CN102368489A - Electroplated triode lead frame - Google Patents
Electroplated triode lead frame Download PDFInfo
- Publication number
- CN102368489A CN102368489A CN2011103319265A CN201110331926A CN102368489A CN 102368489 A CN102368489 A CN 102368489A CN 2011103319265 A CN2011103319265 A CN 2011103319265A CN 201110331926 A CN201110331926 A CN 201110331926A CN 102368489 A CN102368489 A CN 102368489A
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- CN
- China
- Prior art keywords
- pin
- area
- side pin
- lead frame
- chip region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to an electroplated triode lead frame, which comprises a plurality of frame units, wherein the adjacent frame units are connected by an upper rib, an intermediate rib and a bottom rib; each frame unit comprises a heat radiating region, a chip region and a pin region; each heat radiating region is positioned right above the corresponding chip region and is internally provided with a round through hole; and each pin region is positioned right below the corresponding chip region. The electroplated triode lead frame has the advantages of simple structure, no need of any additional component and capability of effectively improving a welding effect.
Description
Technical field
The present invention relates to a kind of semiconductor element, relate in particular to a kind of plating lead frame of triode.
Background technology
Follow the development of electronic market, it is increasingly high that semiconductor does not have the integrated level of device, and its memory space, conversion speed and power increases rapidly, yet volume is but more and more littler.This trend has been quickened the development of semiconductor device packaging technique, so the importance of semiconductor device packaging technique has been subjected to the concern of manufacturing enterprise.The high integration of semiconductor device and the increase of memory make also and the also corresponding increase of the quantity of input and output binding post make also that then the number of lead-in wire increases accordingly that this layout that just requires to go between also must be meticulous.
Lead frame is the skeleton in the semiconductor packages, and it mainly is made up of three parts: radiating area, chip region and pin area.Wherein for chip provides mechanical support, pin area then is to connect the electric path of chip to circuit board to chip region in encapsulation process.The function of lead frame is vital, and chip tends to occur the phenomenon that pad gets loose in encapsulation process, does not directly cause triode to lose efficacy because of welding is firm, influences the normal machines running.In order to satisfy the demand of market development, lead frame also needs constantly innovation in structure and in function aspects.
Summary of the invention
The purpose of this invention is to provide a kind of lead frame of triode of electroplating, can improve the absorption affinity of chip and lead frame in chip region.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of plating lead frame of triode; Comprise several frame units; Be connected through last muscle, middle muscle and end muscle between the described adjacent frame unit, each described frame unit comprises radiating area, chip region and pin area, described radiating area be positioned at chip region directly over; In described radiating area, be provided with a manhole, described pin area be positioned at described chip region under.
Wherein, in described chip region, be provided with the chip positioning area, electroplated metal layer is carried out on described chip positioning area surface, between described chip positioning area and radiating area, is provided with the V-type groove.
Wherein, Described pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other with end muscle through middle muscle with the right side pin and is positioned at the both sides of middle pin; Upper end face at described left side pin and right side pin carries out electroplated metal layer, and described left side pin and right side pin respectively comprise three pins, and described middle pin extends upward and connects described chip region.
The invention has the beneficial effects as follows: on chip positioning area surface and the upper end face of left side pin and right side pin carry out electroplated metal layer, when chips welding during in lead frame, can be through the silver-plated raising chip of plate surface and the absorption affinity of lead frame.And simple in structure, need not to add any parts, can effectively improve welding effect.
Description of drawings
Accompanying drawing 1 is a kind of plating lead frame of triode of the present invention;
Accompanying drawing 2 be in the accompanying drawing 1 A-A to cutaway view.
In the accompanying drawing: the 1-radiating area; The 2-chip region; The 3-pin area; The last muscle of 4-; Muscle among the 5-; Muscle under the 6-; The 11-manhole; 21-chip positioning area; 22-V type groove; 31-left side pin; Pin in the middle of the 32-; 33-right side pin.
Embodiment
Below in conjunction with embodiment shown in the drawings technical scheme of the present invention is done following detailed description the in detail:
See also shown in accompanying drawing 1 and the accompanying drawing 2; A kind of plating lead frame of triode of the present invention comprises several frame units, is connected with end muscle 6 through last muscle 4, middle muscle 5 between the adjacent frame unit; Each frame unit comprises radiating area 1, chip region 2 and pin area 3; Radiating area 1 be positioned at chip region 2 directly over, in radiating area 1, be provided with a manhole 11, pin area 3 be positioned at chip region 2 under.
Wherein, in chip region 2, be provided with chip positioning area 21, electroplated metal layer is carried out on chip positioning area surface, between chip positioning area 21 and radiating area 1, is provided with V-type groove 22.
Wherein, Pin area 3 comprises left side pin 31, middle pin 32 and right side pin 33; Left side pin 31 links to each other with end muscle 6 through middle muscle 5 with right side pin 32 and is positioned at the both sides of middle pin 32; The upper end face of pin 31 and right side pin 33 carries out electroplated metal layer in the left side, and left side pin 31 respectively comprises three pins with right side pin 33, and middle pin 32 extends upward and connects described chip region 2.
The invention has the beneficial effects as follows: on chip positioning area 21 surfaces and the upper end face of left side pin 31 and right side pin 33 carry out electroplated metal layer; When chips welding during in lead frame, can be through the silver-plated raising chip of plate surface and the absorption affinity of lead frame.And simple in structure, need not to add any parts, can effectively improve welding effect.
What should explain at last is: above embodiment only in order to the explanation the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification has carried out detailed explanation to the present invention with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the present invention; And all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the present invention, and it all should be encompassed in the claim scope of the present invention.
Claims (3)
1. electroplate lead frame of triode for one kind; It is characterized in that: comprise several frame units; Be connected through last muscle, middle muscle and end muscle between the described adjacent frame unit, each described frame unit comprises radiating area, chip region and pin area, described radiating area be positioned at chip region directly over; In described radiating area, be provided with a manhole, described pin area be positioned at described chip region under.
2. a kind of plating lead frame of triode according to claim 1; It is characterized in that: in described chip region, be provided with the chip positioning area; Electroplated metal layer is carried out on described chip positioning area surface, between described chip positioning area and radiating area, is provided with the V-type groove.
3. a kind of plating lead frame of triode according to claim 1; It is characterized in that: described pin area comprises left side pin, middle pin and right side pin; Described left side pin links to each other with end muscle through middle muscle with the right side pin and is positioned at the both sides of middle pin; Upper end face at described left side pin and right side pin carries out electroplated metal layer, and described left side pin and right side pin respectively comprise three pins, and described middle pin extends upward and connects described chip region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103319265A CN102368489A (en) | 2011-10-25 | 2011-10-25 | Electroplated triode lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103319265A CN102368489A (en) | 2011-10-25 | 2011-10-25 | Electroplated triode lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102368489A true CN102368489A (en) | 2012-03-07 |
Family
ID=45761048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103319265A Pending CN102368489A (en) | 2011-10-25 | 2011-10-25 | Electroplated triode lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102368489A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102953100A (en) * | 2012-11-19 | 2013-03-06 | 无锡九条龙汽车设备有限公司 | Electroplating crimping die |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201038155Y (en) * | 2007-04-19 | 2008-03-19 | 宁波康强电子股份有限公司 | Local electroplating large power lead wire frame |
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN201829484U (en) * | 2010-10-21 | 2011-05-11 | 江阴康强电子有限公司 | Spot type electroplating triode lead frame |
| CN202259271U (en) * | 2011-10-25 | 2012-05-30 | 张轩 | Electroplated triode lead frame |
-
2011
- 2011-10-25 CN CN2011103319265A patent/CN102368489A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201038155Y (en) * | 2007-04-19 | 2008-03-19 | 宁波康强电子股份有限公司 | Local electroplating large power lead wire frame |
| CN101673721A (en) * | 2008-09-13 | 2010-03-17 | 铜陵丰山三佳微电子有限公司 | High-power integrated circuit lead frame |
| CN201229942Y (en) * | 2008-11-07 | 2009-04-29 | 宁波华龙电子股份有限公司 | Dual row dual column thin type lead frame board |
| CN201829484U (en) * | 2010-10-21 | 2011-05-11 | 江阴康强电子有限公司 | Spot type electroplating triode lead frame |
| CN102034785A (en) * | 2010-11-23 | 2011-04-27 | 吴江恒源金属制品有限公司 | Improved triode lead frame |
| CN202259271U (en) * | 2011-10-25 | 2012-05-30 | 张轩 | Electroplated triode lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102953100A (en) * | 2012-11-19 | 2013-03-06 | 无锡九条龙汽车设备有限公司 | Electroplating crimping die |
| CN102953100B (en) * | 2012-11-19 | 2016-01-06 | 江苏高博智融科技有限公司 | A kind of plating crimp |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120307 |