CN106584933A - IC card making technology - Google Patents
IC card making technology Download PDFInfo
- Publication number
- CN106584933A CN106584933A CN201611053818.5A CN201611053818A CN106584933A CN 106584933 A CN106584933 A CN 106584933A CN 201611053818 A CN201611053818 A CN 201611053818A CN 106584933 A CN106584933 A CN 106584933A
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- CN
- China
- Prior art keywords
- card
- layer
- standard
- materials
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
Abstract
The invention discloses an IC card making technology. The IC card making technology comprises step 1: screening all layers of raw materials, step 2: respectively punching metal and PC materials through a punching machine according to production requirements to obtain one through hole of each one of the metal and PC materials, step3: carrying out high temperature lamination on the layers through a laminating machine, step 4: stamping the laminated card through a mold to obtain a standard card, step 5: encapsulating a chip on the standard card, and step 6: testing performances of the standard card and carrying out warehousing when the standard card is qualified. The product has a simple structure and a reasonable design. The IC card making technology has simple processes. The hardness of the IC card is greater than that of a card prepared from a PVC material and the IC card is not easily bent and broken. The IC card has good appearance, has a quality grade higher than that of the card prepared from the PVC material, and has exalted feeling. The chip is encapsulated on the metal surface and all layers are molded through a high temperature lamination technology. The IC card has good appearance satisfying the ISO7816 standards, electrical performances satisfying the ISO14443 standard, a low production cost and good use effects.
Description
Technical field
The present invention relates to IC-card production field, specifically a kind of processing technology of IC-card.
Background technology
Also known as integrated circuit card, it is in size and common credit card identical plastic cards to set one or many to IC-card
What individual integrated circuit was constituted.IC chip can be memorizer or to processor.IC-card with memorizer is also called note
Recall card or storage card, the IC-card with microprocessor is also called smart card or smart card.Memory card can store bulk information；Intelligence
Can block, but also the function with processing information.Due to being easy to carry, amount of storage is big, and it is increasingly
Favored by people.IC-card can very easily be deposited automobile expense, telephone charge, subway riding fee, dining room table money, highway and pay
Take and shopping tour, auto service etc..Existing IC-card is as card base, by meeting PVC bondings using PVC material at present
The laminating temperature of power is laminated, and chip is packaged by the technique of groove milling, but PVC meets high temperature is easily bent deformation, always
Frangibility after change；PVC card after deformation, hence it is evident that reduce the class of card；PVC is not degradable, and not environmentally, this is all people's
Using bringing inconvenience.
The content of the invention
It is an object of the invention to provide a kind of processing technology of IC-card, with asking for solving to propose in above-mentioned background technology
Topic.
For achieving the above object, the present invention provides following technical scheme：
A kind of processing technology of IC-card, comprises the following steps that：
Step one, sieves to the raw material of ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7
Choosing, ground floor and layer 7 are made using adhesive film material, the second layer and layer 6 using the making of PC materials, third layer and the
Five layers are made using adhesive material, and the 4th layer is made using metal material；
Metal and PC materials are respectively rushed a through hole using punch press according to production requirement by step 2；
Ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 are adopted laminating machine by step 3 successively
Carry out high temperature lamination；
The card being laminated is washed into standard card using mould by step 4；
Step 5, encapsulates chip on standard card using packaging machine；
Step 6, the performance of testing standard card, if put in storage by meeting the requirement of ISO7816 and ISO14443.
As further scheme of the invention：On metal material, the length and width of through hole is 9mm, through hole on PC materials
Length be 13mm, width is 12mm.
As further scheme of the invention：The temperature range of high temperature lamination is 180-200 degree Celsius.
Compared with prior art, the invention has the beneficial effects as follows：The product structure that the present invention makes is simple, reasonable in design,
Simple production process, card of the hardness more than PVC material production are flexible and fracture；Outward appearance is generous, produces than PVC material
Card more have class, highlight the honorable property of client；The product is encapsulated in metal surface and adopt between chip and each layer high temperature
Lamination makes molding, and outward appearance meets ISO7816 standards, and electrical property reaches ISO14443 standards, low production cost, using effect
It is really good.
Specific embodiment
The technical scheme of this patent is described in more detail with reference to specific embodiment.
Embodiment 1
A kind of processing technology of IC-card, comprises the following steps that：
Step one, sieves to the raw material of ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7
Choosing, ground floor and layer 7 are made using adhesive film material, the second layer and layer 6 using the making of PC materials, third layer and the
Five layers are made using adhesive material, and the 4th layer is made using metal material；
Metal and PC materials are respectively rushed a through hole, metal material on through hole using punch press according to production requirement by step 2
Length and width is 9mm, and on PC materials, the length of through hole is 13mm, and width is 12mm；
Ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 are adopted laminating machine by step 3 successively
Carry out high temperature lamination；
The card being laminated is washed into standard card using mould by step 4；
Step 5, encapsulates chip on standard card using packaging machine；
Step 6, the performance of testing standard card, if put in storage by meeting the requirement of ISO7816 and ISO14443.
Embodiment 2
A kind of processing technology of IC-card, comprises the following steps that：
Step one, sieves to the raw material of ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7
Choosing, ground floor and layer 7 are made using adhesive film material, the second layer and layer 6 using the making of PC materials, third layer and the
Five layers are made using adhesive material, and the 4th layer is made using metal material；
Metal and PC materials are respectively rushed a through hole, metal material on through hole using punch press according to production requirement by step 2
Length and width is 9mm, and on PC materials, the length of through hole is 13mm, and width is 12mm；
Ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 are adopted laminating machine by step 3 successively
It is laminated under 180-200 degree Celsius；
The card being laminated is washed into standard card using mould by step 4；
Step 5, encapsulates chip on standard card using packaging machine；
Step 6, the performance of testing standard card, if put in storage by meeting the requirement of ISO7816 and ISO14443.
The present invention operation principle be：The product by the way of manganese steel plate and PC materials combine, and in 180-200
It is laminated at a temperature of degree Celsius, is met the bonding force between each layer, and by the production into standard card so that the product
The IC-card that the hardness of product is made more than PVC, it is not flexible, deform and fracture, it is more durable；The product is than common PVC card more
There is class, it is more aobvious honorable；Metal surface encapsulate chip, technically solve it is non-conductive, and without prejudice to its use function, outward appearance
ISO7816 standards can be reached, electrical property reaches ISO14443 standards；PC materials are natural degradation material, more environmentally friendly；Manganese steel plate
Wearability it is good, long service life is more cost-effective and environmentally friendly.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that those skilled in the art should for clarity
Using description as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.
Claims (3)
1. a kind of processing technology of IC-card, it is characterised in that comprise the following steps that：
Step one, sieves to the raw material of ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7
Choosing, ground floor and layer 7 are made using adhesive film material, the second layer and layer 6 using the making of PC materials, third layer and the
Five layers are made using adhesive material, and the 4th layer is made using metal material；
Metal and PC materials are respectively rushed a through hole using punch press according to production requirement by step 2；
Ground floor, the second layer, third layer, the 4th layer, layer 5, layer 6 and layer 7 are adopted laminating machine by step 3 successively
Carry out high temperature lamination；
The card being laminated is washed into standard card using mould by step 4；
Step 5, encapsulates chip on standard card using packaging machine；
Step 6, the performance of testing standard card, if put in storage by meeting the requirement of ISO7816 and ISO14443.
2. the processing technology of IC-card according to claim 1, it is characterised in that on the metal material length of through hole and
Width is 9mm, and on PC materials, the length of through hole is 13mm, and width is 12mm.
3. a kind of processing technology of the IC-card as described in claim 1 or 2 is arbitrary, it is characterised in that the temperature of the high temperature lamination
Degree scope is 180-200 degree Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611053818.5A CN106584933A (en) | 2016-11-25 | 2016-11-25 | IC card making technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611053818.5A CN106584933A (en) | 2016-11-25 | 2016-11-25 | IC card making technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106584933A true CN106584933A (en) | 2017-04-26 |
Family
ID=58592001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611053818.5A Pending CN106584933A (en) | 2016-11-25 | 2016-11-25 | IC card making technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106584933A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050240778A1 (en) * | 2004-04-26 | 2005-10-27 | E-Smart Technologies, Inc., A Nevada Corporation | Smart card for passport, electronic passport, and method, system, and apparatus for authenticating person holding smart card or electronic passport |
| CN201327647Y (en) * | 2008-11-11 | 2009-10-14 | 白延强 | PET smart card |
| CN103186806A (en) * | 2011-12-27 | 2013-07-03 | 上海浦江智能卡系统有限公司 | Fabrication method of smart card made of polycarbonate material |
| CN104166870A (en) * | 2014-07-01 | 2014-11-26 | 珠海市金邦达保密卡有限公司 | Double-interface metal intelligent chip card and manufacture method |
| CN205139969U (en) * | 2015-11-06 | 2016-04-06 | 黄石捷德万达金卡有限公司 | Intelligence transaction card containing metal level |
-
2016
- 2016-11-25 CN CN201611053818.5A patent/CN106584933A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050240778A1 (en) * | 2004-04-26 | 2005-10-27 | E-Smart Technologies, Inc., A Nevada Corporation | Smart card for passport, electronic passport, and method, system, and apparatus for authenticating person holding smart card or electronic passport |
| CN201327647Y (en) * | 2008-11-11 | 2009-10-14 | 白延强 | PET smart card |
| CN103186806A (en) * | 2011-12-27 | 2013-07-03 | 上海浦江智能卡系统有限公司 | Fabrication method of smart card made of polycarbonate material |
| CN104166870A (en) * | 2014-07-01 | 2014-11-26 | 珠海市金邦达保密卡有限公司 | Double-interface metal intelligent chip card and manufacture method |
| CN205139969U (en) * | 2015-11-06 | 2016-04-06 | 黄石捷德万达金卡有限公司 | Intelligence transaction card containing metal level |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lu Jianfeng Inventor after: Chen Bing Inventor before: Lu Jianfeng |
|
| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170426 |
|
| RJ01 | Rejection of invention patent application after publication |