CN108115273A - A kind of laser processing device and method for being used to carry out workpiece multiaspect processing - Google Patents
A kind of laser processing device and method for being used to carry out workpiece multiaspect processing Download PDFInfo
- Publication number
- CN108115273A CN108115273A CN201611076991.7A CN201611076991A CN108115273A CN 108115273 A CN108115273 A CN 108115273A CN 201611076991 A CN201611076991 A CN 201611076991A CN 108115273 A CN108115273 A CN 108115273A
- Authority
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- China
- Prior art keywords
- laser
- workpiece
- scanning galvanometer
- processing
- carry out
- Prior art date
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Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000003754 machining Methods 0.000 claims description 4
- 230000011514 reflex Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
Abstract
The invention discloses a kind of laser processing devices and method for being used to carry out workpiece multiaspect processing.Laser processing device includes laser and scanning galvanometer, the laser of the laser emitting is transmitted to scanning galvanometer, the laser outlet side of the scanning galvanometer is used to place workpiece to be processed, multiple laser reflection mechanisms are equipped with around workpiece, the side of the laser reflection mechanism and workpiece is oppositely arranged, the laser of the scanning galvanometer outgoing reflexes to the side of workpiece by laser reflection mechanism, and the side of workpiece is made to generate Laser Processing track by the deflection of scanning galvanometer and/or laser reflection mechanism.The present invention can carry out multiple faces of workpiece three-dimensional processing, and then adapt to various application occasions.
Description
Technical field
The present invention relates to laser process equipment more particularly to a kind of laser processing devices for being used to carry out workpiece multiaspect processing
It puts and method.
Background technology
The essence of Laser Processing is that the high-energy density after being focused on using laser forms a rhegmalypt in material surface, so
Machining shape is formed by the telecontrol equipment of auxiliary afterwards.Existing laser processing device is as shown in figure 3, the outgoing of laser 10 swashs
Light is scanned through galvanometer 11 and is transmitted to the surface of workpiece 100, wherein, due to the rectilinear propagation properties of light so that swept utilizing
Galvanometer system is retouched come when cutting, Laser Processing is confined to plane or the small Machining of Curved Surface of gradient.It can not be from multiple sides to work
Part carries out three-dimension process so that laser process equipment is restricted in practical applications.
The content of the invention
The technical problem to be solved in the present invention is, in view of the deficiencies of the prior art, provide it is a kind of can be to the more of workpiece
A face carries out three-dimensional processing, and then adapts to the laser processing device and method of various application occasions.
In order to solve the above technical problems, the present invention adopts the following technical scheme that.
A kind of laser processing device for being used to carry out workpiece multiaspect processing, includes laser and scanning galvanometer, institute
The laser for stating laser emitting is transmitted to scanning galvanometer, and the laser outlet side of the scanning galvanometer is used to place work to be processed
Part, multiple laser reflection mechanisms are equipped with around workpiece, and the laser reflection mechanism is used for the laser of scanning galvanometer outgoing is anti-
The side of workpiece is incident upon, the side of workpiece is made to generate Laser Processing by the deflection of scanning galvanometer and/or laser reflection mechanism
Track.
Preferably, the laser reflection mechanism is four, and four laser reflection branch constructions are in the surrounding of workpiece.
Preferably, beam expanding lens is equipped between the laser and scanning galvanometer, the beam expanding lens is used to adjust laser beam
Spot size.
Preferably, the laser reflection mechanism is disposed adjacent with scanning galvanometer.
A kind of laser processing for being used to carry out workpiece multiaspect processing, it is real that this method is based on a laser processing device
Existing, the laser processing device includes laser and scanning galvanometer, and the laser outlet side of the scanning galvanometer is treated for placing
The workpiece of processing is equipped with multiple laser reflection mechanisms around workpiece, and described method includes following steps：Step S1, it is described to swash
The laser of light device outgoing is transmitted to scanning galvanometer；Step S2, the laser of the scanning galvanometer output are transmitted to multiple laser reflections
One of mechanism；Step S3, using laser reflection mechanism by the laser reflection that scanning galvanometer is emitted to the side of workpiece；Step S4,
The side of workpiece is made to generate Laser Processing track using the deflection of scanning galvanometer and/or laser reflection mechanism.
Preferably, beam expanding lens is equipped between the laser and scanning galvanometer, in the step S1, utilizes the beam expanding lens
To adjust the spot size of laser beam.
In laser processing device disclosed by the invention, the laser beam of laser emitting is scanned through galvanometer and was transmitted to laser
Reflecting mechanism, since laser reflection mechanism is arranged at the side of workpiece and opposite with workpiece so that laser beam passes through laser reflection
Mechanism and the side for reflexing to workpiece, and then the side of workpiece is laser machined, in scanning galvanometer and laser reflection mechanism
Deflection cooperation under, realize that for existing laser process equipment, the range of work of the invention is more to the processing of the multiaspect of workpiece
Extensively, and suitable for various application occasions.
Description of the drawings
Fig. 1 is the structure diagram of laser processing device of the present invention.
Fig. 2 is the top view of laser reflection mechanism and workpiece.
Fig. 3 is the structure diagram of existing laser processing device.
Specific embodiment
The present invention is described in more detail with reference to the accompanying drawings and examples.
The invention discloses a kind of laser processing device for being used to carry out workpiece multiaspect processing, with reference to Fig. 1 and Fig. 2 institutes
Show, include laser 1 and scanning galvanometer 2, the laser that the laser 1 is emitted is transmitted to scanning galvanometer 2, and the scanning is shaken
The laser outlet side of mirror 2 is equipped with multiple laser reflection mechanisms 3, institute for placing workpiece 100 to be processed around workpiece 100
Laser reflection mechanism 3 is stated for by the laser reflection that scanning galvanometer 2 is emitted to the side of workpiece 100, by scanning galvanometer 2 and/
Or laser reflection mechanism 3 deflection and make workpiece 100 side generate Laser Processing track.
In above-mentioned laser processing device, the laser beam of the outgoing of laser 1 is scanned through galvanometer 2 and was transmitted to laser reflection machine
Structure 3, since laser reflection mechanism 3 is arranged at the side of workpiece 100 and opposite with workpiece 100 so that laser beam is anti-by laser
It penetrates mechanism 3 and reflexes to the side of workpiece 100, and then the side of workpiece 100 is laser machined, in scanning galvanometer 2 with swashing
Under the deflection cooperation of light reflection mechanism 3, the multiaspect processing to workpiece, for existing laser process equipment, the present invention are realized
The range of work it is wider, and suitable for various application occasions.
In process, beam of laser can be reflexed to by laser reflection mechanism 3 on workpiece and processed by side,
Beam of laser can be carried out to light-splitting processing, formed after multiple laser while reflex to multiple sides of workpiece.
Further, the laser reflection mechanism 3 can be laser mirror or other have the function of the machine of laser reflection
Structure.
Further, scanning galvanometer 2 and laser reflection mechanism 3 can be driven by mechanisms such as motors deflects to realize.
As a kind of preferred embodiment, the laser reflection mechanism 3 is four, and four laser reflection mechanisms 3 are divided into workpiece
100 surrounding.
In embodiment, beam expanding lens 4 is equipped between the laser 1 and scanning galvanometer 2, the beam expanding lens 4 is sharp for adjusting
The spot size of light beam.Mainly there are two purposes for laser beam expanding lens：One is the diameter of expanded beam；The second is reduce laser
The angle of divergence of beam, therefore, it is used for laser focusing system, the angle of divergence of a branch of light beam expanded and expands than being inversely proportional
Example variation is compared with the light beam without expanding, and the light beam after expanding can be focused to obtain smaller, and the multiplying power of laser bundle-enlarging collimation mirror is
The enlargement ratio of beam diameter.The spot size and angle of divergence product of the laser beam exported from laser are optical invariants, closely
It is seemingly certain value.
Further, the laser reflection mechanism 3 is disposed adjacent with scanning galvanometer 2.Wherein, since laser beam is closer to work
Hot spot power highest at part, so laser reflection mechanism 3 is placed on the position close proximity to scanning galvanometer 2 by the present embodiment,
So that spot diameter of the laser beam in laser reflection mechanism 3 is larger, power is relatively low, and then reduce laser beam to laser reflection machine
The damage of structure 3.
Invention additionally discloses a kind of laser processing for being used to carry out workpiece multiaspect processing, this method is based on a laser
Processing unit (plant) realizes that the laser processing device includes laser 1 and scanning galvanometer 2, the laser output of the scanning galvanometer 2
Side is equipped with multiple laser reflection mechanisms 3, the described method includes as follows for placing workpiece 100 to be processed around workpiece 100
Step：
Step S1, the laser that the laser 1 is emitted are transmitted to scanning galvanometer 2；
Step S2, the laser that the scanning galvanometer 2 exports are transmitted to one of multiple laser reflection mechanisms 3；
Step S3, using laser reflection mechanism 3 by the laser reflection that scanning galvanometer 2 is emitted to the side of workpiece 100；
Step S4 makes the side of workpiece 100 generate laser using the deflection of scanning galvanometer 2 and/or laser reflection mechanism 3
Machining locus.
Laser reflection mechanism 3 can be laser mirror in the present embodiment or other have the function of the mechanism of laser reflection.
In order to which the surrounding in workpiece is processed, the laser reflection mechanism 3 is preferably four, and four laser reflection mechanisms 3 are divided into
The surrounding of workpiece 100.But this is only a preferred embodiment of the invention, is not intended to limit the invention, in practical application
In, the quantity of laser reflection mechanism 3 and position can be adjusted according to the features of shape of workpiece 100, and these adjust and set
It puts within the protection scope of the present invention that should all be included.
Further, beam expanding lens 4 is equipped between the laser 1 and scanning galvanometer 2, in the step S1, using described
Beam expanding lens 4 adjusts the spot size of laser beam.
Disclosed by the invention to be used in laser processing device and method to workpiece progress multiaspect processing, laser is laser
The energy source of processing, the beam expanding lens be laser beam is expanded into shaping so that focus on after hot spot be conducive to process, it is described to sweep
It is the device that laser beam flying is made to form figure to retouch galvanometer, and laser beam can be reflexed to part to be processed by the laser reflection device
Surface is pointed into side after laser reflection device reflects the laser beam propagated downwards, realizes the all-round processing of workpiece.Compared to existing
For having technology, the beneficial effects of the present invention are：Laser beam is anti-by the laser beam propagated downwards by laser reflection device
Side is pointed into after penetrating, can realize all-round processing of the light beam in big gradient curved surface.
The above is preferred embodiments of the present invention, is not intended to limit the invention, all technology models in the present invention
Interior done modification, equivalent substitution or improvement etc. are enclosed, should be included in the range of of the invention protect.
Claims (7)
1. a kind of laser processing device for being used to carry out workpiece multiaspect processing, which is characterized in that include laser (1) and sweep
Galvanometer (2) is retouched, the laser of laser (1) outgoing is transmitted to scanning galvanometer (2), the laser output of the scanning galvanometer (2)
Side is equipped with multiple laser reflection mechanisms (3), the laser is anti-for placing workpiece to be processed (100) around workpiece (100)
Penetrate mechanism (3) for by scanning galvanometer (2) outgoing laser reflection to workpiece (100) side, by scanning galvanometer (2) and/
Or laser reflection mechanism (3) deflection and make workpiece (100) side generate Laser Processing track.
2. the laser processing device as described in claim 1 for being used to carry out workpiece multiaspect processing, which is characterized in that described to swash
Light reflection mechanism (3) is four, and four laser reflection mechanisms (3) are divided into the surrounding of workpiece (100).
3. the laser processing device as described in claim 1 for being used to carry out workpiece multiaspect processing, which is characterized in that described to swash
Beam expanding lens (4) is equipped between light device (1) and scanning galvanometer (2), the beam expanding lens (4) is used to adjust the spot size of laser beam.
4. the laser processing device as described in claim 1 for being used to carry out workpiece multiaspect processing, which is characterized in that described to swash
Light reflection mechanism (3) is disposed adjacent with scanning galvanometer (2).
