CN206163144U - High frequency signal transmission structure - Google Patents

Abstract

The utility model provides a high frequency signal transmission structure which includes: a composite module and two the 2nd composite module, a composite module includes first conducting wire layer and lies in first conducting wire the layer first dielectric layer and second dielectric layer on back of the body surface mutually, this first conducting wire layer is including the signal line, this first dielectric layer is including first composition surface and first opening, this second dielectric layer is including second composition surface and second opening, the aerogel around this signal line is all filled with this second opening to this first opening, every the 2nd composite module includes the second insulating layer and lies in the second conducting wire layer and third dielectric layer that two surfaces were carried on the back mutually to this second insulating layer, this third dielectric layer is including the third composition surface, this first composition surface is fixed with one of them the 2nd composite module's third composition surface, the 2nd composite module's of this second composition surface and another one third composition surface is fixed.

Description

High frequency signal transmission structure

Technical field

The utility model is related to high frequency signal transmission technical field, more particularly to a kind of high frequency signal transmission structure.

Background technology

As electronic product develops towards the direction of high frequency, high-speed transfer and but thin, the design to conducting wire There is higher requirement.In prior art, for transmitting radio-frequency cable (Radio Frequence Cable, the RF of high-frequency signal Cable the outsourcing Rotating fields and the holding wire in the outsourcing Rotating fields formed by metallic copper) are generally comprised, in order to ensure The stability of holding wire, filled with the dielectric for surrounding holding wire in outsourcing Rotating fields, industry practice widely followed is to adopt liquid crystal High molecular polymer (LCP), Teflon (Teflon) or pure glue etc. are used as dielectric, polymeric liquid crystal copolymer, Teflon (Teflon) or those materials such as pure glue belong to special material, those resource-constraineds present on the earth cause radio-frequency cable Cost of manufacture is higher, also, the dielectric constant of those materials is larger, arbitrarily causes insertion loss during signal transmission.

Utility model content

In view of this, it is necessary to which a kind of high frequency signal transmission structure that can solve the problem that above-mentioned technical problem is provided.

A kind of high frequency signal transmission structure, it includes：First composite module and two the second composite modules, first combination Module includes that the first conductive circuit layer and the first medium layer positioned at opposite two surfaces of the first conductive circuit layer and second are situated between Matter layer, first conductive circuit layer includes holding wire, and the first medium layer includes the first composition surface and the first opening, should Second dielectric layer includes the second composition surface and the second opening, and first composition surface is around first opening, second composition surface Around second opening, first opening with the second opening in communication and expose the holding wire, first opening with this second Opening filled with the aeroge around the holding wire, each second composite module include the second insulating barrier and positioned at this Second conductive circuit layer on opposite two surfaces of two insulating barriers and the 3rd dielectric layer, the 3rd dielectric layer includes the 3rd engagement Face, first composition surface is fixed with the 3rd composition surface of one of them the second composite module of two the second composite modules, should Second composition surface is fixed with the 3rd composition surface of another the second composite module of two the second composite modules, two second Composite module forms a cavity with first opening, the second opening, and the holding wire is located in the cavity and by the aeroge bag Enclose.

Compared with prior art, the high frequency signal transmission structure that the utility model is provided, has due to surrounding around holding wire Aeroge, can prevent the holding wire when the first composite module is pressed with the second composite module from subsiding, and by Aeroge of the filling with low-k (Low Dk) around holding wire, realizes low dielectric loss and keeps pouring in meeting height Defeated demand, advantageously reduces signal transmission attenuation.

Description of the drawings

Fig. 1 is the sectional view of the first copper-clad base plate that the utility model is provided and second copper-clad substrate.

Fig. 2 be form first and second photosensitive insulating layer on opposite two surfaces of the first copper-clad base plate, in second copper-clad The second Copper Foil layer surface that substrate includes forms the sectional view of the 3rd photosensitive insulating layer.

Fig. 3 is formed the first conductive circuit layer, the second copper foil layer is made form second and lead to the first copper foil layer is made The sectional view of electric line layer.

Fig. 4 be the surface of the surface of the first conductive circuit layer and first insulating barrier formed respectively first medium layer with Second dielectric layer, on the surface of the second insulating barrier the sectional view of the 3rd dielectric layer is pressed.

Fig. 5 is to be exposed development to first medium layer and second dielectric layer, forms first in the first medium layer 18 and opens Mouthful, and the second opening is formed in the second dielectric layer, development is exposed to the 3rd dielectric layer, the shape in the 3rd dielectric layer Into the sectional view of the 3rd opening.

Fig. 6 is to fill aeroge respectively in first opening and the second opening, makes the aeroge surround the holding wire, is obtained To the first composite module；And aeroge is filled in the 3rd opening, obtain the profile of second composite module.

Fig. 7 is to provide the sectional view of first composite module and two the second composite modules.

Fig. 8 is that the first composite module and two the second composite modules are pressed together the profile to form assembly.

Fig. 9 is that the side wall of the assembly to being formed by first composite module and two the second composite modules carries out whole face plating Copper, the profile that side wall layers of copper is formed in side wall.

Figure 10 is the profile for forming welding resisting layer respectively in two the second conducting wire layer surfaces.

Figure 11 is the profile being surface-treated to the weld pad.

Main element symbol description

Following specific embodiment will further illustrate the utility model with reference to above-mentioned accompanying drawing.

Specific embodiment

With reference to will make further to the high frequency signal transmission structure that the utility model is provided with reference to drawings and Examples Detailed description.

Figure 11 is referred to, for a kind of high frequency signal transmission structure 100 that the utility model is provided, it includes：First combination Module 40 and two the second composite modules 50.

First composite module 40 includes the first insulating barrier 12, is formed in first conducting wire on the surface of the first insulating barrier 12 Layer 140, the first medium layer 18 positioned at the surface of the first conductive circuit layer 140 with and be formed in the surface of the first insulating barrier 12 Second dielectric layer 28.First conductive circuit layer 140 includes the holding wire 150 for transmitting high-frequency signal.

The first medium layer 18 includes the first composition surface 182 and the first opening 180, and the second dielectric layer 28 is included Second composition surface 282 and the second opening 280, first composition surface 182 is around first opening 180, the ring of the second composition surface 282 Around second opening 280.First opening 180 is open with second and 280 is connected and exposes the holding wire 150, and this first is opened Mouth 180 is with second opening 280 filled with the aeroge 30 around the holding wire 150, the dielectric constant Dk of the aeroge 30 Between 1.007～2.First composition surface 182 is respectively arranged with adhesive-layer 35 with second composition surface 282, the adhesive-layer 35 First composition surface 182 and second composition surface 282 is not completely covered.It is arranged such, with the glue for preventing the adhesive-layer 35 from including Water is flow in the cavity that the first opening 180 and the second opening 280 are formed.

Each second composite module 50 includes the second insulating barrier 22 and positioned at second insulating barrier, 22 opposite two tables Second conductive circuit layer 240 in face and the 3rd dielectric layer 38, the 3rd dielectric layer 38 includes the 3rd composition surface 382, and the 3rd Dielectric layer 38 is further opened with the 3rd opening 380, and the 3rd composition surface 382 is filled out around the 3rd opening 380, the 3rd opening 380 Filled with aeroge 30.

First composition surface 182 connects with the 3rd of one of them the second composite module 50 of two the second composite modules 50 the Conjunction face 382 is fixed by the adhesive-layer 30, another second group of second composition surface 282 and two the second composite modules 50 3rd composition surface 382 of matched moulds block 50 is fixed by the adhesive-layer 30, and two second composite modules 50 first are combined with this First opening the 180, second opening 280 and the width of the 3rd opening 380 that module 40 includes is equal, and the width of first opening is big Cause is 2 times of the signal line width, and first opening the 180, second opening 280 and the 3rd opening 380 are connected to form a cavity 101, the holding wire 150 is located in the cavity 101 and is surrounded by the aeroge 30 being located in cavity 101.

