CN206212436U - Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically - Google Patents
Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically Download PDFInfo
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- CN206212436U CN206212436U CN201621186518.XU CN201621186518U CN206212436U CN 206212436 U CN206212436 U CN 206212436U CN 201621186518 U CN201621186518 U CN 201621186518U CN 206212436 U CN206212436 U CN 206212436U
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Abstract
Pcb board high temperature gluing mechanism is torn automatically the utility model discloses formula is pushed up in one kind, including pushing up glue component, inhaling glue component and magazine, wherein, above-mentioned top glue component is arranged at the side of the rotating disk on workbench, and is correspondingly arranged up and down with the product of the high-temp glue to be torn of placement on rotating disk；Above-mentioned top glue component is arranged at the lower section of rotating disk, and is correspondingly arranged with product；Top glue component is from bottom to top moved in the connecting hole of insertion product, the positive high-temp glue of attaching and product connecting hole is departed from product, inhales the high-temp glue that the absorption of glue component departs from product, and high-temp glue is moved to being arranged in the magazine for inhaling glue component sidepiece.The utility model is realized automatically continuously tearing glue, effectively improves and tears glue automation and efficiency, reduces production cost.
Description
Technical field
The utility model is related to automatic field, and the top formula in one kind that refers in particular to tears pcb board high temperature gluing mechanism automatically.
Background technology
Automation refers to that machine or device are operated automatically in the case of unmanned the intervention by predetermined program or instruction
Or the process of control, and mechanical automation is exactly the process that machine or device mechanically realize Automated condtrol.
Pcb board is important composition part in electron trade, and it is integrated by the whole circuit control system and each functional module of product
It is that product function realizes carrier in one；During pcb board is manufactured, needed to pcb board surface after the completion of internally connecting up
Impregnation operation is carried out, insulating effect is formed to make insulating cement be covered in pcb board surface；It is many due to being typically installed with pcb board
Individual connecting hole, connecting hole inside is conductive structure, to plug a variety of electronic components on pcb board, these electronics
Component is turned on by connecting hole with pcb board internal wiring；Therefore, when pcb board impregnation is operated, it is impossible to immerse insulative glue
In connecting hole, block connecting hole or cause connecting hole electric conductivity to decline；To avoid above-mentioned situation, typically grasped in pcb board impregnation
The outside of connecting hole is attached into high-temp glue before making, in advance to cover connection hole surface, pcb board is prevented in leaching by high-temp glue
When glue is operated, in insulating cement immersion connecting hole；, it is necessary to high-temp glue is torn from pcb board after the completion of impregnation, so as to follow-up each
Plant in electronic component insertion connecting hole.
Influenceed by hole number and set location is connected on pcb board, tear high-temp glue and be difficult to be realized by automated machine structure
Standardization is automatic to tear glue action, and the existing high temperature adhesive process that tears typically uses manual operations；Because high-temp glue is carrying out impregnation operation
When, it is tighter with adhesion between pcb board surface, tears need to spend more time and energy single one by one during glue by hand
Solely tear, tear that glue efficiency is low, human cost is high.
Utility model content
The technical problems to be solved in the utility model is directed to above-mentioned the deficiencies in the prior art, there is provided one kind is realized connecting automatically
It is continuous to tear glue, effectively improve and tear glue automation and efficiency, the upper top formula for reducing production cost tears pcb board high-temp glue machine automatically
Structure.
The technical scheme that the utility model is taken is as follows：Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism, including top glue automatically
Component, inhale glue component and magazine, wherein, above-mentioned top glue component is arranged at the side of the rotating disk on workbench, and with rotating disk on
The product of the high-temp glue to be torn placed is correspondingly arranged up and down；Above-mentioned top glue component is arranged at the lower section of rotating disk, and corresponding with product
Set；Top glue component is from bottom to top moved in the connecting hole of insertion product, attaching is taken off with the positive high-temp glue of product connecting hole
From product, the high-temp glue that the absorption of glue component departs from product is inhaled, and high-temp glue is moved to the magazine for being arranged at suction glue component sidepiece
It is interior.
