CN206112559U - Infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip - Google Patents
Infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip Download PDFInfo
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- CN206112559U CN206112559U CN201621132480.8U CN201621132480U CN206112559U CN 206112559 U CN206112559 U CN 206112559U CN 201621132480 U CN201621132480 U CN 201621132480U CN 206112559 U CN206112559 U CN 206112559U
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Abstract
The utility model discloses an infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip, include PVF lens, dust cover, light source sensor, LED lamp, infrared ray, procapsid, back casing, the portable groove of backshell, the portable groove of preceding shell, chip board, driver, go up lug, lower lug, left recess, right recess, right lug, left lug, low groove and upper groove, the beneficial effects of the utility model are that: utilize two protruding two concave combinations, realize the connection between two casings, guarantee the compactness of connection, downthehole at the procapsid is installed to the chip board, the welding has the driver on the chip board, the light source sensor links together with the chip board, the LED lamp links together with the chip board after through wire series, the infrared ray is connected to the lower extreme of chip board, all be connected all operation elements with the chip board, utilize driver distribution work, whether control these components starts, with this drive function that realizes the light source inter -module.
Description
Technical field
This utility model is related to a kind of infrared LED light source, specially a kind of based on the luminous and integrated envelope of driving chip
The infrared LED light source assembly of dress, belongs to light source hybrid integrated apparatus field.
Background technology
Common single LED lamp type has direct insertion, SMD, high-power packaged type etc.；Wherein, great power LED list lamp one
As have two kinds of packing forms：The single lamp of ceramic bases LED encapsulation, the single lamp of PPA (polyphthalamide) plastic stents LED encapsulation.
Both single modulated structures are mainly made up of package support, luminescence chip, fluorescent glue, the several core parts of lens, envelope
There is copper post in dress support central authorities, and copper post upper surface is fixed with luminescence chip, and luminescence chip surface-coated has fluorescent glue, and fluorescent glue is general
Parcel luminescence chip, lens are generally silica-gel lens, and lens are fixed on the package support, with luminescence chip, fluorescent glue and encapsulation
Support composition one, constitutes the single lamp of LED encapsulation, although this several element has good practical characteristic, but this several element system
Make difficulty big, market price is high, thus production cost also increases therewith so that the light source assembly produced becomes luxurious product
Product, it is impossible in popular popularization, therefore, to overcome problem above, there is provided a kind of based on luminous red with driving chip integration packaging
Outer LED light source component.
Utility model content
The purpose of this utility model is that and provide that a kind of being based on lights and driving chip collection in order to solve the above problems
Into the infrared LED light source assembly of encapsulation.
This utility model is achieved through the following technical solutions above-mentioned purpose：One kind is based on the luminous and integrated envelope of driving chip
The infrared LED light source assembly of dress, including PVF eyeglasses, dust cover, light source sensor, LED, infrared ray, procapsid, back casing,
The portable groove of back cover, the portable groove of fore shell, chip board, driver, upper protruding block, lower protruding block, left groove, right groove, right projection, a left side are convex
Block, low groove and upper groove；The portable groove of fore shell is provided with the side of the procapsid；It is provided with the side of the back casing
The portable groove of back cover；The portable groove of fore shell forms a spill with the portable groove of back cover when the procapsid links together with back casing
Groove；The front end of the procapsid is provided with dust cover；The front top of the procapsid is provided with light source sensor；The light source is passed
LED is disposed with around sensor；The infrared ray is arranged on the lower right corner on the front top of procapsid；The front top of the procapsid
PVF eyeglasses are installed；The PVF eyeglasses are arranged on light source sensor and LED and ultrared front end；The back casing
Upper protruding block and lower protruding block are provided with front end face；Left groove and right groove are provided with the front end face of the back casing；Before described
Right projection and left projection are provided with the rear end face of housing；Low groove and upper groove are provided with the rear end face of the procapsid；
The chip board is arranged in the hole of procapsid；Driver is welded with the chip board；The light source sensor and chip board
Link together；The LED is linked together after wired in series with chip board；The infrared ray is connected to chip board
Lower end.
Preferably, in order to ensure the portability of device, the one of its side when the procapsid links together with back casing
Bar Baltimore groove is spliced by the portable groove of fore shell with the portable groove of back cover.
Preferably, in order to ensure the normal work of internal light source component, being arranged on the dust cover of procapsid front end is
For playing shading dustproof effect to PVF eyeglasses.
Preferably, for the compactness for ensureing to connect, upper protruding block and lower protruding block are the front end faces by housing in the rear
On carry out lathe cut Milling Machining formation.
Preferably, for the compactness for ensureing to connect, left groove and right groove are to lead on the front end face of housing in the rear
Cross and bore what Milling Machining was formed.
Preferably, can be while working, four LEDs are first to carry out series connection company by wire in order to ensure four LEDs
It is attached with the connectivity port on the chip board again after connecing.
