CN206179618U - Temperature sensor - Google Patents
Temperature sensor Download PDFInfo
- Publication number
- CN206179618U CN206179618U CN201490001307.7U CN201490001307U CN206179618U CN 206179618 U CN206179618 U CN 206179618U CN 201490001307 U CN201490001307 U CN 201490001307U CN 206179618 U CN206179618 U CN 206179618U
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- interarea
- temperature sensor
- thermistor
- base station
- temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
Temperature sensor (1) includes for the temperature of the position on the surface to keeping away from circuit board detects: base station (2), this base station have each other relative first interarea (M1) and second interarea (M2), a plurality of wiring conductor (31, 32), these a plurality of wiring conductors are between two interareas (M1, M2) to the tip ability of interarea (M1) the side of these a plurality of wiring conductors and a plurality of connection pad electric connection that form on the surface, thermistor (4), this thermistor has each other relative third interarea (M3) and fourth interarea (M4) to be fixed in base station (2) in the face of the mode of interarea (M2) in fact with interarea (M3), and a plurality of electrodes (42, 43), these a plurality of electrodes are formed at thermistor (4) to the tip electricity that can incline with the interarea (M2) of a plurality of wiring conductors (31, 32) is connected.
Description
Technical field
The utility model is related to possess thermistor element, and can be arranged on the temperature sensor on circuit substrate.
Background technology
In the past, as this temperature sensor, exist for example in the thermistor sensing described in following patent documents 1
Device.The temperature sensor possesses pliability adhesive tape.On the surface of pliability adhesive tape, two leads formed by metal foil are abreast
It is extended laterally side by side.In one end of two leads, thermistor element is set.Additionally, the most of and heat to cover two leads
The mode of quick resistive element carries out resin coating.Additionally, in order to be able to temperature sensor is arranged on circuit substrate, exposing two and drawing
The other end of line is without carrying out resin coating.
Temperature sensor is installed along with circuit substrate with various electronic circuits.Specifically, the other end of two leads
With the terminal pad electrode engagement being formed on circuit substrate.And, thermistor element with the object as temperature detection
The mode of object directly contact is configured.In addition, the thermistor element is with the thing with the object as temperature detection
The mutually close mode of body or space is configured.If the temperature of detection object changes, the resistance value of thermistor element
Change.Now, if heat sensitive resistive element is powered, between the other end of two leads, it may appear that right with detecting
The voltage of the related value of the temperature of elephant.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 08-068699 publications
Utility model content
Utility model technical problem to be solved
Temperature sensor is arranged on circuit substrate, when actually used, for the object that exists around itself
Temperature is detected.However, not existing enough spaces around circuit substrate sometimes.In this condition, there is problem such as
Under：Due to the influence of elongated pliability adhesive tape, temperature sensor easily can not be installed on circuit substrate during fabrication.
Therefore, the purpose of this utility model is to provide a kind of temperature sensor that can be easily mounted on circuit substrate.
Solve the technical scheme of technical problem
In order to reach above-mentioned purpose, one side of the present utility model is can be to the position on the surface away from circuit substrate
The temperature sensor that temperature is detected, including：Base station, the base station has the first interarea and the second interarea relative to each other；
Multiple wiring conductors, the plurality of wiring conductor extends between first interarea and second interarea, and at least should
The end of the first interarea side of multiple wiring conductors can be connected disc electrode and electrically connect with the multiple for being formed in the surface；Heat
Quick resistance, the thermistor has the 3rd interarea and the 4th interarea relative to each other, and substantial with the 3rd interarea
Mode towards second interarea is fixed on the base station；And multiple electrodes, it is electric that the plurality of electrode is formed in the temperature-sensitive
Resistance, and can be electrically connected with the end of the second interarea side of the multiple wiring conductor.
Utility model effect
According to above-mentioned aspect, temperature sensor can be easily mounted on circuit substrate.
Brief description of the drawings
Fig. 1 is the stereogram of the finished goods of the temperature sensor involved by an implementation method of the present utility model.
Fig. 2 is the exploded perspective view of the temperature sensor of Fig. 1.
Fig. 3 A show the first schematic diagram of the manufacturing process of the temperature sensor of Fig. 1.
Fig. 3 B show the second schematic diagram of the manufacturing process of the temperature sensor of Fig. 1.
Fig. 3 C show the 3rd schematic diagram of the manufacturing process of the temperature sensor of Fig. 1.
Fig. 3 D show the 4th schematic diagram of the manufacturing process of the temperature sensor of Fig. 1.
Fig. 4 shows the schematic diagram of the application examples of the temperature sensor of Fig. 1 etc..
Fig. 5 is the schematic diagram of the problem of the thermistor (temperature) sensor that illustrate in detail conventional.
Fig. 6 is the stereogram of the finished goods of the temperature sensor involved by variation.
