CN201038155Y - Local electroplating large power lead wire frame - Google Patents
Local electroplating large power lead wire frame Download PDFInfo
- Publication number
- CN201038155Y CN201038155Y CN 200720108293 CN200720108293U CN201038155Y CN 201038155 Y CN201038155 Y CN 201038155Y CN 200720108293 CN200720108293 CN 200720108293 CN 200720108293 U CN200720108293 U CN 200720108293U CN 201038155 Y CN201038155 Y CN 201038155Y
- Authority
- CN
- China
- Prior art keywords
- plating
- lead frame
- area
- packaging material
- little solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
A local plating large-power lead frame comprises a mainbody consisting of a heat dissipation fixing part, a chip part, a small welding spot, a middle pin and a side pin, and a plating layer covered on the mainbody; the plating layer covers the area ranging from the chip part to the small welding spot or the area of the small welding spot; the plating metal layer and the plastic packaging material are required on the lead frame for packaging and the lead frame, the plating layer and the plastic packaging material are made of different materials with different thermal physical performances and thermal expansion coefficients, in particular to poor cohesion between the plating layer and the plastic packaging material. At present the local plating lead frame is adopted, and the plating cover is carried out only at the area of the small welding spots or the area of the small welding spots and the chips, which meets the packaging requirement and reduces the consumption of the metal plating layer material by large area, reduces the production cost and reduces the exhaust pollution of the harmful matters caused by plating, and reinforces the cohesion and sealing strength between the lead frame and the plastic packaging material.
Description
Technical field
The utility model relates to a kind of lead frame, the used Localized Electrolytic Plating High-Power Lead Wire Frame of particularly a kind of large power triode.
Background technology
Lead frame is to make the basic element of character of producing semiconductor element, also needs to utilize resin plastic-sealed chip to be fixed into holistic semiconductor element again at its most of local electroplated metal layer in surface.
Existing TO-220 lead frame as shown in Figure 3, according to cartridge chip be welded to connect the needs of line, its plating area L has covered the entire area of heat radiation fixed part 1, chip section 2 and little solder joint 3, electroplating cost height.
Summary of the invention
Technical problem to be solved in the utility model is, a kind of Localized Electrolytic Plating High-Power Lead Wire Frame is provided, both when satisfying original encapsulation requirement, strengthened adhesion and sealing intensity between lead frame and plastic packaging material again, and reduce electroplating cost and reduce when electroplating discharging pollution environment.
The technical scheme in the invention for solving the above technical problem is: Localized Electrolytic Plating High-Power Lead Wire Frame comprises that main body that is made of heat radiation fixed part, chip section, little solder joint, interim pins, side pipe pin and the electrodeposited coating that covers on the main body form, described electrodeposited coating a, covers chip section and arrives in the zone of little solder joint; B, cover in the zone of little solder joint.
Compared with prior art, advantage of the present utility model is, because of also needing electroplated metal layer on the lead frame and encapsulating with plastic packaging material, and lead frame, electrodeposited coating, plastic packaging material is respectively by different material, the thermophysical property of each material, thermal coefficient of expansion is all inequality, especially the adhesion of electrodeposited coating and plastic packaging material is undesirable, with its clear-cut like this scope of dwindling the plating area, only electroplate at little solder joint or little solder joint and chip section zone, adopt the parcel plating lead frame, relatively just strengthened combining and sealing intensity of lead frame and plastic packaging material, not only satisfied encapsulation requires but also large tracts of land has reduced electrodeposited coating, reduce the consumption of coat of metal material, reduced production cost and reduced the discharge of poisonous waste pollution that brings when electroplating again.
Description of drawings
Fig. 1, structural representation of the present utility model (covering the M zone).
Fig. 2, structural representation of the present utility model (covering the n-quadrant).
Fig. 3, prior art electrodeposited coating cover schematic diagram (L between electroplating region).
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further described.
Main body is linked to be whole interim pins 4 and two and forms with little solder joint 3 and with the both sides pin 5 that interim pins 4 links together with heat radiation fixed part 1, chip section 2 by the heat radiation fixed part 1 and the lower end chip section 2 of upper end band through hole.
Electroplated metal layer, electrodeposited coating 6 cover chip section 2 in little solder joint 3 zones, i.e. M zone among Fig. 1, and the M zone has comprised whole parts that reach interim pins top of chip section 2, two little solder joints 3.
Electrodeposited coating 7 covers in little solder joint 3 zones, i.e. n-quadrant among Fig. 2, n-quadrant have comprised the parts of corresponding little solder joint 3 height on the whole and interim pins 4 of two little solder joints 3.
Claims (3)
1. Localized Electrolytic Plating High-Power Lead Wire Frame, comprise by heat radiation fixed part (1), chip section (2), little solder joint (3), interim pins (4), the main body of side pipe pin (5) formation and the electrodeposited coating that covers on the main body and forming, it is characterized in that described electrodeposited coating a, cover chip section (2) in the zone of little solder joint (3); B, cover in the zone of little solder joint (3).
2. Localized Electrolytic Plating High-Power Lead Wire Frame according to claim 1, it is characterized in that described electrodeposited coating (6) covers chip section (2) to the M zone between little solder joint (3), has comprised the part on whole and interim pins (4) top of chip section (2) and two little solder joints (3).
3. Localized Electrolytic Plating High-Power Lead Wire Frame according to claim 1, it is characterized in that described electrodeposited coating (7) covers the n-quadrant of little solder joint (3), comprised that the whole and interim pins (4) of two little solder joints (3) goes up the part of corresponding little solder joint (3) height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720108293 CN201038155Y (en) | 2007-04-19 | 2007-04-19 | Local electroplating large power lead wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720108293 CN201038155Y (en) | 2007-04-19 | 2007-04-19 | Local electroplating large power lead wire frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201038155Y true CN201038155Y (en) | 2008-03-19 |
Family
ID=39210675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720108293 Expired - Lifetime CN201038155Y (en) | 2007-04-19 | 2007-04-19 | Local electroplating large power lead wire frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201038155Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930953A (en) * | 2009-06-25 | 2010-12-29 | 国际商业机器公司 | Semiconductor apparatus assembly and heat sink assembly |
| CN102368489A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Electroplated triode lead frame |
-
2007
- 2007-04-19 CN CN 200720108293 patent/CN201038155Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101930953A (en) * | 2009-06-25 | 2010-12-29 | 国际商业机器公司 | Semiconductor apparatus assembly and heat sink assembly |
| CN101930953B (en) * | 2009-06-25 | 2012-03-21 | 国际商业机器公司 | Semiconductor device assembly and radiator assembly |
| CN102368489A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Electroplated triode lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Ningbo Mingxin Microelectronic Co., Ltd. Assignor: Ningbo Kangqiang Electronics Co., Ltd. Contract fulfillment period: 2008.7.1 to 2014.6.30 Contract record no.: 2008330001456 Denomination of utility model: Local electroplating large power lead wire frame Granted publication date: 20080319 License type: Exclusive license Record date: 20081029 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.7.1 TO 2014.6.30; CHANGE OF CONTRACT Name of requester: NINGBO MINGXIN MICRO-ELECTRON CO., LTD. Effective date: 20081029 |
|
| CX01 | Expiry of patent term |
Granted publication date: 20080319 |
|
| CX01 | Expiry of patent term |