Preferably, described top glue component include top glue support, top glue support plate, top glue lifting sliding rail, top glue lift cylinder,
Glue slide, top rubber base and top glue bar are pushed up, wherein, above-mentioned top glue support is arranged on workbench, and positioned at the bottom of rotating disk, top
Glue support plate is arranged at the sidepiece of top glue support, and top glue slide rail is arranged on the side wall of top glue support plate；Above-mentioned top glue slide is slidably
Be embedded top glue slide rail on, top glue slide at the top of be provided with the top rubber base for extending outward.
Preferably, described top glue lift cylinder is arranged at the bottom of top glue support plate, pushes up the output end court of glue lift cylinder
Top is set, and is connected on above-mentioned top glue slide, to drive top glue slide along top glue slide rail straight line elevating movement；Above-mentioned top
Glue bar includes at least two, and top glue bar is arranged on above-mentioned top rubber base, and is upwardly extended, top glue lift cylinder drive top glue bar to
Upper motion is inserted from the connecting hole of product, so that the upward jack-up of the high-temp glue for attaching connection hole is to departing from product.
Preferably, described suction glue component include inhaling glue support, inhale glue straight line module, inhale rubber moulding group motor, inhale glue slide,
Glue bearing is inhaled, glue lift cylinder is inhaled, is inhaled glue cylinder bearing, inhale glue lifting sliding rail, inhale rubber base, inhale glue valve and inhale glue buffering elastic
Spring, wherein, above-mentioned suction glue support is arranged on the sidepiece of rotating disk, inhales glue straight line module and is arranged on suction glue support, inhales rubber moulding group electricity
Machine is arranged on one end of straight line module；Above-mentioned suction glue slide is slideably embedded on glue straight line module is inhaled, and inhales rubber moulding group motor
Suction glue slide is driven to be moved along a straight line back and forth along glue straight line module is inhaled.
Preferably, described suction glue bearing is arranged at the sidepiece for inhaling glue slide, inhales glue lifting sliding rail and is arranged at suction glue bearing
Side wall on；Above-mentioned suction rubber base is slideably embedded on glue lifting sliding rail is inhaled；Above-mentioned suction glue cylinder bearing is positioned close to inhale
Jiao Zhizuodingbuchu, inhales glue lift cylinder and is fixed on suction glue cylinder bearing, and the output end for inhaling glue lift cylinder extends downward,
And be connected on suction rubber base, inhale rubber base elevating movement to drive.
Preferably, described suction glue valve includes at least two, inhales glue valve and is connected to suction glue by inhaling glue buffer spring
The bottom of seat；Inhale glue lift cylinder and drive and inhale the top that glue valve moves downwardly to product, and near high-temp glue, to will be disengaged from
The absorption of product high-temp glue is fixed；And move to the top of magazine high-temp glue absorption, high-temp glue is put into magazine.
The beneficial effects of the utility model are：
The utility model is researched and developed for tearing glue automation process, is devised one kind and is torn automatically for upper top formula
Pcb board high temperature gluing mechanism；The utility model belong to it is automatic tear in pcb board high temperature adhesive dispenser tear high temperature gluing mechanism, this tears automatically
Pcb board high temperature adhesive dispenser realizes the linear motion of product using the traditional material strip of automation industry with product fixed seat, by turning
Disk is realized respectively tearing the switching between glue station.
Three connecting hole back sides of product are encircled for protection by electronic component in the utility model, and electronic component side is higher than company
Hole outer is connect, therefore is not in the situation that glue enters in the connecting hole through the back side in immersing glue process, only in this three connections
The front in hole attaches three disk glue, and for this kind of rubberizing mode, the utility model originally designs top glue component and inhales glue
Component, the top glue bar for being arranged at the top glue component of rotating disk bottom is from bottom to top inserted through three back sides of connecting hole, high by three
The warm upward jack-up of glue disengages it from pcb board, inhales glue component and above-mentioned disk glue is adsorbed into fixation, and is moved to magazine, from
And realize once completing three disk glue tear action, effectively improve and tear glue efficiency, reduce and tear glue cost.