Fig. 7 is the exploded perspective view of the temperature sensor of Fig. 6.
Fig. 8 A show the first schematic diagram of the manufacturing process of the thermistor element of Fig. 6.
Fig. 8 B show the second schematic diagram of the manufacturing process of the thermistor element of Fig. 6.
Fig. 8 C show the 3rd schematic diagram of the manufacturing process of the thermistor element of Fig. 6.
Fig. 8 D show the 4th schematic diagram of the manufacturing process of the thermistor element of Fig. 6.
Specific embodiment
《Implementation method》
Hereinafter, referring to the drawings, the temperature sensor 1 involved by an implementation method of the present utility model is illustrated.
Before the explanation, it is defined for several L axles shown in the drawings, W axles, T axles.L axles, W axles and T axles are mutually orthogonal, represent
The left and right directions (length direction) of base station 2 and thermistor element 4, fore-and-aft direction (width) and above-below direction (height
Direction).
《The basic structure of temperature sensor 1》
As shown in Figure 1 and Figure 2, temperature sensor 1 is generally comprised：Base station 2, the first wiring conductor 31, the second wiring conductor
32 and thermistor element 4.
Base station 2 with of a relatively high rigid Ins. ulative material by making.As this material, it is exemplified with
So-called rigid printed base plate identical material (for example, glass epoxide or aluminum oxide etc.).In addition, as base station 2
Material, it is possible to use the resin material such as PET (polyethylene terephthalate).Herein, in order to not by thermistor element 4
Heat (for example, the heat from circuit substrate 54 (reference picture 4)) beyond temperature detection object is transferred to thermistor element
4, as the material of base station 2, more preferably use PET with relatively low pyroconductivity etc..
Additionally, base station 2 substantially has following shape：Two are formed with the cuboid block being made by above-mentioned material
Semicircular cylinder groove.Herein, two semicircular cylinder grooves are formed at mutual relative two face of cuboid block.In the present embodiment, show
Example property ground forms a semicircular cylinder face groove respectively in the relative left surface and right flank of L direction of principal axis.Hereinafter, for base station 2
One configuration example is described in detail.
In the present embodiment, base station 2 has：First interarea M1, the second interarea M2, first side S1, second side S2,
3rd side S3 and the 4th side S4.
Interarea M1, M2 are the bottom surface and upper surface of base station 2.The interarea M1, M2 are almost parallel with LW planes respectively, with that
This same shape.Additionally, interarea M2 substantially overlaps when being overlooked from T direction of principal axis with interarea M1, interarea M2 is square in T axles
Discretely it is configured with interarea M1 upwards.Herein, by the mutual chain-dotted line A-A ' definition in the respective centers of connection interarea M1, M2
It is axle A-A '.Additionally, two cornerwise intersection points that the center of interarea M1, M2 refers to interarea M1, M2 each to be had.Additionally, will
Vertical median plane is referred to as by axle A-A ' and the face almost parallel with WT planes.Additionally, will by axle A-A ' and with vertical center
The face that face is substantially orthogonal is referred to as horizontal median plane.
Interarea M1 has relative both sides (that is, the left side and the right) on L direction of principal axis.The left side and the right have to indulge center
Shape substantially symmetrical to the other on the basis of face.Additionally, the middle body on the left side and the right is equivalent to left side and the semicircular cylinder on right side
The lower end of groove, with circular shape.
Interarea M2 have with interarea M1 identical shapes, therefore reduction it is described in detail.
Side S1 is the left surface of base station 2, shares the side (i.e. the left side) of the L axle negative direction sides that interarea M1, M2 have.Side
S1 (is hereinafter referred to as overlooked) when being overlooked from T direction of principal axis, and the left side with interarea M1, M2 substantially overlaps.Thus, side S1 turns into
The semicircular cylinder face of the shape of regulation groove and the combination in the front and rear rectangular face for being connected in semicircular cylinder face.
Side S2 is the right flank of base station 2.Side S2 has substantially symmetric with side S1 on the basis of vertical median plane
Shape.Therefore, the detailed description to side S2 is reduced.
Side S3 is the front of base station 2.Side S3 is the generally rectangular face parallel with TL planes, shares interarea
The W axle negative direction sides that M1, M2 have while (i.e. front side while), and the front side of common side S1, S2 side.
Side S4 is the back side of base station 2.Side S4 has substantially symmetric with side S3 shape on the basis of horizontal median plane.
Therefore, the detailed description to side S4 is reduced.
Wiring conductor 31,32 is formed with conductive material.Copper etc. is typical conductive material.However, in order to suppress
Heat sensitive resistive element 4 carries out undesirable heat transfer, preferably by the metal (for example, alloy of copper and mickel) of low-thermal conductivity
It is used in the first wiring conductor 31.
