CN200962226Y - A hetero encapsulation non-contact IC card - Google Patents

A hetero encapsulation non-contact IC card Download PDF

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Publication number
CN200962226Y
CN200962226Y CN 200620044794 CN200620044794U CN200962226Y CN 200962226 Y CN200962226 Y CN 200962226Y CN 200620044794 CN200620044794 CN 200620044794 CN 200620044794 U CN200620044794 U CN 200620044794U CN 200962226 Y CN200962226 Y CN 200962226Y
Authority
CN
China
Prior art keywords
card
integrated circuit
contact
contactless
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 200620044794
Other languages
Chinese (zh)
Inventor
俞军
谢志刚
纪兰花
张弛
沈磊
汤家甦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Public Transportation Card Co., Ltd.
Shanghai Fudan Microelectronics Group Co Ltd
Original Assignee
SHANGHAI PUBLIC TRANSPORTATION CARD CO Ltd
Shanghai Fudan Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI PUBLIC TRANSPORTATION CARD CO Ltd, Shanghai Fudan Microelectronics Co Ltd filed Critical SHANGHAI PUBLIC TRANSPORTATION CARD CO Ltd
Priority to CN 200620044794 priority Critical patent/CN200962226Y/en
Application granted granted Critical
Publication of CN200962226Y publication Critical patent/CN200962226Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a non-contact IC (integrated circuit) card with heterotype packing. The non-contact IC (integrated circuit) of the type can provide multi-style heterotype card forms different from the general non-contact IC (integrated circuit) with a common packing structure for the current system using the non-contact IC (integrated circuit) card as the information storage media. The non-contact IC (integrated circuit) of this type has the characteristics of various form and beauty, higher packing reliability, lightness and flexibility, thereby meeting the requirements for application of different users.

Description

A kind of contactless IC card of special-shaped encapsulation
Technical field
The utility model relates to a kind of novel structure shape of contactless ic (integrated circuit) card.
Background technology
Along with the informationalized development of China, the application of contactless ic (integrated circuit) card is constantly expanded, and the applied environment of card constantly improves.For general non-contact card, physical dimension normally adopts the card that meets the ISO7810 standard, mechanical, single, the general flavor of shape.Along with the expansion of the application of the type card, all types of user has proposed various further requirements to the application of card, and wherein major part relates to compact outline and attractive and durable requirement, but there is no change at present.
Summary of the invention
The purpose of this utility model is contactless ic (integrated circuit) card that obtains a kind of good looking appearance, durable, diversified special-shaped encapsulation.
Content of the present utility model is contactless ic (integrated circuit) card that has proposed a kind of good looking appearance, durable, diversified special-shaped encapsulation.
Contactless IC card has the convenience of portably using as novel IC (integrated circuit) card, and is easy and simple to handle, characteristics such as long service life, and application is more and more wider, has become the principal mode of IC (integrated circuit) card.General contactless ic (integrated circuit) card is of a size of the requirement of following the ISO7810 standard, specifically be of a size of length * wide=86mm * 54mm, thickness is about 0.8mm, expansion along with the application of such card, people have proposed new requirement for size, shape, the outward appearance of card, wherein miniaturization, abnormal shapeization, durableization and attractive in appearance be main demand.This type of card is passive substantially, power supply is provided by the radiofrequency signal of card-reading apparatus emission, card is by induction antenna, circuit chip and PVC or PVT card base constitute, induction antenna is connected on the pin of circuit chip by electric spot welding technology, be pressed into into card by lamination again, and in the sheet basic circuit of chip by power supply generation, signal demodulation, control and postback the circuit several sections and form, obtain signal and energy from induction antenna during work, demodulate signal, behind control circuit execution corresponding operating, send answer signal to card-reading apparatus by postbacking circuit.
Contactless ic (integrated circuit) card of the abnormal shape that the utility model proposes encapsulation is an aerial coil 1 external capacitor 2 in parallel and is composed in series card with integrated circuit (IC) chip 3, the card outside is that the plastic drop material encapsulation constitutes, drip the plastic packaging dress and can make card-like abnormal shape various, so the profile of card is an arbitrary shape.
In the utility model, the profile of card is a polygon.
In the utility model, the profile of card is special-shaped polygon, for example the entertaining pattern of different shape.
In the utility model, the surface of card is the ornament materials wrapping and encapsulating of stereo pattern.
In the utility model, the profile of card is the cartoon figure.
In the utility model, through hole 4 is arranged on the card.
Novel contactless ic (integrated circuit) card that the utility model provides the card be made up of an aerial coil L (1) and an external capacitor C (2) and integrated circuit (IC) chip M (3) and outside plastic drop material (6) encapsulation to constitute; the aerial coil that is encapsulated in the card can change with physical dimension; outside plastic drop material not only plays the effect of protection card; also increase the durability of card, and increased the aesthetic property of card and the dirigibility of use.The outer enclosure material has adopted the ornament materials of band stereo pattern, then can produce more interesting and attracting effect.If such card such as the utility model leave corresponding through hole as centre as described in the claim 3, be convenient to the connection of cotton rope or metal hasp, can make this novel contactless ic (integrated circuit) card can become a kind of decoration suspension member simultaneously, not only increase aesthetic property, also increased the dirigibility of carrying greatly.
Description of drawings
Fig. 1 is the utility model card cut-away view.
Fig. 2 is the utility model card side view.
Fig. 3 is the utility model card circuit structure diagram.1 is aerial coil among the figure, the 2nd, and external capacitor, the 3rd, integrated circuit (IC) chip, the 4th, through hole, the 5th, the card body, the 6th, drip the plastic packaging dress.
Embodiment
Specific embodiments is the mini special-shaped card that is applied to the wide 3CM of a kind of long 5CM, card is inner to adopt as shown in Figure 3 the circuit of being made up of coil L and chip capacity C and integrated circuit (IC) chip M, and adopt PVC or the compacting of PET material to form, the tow sides of card are printed on the picture of corresponding performance meaning and the picture of related description literal, leave the through hole of a 2mm diameter on certain angle of card, simultaneously the card tow sides all adopt to drip and mould technology and be packaged into formal product.