Brief description of the drawings
Fig. 1 is dimensional structure diagram of the present utility model.
Fig. 2 is to tear the dimensional structure diagram of glue component in Fig. 1.
Specific embodiment
The utility model is further described below in conjunction with accompanying drawing：
As shown in Figure 1 to Figure 2, the technical scheme that the utility model is taken is as follows：Formula is pushed up in one kind and tears pcb board high temperature automatically
Gluing mechanism, including top glue component 91, suction glue component 92 and magazine 93, wherein, above-mentioned top glue component 91 is arranged on workbench
Rotating disk side, and be correspondingly arranged up and down with the product of high-temp glue to be torn placed on rotating disk；Above-mentioned top glue component 91 is set
In the lower section of rotating disk, and it is correspondingly arranged with product；From bottom to top motion is inserted in the connecting hole of product to push up glue component 91, makes attaching
Depart from product with the positive high-temp glue of product connecting hole, inhale glue component 92 and adsorb the high-temp glue for departing from product, and high-temp glue is removed
Move to and be arranged in the magazine 93 for inhaling the sidepiece of glue component 92.
Preferably, described top glue component 91 is including pushing up glue support 911, top glue support plate 912, top glue lifting sliding rail 913, top
Glue lift cylinder 914, top glue slide 915, top rubber base 916 and top glue bar 917, wherein, above-mentioned top glue support 911 is arranged at work
On platform, and positioned at the bottom of rotating disk, push up glue support plate 912 and be arranged at the sidepiece for pushing up glue support 911, push up glue slide rail 913 and be arranged on
Push up on the side wall of glue support plate 912；Above-mentioned top glue slide 915 is slideably embedded on glue slide rail 913 is pushed up, and pushes up glue slide 915
Top is provided with the top rubber base 916 for extending outward.
Preferably, described top glue lift cylinder 914 is arranged at the bottom of top glue support plate 912, top glue lift cylinder 914
Output end is set upward, and is connected on above-mentioned top glue slide 915, to drive top glue slide 915 straight along top glue slide rail 913
Line elevating movement；Above-mentioned top glue bar 917 includes at least two, pushes up glue bar 917 and is arranged on above-mentioned top rubber base 916, and prolongs upwards
Stretch, push up the driving of glue lift cylinder 914 and push up connecting hole insertion of the upward motion of glue bar 917 from product, so that connection hole is attached
The upward jack-up of high-temp glue to departing from product.
Preferably, described suction glue component include inhaling glue support 921, inhale glue straight line module 922, inhale rubber moulding group motor 923,
Glue slide 924 is inhaled, glue bearing 925 is inhaled, is inhaled glue lift cylinder 926, inhale glue cylinder bearing 927, inhale glue lifting sliding rail 928, inhale glue
Seat 929, suction glue valve 9211 and suction glue buffer spring 9210, wherein, above-mentioned suction glue support 921 is arranged on the sidepiece of rotating disk, inhales
Glue straight line module 922 is arranged on suction glue support 921, inhales one end that rubber moulding group motor 923 is arranged on straight line module 922；It is above-mentioned
Inhale glue slide 924 to be slideably embedded on glue straight line module 922 is inhaled, inhale rubber moulding group motor 923 and drive and inhale glue slide 924 along suction
Glue straight line module 922 moves along a straight line back and forth.
Preferably, described suction glue bearing 925 is arranged at the sidepiece for inhaling glue slide 924, inhales glue lifting sliding rail 928 and is arranged at
Inhale on the side wall of glue bearing 925；Above-mentioned suction rubber base 929 is slideably embedded on glue lifting sliding rail 928 is inhaled；Above-mentioned suction glue cylinder
Bearing 927 is positioned close to inhale at the top of glue bearing 925, inhales glue lift cylinder 926 and is fixed on suction glue cylinder bearing 927, inhales
The output end of glue lift cylinder 926 extends downward, and is connected on suction rubber base 929, and the lifting fortune of rubber base 929 is inhaled to drive
It is dynamic.
Preferably, described suction glue valve 9211 includes at least two, inhales glue valve 9211 by inhaling glue buffer spring
9210 are connected to the bottom for inhaling rubber base 929；Inhaling glue lift cylinder 926 drives suction glue valve 9211 to move downwardly to the upper of product
Side, and near high-temp glue, fixed to will be disengaged from the absorption of product high-temp glue；And move high-temp glue absorption upper to magazine 93
Side, high-temp glue is put into magazine 93.
Further, the utility model devises one kind and tears pcb board high temperature gluing mechanism automatically for upper top formula；The utility model
Belong to it is automatic tear in pcb board high temperature adhesive dispenser tear high temperature gluing mechanism, this is torn pcb board high temperature adhesive dispenser and is gone using automation automatically
The traditional material strip of industry realizes the linear motion of product with product fixed seat, realizes respectively tearing the switching between glue station by rotating disk.
Three connecting hole back sides of product are encircled for protection by electronic component in the utility model, and electronic component side is higher than company
Hole outer is connect, therefore is not in the situation that glue enters in the connecting hole through the back side in immersing glue process, only in this three connections
The front in hole attaches three disk glue, and for this kind of rubberizing mode, the utility model originally designs top glue component and inhales glue
Component, the top glue bar for being arranged at the top glue component of rotating disk bottom is from bottom to top inserted through three back sides of connecting hole, high by three
The warm upward jack-up of glue disengages it from pcb board, inhales glue component and above-mentioned disk glue is adsorbed into fixation, and is moved to magazine, from
And realize once completing three disk glue tear action, effectively improve and tear glue efficiency, reduce and tear glue cost.
Embodiment of the present utility model is to introduce its specific embodiment, does not lie in and limits its protection domain.The industry
Technical staff can make under the inspiration of the present embodiment some modifications, therefore all done according to the utility model the scope of the claims
Equivalent change or modification, belongs in the utility model scope of the patent claims.
Claims (6)
1. formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically, it is characterised in that：Including top glue component（91）, inhale glue component
（92）And magazine（93）, wherein, above-mentioned top glue component（91）The side of the rotating disk being arranged on workbench, and with rotating disk on put
The product of the high-temp glue to be torn put is correspondingly arranged up and down；Above-mentioned top glue component（91）Be arranged at the lower section of rotating disk, and with product pair
Should set；Top glue component（91）From bottom to top in the connecting hole of motion insertion product, make attaching and the positive height of product connecting hole
Warm glue departs from product, inhales glue component（92）Absorption depart from product high-temp glue, and by high-temp glue move to be arranged at inhale glue component
（92）The magazine of sidepiece（93）It is interior.
2. push up formula in one kind according to claim 1 and tear pcb board high temperature gluing mechanism automatically, it is characterised in that：Described top
Glue component（91）Including top glue support（911）, top glue support plate（912）, top glue lifting sliding rail（913）, top glue lift cylinder
（914）, top glue slide（915）, top rubber base（916）And top glue bar（917）, wherein, above-mentioned top glue support（911）It is arranged at work
On platform, and positioned at the bottom of rotating disk, glue support plate is pushed up（912）It is arranged at top glue support（911）Sidepiece, push up glue slide rail（913）
It is arranged on top glue support plate（912）Side wall on；Above-mentioned top glue slide（915）Slideably it is embedded in top glue slide rail（913）On, top
Glue slide（915）Top be provided with the top rubber base for extending outward（916）.
3. push up formula in one kind according to claim 2 and tear pcb board high temperature gluing mechanism automatically, it is characterised in that：Described top
Glue lift cylinder（914）It is arranged at top glue support plate（912）Bottom, push up glue lift cylinder（914）Output end set upward,
And it is connected to above-mentioned top glue slide（915）On, to drive top glue slide（915）Along top glue slide rail（913）Straight line elevating movement；
Above-mentioned top glue bar（917）Including at least two, glue bar is pushed up（917）It is arranged on above-mentioned top rubber base（916）On, and upwardly extend, push up
Glue lift cylinder（914）Drive top glue bar（917）Motion upwards is inserted from the connecting hole of product, so as to attach connection hole
The upward jack-up of high-temp glue is to departing from product.
4. push up formula in one kind according to claim 3 and tear pcb board high temperature gluing mechanism automatically, it is characterised in that：Described suction
Glue component includes inhaling glue support（921）, inhale glue straight line module（922）, inhale rubber moulding group motor（923）, inhale glue slide（924）, inhale
Glue bearing（925）, inhale glue lift cylinder（926）, inhale glue cylinder bearing（927）, inhale glue lifting sliding rail（928）, inhale rubber base
（929）, inhale glue valve（9211）And inhale glue buffer spring（9210）, wherein, above-mentioned suction glue support（921）It is arranged on the side of rotating disk
Portion, inhales glue straight line module（922）It is arranged on suction glue support（921）On, inhale rubber moulding group motor（923）It is arranged on straight line module
（922）One end；Above-mentioned suction glue slide（924）Slideably it is embedded and is inhaling glue straight line module（922）On, inhale rubber moulding group motor
（923）Drive and inhale glue slide（924）Along suction glue straight line module（922）Move along a straight line back and forth.
5. push up formula in one kind according to claim 4 and tear pcb board high temperature gluing mechanism automatically, it is characterised in that：Described suction
Glue bearing（925）It is arranged at suction glue slide（924）Sidepiece, inhale glue lifting sliding rail（928）It is arranged at suction glue bearing（925）Side
On wall；Above-mentioned suction rubber base（929）Slideably it is embedded and is inhaling glue lifting sliding rail（928）On；Above-mentioned suction glue cylinder bearing（927）If
Put near suction glue bearing（925）At top, glue lift cylinder is inhaled（926）It is fixed on suction glue cylinder bearing（927）On, inhale glue liter
Drop cylinder（926）Output end extend downward, and be connected to suction rubber base（929）On, to drive suction rubber base（929）Lifting fortune
It is dynamic.
6. push up formula in one kind according to claim 5 and tear pcb board high temperature gluing mechanism automatically, it is characterised in that：Described suction
Glue valve（9211）Including at least two, glue valve is inhaled（9211）By inhaling glue buffer spring（9210）It is connected to suction rubber base
（929）Bottom；Inhale glue lift cylinder（926）Drive and inhale glue valve（9211）The top of product is moved downwardly to, and near height
Warm glue, fixes to will be disengaged from the absorption of product high-temp glue；And move to magazine high-temp glue absorption（93）Top, by high-temp glue
It is put into magazine（93）It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621186518.XU CN206212436U (en) | 2016-10-28 | 2016-10-28 | Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621186518.XU CN206212436U (en) | 2016-10-28 | 2016-10-28 | Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206212436U true CN206212436U (en) | 2017-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621186518.XU Active CN206212436U (en) | 2016-10-28 | 2016-10-28 | Formula is pushed up in one kind and tears pcb board high temperature gluing mechanism automatically |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206212436U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041436A (en) * | 2018-10-19 | 2018-12-18 | 深圳市克鲁斯机器人科技有限公司 | One kind tears glue, moves back PIN machine automatically |
-
2016
- 2016-10-28 CN CN201621186518.XU patent/CN206212436U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041436A (en) * | 2018-10-19 | 2018-12-18 | 深圳市克鲁斯机器人科技有限公司 | One kind tears glue, moves back PIN machine automatically |
| CN109041436B (en) * | 2018-10-19 | 2023-06-23 | 深圳市克鲁斯机器人科技有限公司 | Automatic tear gluey, move back PIN machine |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: 518104 1st floor, building 38, South Ring Road Science Park, Ma'anshan community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinghe Automation Co.,Ltd. Address before: 518000 B, block C, 1 floor, first floor, Ma An Shan science and Technology Park, Western Baoan District, Guangdong, Shenzhen, Baoan District. Patentee before: SHENZHEN SINVO AUTOMATIC Co.,Ltd. |