The high frequency signal transmission structure 100 also includes side wall layers of copper 110, and side wall layers of copper 110 covers first combination die The side of block 40 and two the second composite modules 50, side wall layers of copper 110 be used to making the first conductive circuit layer 140 and two this Two conductive circuit layers 240 mutually electrically conduct.

The high frequency signal transmission structure 100 also includes being formed in the welding resisting layer 250 on the surface of the second conductive circuit layer 240, should Welding resisting layer 250 includes opening portion 252, the expose portion of opening portion 252 second conductive circuit layer 240, by the opening portion 252 Exposed second conductive circuit layer 240 is formed as weld pad 242.

The surface of weld pad 242 forms protective layer 244, and the protective layer 244 can be the metals such as tin, lead, silver, gold, nickel, palladium Or the single layer structure of its alloy, or two kinds or two or more sandwich constructions in above-mentioned metal.The protective layer 244 It can also be organic guarantor's layer (O SP).

Fig. 1 to Figure 11 is referred to, the preparation method of the high frequency signal transmission structure 100 includes step：

The first step, refer to Fig. 1, there is provided one first copper-clad base plate 10 and a second copper-clad substrate 20.This first cover it is copper-based Plate 10 is one side copper-clad base plate with second copper-clad substrate 20.First copper-clad base plate 10 includes the first insulating barrier 12 and is located at First copper foil layer 14 on the surface of the first insulating barrier 12.The second copper-clad substrate 20 includes the second insulating barrier 22 and exhausted positioned at second Second copper foil layer 24 on the surface of edge layer 22.

The copper foil layer 24 of first copper foil layer 14 and second can be rolled copper foil, or electrolytic copper foil.This is first exhausted The insulating barrier 22 of edge layer 12 and second can be hard resin layer, such as epoxy resin, glass-fiber-fabric, it is also possible to flexible resin layer, such as Polyimides (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephtalate, PET), polytetrafluoroethylene (PTFE) (Teflon), polyamide (Polyamide), polymethyl methacrylate (Polymethylmethacrylate, PMMA), Merlon (Polycarbonate, PCB) or polyimides-polyethylene-right Benzene diformazan ester copolymer (Polyamide polyethylene-terephthalate copolymer) etc..

Second step, refers to Fig. 2 and Fig. 3, the first copper foil layer 14 and the second copper foil layer 24 is made respectively into formation first and is led The conductive circuit layer 240 of electric line layer 140 and second, and otch 120 is formed in the first insulating barrier 12.

In the present embodiment, the conductive circuit layer 240 of the first conductive circuit layer 140 and second is by micro-photographing process shape Into.Specifically include step：Fig. 2 is referred to, the first photosensitive insulating layer 16 is formed on the surface of the first copper foil layer 14, in the second copper foil layer 24 surfaces form the second photosensitive insulating layer 26；First photosensitive insulating layer 16 and second photosensitive insulating layer 26 can for dry film or Anti-welding green paint of person etc..

Respectively development is exposed to the first photosensitive insulating layer 16 and the second photosensitive insulating layer 26, Fig. 3 is referred to, to first Copper foil layer 14 is etched with the second copper foil layer 24, and the first copper foil layer 14 and the second copper foil layer 24 are made respectively into formation first The conductive circuit layer 240 of conductive circuit layer 140 and second.First conductive circuit layer 140 is included for transmitting high-frequency signal Holding wire 150.First conductive circuit layer 140 also includes first surface 142 and the second surface opposite with first surface 142 144。

In the present embodiment, it is that the otch 120 is formed in the first insulating barrier 12 using the method for laser ablation.This is cut Mouth 120 exposes the holding wire 150.

3rd step, refers to Fig. 4, on the surface of the surface of the first conductive circuit layer 140 and first insulating barrier 12 point Not Xing Cheng first medium layer 18 and second dielectric layer 28, press the 3rd dielectric layer 38 on the surface of the second insulating barrier 22.One Jie Matter layer 18, the material of the dielectric layer 38 of second dielectric layer 28 and the 3rd are photosensitive resin.

