based on one
Laser processing device realizes that the laser processing device includes laser 1 and scanning galvanometer 2, the laser of the scanning galvanometer 2
Outlet side is used to place workpiece 100 to be processed, and multiple laser reflection mechanisms 3 are provided with around workpiece 100, and methods described includes
Following steps：
Step S1, the Laser Transmission of the outgoing of the laser 1 to scanning galvanometer 2；
One of step S2, Laser Transmission that the scanning galvanometer 2 is exported to multiple laser reflection mechanisms 3；
Step S3, using laser reflection mechanism 3 by the sidepiece of the laser reflection of the outgoing of scanning galvanometer 2 to workpiece 100；
Step S4, makes the sidepiece of workpiece 100 produce laser using the deflection of scanning galvanometer 2 and/or laser reflection mechanism 3
Machining locus.
Laser reflection mechanism 3 can be laser mirror in the present embodiment, or other have the mechanism of laser reflection function.
In order to the surrounding in workpiece is processed, the laser reflection mechanism 3 is preferably four, and four laser reflection mechanisms 3 are divided into
The surrounding of workpiece 100.But this is only one preferred embodiment of the utility model, is not limited to the utility model,
In practical application, the quantity of laser reflection mechanism 3 and position can be adjusted according to the features of shape of workpiece 100, and these
Within the protection domain of the present utility model that adjustment and setting should be included.
Further, beam expanding lens 4 is provided between the laser 1 and scanning galvanometer 2, in the step S1, using described
Beam expanding lens 4 adjusts the spot size of laser beam.
In the disclosed laser processing device and method for carrying out multiaspect processing to workpiece of the utility model, laser is
The energy source of Laser Processing, described beam expanding lens is that laser beam is expanded into shaping so that the hot spot after focusing on is conducive to processing, institute
It is the device for making laser beam flying form figure to state scanning galvanometer, and the laser reflection device can reflex to laser beam processed
Piece surface, side is pointed into after laser reflection device is by the downward laser beam reflection propagated, and realizes the all-round processing of workpiece.Phase
For prior art, the beneficial effects of the utility model are：Laser beam is propagated by laser reflection device by downward
Side is pointed into after laser beam reflection, it is possible to achieve all-round processing of the light beam in big gradient curved surface.
The above is the utility model preferred embodiment, is not limited to the utility model, all in this practicality
Modification, equivalent or improvement made in new technical scope etc., should be included in the model that the utility model is protected
In enclosing.
Claims (4)
1. a kind of laser processing device for carrying out multiaspect processing to workpiece, it is characterised in that include laser (1) and sweep
Galvanometer (2) is retouched, to scanning galvanometer (2), the laser of the scanning galvanometer (2) is exported the Laser Transmission of the laser (1) outgoing
Side is used to place workpiece (100) to be processed, and multiple laser reflection mechanisms (3) are provided with around workpiece (100), and the laser is anti-
Mechanism (3) is penetrated for by the sidepiece of the laser reflection of scanning galvanometer (2) outgoing to workpiece (100), by scanning galvanometer (2) and/
Or laser reflection mechanism (3) deflection and make workpiece (100) sidepiece produce Laser Processing track.
2. it is used to carry out workpiece the laser processing device of multiaspect processing as claimed in claim 1, it is characterised in that described to swash
Light reflecting mechanism (3) is four, and four laser reflection mechanisms (3) are divided into the surrounding of workpiece (100).
3. it is used to carry out workpiece the laser processing device of multiaspect processing as claimed in claim 1, it is characterised in that described to swash
It is provided with beam expanding lens (4) between light device (1) and scanning galvanometer (2), the beam expanding lens (4) is for adjusting the spot size of laser beam.
4. it is used to carry out workpiece the laser processing device of multiaspect processing as claimed in claim 1, it is characterised in that described to swash
Light reflecting mechanism (3) is disposed adjacent with scanning galvanometer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621286915.4U CN206241467U (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device for carrying out multiaspect processing to workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621286915.4U CN206241467U (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device for carrying out multiaspect processing to workpiece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206241467U true CN206241467U (en) | 2017-06-13 |
Family
ID=59002227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621286915.4U Expired - Fee Related CN206241467U (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device for carrying out multiaspect processing to workpiece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206241467U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115273A (en) * | 2016-11-28 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and method for being used to carry out workpiece multiaspect processing |
| CN108405490A (en) * | 2018-04-23 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | Laser cleaner and laser cleaning method |
-
2016
- 2016-11-28 CN CN201621286915.4U patent/CN206241467U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115273A (en) * | 2016-11-28 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and method for being used to carry out workpiece multiaspect processing |
| CN108405490A (en) * | 2018-04-23 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | Laser cleaner and laser cleaning method |
| CN108405490B (en) * | 2018-04-23 | 2020-11-06 | 大族激光科技产业集团股份有限公司 | Laser cleaning device and laser cleaning method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 |
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| CF01 | Termination of patent right due to non-payment of annual fee |