The beneficial effects of the utility model are：The luminous infrared LED light source assembly with driving chip integration packaging should be based on
It is reasonable in design, the portable groove of fore shell is provided with the side of procapsid, the portable groove of back cover, procapsid are provided with the side of back casing
The portable groove of fore shell forms a Baltimore groove with the portable groove of back cover when linking together with back casing, is arranged on the side of housing two
Portable groove can facilitate staff to move by hand, and finger only need to be pinched in the portable groove on both sides by staff, just can easily put down
Quietly device is taken up and moved, the front end of procapsid is provided with dust cover, prevent the dust above housing from falling into PVF eyeglasses
On, cause minute surface to pollute, the front top for affecting the operation element in eyeglass, procapsid is provided with light source sensor, catches outside
Light source, and transfer data to inside chip and carry out data processing, LED is disposed with around light source sensor, it is ensured that
Light source sensor can capture all the time external light source where darker, and infrared ray is arranged on the bottom right on the front top of procapsid
Angle, infrared ray realizes night night vision function, it is ensured that light source sensor still can be with normal work, the front top of procapsid at night
PVF eyeglasses are installed, PVF eyeglasses are arranged on light source sensor and LED and ultrared front end, for light sensitive component one is provided
Layer protection, and the ability to work of inner member is not affected, upper protruding block and lower protruding block, back cover are provided with the front end face of back casing
Left groove and right groove are provided with the front end face of body, right projection and left projection, procapsid are provided with the rear end face of procapsid
Rear end face on be provided with low groove and upper groove, using two convex two recessed combinations, realize the connection between two housings, it is ensured that connection
Compactness, chip board be arranged on procapsid hole in, driver is welded with chip board, light source sensor is connected with chip board
Together, LED is linked together after wired in series with chip board, and infrared ray is connected to the lower end of chip board, will be all
Operation element be all connected with chip board, shared out the work using driver, control whether these elements start, light source is realized with this
The driving function of inter-module.
Description of the drawings
Fig. 1 is the overall structure diagram of this utility model LED light source component；
Fig. 2 is this utility model procapsid structural representation；
Fig. 3 is this utility model back casing structural representation；
Fig. 4 is this utility model driving chip structural representation；
In figure：1st, PVF eyeglasses, 2, dust cover, 3, light source sensor, 4, LED, 5, infrared ray, 6, procapsid, 7, back cover
Body, 8, the portable groove of back cover, 9, the portable groove of fore shell, 10, chip board, 11, driver, 12, upper protruding block, 13, lower protruding block, 14, left recessed
Groove, 15, right groove, 16, right projection, 17, left projection, 18, low groove and 19, upper groove.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of this utility model protection.
Refer to Fig. 1～4, a kind of infrared LED light source assembly based on luminous and driving chip integration packaging, including PVF
The portable groove 8, fore shell of eyeglass 1, dust cover 2, light source sensor 3, LED 4, infrared ray 5, procapsid 6, back casing 7, back cover is portable
Groove 9, chip board 10, driver 11, upper protruding block 12, lower protruding block 13, left groove 14, right groove 15, right projection 16, left projection 17,
Low groove 18 and upper groove 19, are provided with the portable groove 9 of fore shell on the side of the procapsid 6, set on the side of the back casing 7
The portable groove 8 of back cover is equipped with, the portable groove 9 of fore shell is formed with the portable groove 8 of back cover when the procapsid 6 links together with back casing 7
One Baltimore groove, the portable groove being arranged on the side of housing two can facilitate staff to move by hand, and staff only need to be by handss
In referring to the portable groove for pinching both sides, just easily smoothly device can be taken up and be moved, the front end of the procapsid 6 is provided with
Dust cover 2, prevents the dust above housing from falling on PVF eyeglasses, causes minute surface to pollute, and affects the operation element in eyeglass, institute
The front top for stating procapsid 6 is provided with light source sensor 3, catch outside light source, and transfer data to inside chip and carry out
Data processing, is disposed with LED 4, it is ensured that light source sensor all the time may be used where darker around the light source sensor 3
To capture external light source, the infrared ray 5 is arranged on the lower right corner on the front top of procapsid 6, and infrared ray realizes night night vision work(
Can, it is ensured that light source sensor still can be provided with PVF eyeglasses 1, institute at night with normal work, the front top of the procapsid 6
The front end that PVF eyeglasses 1 are arranged on light source sensor 3 and LED4 lamps and infrared ray 5 is stated, for light sensitive component one layer of protection is provided,
And the ability to work of inner member is not affected, upper protruding block 12 and lower protruding block 13, institute are provided with the front end face of the back casing 7
Left groove 14 and right groove 15 are provided with the front end face for stating back casing 7, on the rear end face of the procapsid 6 right projection is provided with
16 and left projection 17, low groove 18 and upper groove 19 are provided with the rear end face of the procapsid 6, using two convex two recessed combinations,
Realize the connection between two housings, it is ensured that the compactness of connection, the chip board 10 is arranged in the hole of procapsid 6, the core
Driver 11 is welded with sheet 10, the light source sensor 3 links together with chip board 10, the LED 4 passes through wire
Link together with chip board 10 after series connection, the infrared ray 5 is connected to the lower end of chip board 10, by all of operation element all
It is connected with chip board, is shared out the work using driver, control whether these elements start, the driving between light source assembly is realized with this
Function.