First medium layer 18 covers the first surface 142 of first conductive circuit layer 140 and fills first conducting wire The gap of layer 142, the second dielectric layer 28 covers first insulating barrier 12 and the otch 120.

Fig. 5 is referred to, respectively development is exposed to first medium layer 18 and second dielectric layer 28, in the first medium layer 18 form the first opening 180, and form the second opening 280 in the second dielectric layer 28, wherein, first opening 180 with should Second opening 280 is connected, and its width is consistent and exposes the holding wire 150.

Development is exposed to the 3rd dielectric layer 38, the 3rd opening 380 is formed in the 3rd dielectric layer 38, wherein, should 3rd opening 380 expose portions second insulating barrier 22, and the first opening 180, the second opening 280 with the 3rd be open 380 width Degree is roughly equal, the first opening 180, and the width of the second opening 280 and the 3rd opening 380 is 2 times of the width of holding wire 150.

4th step, refers to Fig. 6, and in the opening 280 of the first opening 180 and second aeroge is filled respectively (Aerogel) 30, make the aeroge 30 surround the holding wire 150, obtain the first composite module 40.In the present embodiment, should Aeroge 30 is formed in by way of printing in the first opening 180 and second opening 280.

First medium layer 18 includes the first composition surface 182, and the second dielectric layer 28 includes the second composition surface 282, should Around first opening 180, second composition surface 282 is around second opening 280 on the first composition surface 182.

Aeroge 30 is filled in the 3rd opening 380, second composite module 50 is obtained.3rd dielectric layer 38 includes the Three composition surfaces 382.In the present embodiment, the dielectric constant Dk of the aeroge 30 of filling is between 1.007～2.The gas The dielectric constant Dk of gel 30 less than polymeric liquid crystal copolymer (LCP) (Dk=3.2), Teflon (Teflon) (Dk=2.1) Or the dielectric constant of the material such as pure glue, thus, it is possible to loss when reducing signal transmission.

5th step, refers to Fig. 7 and Fig. 8, there is provided first composite module 40 and two the second composite modules 50, Adhesive-layer 35 is respectively provided with first composition surface 182 and the second composition surface 282 of one composite module 40, by one of them second group 3rd composition surface 382 of matched moulds block 50 is pressure bonded to first composition surface 182, and the 3rd of another the second composite module 50 the is connect Conjunction face 382 is pressure bonded to second composition surface 282, makes the first composite module 40 and two second composite modules 50 viscous by this Glue-line 35 is fixed together to form assembly 45, the holding wire 150 be located at two of assembly 45 second insulating barriers 22, this In the cavity 101 that one opening the 180, second opening 280 and the 3rd opening 380 are formed, and surrounded by aeroge 30.

6th step, refers to Fig. 9, to the assembly formed by first composite module 40 and two the second composite modules 50 45 side wall carries out whole face copper facing, to form side wall layers of copper 110 in side wall, and side wall layers of copper 110 is completely covered this first group The side wall of matched moulds block 40 and two the second composite modules 50, side wall layers of copper 110 is used to make the first conductive circuit layer 140 and two Second conductive circuit layer 240 mutually electrically conducts.

7th step, refers to Figure 10, and at two, the surface of the second conductive circuit layer 240 forms respectively welding resisting layer 250, and this is prevented Layer 250 includes opening portion 252, the expose portion of opening portion 252 second conductive circuit layer 240, sudden and violent by the opening portion 252 Second conductive circuit layer 240 of dew is formed as weld pad 242.In the present embodiment, the welding resisting layer 250 is anti-welding green paint.

8th step, refers to Figure 11, the weld pad 242 is surface-treated using known method, the side of surface treatment Method is the weld pad 242 to be dried after process to form protective layer 244 on the surface of weld pad 242 again.The protective layer 244 can Think the metals such as tin, lead, silver, gold, nickel, palladium or the single layer structure of its alloy, or two kinds or two kinds in above-mentioned metal Sandwich construction above.The protective layer 244 can also be organic guarantor's layer (O SP).

