CN206148422U - Lead frame of optoelectronic IC chip - Google Patents
Lead frame of optoelectronic IC chip Download PDFInfo
- Publication number
- CN206148422U CN206148422U CN201621146196.6U CN201621146196U CN206148422U CN 206148422 U CN206148422 U CN 206148422U CN 201621146196 U CN201621146196 U CN 201621146196U CN 206148422 U CN206148422 U CN 206148422U
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- pin
- lead frame
- chip
- optoelectronic
- platform
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a lead frame of optoelectronic IC chip, include: first pin 1, second pin 2, third pin 3 and base 4, first pin 1 2 draws of second pin third pin 3 is located respectively on the base 4, second pin 2 is located 1 draw of first pin the third pin is between 3, 2 tops of second pin are provided with the platform 5 of U type, platform 5 is used for placing the chip, first pin 1 2 draws of second pin third pin 3 respectively with chip electric connection. The utility model provides a pair of lead frame of optoelectronic IC chip with the mode of pin in the middle of the lead frame through the punching press of bending, forms U type platform, and the horizontal plane area of this U type platform is enough big, can bond the optoelectronic IC chip on the plane, realizes top sensitization.
Description
Technical field
This utility model relates to integrated optoelectronic circuit field, is related specifically to a kind of lead frame of optoelectronic integrated circuit chip
Frame.
Background technology
At present, conventional integrated optoelectronic circuit lead frame, due to optoelectronic integrated circuit chip area it is larger, so can only
Frame facet is bonded in, using the photosensitive form in side, photosensitive form is single.If it is desired to using the photosensitive form in top, needing
The cross section of larger area is formed in frame roof, but material behavior is limited by, bears that pressure is excessive to be easily bent fracture, it is impossible to
Directly stamp out the larger cross section of area, therefore optoelectronic integrated circuit chip seldom adopts the photosensitive mode in top.
Utility model content
This utility model provides a kind of lead frame of optoelectronic integrated circuit chip, for solving current integrated optoelectronic circuit
Middle photosensitive form is single, can only side it is photosensitive, it is impossible to top sensitive technologies problem.
To solve above-mentioned technical problem, this utility model provides a kind of lead frame of optoelectronic integrated circuit chip, bag
Include：First pin 1, second pin 2, the 3rd pin 3 and base 4；First pin 1, the second pin 2 and the described 3rd
Pin 3 is located on the base 4 respectively；The second pin 2 is located between first pin 1 and the 3rd pin 3；Institute
State and at the top of second pin 2, be provided with U-shaped platform 5；The platform 5 is used for chip placement, first pin 1, described second
Pin 2 and the 3rd pin 3 are electrically connected with chip respectively.
Further, in first pin 1, the 3rd pin 3 and the second pin 2, the platform 5 is in together
One plane.
Further, also including connecting line 6, the connecting line 6 respectively with first pin 1, the second pin 2 and
3rd pin 3 connects.
Further, the middle setting of the base 4 has for identifying the through hole 7 of each framework.
A kind of lead frame of optoelectronic integrated circuit chip that this utility model is provided, lead frame middle pin is passed through
The mode of bending punching press, forms U-shaped platform, and the horizontal surface area of this U-shaped platform is sufficiently large, can be by integrated optoelectronic circuit core
Piece bonds in the plane, realizes that top is photosensitive.
Description of the drawings
A kind of lead frame front view of optoelectronic integrated circuit chip that Fig. 1 is provided for this utility model；
A kind of lead frame second pin side view of optoelectronic integrated circuit chip that Fig. 2 is provided for this utility model；
A kind of leadframe product schematic diagram of optoelectronic integrated circuit chip that Fig. 3 is provided for this utility model.