Claims (4)

1, a kind of contactless IC card of special-shaped encapsulation is characterized in that an aerial coil (a 1) external capacitor (2) in parallel and is composed in series card with integrated circuit (IC) chip (3) that the card outside is that the plastic drop material encapsulation constitutes, and the profile of card is a polygon.
2, contactless IC card as claimed in claim 1, the profile that it is characterized in that card are special-shaped polygons.
3, contactless IC card as claimed in claim 1, the surface that it is characterized in that card are the ornament materials wrapping and encapsulating.
4, contactless IC card as claimed in claim 1 is characterized in that having on the card through hole (4).
CN 200620044794 2006-08-11 2006-08-11 A hetero encapsulation non-contact IC card Expired - Lifetime CN200962226Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200620044794 CN200962226Y (en) 2006-08-11 2006-08-11 A hetero encapsulation non-contact IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200620044794 CN200962226Y (en) 2006-08-11 2006-08-11 A hetero encapsulation non-contact IC card

Publications (1)

Publication Number Publication Date
CN200962226Y true CN200962226Y (en) 2007-10-17

Family

ID=38798739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200620044794 Expired - Lifetime CN200962226Y (en) 2006-08-11 2006-08-11 A hetero encapsulation non-contact IC card

Country Status (1)

Country Link
CN (1) CN200962226Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882234A (en) * 2009-05-08 2010-11-10 北京握奇数据系统有限公司 Method for making noncontact IC card
CN102254205A (en) * 2010-05-18 2011-11-23 上海卡美循环技术有限公司 Non-contact two-purpose IC (integrated circuit) card combined with card type special-shaped pendant and manufacturing method of IC card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882234A (en) * 2009-05-08 2010-11-10 北京握奇数据系统有限公司 Method for making noncontact IC card
CN101882234B (en) * 2009-05-08 2014-03-05 北京握奇数据系统有限公司 Method for making noncontact IC card
CN102254205A (en) * 2010-05-18 2011-11-23 上海卡美循环技术有限公司 Non-contact two-purpose IC (integrated circuit) card combined with card type special-shaped pendant and manufacturing method of IC card

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHANGHAI FUDAN MICROELECTRONICS GROUP COMPANY LIMI

Free format text: FORMER NAME: FUDAN MICROELECTRONICS CO., LTD., SHANGHAI

CP03 Change of name, title or address

Address after: 200433 building 4, Fudan Science Park, 127 Cathay Pacific Road

Co-patentee after: Shanghai Public Transportation Card Co., Ltd.

Patentee after: Shanghai Fudan Microelectronic Group Co., Ltd.

Address before: 200433 No. 127 Cathay Pacific Road, Shanghai

Co-patentee before: Shanghai Public Transportation Card Co., Ltd.

Patentee before: Fudan Microelectronics Co., Ltd., Shanghai

CX01 Expiry of patent term

Granted publication date: 20071017

EXPY Termination of patent right or utility model