In sum, the high frequency signal transmission structure that the utility model is provided, being surrounded due to the surrounding of holding wire 150 has airsetting Glue 30, can prevent when the first composite module and the second composite module are pressed, and holding wire 150 subsides, and passes through Aeroge 30 of the filling with low-k (Low Dk), advantageously reduces signal transmission attenuation around holding wire 150.

It is understood that above example is only used for illustrating the utility model, it is not used as to limit of the present utility model It is fixed.For the person of ordinary skill of the art, other made according to technology design of the present utility model are various corresponding Change and deformation, all fall within the utility model scope of the claims.

Claims (10)

1. a kind of high frequency signal transmission structure, it includes：First composite module and two the second composite modules, first combination die Block includes the first conductive circuit layer and the first medium layer and second medium positioned at opposite two surfaces of the first conductive circuit layer Layer, first conductive circuit layer includes holding wire, and the first medium layer includes the first composition surface and the first opening, and this Second medium layer includes the second composition surface and the second opening, and first composition surface surround first opening, the second engagement face ring Around second opening, first opening with the second opening in communication and expose the holding wire, first opening second is opened with this Mouth filled with around the holding wire aeroge, each second composite module include the second insulating barrier and positioned at this second Second conductive circuit layer on opposite two surfaces of insulating barrier and the 3rd dielectric layer, the 3rd dielectric layer includes the 3rd composition surface, First composition surface is fixed with the 3rd composition surface of one of them the second composite module of two the second composite modules, and this second Composition surface is fixed with the 3rd composition surface of another the second composite module of two the second composite modules, two second combinations Module forms a cavity with first opening, the second opening, and the holding wire is located in the cavity and by the aeroge and surrounds.

2. high frequency signal transmission structure as claimed in claim 1, it is characterised in that the first composition surface and second composition surface point Adhesive-layer is not provided with, the 3rd composition surface of one of them second composite module is by the adhesive-layer and first composition surface Fixed, the 3rd composition surface of another second composite module is fixed by the adhesive-layer with second composition surface.

3. high frequency signal transmission structure as claimed in claim 2, it is characterised in that first composite module also includes that first is exhausted Edge layer, first conductive circuit layer is formed in the surface of first insulating barrier, and the first medium layer is located at first conducting wire The surface of layer, the second dielectric layer is located at the surface of first insulating barrier.

4. high frequency signal transmission structure as claimed in claim 1, it is characterised in that the dielectric constant of the aeroge between 1.007 between～2.

5. high frequency signal transmission structure as claimed in claim 4, it is characterised in that the 3rd dielectric layer is further opened with the 3rd and opens Mouthful, the 3rd composition surface around the 3rd opening, the 3rd opening be filled with aeroge, this first opening, second opening and Two the 3rd opening in communication.

6. high frequency signal transmission structure as claimed in claim 4, it is characterised in that also including side wall layers of copper, the side wall layers of copper The side of first composite module and two the second composite modules is covered, the side wall layers of copper is used to make the first conductive circuit layer and two Individual second conductive circuit layer mutually electrically conducts.

7. high frequency signal transmission structure as claimed in claim 6, it is characterised in that also including being formed in the second conductive circuit layer The welding resisting layer on surface, the welding resisting layer includes opening portion, the opening portion expose portion second conductive circuit layer, by the opening portion Exposed second conductive circuit layer is formed as weld pad.

8. high frequency signal transmission structure as claimed in claim 7, it is characterised in that first opening, the second opening and the 3rd The width of opening is equal, and the width of first opening is about 2 times of the signal line width.

9. high frequency signal transmission structure as claimed in claim 8, it is characterised in that the weld pad surface forms matcoveredn.

10. high frequency signal transmission structure as claimed in claim 9, it is characterised in that the protective layer can be gold or nickel.