Wiring conductor 31 is formed in the way of being reached on interarea M2 via side S1 at least from interarea M1.In this embodiment party
In formula, exemplarily, wiring conductor 31 includes coating portion and conductive pattern portion.Coating portion is with least in the semicircular cylinder face of side S1
On the mode that the left side of interarea M1, M2 is connected with each other is formed.Additionally, conductive pattern portion is to be used in the temperature-sensitive for hereinafter illustrating
The connection disc electrode of the installation of resistive element 4, and be formed on interarea M2.
Wiring conductor 32 has substantially symmetric with wiring conductor 31 shape on the basis of indulging median plane.Therefore, it is right to reduce
The detailed description of wiring conductor 32.
Thermistor element 4 is the paster thermistor of such as cascade type, comprising thermistor body 41, the first external electrical
The outer electrode 43 of pole 42 and second.
Thermistor body 41 includes multiple ceramic layers.Herein, multiple ceramic layers are laminated on T direction of principal axis.Additionally, many
In individual ceramic layer, the adjacent ceramic interlayer on T direction of principal axis is respectively provided with an internal electrode.
Additionally, thermistor body 41 has the temperature being had greatly changed relative to the changes in resistance value of environment temperature
Characteristic.In the present embodiment, it is assumed that thermistor body 41 is as temperature rises the NTC thermistor that resistance value diminishes.
Above-mentioned NTC thermistor can be by will be from transition such as such as manganese (Mn), nickel (Ni), iron (Fe), cobalt (Co) and copper (Cu)
The oxide of two kinds to five kinds selected in the group of element mixes and sinters oxidate sintered body (ceramic sintered bodies) system for obtaining
Form.
Additionally, thermistor body 41 has according to such as JIS (Japanese Industrial Standards) standardized size.Additionally, hot
It is shown in broken circle in such as Fig. 2 of quick resistance body 41, with by the 3rd interarea M3, the 4th interarea M4, the 5th side S5, the 6th
The approximately parallelepiped body shape that side S6, heptalateral face S7 and the 8th side S8 are constituted.Interarea M3, M4 are the bottoms of thermistor 41
Face and upper surface.Additionally, side S5, S6 are the left surface and right flank of thermistor body 41.Side S7, S8 are thermistors
41 front and the back side.
Outer electrode 42,43 is by with the basalis that for example silver-colored (Ag) is main component, forming nickel on the base layer
(Ni) coating and the tin coating (Sn) being formed on Ni coating are constituted.
Outer electrode 42 covers the left part of such as thermistor body 41.Specifically, outer electrode 42 is in this implementation
It is set in mode in addition to the side S5 whole regions of thermistor body 41, also covers interarea M3, M4 and side S7, S8 are each
From left end portion.
Outer electrode 43 covers the right part of such as thermistor body 41.Specifically, outer electrode 43 is in this implementation
It is set in mode in addition to the side S6 whole regions of thermistor body 41, also covers interarea M3, M4 and side S7, S8 are each
From right end portion.The outer electrode 43 is on the basis of outer electrode 42, predetermined distance to be separated on L direction of principal axis to set.
Thermistor element 4 is fixed on the upper surface of base station 2.Specifically, underrun welding of outer electrode 42 etc.
Upper surface with the connection disc electrode of wiring conductor 31 engages, additionally, underrun welding of outer electrode 43 etc. and wiring
The upper surface of the connection disc electrode of conductor 32 engages.As a result, thermistor body 41 is layered in the upper surface of base station 2, make
The interarea M3 of thermistor body 41 is obtained substantially facing to the interarea M2 of base station 2.
《The size of thermistor element 4, base station 2》
In thermistor element 4, although the size to thermistor body 41 is not particularly limited, but in this reality
Apply in mode, thermistor body 41 has according to the standardized sizes of JIS.If for example, the size of thermistor body 41 is
0603 size, then the size (that is, L cuns) of L direction of principal axis is 0.6mm, and the size (that is, W cuns) of W direction of principal axis is 0.3mm.Additionally, T axles
The size (that is, T cuns) in direction is determined according to JIS standards, but such as 0.15mm.Herein, L cuns, W cuns and T cuns
It is design object value, it is not necessary to exactly 0.6mm, 0.3mm and 0.15mm.That is, L cuns, W cuns and T cuns is have public affairs
Poor.
Although the size of base station 2 is not particularly limited, suitably set according to following viewpoints.First, base station 2
L cuns and W cuns on the basis of consider thermistor body 41 L cuns and W cuns, will also consider that the limitation in manufacture method is fitted
Locality setting.For example, in manufacturing process, chip mounter etc. configures multiple thermistor elements 4 mother substrate 21 is up in column-like manner,
Afterwards, cutting machine etc. is cut so as to complete each temperature sensor 1 (reference picture 3A~Fig. 3 D) mother substrate 21.In the feelings
Under condition, L cuns of base station 2 and W cuns becomes bigger than L cuns of thermistor body 41 and W cuns.