Specific embodiment
Referring to Fig. 1-3, this utility model provides a kind of lead frame of optoelectronic integrated circuit chip, including：First draws
Foot 1, second pin 2, the 3rd pin 3 and base 4.First pin 1, second pin 2 and the 3rd pin 3 are located on base 4 respectively,
The middle setting of base 4 has for identifying the through hole 7 of each framework in the present embodiment.Second pin 2 is located at 1 He of the first pin
Between 3rd pin 3, U-shaped platform 5 at the top of second pin 2, is formed by way of bending punching press, platform 5 is used to place core
Piece.First pin 1, second pin 2 and the 3rd pin 3 are electrically connected with chip respectively, in the present embodiment the first pin 1, second
Platform 5 on pin 2 and the 3rd pin 3 is in same plane, is easy to chip and the first pin 1 and second using such design
The connection of pin 2, while also saving the electric wire that connection needs.First pin 1, second pin of lead frame in this embodiment
2 and the 3rd are connected together by connecting line 6 between pin 3, are so easy to the production of lead frame.
A kind of lead frame production of the optoelectronic integrated circuit chip for providing to this utility model below and operation principle are done
Illustrate.The lead frame makes framework by the way of etching in the circuit board, can make multiple drawing on a wiring board
Wire frame, each lead frame are made up of the first pin 1, second pin 2, the 3rd pin 3 and base 4, at the same each pin it
Between linked together by connecting line 6.Divide after in use each lead frame is distinguished by the through hole 7 on base 4
Open, then chip be placed on the U-shaped platform 5 of second pin 2, chip by electric wire respectively with the first pin 1, second pin 2,
3rd pin 3 connects, then with transparent encapsulating material by chip and the first pin 1, second pin 2,3 connecting portion of the 3rd pin
Enfeoffment is loaded.When needed using chip in integrated circuits, it is only necessary to which base 4 is cut, the first pin 1,2 and of second pin
After connecting line 6 between 3rd pin 3 is cut off, the device is installed in integrated circuits.
It should be noted last that, above specific embodiment is only to illustrate the technical solution of the utility model rather than limit
System, although being described in detail to this utility model with reference to example, it will be understood by those within the art that, can be right
The technical solution of the utility model is modified or equivalent, without deviating from the spirit and model of technical solutions of the utility model
Enclose, which all should be covered in the middle of right of the present utility model.
Claims (4)
1. a kind of lead frame of optoelectronic integrated circuit chip, it is characterised in that include：First pin (1), second pin (2),
3rd pin (3) and base (4)；First pin (1), the second pin (2) and the 3rd pin (3) are located at respectively
On the base (4)；The second pin (2) is between first pin (1) and the 3rd pin (3)；Described
U-shaped platform (5) is provided with the top of two pins (2)；The platform (5) is for chip placement, first pin (1), described
Second pin (2) and the 3rd pin (3) are electrically connected with chip respectively.
2. the lead frame of a kind of optoelectronic integrated circuit chip according to claim 1, it is characterised in that described first draws
In foot (1), the 3rd pin (3) and the second pin (2), the platform (5) is in same plane.
3. the lead frame of a kind of optoelectronic integrated circuit chip according to claim 1, it is characterised in that also including connection
Line (6), the connecting line (6) is respectively with first pin (1), the second pin (2) and the 3rd pin (3) even
Connect.
4. a kind of lead frame of the optoelectronic integrated circuit chip according to any one of claim 1-3, it is characterised in that institute
The middle setting for stating base (4) has for identifying the through hole (7) of each framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621146196.6U CN206148422U (en) | 2016-10-21 | 2016-10-21 | Lead frame of optoelectronic IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621146196.6U CN206148422U (en) | 2016-10-21 | 2016-10-21 | Lead frame of optoelectronic IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206148422U true CN206148422U (en) | 2017-05-03 |
Family
ID=58623484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621146196.6U Active CN206148422U (en) | 2016-10-21 | 2016-10-21 | Lead frame of optoelectronic IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206148422U (en) |
-
2016
- 2016-10-21 CN CN201621146196.6U patent/CN206148422U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180125 Address after: No. 16, No. four street, Shenyang economic and Technological Development Zone, Liaoning, Liaoning Patentee after: Kodenshi Corp. Address before: No. 16, four street, economic and Technological Development Zone, Shenyang, Liaoning Patentee before: Horizon semiconductor (Shenyang) Co., Ltd. |