5. a kind of laser processing for being used to carry out workpiece multiaspect processing, which is characterized in that this method is added based on a laser
Frock puts realization, and the laser processing device includes laser (1) and scanning galvanometer (2), the laser of the scanning galvanometer (2)
Outlet side is equipped with multiple laser reflection mechanisms (3), the side for placing workpiece to be processed (100) around workpiece (100)
Method includes the following steps：
Step S1, the laser of laser (1) outgoing are transmitted to scanning galvanometer (2)；
Step S2, the laser of scanning galvanometer (2) output are transmitted to one of multiple laser reflection mechanisms (3)；
Step S3, using laser reflection mechanism (3) by the laser reflection that scanning galvanometer (2) is emitted to the side of workpiece (100)；
Step S4 is made the side of workpiece (100) generate using the deflection of scanning galvanometer (2) and/or laser reflection mechanism (3) and swashed
Light machining locus.
6. the laser processing as claimed in claim 5 for being used to carry out workpiece multiaspect processing, which is characterized in that described to swash
Light reflection mechanism (3) is four, and four laser reflection mechanisms (3) are divided into the surrounding of workpiece (100).
7. the laser processing as claimed in claim 5 for being used to carry out workpiece multiaspect processing, which is characterized in that described to swash
Beam expanding lens (4) is equipped between light device (1) and scanning galvanometer (2), it is sharp to adjust using the beam expanding lens (4) in the step S1
The spot size of light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611076991.7A CN108115273A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and method for being used to carry out workpiece multiaspect processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611076991.7A CN108115273A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and method for being used to carry out workpiece multiaspect processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108115273A true CN108115273A (en) | 2018-06-05 |
Family
ID=62226029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611076991.7A Pending CN108115273A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and method for being used to carry out workpiece multiaspect processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108115273A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115255652A (en) * | 2022-09-05 | 2022-11-01 | 深圳市智鼎自动化技术有限公司 | Multi-angle laser emission self-adaptive control method and device for laser engraving machine |
Citations (7)
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|---|---|---|---|---|
| JPH01162591A (en) * | 1987-12-18 | 1989-06-27 | Nec Corp | Laser beam scanner |
| CN1519075A (en) * | 1997-03-21 | 2004-08-11 | ס���ػ�е��ҵ��ʽ���� | Laser working equipment and laser working method |
| CN103706947A (en) * | 2013-11-14 | 2014-04-09 | 中国科学技术大学 | Large-area manufacturing method and processing system for surfaces of micrometer and nanometer structures with tunable periods and tunable morphologies |
| CN203649644U (en) * | 2013-12-30 | 2014-06-18 | 北京世纪桑尼科技有限公司 | Laser scaling device |
| CN204913054U (en) * | 2015-08-31 | 2015-12-30 | 深圳中科光子科技有限公司 | Automatically cleaning adsorbs platform |
| CN105458515A (en) * | 2014-09-11 | 2016-04-06 | 大族激光科技产业集团股份有限公司 | Sapphire laser grooving device and grooving method thereof |
| CN206241467U (en) * | 2016-11-28 | 2017-06-13 | 深圳中科光子科技有限公司 | A kind of laser processing device for carrying out multiaspect processing to workpiece |
-
2016
- 2016-11-28 CN CN201611076991.7A patent/CN108115273A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01162591A (en) * | 1987-12-18 | 1989-06-27 | Nec Corp | Laser beam scanner |
| CN1519075A (en) * | 1997-03-21 | 2004-08-11 | ס���ػ�е��ҵ��ʽ���� | Laser working equipment and laser working method |
| CN103706947A (en) * | 2013-11-14 | 2014-04-09 | 中国科学技术大学 | Large-area manufacturing method and processing system for surfaces of micrometer and nanometer structures with tunable periods and tunable morphologies |
| CN203649644U (en) * | 2013-12-30 | 2014-06-18 | 北京世纪桑尼科技有限公司 | Laser scaling device |
| CN105458515A (en) * | 2014-09-11 | 2016-04-06 | 大族激光科技产业集团股份有限公司 | Sapphire laser grooving device and grooving method thereof |
| CN204913054U (en) * | 2015-08-31 | 2015-12-30 | 深圳中科光子科技有限公司 | Automatically cleaning adsorbs platform |
| CN206241467U (en) * | 2016-11-28 | 2017-06-13 | 深圳中科光子科技有限公司 | A kind of laser processing device for carrying out multiaspect processing to workpiece |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115255652A (en) * | 2022-09-05 | 2022-11-01 | 深圳市智鼎自动化技术有限公司 | Multi-angle laser emission self-adaptive control method and device for laser engraving machine |
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Application publication date: 20180605 |
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