Additionally, the T on base station 2 cuns suitably sets according to following viewpoints.Temperature sensor 1 when actually used,
On the interarea of the circuit substrate 54 of electronic equipment 5 (for example, smart mobile phone or panel computer terminal) (reference picture 4).And
And, temperature sensor 1 pair for example on the basis of the interarea of circuit substrate 54, in its normal direction (i.e. T direction of principal axis) at a distance of away from
Space temperature from the position of d is detected.Herein, using temperature sensor 1 locus to be detected as specification by electronics
The designer of equipment 1 presets.In the above cases, the T cun of setting base station 2 cause from interarea M1 to interarea M4 away from
It is substantially equal with distance d from D.
《The manufacture method of temperature sensor 1》
Then, the manufacturing process for temperature sensor 1 illustrates.The manufacturing process of temperature sensor 1 generally wraps
Include：The manufacturing process of thermistor element 4, the installation procedure that thermistor element 4 is attached to base station 2.Hereinafter, for each work
Sequence is illustrated in sequence.
Operation of the manufacturing process of thermistor element 4 comprising following (A-1)~(A-3).
(A-1) the ceramic raw material i.e. Mn of ormal weight is weighed3O4、Fe2O3、Co3O4, NiO, CuO, thus obtain ceramic original
Material.The ceramic raw material, puts into ball mill of the inside containing powder mediums such as zirconium oxides, carries out fully case of wet attrition.
Ceramic raw material after crushing carries out the calcination processing of about 2 hours with about 760 DEG C of temperature, thus, obtains ceramic powders.Connect
, the organic bond of the ceramic powders and ormal weight together, mixed processing is carried out using wet method, thus obtains slurry.The slurry
Material carries out processing and forming by doctor blade method etc., thus, obtains ceramic green sheet.
(A-2) paste for internal electrode with the alloy of silver-colored (Ag) and palladium (Pd) as main component is utilized by above-mentioned
The pattern of silk-screen printing internal electrode on the ceramic green sheet that operation (A-1) is obtained.Then, in the ceramic green for printing finishing patterns
Piece multi-slice poststack, thereon lower two surfaces crimping does not have figuratum ceramic green sheet.Thus, the layered product not burnt till.Connect
, the layered product not burnt till is accommodated in the case of zirconium oxide after given size is cut into.Afterwards, for the stacking in case
Body carries out unsticking mixture process with about 350 DEG C of temperature, the condition of about 2 hours.For the stacking for completing unsticking mixture process
Body, carries out burning till treatment with set point of temperature (such as 1100 DEG C~1175 DEG C).Thus, thermistor body 41 is obtained.
(A-3) in the left and right both ends of the surface of the thermistor body 41 obtained by above-mentioned operation (A-2), be coated with and calcine with
Ag is the outer electrode thickener of main component, is formed into the basic basal electrode of outer electrode 42,43.Afterwards, pass through
Electrolytic coating, forms Ni coating on each basal electrode, and Sn coating is formed on each Ni coating.
By above-mentioned operation (A-1)~(A-3), substantial amounts of thermistor element 4 is produced together.
The installation procedure that thermistor element 4 is attached to base station 2 is included into operation (B-1)~(B-3).
(B-1) then, as shown in Figure 3A, prepare to turn into the large-scale mother substrate 21 of base station 2.The thickness of mother substrate 21 into
Be the T cun of base station 2, therefore the thickness of mother substrate 21 is suitably determined according to above-mentioned viewpoint, be such as 180 μm, 680 μm, 1180 μm,
Any one in 1680 μm and 2180 μm.Additionally, mother substrate 21 is set to the copper foil covered lamination in such as two sides.In female base
On plate 21, being formed will turn into the wiring pattern 33 of wiring conductor 31,32 in large quantities.Specifically, for example, by etching, in large quantities
Form the conductive pattern of connection disc electrode.The conductive pattern is formed as ranks shape on two directions of L axles and W axles.Afterwards,
Respectively between two conductive patterns adjacent on the L direction of principal axis, via conductors are formed for example, by copper facing.Thus, form a large amount of
Wiring pattern 33.
(B-2) then, in the terminal pad electrode part of each wiring pattern 33, Sn-Ag-Cu classes are printed with 60 μm of thickness
Welding thickener.Afterwards, as shown in Figure 3 B, by chip mounter etc., by the placing of thermistor element 4 wiring pattern 33 terminal pad
Electrode part.Then, reflow treatment is carried out to the mother substrate 21 of placing thermistor element 4 with about 260 DEG C of temperature, thus,
As shown in Figure 3 C, mother substrate 21 of the thermistor element 4 on wiring pattern 33 is obtained.
(B-3) then, mother substrate 21 is cut using cutting machine etc..More specifically, with by the center of each through hole and
Almost parallel with WT planes is respectively cut in face of mother substrate 21, and with by adjacent two wiring diagrams on W direction of principal axis
The center of case 33 and almost parallel with TL planes respectively cut in face of mother substrate 21.Additionally, each cut surface is used in fig. 3d
Dotted line is represented.
By above-mentioned operation (A-1)~(B-3), substantial amounts of temperature sensor 1 is produced together.
《The application examples of temperature sensor 1》
As shown in figure 4, temperature sensor 1 as described above is arranged on the circuit substrate that the inside of electronic equipment 5 possesses
On 54 interarea, the space temperature with the interarea position of d separated by a distance on T direction of principal axis is detected.Hereinafter, reference
Fig. 4 is illustrated to the installation procedure that temperature sensor 1 is attached to electronic equipment 5.
First, the lowermost of reference picture 4.Electronic equipment 5 possesses housing (in other words, external packing body) 51.Housing 51 includes
External package casing 52 when user uses as rear side and the external packing cover plate 53 as face side when user uses.
In the inside of external package casing 52, storage is mounted with the circuit substrate 54 of various electronic circuits.Herein, the interarea of circuit substrate 54
It is just right via gap (that is, air layer) and the inner surface of external package casing 52.In addition, although diagram is eliminated, in external packing
Cover plate 53 is provided with such as liquid crystal display.
Then, the uppermost of reference picture 4.Temperature sensor 1 with above-mentioned operation (B-2) identical method, installed in electricity
On base board 54.
Then, as shown in Fig. 4 second segments since upper, circuit substrate 54 is received and is fixed on the interior of external package casing 52
Portion so that the interarea of circuit substrate 54 and the inner surface of external package casing 52 are just right.
Then, as shown in the 3rd section since upper of Fig. 4, the inside that the closing external package casing 52 of cover plate 53 is packed in addition is empty
Between mode install, electronic equipment 5 is completed as shown in the lowermost of Fig. 4.In this condition, in the worked of electronic equipment 5
Cheng Zhong, temperature sensor 1 is detected to the space temperature between circuit substrate 54 and external package casing 52.
《Effect-the effect of temperature sensor 1》
However, such as " utility model technical problem to be solved " column it is stated that as, due to elongated pliability glue
The influence of band, conventional temperature sensor can not be easily installed at circuit substrate during fabrication sometimes.Hereinafter, to the problem
Reference picture 5 is described in detail.
Fig. 5 shows the schematic diagram of the operation for conventional temperature sensor to be attached to electronic equipment.Additionally, figure
In 5, pair part suitable with the equipment-structure shown in Fig. 4 mark identical reference numeral omits respective explanation.
Conventional temperature sensor 101 such as " prior art " column it is stated that as, possess pliability adhesive tape 102.At this
The surface of pliability adhesive tape 102, is extended two leads.In one end of two leads, temperature-sensitive element 103 is set.Additionally, two draw
The other end 104 of line exposes so that can be electrically connected with circuit substrate 54, without implementing resin coating.
In the inside of above-mentioned electronic equipment 5, temperature sensor 101 is installed as described as follows.Such as the uppermost of Fig. 5
Shown, temperature sensor 101 is installed on external package casing 52 and circuit substrate 54 in manually-operated mode.Specifically,
Thermistor element 103 is configured in the vicinity of detection object.Additionally, with welding etc. by the other end 104 and circuit of two leads
Connection disc electrode on the interarea of substrate 54 is engaged.
Then, as shown in Fig. 5 second segments since upper, circuit substrate 54 is received and is fixed on the interior of external package casing 52
Portion so that the interarea of circuit substrate 54 and the inner surface of external package casing 52 are just right.
Then, as shown in the 3rd section since upper of Fig. 5, the inside that the closing external package casing 52 of cover plate 53 is packed in addition is empty
Between mode installed, electronic equipment 5 is completed as shown in the lowermost of Fig. 5.In this condition, in the work of electronic equipment 5
During work, thermistor element 103 is detected to case temperature.
In the electronic equipment 5 for having used conventional temperature sensor 101, although the lead of thermistor element 103 and two
The other end 104 it is close to each other, due to circuit substrate 54 to be accommodated in the inside of external package casing 52 with artificial operation, need
Wanting pliability adhesive tape 103 has enough length.As a result, pliability adhesive tape 102 produces unnecessary part, generation must be by the portion
It is partially pressed into the situation of narrow space.
In this regard, in the case of this temperature sensor 1, by the effect of feature base station 2, can be in manufacture electronic equipment 5 etc.
When be easily fitted to circuit substrate 54.Specifically, base station 2 has the high rigidity different from pliability adhesive tape 102, and base
In the specification of electronic equipment 5, the height of T direction of principal axis is pre-adjusted.Additionally, wiring conductor 31,32 is in the side of the base station 2 of high rigidity
On face S3, S4, by thermistor element 4 and circuit substrate 54 it is linear the mode that connects formed.Thus, wiring conductor
31st, 32 is neither elongated and do not bend, therefore according to this temperature sensor 1, can be easily fitted to when the grade of electronic equipment 5 is manufactured
Circuit substrate 54.
Additionally, according to this temperature sensor 1, thermistor element 4 is mounted on base station 2.Thus, even if in TEMP
In the case that the temperature of the position on 1 pair of surface away from circuit substrate 54 of device is detected, adjusted by the height to base station 2
It is whole, the volume of thermistor element 4 can be reduced.Thus, the thermal capacity of thermistor element 4 diminishes, therefore thermistor element 4
Change that can be rapidly to environment temperature is reacted.
Additionally, the electronic component more than the caloric values such as circuit substrate 54 installation CPU and power amplifier (below, claims
It is heating element).But, according to this temperature sensor 1, by clipping base station 2, can be by thermistor element 4 and these hairs
Hot component thermal isolation.Thus, thermistor element 4 can more correctly detect the temperature of object.
《Note 1》
In the above-described embodiment, thermistor body 41 is NTC thermistor.But this is not limited to, thermistor
Main body 41 can also be PTC thermistor.In this case, thermistor body 41 is generally by by the terres rares and titanium of ormal weight
Sour barium (BaTiO3) ceramic sintered bodies after mixed sintering are formed.
《Note 2》
In the above-described embodiment, illustrated thermistor element 4 as cascade type paster thermistor.But simultaneously
Not limited to this, thermistor element 4 can also be the paster thermistor of single panel type.
《Note 3》
Additionally, thermistor body 41 be not limited to 0603 size, or 3225 sizes, 3216 sizes, 2012 sizes,
1608 sizes, 1005 sizes, 0402 size.On these sizes, as described in the table described as follows 1 such as L cuns.
[table 1]
Table 1：The size of resistive element 41
| Size | L cuns [mm] | W cuns [mm] | T cuns [mm] |
| 3225 | 3.2 | 2.5 | 1.0 |
| 3216 | 3.2 | 1.6 | 1.0 |
| 2012 | 2.0 | 1.2 | 1.0 |
| 1608 | 1.6 | 0.8 | 0.4 |
| 1005 | 1.0 | 0.5 | 0.25 |
| 0603 | 0.6 | 0.3 | 0.15 |
| 0402 | 0.4 | 0.2 | 0.1 |
《Note 4》
In above-mentioned operation (A-1), Mn is used3O4Deng oxide as ceramic raw material.But this is not limited to, can be with
Carbonate or hydroxide using Mn etc..
《Note 5》
In operation (A-3), outer electrode 42,43 is formed by the calcining and electrolytic coating of Ag.But do not limit
In this, it is also possible to formed by sputtering method or vacuum vapour deposition etc..
《Variation》
Then, reference picture 6, Fig. 7, illustrates to the temperature sensor 1a involved by the variation of above-mentioned implementation method.
In Fig. 6, Fig. 7, compared with the shown temperature sensor 1 such as Fig. 1, difference is to use thermistor element to temperature sensor 1a
4a replaces thermistor element 4.There is no difference between two temperatures sensor 1,1a in addition.Therefore, in Fig. 6, Fig. 7,
The part mark identical reference numeral suitable to the structure shown with Fig. 1 etc., omits respective explanation.Hereinafter, to temperature-sensitive electricity
One configuration example of resistance element 4a is described in detail.
Thermistor element 4a includes：Paster thermistor 44a, protection component 45a, the electricity of first electrode 46a and second
Pole 47a.Additionally, illustrating for convenience, protection component 45a, paster heat are illustrate only in figure 6 on thermistor element 4a
Quick resistance 44a and electrode 46a, 47a only figure 7 illustrates.
Paster thermistor 44a has the identical structure of thermistor element 4 with above-mentioned implementation method.Therefore, reduce
Detailed description to paster thermistor 44a.
Protection component 45a resin materials with electrical insulating property as such as epoxy resin are made.In addition, may be used
To use phenolic resin, polyimide resin etc. as resin material.
Protection component 45a at least covers the whole region of the interarea M4 sides of paster thermistor 44a.Herein, it is necessary to note
Meaning be：Protection component 45a not only covers the interarea M4 sides of the thermistor body that paster thermistor 44a has, and also covers
The interarea M4 sides of the outer electrode of lid two.Additionally, it is further preferred that on the side face of protection component 45a covering paster thermistors 44a
Whole region in addition to interarea M3.By setting above-mentioned protection component 45a, can be by thermistor element 4a and electric conductivity
Detection object (for example, electronic equipment have metal housing) directly contact.
Electrode 46a, 47a be previously formed in the outer electrode that paster thermistor 44a has and another outside
On the bottom surface of electrode, the surface for being attached to circuit substrate.
The electrode 46a, 47a include Sn coating, Ni coating, Cu coating and Copper Foil.Sn coating is at the bottom of each outer electrode
Formed in the way of directly contact on face, each Ni coating is formed on the bottom surface of corresponding Sn coating in the way of directly contact,
Each Cu coating is formed on the bottom surface of corresponding Ni coating in the way of directly contact, and each Copper Foil is in the bottom surface of corresponding Cu coating
On formed in the way of directly contact.
《The manufacture method of thermistor element 4a》
Then, reference picture 8A~Fig. 8 D a, example to the manufacture method of above-mentioned thermistor element 4a is illustrated.
Operation of the manufacture method comprising following (C-1)~(C-5).
(C-1) first, female Copper Foil 48 as shown in Figure 8 A, is prepared.The thickness (i.e. T cuns) of female Copper Foil 48 is such as 18 μm.
Additionally, on L cuns, W cuns, in order to produce substantial amounts of thermistor element 4a, L cuns, W cuns preferably as big as possible together.
On the interarea of the female Copper Foil 48 being ready for, dry film photoresist (not shown) is pasted by laminating machine.Afterwards, by exposing-showing
Shadow, opening is formed in the position corresponding with electrode 46a, 47a of multiple thermistor element 4a of the dry film photoresist.Using electricity
Plating, plating is being carried out from each female Copper Foil 48 for being open and exposing successively by the order of Cu, Sn and Ni.Thus, formation will turn into
The part of electrode 46a, 47a.
(C-2) it is coated with scaling powder in the part as electrode 46a, 47a obtained using above-mentioned operation (C-1).Afterwards, such as
Shown in Fig. 8 B, using chip mounter etc., carried out in the way of each outer electrode of paster thermistor 44a is abutted with corresponding part
Placing.Herein, paster thermistor 44a is matched somebody with somebody in the way of equally spaced being arranged respectively on L direction of principal axis and W direction of principal axis
Put.To placing, female Copper Foil 48 of paster thermistor 44a carries out reflow treatment, as a result, in the master of paster thermistor 44a
The two end portions of face M3 sides form electrode 46a, 47a.
(C-3) on the female Copper Foil 48 obtained using above-mentioned operation (C-2), as shown in Figure 8 C, by such as Thermocurable ring
Oxygen tree fat formed uncured resin sheet material 49 to cover each paster thermistor 44a in the way of be laminated regulation piece number.This is not solid
The thickness (that is, T cuns) for changing resin sheet 49 is such as 100 μm.L cuns and W cuns substantially identical with female Copper Foil 48 respectively.Using true
Sky heating pressue device carries out pressure-heat treatment to these uncured resin sheet materials 49.Specifically, in about 130 DEG C of temperature
After about two minutes vacuumize is implemented under degree, the pressure of about 5MP is applied to by uncured resin by flat stamping mold
On sheet material 49.
(C-4) after above-mentioned pressure-heat treatment, recycle baking oven at a temperature of about 180 DEG C to resin sheet 49
Heating about 60 minutes.Thus, resin sheet 49 solidifies integrally.And, each paster thermistor 44a in addition to interarea M3 sides,
It is sealed in the inside of the layered product 49 ' of cured resin sheet 49.
(C-5) after above-mentioned operation (C-4), for female Copper Foil 48 using methods such as etchings, in paster thermistor 44a
Each outer electrode on form the undermost copper foil layer for constituting electrode 46a, 47a.Afterwards, as in fig. 8d, by cutting machine
Deng cutting resin sheet material 49.More specifically, with by adjacent two centers of paster thermistor 44a on L direction of principal axis
And almost parallel with WT planes is respectively cut in face of resin sheet 49, and with by W direction of principal axis adjacent two
The center of individual paster thermistor 44a and almost parallel with TL planes respectively cut in face of resin sheet 49.Additionally, each
Cut surface is represented in Fig. 8 D with chain-dotted line.Additionally, from from the viewpoint of clear and definite cut surface, omitting most paster temperature-sensitive
The diagram of resistance 44a.
By above-mentioned operation (C-1)~(C-5), substantial amounts of thermistor element 4a is produced together.
Industrial practicality
Temperature sensor involved by the utility model can be easily mounted on circuit substrate, it is adaptable to electronic equipment
Deng.
Label declaration
1st, 1a temperature sensors
2 base stations
The interarea of M1, M2 first, the second interarea
S1, S2, S3, S4 first side, second side, the 3rd side, the 4th side
31st, 32 first wiring conductors, the second wiring conductor
4th, 4a thermistor elements
41 thermistor bodies
44a paster thermistors
The interarea of M3, M4 the 3rd, the 4th interarea
The side of S5, S6, S7, S8 the 5th, the 6th side, heptalateral face, the 8th side
42nd, 43 first outer electrodes, the second outer electrode
45a protects component
46a, 47a first electrode, second electrode.
Claims (9)
1. a kind of temperature sensor, the temperature sensor can detect to the temperature of the position on the surface away from circuit substrate,
It is characterised in that it includes：
Base station, the base station has the first interarea and the second interarea relative to each other；
Multiple wiring conductors, the plurality of wiring conductor extends between first interarea and second interarea, and extremely
The end of the first interarea side of few the plurality of wiring conductor can be connected disc electrode and be electrically connected with the multiple for being formed in the surface
Connect；
Thermistor, the thermistor has the 3rd interarea and the 4th interarea relative to each other, and with the 3rd interarea
Mode substantially in face of second interarea is fixed on the base station；
And multiple electrodes, the plurality of electrode is formed in the thermistor, and can with described in the multiple wiring conductor
The end electrical connection of the second interarea side.
2. temperature sensor as claimed in claim 1, it is characterised in that separate the position of predetermined distance with the surface in detection
In the case of the temperature put, the distance between first interarea and the 4th interarea is set based on the predetermined distance.
3. temperature sensor as claimed in claim 1, it is characterised in that circuit substrate described in the thermal conductivity ratio of the base station
Pyroconductivity it is low.
4. temperature sensor as claimed in claim 2, it is characterised in that circuit substrate described in the thermal conductivity ratio of the base station
Pyroconductivity it is low.
5. the temperature sensor as described in any one in Claims 1-4, it is characterised in that the multiple wiring conductor by
The metal material of low-thermal conductivity is made.
6. the temperature sensor as described in any one in Claims 1-4, it is characterised in that also described including at least covering
4th interarea, and the protection component being made up of resin material.
7. temperature sensor as claimed in claim 5, it is characterised in that also including at least covering the 4th interarea, and by
The protection component that resin material is made.
8. temperature sensor as claimed in claim 6, it is characterised in that the resin material has electrical insulating property.
9. temperature sensor as claimed in claim 7, it is characterised in that the resin material has electrical insulating property.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014001089 | 2014-01-07 | ||
| JP2014-001089 | 2014-01-07 | ||
| PCT/JP2014/073930 WO2015104868A1 (en) | 2014-01-07 | 2014-09-10 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206179618U true CN206179618U (en) | 2017-05-17 |
Family
ID=53523710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490001307.7U Active CN206179618U (en) | 2014-01-07 | 2014-09-10 | Temperature sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206179618U (en) |
| WO (1) | WO2015104868A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166679A (en) * | 2018-09-03 | 2019-01-08 | 深圳市特普生传感有限公司 | A kind of NTC thermistor processing method |
| US20220301447A1 (en) * | 2021-03-17 | 2022-09-22 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020133985A1 (en) * | 2020-12-17 | 2022-06-23 | Tdk Electronics Ag | Sensor arrangement and method for manufacturing a sensor arrangement |
| JP7340130B1 (en) | 2022-04-25 | 2023-09-07 | 直文 蕨 | Non-contact temperature sensor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11288803A (en) * | 1998-04-01 | 1999-10-19 | Murata Mfg Co Ltd | Surface mounted thermistor component |
| JP4936634B2 (en) * | 2003-02-21 | 2012-05-23 | 株式会社大泉製作所 | Method for improving thermal response of temperature sensor for automotive evaporator |
| JP2004335793A (en) * | 2003-05-08 | 2004-11-25 | Mitsubishi Materials Corp | Thermometer |
-
2014
- 2014-09-10 WO PCT/JP2014/073930 patent/WO2015104868A1/en active Application Filing
- 2014-09-10 CN CN201490001307.7U patent/CN206179618U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166679A (en) * | 2018-09-03 | 2019-01-08 | 深圳市特普生传感有限公司 | A kind of NTC thermistor processing method |
| CN109166679B (en) * | 2018-09-03 | 2021-03-23 | 深圳市特普生科技有限公司 | NTC thermistor processing method |
| US20220301447A1 (en) * | 2021-03-17 | 2022-09-22 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
| US11682313B2 (en) * | 2021-03-17 | 2023-06-20 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
| US20240046806A1 (en) * | 2021-03-17 | 2024-02-08 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
| US12002372B2 (en) * | 2021-03-17 | 2024-06-04 | Gregory M. Griffith | Sensor assembly for use in association with aircraft collision avoidance system and method of using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015104868A1 (en) | 2015-07-16 |
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