CN206109578U - Material local otherness in base steel material plane is electroplated and is used anchor clamps - Google Patents
Material local otherness in base steel material plane is electroplated and is used anchor clamps Download PDFInfo
- Publication number
- CN206109578U CN206109578U CN201621020249.XU CN201621020249U CN206109578U CN 206109578 U CN206109578 U CN 206109578U CN 201621020249 U CN201621020249 U CN 201621020249U CN 206109578 U CN206109578 U CN 206109578U
- Authority
- CN
- China
- Prior art keywords
- insulating part
- clamp
- steel substrate
- electric plating
- planar materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a material local otherness in base steel material plane is electroplated and is used anchor clamps, including one or two at least moulds of arranging side by side, the mould includes first insulation spare, second insulating part and magnetic part, and this first insulation spare and second insulating part are used for the magnetic part sealedly. The utility model discloses plating jig is convenient in the loading and unloading of plating in -process, can guarantee continuous production, and efficiency promotes greatly, in addition, these anchor clamps can be recycled, greatly reduced manufacturing cost to can not cause any pollution to the environment during the course yet.
Description
Technical field
This utility model is related to electroplating technology field, is related to a kind of fixture for steel substrate planar materials parcel plating,
Suitable for steel substrate ic shell inner chamber, the thin gold of lead parcel plating.
Background technology
Hydrid integrated circuit shell Gold plated Layer is excellent antioxidation, corrosion-resistant coating layer, and in metal shell inner chamber, interior
In the welding procedure of lead, the acting surface of actual welding is the nickel coating below Gold plated Layer, and Gold plated Layer here plays protection
Fresh nickel surface is not oxidized, improve the effect of solder high-temperature moisture ability, but solder side layer gold and the easy shape of tin-lead solder
Into the Au-Sn intermetallic compounds of fragility, weld failure is easily caused, thus it is reliable and stable to ensure weld interface, and weld zone is golden
Layer can not be too thick;And ic shell non-solder area(Such as outer bottom)Certain salt fog requirement is met again, and layer gold again can not
It is too thin.Existing old-fashioned technique shields Bao Jin regions using taping or applying by the way of plating is painted, not only inefficiency,
Complex process, and also have certain pollution to environment.In order to meet the plating requirement and solution of said integrated circuit shell
The variety of problems that old-fashioned technique is present, utility model people propose this utility model after studying for a long period of time.
Utility model content
This utility model provides the diversity plating folder of a kind of quick despatch, easy to operate, with low cost, Environmental Safety
Tool, it is adaptable to the diversity plating of integrated circuit metal shell plated thickness.
To solve above-mentioned technical problem, this utility model is adopted the following technical scheme that:
A kind of steel substrate planar materials local diversity clamp for electric plating, including one or at least two moulds being arranged in juxtaposition
Tool, the mould includes the first insulating part, the second insulating part and magnetic part, and first insulating part and the second insulating part are for by magnetic
Property part sealing.
The lower surface of first insulating part and/or side are fitted with silica gel piece.
The lower surface of first insulating part and/or side offer several for avoiding integrated circuit metal inside the shell
The blind hole of lead, offers the through hole coordinated with the blind hole on the silica gel piece.
Offer on first insulating part for placing the groove of magnetic part, second insulating part adopts Step-edge Junction
Structure, wherein it is insulation board for covering magnetic part to get out of a predicament or an embarrassing situation, top bar is for convenience of the insulated column for clamping, the insulation board and institute
State groove sealing to coordinate.
First insulating part and the second insulating part adopt acidproof base material, between the silica gel piece and the first insulating part
By between the groove of silica gel water-stop, the insulation board of the second insulating part and the first insulating part also by silica gel water-stop, the silicon
Glue is needed also exist for acid and alkali-resistance characteristic.
Ic shell is plated one layer of thin gold by this utility model fixture in use first, is secondly loaded fixture
The position for needing to plate thin gold is covered up in the middle of shell, the shell for installing fixture is put into into plating bath finally and continues plating gold,
Again fixture is disassembled after the completion of plating, so as to realize that diversity is electroplated.
From above technical scheme, this utility model electroplating clamp is easy to loading and unloading during plating, the company of ensure that
Continuous production, efficiency are greatly promoted;In addition, the fixture can be recycled, production cost is greatly reduced, and during also not
Any pollution can be caused to environment.
Description of the drawings
Structural representations of the Fig. 1 for this utility model one embodiment;
Structure decomposition figures of the Fig. 2 for this utility model one embodiment;
Structural representations of the Fig. 3 for second embodiment of this utility model;
Structure decomposition figures of the Fig. 4 for second embodiment of this utility model.
In figure:1st, mould, the 2, first insulating part, 21, blind hole, 22, groove, the 3, second insulating part, 31, insulation board, 32, absolutely
Edge post, 4, magnetic part, 5, silica gel piece, 51, through hole.
Specific embodiment
Fixture of the present utility model is electroplated for integrated circuit metal shell plated thickness diversity, be should be noted
It is that this utility model is also used as other steel substrate planar materials parcel plating fixtures.This utility model indication " integrated electricity
Road shell plated thickness diversity plating " is merely for purposes of illustration, and is not used to limit range of application of the present utility model.It is special
Not, old-fashioned technique exist low work efficiency, high cost and not environmentally the shortcomings of, this utility model aims to solve the problem that these shortcomings are carried out
Design.
Below in conjunction with the drawings and specific embodiments, this utility model is described in detail, it is new this practicality is described in detail
Before the technical scheme of each embodiment of type, involved noun and term are explained, in this manual, title is identical
Or label identical part represents similar or identical structure, and it is only limitted to the purpose illustrated.
Embodiment 1:
As illustrated in fig. 1 and 2, the electroplating clamp of the present embodiment is included by the first insulating part 2, the second insulating part 3, magnetic part 4
The mould 1 constituted with silica gel piece 5.First insulating part, 2 lower surface is smooth, silica gel piece 5 is processed into exhausted with first
Edge part lower surface area is equal to the shape of size, then they is glued together by silica gel water, it should be noted that silica gel piece
Thickness is 0.1 ~ 10mm, and the gap after laminating can not have cull, if it has, removing it after the completion of will waiting glue curing.
2 lower surface of the first insulating part in the present embodiment offers several blind holes, and the purpose of blind hole is to allow integrated electricity
The lead of road bottom of shell inner cavity, so as to reach shielding lead and and can and the purpose that closely fit of inside the shell bottom,
The aperture of blind hole be 0.1 ~ 10mm, it should be noted that blind hole wants chamfering, so as to fixture in plating easy to loading and unloading, chamfer angle
Scope is 10 ° ~ 80 °, and fillet surface length is 1 ~ 10mm.In addition, being also required to be processed into and the first insulating part bottom surface on silica gel piece 5
Corresponding through hole 51, pore size are 0.1 ~ 10mm.
2 upper surface of the first insulating part in the present embodiment is processed into a square groove 22, and magnetic part is put in groove
4, wherein, the wall thickness of groove is 0.5 ~ 100mm, and the depth of groove is 0.5 ~ 100mm.
Second insulating part 3 is processed into a ledge structure, wherein it is insulation board 31 for covering magnetic part to get out of a predicament or an embarrassing situation, institute
State insulation board to coordinate with the groove 22, magnetic part imbedded wherein, then silica gel water-stop is used, it should be noted that insulation board with
The fit clearance of groove is 0.01 ~ 10mm, and the top bar of the second insulating part is insulated column 32, is processed into cylindric so as in plating
During it is easy to loading and unloading.
Embodiment 2:
As shown in Figures 3 and 4, the electroplating clamp of the present embodiment includes three by the first insulating part 2, the second insulating part 3, magnetic
The mould 1 that part 4 and silica gel piece 5 are constituted, wherein the structure of the first insulating part, the second insulating part, silica gel piece is similar to Example 1.
2 side of the first insulating part in the present embodiment offers several blind holes 21, and the purpose of blind hole is to allow in ic shell
The lead of chamber side wall, so as to reach shielding lead and and can and the purpose that closely fit of inside the shell bottom, on silica gel piece 5
It is also required to be processed into the through hole 51 corresponding with the first insulating part side.
In the present embodiment, the length of three moulds 1 is all equal, and middle mould side does not have blind hole and silica gel piece.
Above example 1,2 electroplating clamp of embodiment in use, implement the technical process of thin gold:First will
Ic shell plates one layer of thin gold, secondly loads fixture and the position for needing to plate thin gold is covered up in the middle of shell, finally
The shell of upper complete fixture is put into into plating bath and continues plating gold, again fixture is disassembled after the completion of plating.
Although specifically describing content of the present utility model, the skill of art with reference to above example 1, embodiment 2
Art personnel, can be to concrete reality of the present utility model in the range of this utility model limited without departing from claims below
The mode of applying carries out the change of various local, can make various changes or adjustment in the form and details to this utility model,
But it is protection domain of the present utility model.
Claims (9)
1. a kind of steel substrate planar materials local diversity clamp for electric plating, it is characterised in that including or at least two simultaneously
The mould (1) of row arrangement, the mould include the first insulating part (2), the second insulating part (3) and magnetic part (4), first insulation
Part and the second insulating part are for magnetic part is sealed.
2. steel substrate planar materials local diversity clamp for electric plating according to claim 1, it is characterised in that described
The lower surface of one insulating part (2) and/or side are fitted with silica gel piece (5).
3. steel substrate planar materials local diversity clamp for electric plating according to claim 2, it is characterised in that the silicon
Pass through silica gel water-stop between film (5) and the first insulating part (2).
4. steel substrate planar materials local diversity clamp for electric plating according to claim 2, it is characterised in that described
The lower surface of one insulating part (2) and/or side offer several for avoiding the blind hole (21) of lead, the silica gel piece
(5) through hole (51) coordinated with the blind hole is offered on.
5. the steel substrate planar materials local diversity clamp for electric plating according to any one of Claims 1-4, its feature exist
In offering on first insulating part (2) for placing the groove (22) of magnetic part.
6. the steel substrate planar materials local diversity clamp for electric plating according to any one of Claims 1-4, its feature exist
In second insulating part (3) adopts ledge structure, wherein it is for covering the insulation board of magnetic part (31), appearing on the stage to get out of a predicament or an embarrassing situation
Rank is for convenience of the insulated column (32) for clamping.
7. the steel substrate planar materials local diversity clamp for electric plating according to any one of Claims 1-4, its feature exist
In, offering on first insulating part (2) for placing the groove (22) of magnetic part, second insulating part (3) includes using
In the insulation board (31) and the insulated column (32) being arranged on the insulation board, the insulation board and the groove that cover magnetic part
Sealing coordinates.
8. steel substrate planar materials local diversity clamp for electric plating according to claim 7, it is characterised in that it is described absolutely
Pass through silica gel water-stop between listrium (31) and groove (22).
9. steel substrate planar materials local diversity clamp for electric plating according to claim 1, it is characterised in that described
One insulating part (2) and the second insulating part (3) adopt acidproof base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621020249.XU CN206109578U (en) | 2016-08-30 | 2016-08-30 | Material local otherness in base steel material plane is electroplated and is used anchor clamps |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621020249.XU CN206109578U (en) | 2016-08-30 | 2016-08-30 | Material local otherness in base steel material plane is electroplated and is used anchor clamps |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206109578U true CN206109578U (en) | 2017-04-19 |
Family
ID=58516417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621020249.XU Active CN206109578U (en) | 2016-08-30 | 2016-08-30 | Material local otherness in base steel material plane is electroplated and is used anchor clamps |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206109578U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106167910A (en) * | 2016-08-30 | 2016-11-30 | 合肥圣达电子科技实业公司 | A kind of steel substrate planar materials local diversity clamp for electric plating |
CN112813472A (en) * | 2020-12-29 | 2021-05-18 | 西安赛尔电子材料科技有限公司 | Local gold plating process for metal-glass packaging tube shell for hybrid integrated circuit |
-
2016
- 2016-08-30 CN CN201621020249.XU patent/CN206109578U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106167910A (en) * | 2016-08-30 | 2016-11-30 | 合肥圣达电子科技实业公司 | A kind of steel substrate planar materials local diversity clamp for electric plating |
CN112813472A (en) * | 2020-12-29 | 2021-05-18 | 西安赛尔电子材料科技有限公司 | Local gold plating process for metal-glass packaging tube shell for hybrid integrated circuit |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN206109578U (en) | Material local otherness in base steel material plane is electroplated and is used anchor clamps | |
CN102950350A (en) | Process for welding electronic microcomponents based on multi-temperature gradient | |
CN204361114U (en) | A kind of hot dip welding that can improve cell piece power output | |
CN108391368B (en) | Manufacturing method of copper-embedded block plate | |
CN105704914A (en) | Thick copper plate for different types of circuit boards and production method for circuit board | |
CN106167910A (en) | A kind of steel substrate planar materials local diversity clamp for electric plating | |
CN208622684U (en) | A kind of wire bonding tooling | |
CN103517565A (en) | Aluminum substrate sink copper plate electric edge sealing method | |
CN210753435U (en) | Carrier for coating soldering flux on preformed soldering lug | |
CN211125695U (en) | L ED support with ceramic dam | |
CN201829487U (en) | Triode lead frame | |
CN214266694U (en) | Automatic tool of subsides of cover of plastic part | |
CN201051498Y (en) | Integrated circuit out lead framework | |
CN103817390B (en) | A kind of brazing technique for contactor assembling | |
CN103441116A (en) | Semiconductor package piece and manufacturing method thereof | |
CN207004325U (en) | A kind of architectural decorative glass attachment device | |
CN216807109U (en) | Clamping device for coating double-layer circuit board | |
CN201829485U (en) | Dot-type electroplating lead frame | |
CN201038155Y (en) | Local electroplating large power lead wire frame | |
CN203812721U (en) | Clamp capable of ensuring planeness of hollow coil inductor enamelled wire shell | |
CN205024343U (en) | Quick positioning jig of car corner lamp | |
CN204539060U (en) | A kind of photovoltaic green-house and photovoltaic module fixed structure thereof | |
JPS5647592A (en) | Plating method of inner surface of casting mold for continuous casting | |
CN213838229U (en) | High-weather-resistance aluminum alloy profile | |
CN205211793U (en) | LED support |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |