CN206193879U

CN206193879U - IC card

Info

Publication number: CN206193879U
Application number: CN201621274915.2U
Authority: CN
Inventors: 陆建峰
Original assignee: Shenzhen Financial Touchplus Information Corp
Current assignee: Shenzhen Financial Touchplus Information Corp
Priority date: 2016-11-25
Filing date: 2016-11-25
Publication date: 2017-05-24
Anticipated expiration: 2026-11-25

Abstract

The utility model discloses a IC card, including first layer, the second floor, third layer, fourth layer, the 5th layer, the 6th layer and the 7th layer, first layer, the second floor, third layer, fourth layer, the 5th layer, the 6th layer and the 7th layer of follow are last to setting gradually down, and first layer and the 7th layer all adopt glued membrane material producing, and the second floor and the 6th layer all adopt PC material producing, and third layer and the 5th layer all adopt non -setting adhesive material producing, and fourth layer adoption metal material producing has all opened the through -hole on first layer, the second floor and the fourth layer, be packaged with the chip in the through -hole of the second floor. The hardness of this product is greater than the card of PVC material production, not flexible and rupture, the outward appearance is generous, more has grade, prominent customer's honorable nature than the card of PVC material production, and adopt high temperature lamination technique preparation shaping between each layer, the outward appearance accords with the ISO7816 standard to this product at metal surface encapsulation chip, and the electrical property reaches ISO14443 standard, low in production cost.

Description

A kind of IC-card

Technical field

The utility model is related to a kind of card, specifically a kind of IC-card.

Background technology

Also known as integrated circuit card, it is to set one or many in size and common credit card identical plastic cards to IC-card What individual integrated circuit was constituted.IC chip can be memory or to processor.IC-card with memory is also called note Recall card or storage card, the IC-card with microprocessor is also called smart card or smart card.Memory card can store bulk information；Intelligence Can block then not only has memory capability, but also the function with processing information.Due to being easy to carry, amount of storage is big, and it is increasingly Favored by people.IC-card can very easily deposit automobile expense, telephone charge, subway riding fee, dining room table money, highway and pay Take and shopping tour, auto service etc..Current existing IC-card is, as card base, to be bonded by meeting PVC using PVC material The laminating temperature of power is laminated, and chip is packaged by the technique of groove milling, but PVC meets high temperature is easily bent deformation, always Frangibility after change；PVC card after deformation, hence it is evident that reduce the class of card；PVC is not degradable, and not environmentally, this is all people's Using bringing inconvenience.

Utility model content

The purpose of this utility model is to provide a kind of IC-card, to solve the problems, such as to be proposed in above-mentioned background technology.

To achieve the above object, the utility model provides following technical scheme：

A kind of IC-card, including ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7, described One layer, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 set gradually and use heat zone from top to bottom Pressure technology is connected, and ground floor and layer 7 are made using adhesive film material, and the second layer and layer 6 are made using PC materials, the Three layers are made with layer 5 using adhesive material, and the 4th layer is made using metal material, ground floor, the second layer and the 4th layer On be provided with the through hole being used in conjunction with each other, be packaged with chip in the through hole of the second layer.

As further program of the utility model：4th layer is made using manganese steel material, and the temperature of high temperature lamination is 180-200 degrees Celsius, the length of the through hole of ground floor and the second layer is 13mm, and width is 12mm, and the 4th layer of through hole is long Degree and width are 9mm.

As further program of the utility model：The thickness of ground floor and layer 7 is 0.04mm, the second layer and Six layers of thickness is 0.2mm, and the thickness of third layer and layer 5 is 0.05mm, and the 4th layer of thickness is 0.35mm.

Compared with prior art, the beneficial effects of the utility model are：The product structure is simple, and reasonable in design, hardness is big It is not flexible and fracture in the card of PVC material production；Outward appearance is generous, and the card produced than PVC material more has class, highlights The honorable property of client；The product encapsulated in metal surface and be molded using high temperature lamination fabrication techniques between chip and each layer, outward Sight meets ISO7816 standards, and electrical property reaches ISO14443 standards, and low production cost, using effect is good.

Brief description of the drawings

Fig. 1 is the explosive view of IC-card.

Wherein：1- ground floors, the 2- second layers, 3- third layer, the 4th layer of 4-, 5- layer 5s, 6- layer 6s, 7- layer 7s, 8- through holes, 9- chips.

Specific embodiment

The technical scheme of this patent is described in more detail with reference to specific embodiment.

Refer to Fig. 1, a kind of IC-card, including ground floor 1, the second layer 2, third layer 3, the 4th layer 4, layer 55, layer 6 6 and layer 77, the ground floor 1, the second layer 2, third layer 3, the 4th layer 4, layer 55, layer 66 and layer 77 are from up to Under set gradually and be connected using high temperature lamination, ground floor 1 and layer 77 are made using adhesive film material, the second layer 2 Made using PC materials with layer 66, third layer 3 and layer 55 are made using adhesive material, and the 4th layer 4 using gold Category material is made, and the through hole 8 being used in conjunction with each other, the through hole 8 of the second layer 2 are provided with ground floor 1, the second layer 2 and the 4th layer 4 In be packaged with chip 9.Made using manganese steel material for 4th layer 4, the temperature of high temperature lamination is 180-200 degrees Celsius, the He of ground floor 1 The length of the through hole 8 of the second layer 2 is 13mm, and width is 12mm, and the 4th layer 4 of the length and width of through hole 8 is 9mm.The The thickness of one layer 1 and layer 77 is 0.04mm, and the thickness of the second layer 2 and layer 66 is 0.2mm, third layer 3 and the 5th The thickness of layer 5 is 0.05mm, and the 4th layer 4 of thickness is 0.35mm.

Operation principle of the present utility model is：The product by the way of manganese steel plate and PC materials are combined, and It is laminated at a temperature of 180-200 degrees Celsius, is met the bonding force between each layer, and by the production into standard card, So that the hardness of the product is more than the IC-card that PVC makes, and it is not flexible, deform and fracture, it is more durable；The product is than common PVC card more has class, more aobvious honorable；Metal surface encapsulate chip, technically solve it is non-conductive, and without prejudice to its use work( Can, outward appearance can reach ISO7816 standards, and electrical property reaches ISO14443 standards；PC materials are natural degradation material, more ring Protect；The wearability of manganese steel plate is good, long service life, more cost-effective and environmental protection.The preparation flow of the product is as follows：First, Metal is rushed into the hole that a length and width is 9mm according to production requirement using punch press；Second, will according to production by PC materials It is 13mm to ask and use one length of punch press punching, and width is the hole of 12mm；3rd, successively by ground floor, the second layer, third layer, Four layers, layer 5, layer 6 and layer 7 are laminated using laminating machine under 180-200 degrees Celsius；4th, by what is be laminated Card is washed into standard card using mould；5th, chip is encapsulated on standard card using packaging machine；6th, the property of testing standard card Can, if meet ISO7816 and ISO14443 requirement can storage.Manufacturer can use other materials, such as PVC materials Material, instead of glued membrane, meets the different demands of manufacturer.

The product structure is simple, reasonable in design, hardness more than PVC material production card, it is not flexible and fracture；Outward appearance Generous, the card produced than PVC material more has class, highlights the honorable property of client；The product encapsulates chip 9 simultaneously in metal surface And using high temperature lamination fabrication techniques shaping between each layer, outward appearance meets ISO7816 standards, and electrical property reaches ISO14443 marks Standard, low production cost, using effect is good.

It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, can in other specific forms realize that this practicality is new Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.

Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined May be appreciated other embodiment.

Claims

1. a kind of IC-card, it is characterised in that including ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and the 7th Layer, the ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 set gradually from top to bottom and It is connected using high temperature lamination, ground floor and layer 7 are made using adhesive film material, and the second layer and layer 6 use PC Material is made, and third layer and layer 5 are made using adhesive material, and the 4th layer is made using metal material, ground floor, the The through hole being used in conjunction with each other is provided with two layers and the 4th layer, chip is packaged with the through hole of the second layer.

2. IC-card according to claim 1, it is characterised in that described 4th layer is made using manganese steel material, high temperature lamination Temperature be 180-200 degrees Celsius, the length of the through hole of ground floor and the second layer is 13mm, and width is 12mm, the 4th layer Through hole length and width be 9mm.

3. IC-card according to claim 1 and 2, it is characterised in that the thickness of the ground floor and layer 7 is The thickness of 0.04mm, the second layer and layer 6 is 0.2mm, and the thickness of third layer and layer 5 is 0.05mm, the 4th layer Thickness is 0.35mm.