CN102953100A - Electroplating crimping die - Google Patents
Electroplating crimping die Download PDFInfo
- Publication number
- CN102953100A CN102953100A CN2012104675276A CN201210467527A CN102953100A CN 102953100 A CN102953100 A CN 102953100A CN 2012104675276 A CN2012104675276 A CN 2012104675276A CN 201210467527 A CN201210467527 A CN 201210467527A CN 102953100 A CN102953100 A CN 102953100A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- die
- moldingmoulding
- pressing mold
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title abstract description 8
- 238000002788 crimping Methods 0.000 title abstract 3
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Punching Or Piercing (AREA)
Abstract
The invention discloses an electroplating crimping die, comprising a moulding die strip, wherein the moldingmoulding die strip is rectangular; a plurality of evenly-arranged pressing blocks are arranged on the lower part of the moldingmoulding die strip; an electroplating joint is arranged between two adjacent pressing blocks; a through hole available for the pass of a welding gun is formed in the interior of the moldingmoulding die strip in a manner corresponding to each electroplating joint; and a positioning structure is arranged on two ends of the moldingmoulding die strip respectively. With the adoption of the electroplating crimping die provided by the invention, multiple audions can undergo operations such as electroplating and cutting in one step through manual operation; the operations can be realized by hand without large equipment; and moreover, the quality of a moldingmoulding die can be inspected in real time.
Description
Technical field
The present invention relates to a kind of wafer plating crimp, definite saying carried out the mould that uses in the electroplating process to the triode pin.
Background technology
Existing triode pin mostly needs to finish with large-scale mechanical means in the process of electroplating cutting, and complex structure and cost are high, and efficient is restricted.
Summary of the invention
Efficient in order to improve the cutting of triode pin, to electroplate reduces production costs, and the invention provides a kind of plating crimp.
Purpose of the present invention is come specific implementation by the following technical programs:
A kind of plating crimp, comprise the pressing mold bar, described pressing mold bar is rectangle, and is provided with several evenly distributed briquettings in the bottom of pressing mold bar, be provided with the plating joint between adjacent two briquettings, corresponding each plating joint is provided with the through hole that welding gun can pass through in the inside of pressing mold bar.
Two ends at described pressing mold bar are provided with locating structure.
Plating crimp provided by the invention can the disposable operation that a plurality of triodes are electroplated, cut, and adopts manual operations to realize, need to be by large-scale equipment, and quality that can the real-time inspection pressing mold.
Description of drawings
The below is described in further detail the present invention with embodiment with reference to the accompanying drawings.
Fig. 1 is the structure iron of the described plating crimp of the embodiment of the invention.
Embodiment
As shown in Figure 1, the described plating crimp of the embodiment of the invention, comprise the pressing mold bar, described pressing mold bar is rectangle, be provided with several evenly distributed briquettings in the bottom of pressing mold bar, be provided with between adjacent two briquettings and electroplate joint 6, corresponding each plating joint is provided with the through hole 7 that welding gun can pass through in the inside of pressing mold bar.
Two ends at described pressing mold bar are provided with locating structure.
Plating crimp provided by the invention can the disposable operation that a plurality of triodes are electroplated, cut, and adopts manual operations to realize, need to be by large-scale equipment, and quality that can the real-time inspection pressing mold.
Claims (2)
1. electroplate crimp for one kind, comprise the pressing mold bar, it is characterized in that, described pressing mold bar is rectangle, be provided with several evenly distributed briquettings in the bottom of pressing mold bar, be provided with the plating joint between adjacent two briquettings, corresponding each plating joint is provided with the through hole that welding gun can pass through in the inside of pressing mold bar.
2. plating crimp as claimed in claim 1 is characterized in that, is provided with locating structure at the two ends of described pressing mold bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210467527.6A CN102953100B (en) | 2012-11-19 | 2012-11-19 | A kind of plating crimp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210467527.6A CN102953100B (en) | 2012-11-19 | 2012-11-19 | A kind of plating crimp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102953100A true CN102953100A (en) | 2013-03-06 |
| CN102953100B CN102953100B (en) | 2016-01-06 |
Family
ID=47762464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210467527.6A Expired - Fee Related CN102953100B (en) | 2012-11-19 | 2012-11-19 | A kind of plating crimp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102953100B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140099A (en) * | 1986-12-01 | 1988-06-11 | Ngk Insulators Ltd | Plating treatment device |
| CN1241650A (en) * | 1999-07-16 | 2000-01-19 | 清华大学 | Method of electromolding tridimensional metal structure directly on silicon substrate and the special fixture thereof |
| CN201729905U (en) * | 2010-05-11 | 2011-02-02 | 上海新阳半导体材料股份有限公司 | Clamping device for lead frame rack and plating device |
| CN102368489A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Electroplated triode lead frame |
| CN102500722A (en) * | 2011-10-19 | 2012-06-20 | 苏州奥兰迪尔自动化设备有限公司 | Crystal pin cutting device |
-
2012
- 2012-11-19 CN CN201210467527.6A patent/CN102953100B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140099A (en) * | 1986-12-01 | 1988-06-11 | Ngk Insulators Ltd | Plating treatment device |
| CN1241650A (en) * | 1999-07-16 | 2000-01-19 | 清华大学 | Method of electromolding tridimensional metal structure directly on silicon substrate and the special fixture thereof |
| CN201729905U (en) * | 2010-05-11 | 2011-02-02 | 上海新阳半导体材料股份有限公司 | Clamping device for lead frame rack and plating device |
| CN102500722A (en) * | 2011-10-19 | 2012-06-20 | 苏州奥兰迪尔自动化设备有限公司 | Crystal pin cutting device |
| CN102368489A (en) * | 2011-10-25 | 2012-03-07 | 张轩 | Electroplated triode lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102953100B (en) | 2016-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151201 Address after: 214000 Xinhua Road, Wuxi province national high tech Industrial Development Zone, No. innovation Creative Industrial Park, building, room 109, B, China, Jiangsu Applicant after: JIANGSU GAOBO ZHIRONG TECHNOLOGY Co.,Ltd. Address before: 214000 Jiangsu city in Wuxi Province Economic Development Zone Huishan Weifu Industrial Park Applicant before: WUXI JIUTIAOLONG AUTOMOBILE EQUIPMENT Co.,Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Lifeng Inventor before: Bao Anliang |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170519 Address after: 528000 Guangdong province Foshan city Gaoming Cangjiang Industrial Park District high Tian Lu Ming City Park Patentee after: FOSHAN GAOMING LIGANG PRECISION CASTING CO.,LTD. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170519 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 214000 Xinhua Road, Wuxi province national high tech Industrial Development Zone, No. innovation Creative Industrial Park, building, room 109, B, China, Jiangsu Patentee before: JIANGSU GAOBO ZHIRONG TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20191119 |