The course of work：When using it is described based on luminous infrared LED light source assembly with driving chip integration packaging when, it is first
First, each operation element is connected with chip board, then chip board is arranged in the hole of procapsid and ensures to firmly install, its
It is secondary, back casing is connected with procapsid, it is ensured that be completely embedded, finally, required workplace will be placed on, you can normal work
Make.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can in other specific forms realize that this practicality is new
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type is by claims rather than described above is limited, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in this utility model.Any reference in claim should not be considered as restriction
Involved claim.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that for clarity those skilled in the art should
Using description as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.
Claims (4)
1. a kind of based on the luminous infrared LED light source assembly with driving chip integration packaging, it is characterised in that：Including PVF eyeglasses
(1), dust cover (2), light source sensor (3), LED (4), infrared ray (5), procapsid (6), back casing (7), the portable groove of back cover
(8), the portable groove of fore shell (9), chip board (10), driver (11), upper protruding block (12), lower protruding block (13), left groove (14), the right side are recessed
Groove (15), right projection (16), left projection (17), low groove (18) and upper groove (19)；Arrange on the side of the procapsid (6)
There is the portable groove of fore shell (9)；The portable groove of back cover (8) is provided with the side of the back casing (7)；The procapsid (6) and back cover
The portable groove of fore shell (9) forms a Baltimore groove with the portable groove of back cover (8) when body (7) links together；Before the procapsid (6)
End is provided with dust cover (2)；The front top of the procapsid (6) is provided with light source sensor (3)；The light source sensor (3)
Around be disposed with LED (4)；The infrared ray (5) is arranged on the lower right corner on the front top of procapsid (6)；The procapsid (6)
Front top PVF eyeglasses (1) are installed；The PVF eyeglasses (1) are arranged on light source sensor (3) and LED (4) and infrared
The front end of line (5)；Upper protruding block (12) and lower protruding block (13) are provided with the front end face of the back casing (7)；The back casing (7)
Front end face on be provided with left groove (14) and right groove (15)；Right projection is provided with the rear end face of the procapsid (6)
And left projection (17) (16)；Low groove (18) and upper groove (19) are provided with the rear end face of the procapsid (6)；The chip
Plate (10) is in the hole of procapsid (6)；Driver (11) is welded with the chip board (10)；The light source sensor
(3) link together with chip board (10)；The LED (4) is linked together after wired in series with chip board (10)；Institute
State the lower end that infrared ray (5) is connected to chip board (10).
2. according to claim 1 a kind of based on the luminous infrared LED light source assembly with driving chip integration packaging, it is special
Levy and be：One Baltimore groove of its side is by the portable groove of fore shell (9) when the procapsid (6) links together with back casing (7)
It is spliced with the portable groove of back cover (8).
3. according to claim 1 a kind of based on the luminous infrared LED light source assembly with driving chip integration packaging, it is special
Levy and be：Left groove (14) and right groove (15) are in the rear on the front end face of housing (7) by boring what Milling Machining was formed.
4. according to claim 1 a kind of based on the luminous infrared LED light source assembly with driving chip integration packaging, it is special
Levy and be：Four LEDs (4) be first be connected in series by wire after enter with the connectivity port on the chip board (10) again
Row connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621132480.8U CN206112559U (en) | 2016-10-18 | 2016-10-18 | Infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621132480.8U CN206112559U (en) | 2016-10-18 | 2016-10-18 | Infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206112559U true CN206112559U (en) | 2017-04-19 |
Family
ID=58526139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621132480.8U Active CN206112559U (en) | 2016-10-18 | 2016-10-18 | Infrared LED light source subassembly based on integrated encapsulation of luminous and driver chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206112559U (en) |
-
2016
- 2016-10-18 CN CN201621132480.8U patent/CN206112559U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Guangdong province Shenzhen city Longhua District Longhua County Office Road No. 57 building 810 times 8 is still the United States Patentee after: Guangdong Xusheng Semiconductor Co.,Ltd. Address before: 810, 8th floor, Shangmei times, No. 57, Longguan East Road, Longhua office, Longhua new area, Shenzhen Patentee before: SHENZHEN XUSHENG SEMICONDUCTOR CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Infrared LED light source assembly based on integrated package of light emitting and driving chip Effective date of registration: 20220323 Granted publication date: 20170419 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd. Registration number: Y2022980003071 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |